IT7950601A0 - Procedimento per trattare sostrati polimerici al fine di renderli ricettivi ad una placcatura anelettro litica - Google Patents

Procedimento per trattare sostrati polimerici al fine di renderli ricettivi ad una placcatura anelettro litica

Info

Publication number
IT7950601A0
IT7950601A0 IT7950601A IT5060179A IT7950601A0 IT 7950601 A0 IT7950601 A0 IT 7950601A0 IT 7950601 A IT7950601 A IT 7950601A IT 5060179 A IT5060179 A IT 5060179A IT 7950601 A0 IT7950601 A0 IT 7950601A0
Authority
IT
Italy
Prior art keywords
receptive
procedure
make
order
electrolytic plating
Prior art date
Application number
IT7950601A
Other languages
English (en)
Other versions
IT1164737B (it
Inventor
Donald Alan Arcilesi
Warren Russel Doty
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of IT7950601A0 publication Critical patent/IT7950601A0/it
Application granted granted Critical
Publication of IT1164737B publication Critical patent/IT1164737B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
IT50601/79A 1978-10-20 1979-10-18 Procedimento per trattare sostrati polimerici al fine di renderli ricettivi ad una placcatura anelettrolitica IT1164737B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/953,153 US4204013A (en) 1978-10-20 1978-10-20 Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine

Publications (2)

Publication Number Publication Date
IT7950601A0 true IT7950601A0 (it) 1979-10-18
IT1164737B IT1164737B (it) 1987-04-15

Family

ID=25493642

Family Applications (1)

Application Number Title Priority Date Filing Date
IT50601/79A IT1164737B (it) 1978-10-20 1979-10-18 Procedimento per trattare sostrati polimerici al fine di renderli ricettivi ad una placcatura anelettrolitica

Country Status (13)

Country Link
US (1) US4204013A (it)
JP (1) JPS6049717B2 (it)
AU (1) AU528226B2 (it)
BR (1) BR7906754A (it)
CA (1) CA1144432A (it)
DE (1) DE2941997C2 (it)
ES (1) ES485223A1 (it)
FR (1) FR2439214A1 (it)
GB (1) GB2036755B (it)
HK (1) HK67986A (it)
IT (1) IT1164737B (it)
MX (1) MX152328A (it)
SG (1) SG42386G (it)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3172414D1 (en) * 1981-06-02 1985-10-31 Asahi Glass Co Ltd Process for preparing nickel layer
US4448811A (en) * 1981-12-30 1984-05-15 Omi International Corporation Oxidizing agent for acidic accelerator in electroless metal plating process
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
DE3376852D1 (en) * 1982-05-26 1988-07-07 Macdermid Inc Catalyst solutions for activating non-conductive substrates and electroless plating process
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
US4610895A (en) * 1984-02-01 1986-09-09 Shipley Company Inc. Process for metallizing plastics
US4592929A (en) * 1984-02-01 1986-06-03 Shipley Company Inc. Process for metallizing plastics
JPS60218477A (ja) * 1984-04-11 1985-11-01 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 無電解付着のための触媒化処理法
JPS6230509U (it) * 1985-08-09 1987-02-24
JPH0765154B2 (ja) * 1985-09-02 1995-07-12 ポリプラスチックス株式会社 表面金属処理した樹脂成形品
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
DE3743743A1 (de) * 1987-12-23 1989-07-06 Basf Ag Polymere konditionierungsmittel zur vorbehandlung von nichtmetallischen oberflaechen fuer eine chemische metallisierung
US5053280A (en) * 1988-09-20 1991-10-01 Hitachi-Chemical Co., Ltd. Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film
US5843538A (en) * 1996-12-09 1998-12-01 John L. Raymond Method for electroless nickel plating of metal substrates
US6361712B1 (en) 1999-10-15 2002-03-26 Arch Specialty Chemicals, Inc. Composition for selective etching of oxides over metals
DE10054544A1 (de) * 2000-11-01 2002-05-08 Atotech Deutschland Gmbh Verfahren zum chemischen Metallisieren von Oberflächen
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
US6783690B2 (en) 2002-03-25 2004-08-31 Donna M. Kologe Method of stripping silver from a printed circuit board
WO2004027113A2 (en) * 2002-09-20 2004-04-01 Noble Fiber Technologies Improved silver plating method and articles made therefrom
DE10259187B4 (de) * 2002-12-18 2008-06-19 Enthone Inc., West Haven Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren
EP2233608B1 (en) * 2009-03-23 2016-03-23 ATOTECH Deutschland GmbH Pre-treatment process for electroless nickel plating
CA2918939C (en) 2013-07-24 2021-10-26 National Research Council Of Canada Process for depositing metal on a substrate
ES2785400T3 (es) 2014-04-01 2020-10-06 Atotech Deutschland Gmbh Composición y procedimiento para metalizar superficies de plástico no conductor
CN106471156B (zh) * 2014-07-10 2021-11-26 奥野制药工业株式会社 树脂镀敷方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3532518A (en) * 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
US3620804A (en) * 1969-01-22 1971-11-16 Borg Warner Metal plating of thermoplastics
US3622370A (en) * 1969-04-07 1971-11-23 Macdermid Inc Method of and solution for accelerating activation of plastic substrates in electroless metal plating system
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
DE2659680C2 (de) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Aktivieren von Oberflächen

Also Published As

Publication number Publication date
DE2941997A1 (de) 1980-04-30
CA1144432A (en) 1983-04-12
DE2941997C2 (de) 1982-12-23
HK67986A (en) 1986-09-18
JPS5556137A (en) 1980-04-24
FR2439214B1 (it) 1983-07-01
JPS6049717B2 (ja) 1985-11-05
AU528226B2 (en) 1983-04-21
IT1164737B (it) 1987-04-15
SG42386G (en) 1987-03-27
GB2036755A (en) 1980-07-02
ES485223A1 (es) 1980-07-01
MX152328A (es) 1985-06-27
AU5116679A (en) 1980-04-24
FR2439214A1 (fr) 1980-05-16
US4204013A (en) 1980-05-20
BR7906754A (pt) 1980-06-17
GB2036755B (en) 1983-05-11

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