IT8019613A0 - Processo per depositare tracciati metallici su un substrato ceramico senza l'uso di maschere. - Google Patents

Processo per depositare tracciati metallici su un substrato ceramico senza l'uso di maschere.

Info

Publication number
IT8019613A0
IT8019613A0 IT8019613A IT1961380A IT8019613A0 IT 8019613 A0 IT8019613 A0 IT 8019613A0 IT 8019613 A IT8019613 A IT 8019613A IT 1961380 A IT1961380 A IT 1961380A IT 8019613 A0 IT8019613 A0 IT 8019613A0
Authority
IT
Italy
Prior art keywords
masks
ceramic substrate
metallic traces
depositing metallic
depositing
Prior art date
Application number
IT8019613A
Other languages
English (en)
Other versions
IT1151078B (it
Inventor
Schmeckenbecher Arno Friedrich
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT8019613A0 publication Critical patent/IT8019613A0/it
Application granted granted Critical
Publication of IT1151078B publication Critical patent/IT1151078B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
IT19613/80A 1979-02-28 1980-02-01 Processo per depositare tracciati metallici su un substrato ceramico senza l'uso di maschere IT1151078B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/016,033 US4206254A (en) 1979-02-28 1979-02-28 Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern

Publications (2)

Publication Number Publication Date
IT8019613A0 true IT8019613A0 (it) 1980-02-01
IT1151078B IT1151078B (it) 1986-12-17

Family

ID=21775021

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19613/80A IT1151078B (it) 1979-02-28 1980-02-01 Processo per depositare tracciati metallici su un substrato ceramico senza l'uso di maschere

Country Status (6)

Country Link
US (1) US4206254A (it)
EP (1) EP0016925B1 (it)
JP (1) JPS5814078B2 (it)
CA (1) CA1132857A (it)
DE (1) DE3060787D1 (it)
IT (1) IT1151078B (it)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501768A (en) * 1982-03-18 1985-02-26 International Business Machines Corporation Thin film floating zone metal coating technique
US4493856A (en) * 1982-03-18 1985-01-15 International Business Machines Corporation Selective coating of metallurgical features of a dielectric substrate with diverse metals
US4442137A (en) * 1982-03-18 1984-04-10 International Business Machines Corporation Maskless coating of metallurgical features of a dielectric substrate
DE3380413D1 (en) * 1982-04-27 1989-09-21 Richardson Chemical Co Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
US4474465A (en) * 1982-09-07 1984-10-02 International Business Machines Corporation Method and apparatus for making a mask conforming to a ceramic substrate metallization pattern
DE3242069A1 (de) * 1982-11-13 1984-05-17 Erwin W. Dipl.-Chem. Dr. 7000 Stuttgart Wartenberg Verfahren zum herstellen gemusterter luesterueberzuege auf oberflaechen von koerpern und siebdruckpaste zur durchfuehrung des verfahrens
US4604299A (en) * 1983-06-09 1986-08-05 Kollmorgen Technologies Corporation Metallization of ceramics
US4526859A (en) * 1983-12-12 1985-07-02 International Business Machines Corporation Metallization of a ceramic substrate
US4701352A (en) * 1984-05-10 1987-10-20 Kollmorgen Corporation Surface preparation of ceramic substrates for metallization
US4552615A (en) * 1984-05-21 1985-11-12 International Business Machines Corporation Process for forming a high density metallurgy system on a substrate and structure thereof
US4582722A (en) * 1984-10-30 1986-04-15 International Business Machines Corporation Diffusion isolation layer for maskless cladding process
US4833039A (en) * 1985-09-26 1989-05-23 General Electric Company Hermetic feedthrough in ceramic substrate
US4684446A (en) * 1985-09-26 1987-08-04 General Electric Company Secondary metallization by glass displacement in ceramic substrate
US4732780A (en) * 1985-09-26 1988-03-22 General Electric Company Method of making hermetic feedthrough in ceramic substrate
US4699811A (en) * 1986-09-16 1987-10-13 Macdermid, Incorporated Chromium mask for electroless nickel or copper plating
WO1988006803A1 (en) * 1987-02-27 1988-09-07 Asahi Glass Company Ltd. Method for electrically isolating large area electrode bodies
US4835008A (en) * 1987-10-05 1989-05-30 Harris Corp. Process of forming breadboard interconnect structure having plated through-holes
US4805683A (en) * 1988-03-04 1989-02-21 International Business Machines Corporation Method for producing a plurality of layers of metallurgy
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
AT398675B (de) * 1989-08-29 1995-01-25 Austria Tech & System Tech Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen
US5104689A (en) * 1990-09-24 1992-04-14 International Business Machines Corporation Method and apparatus for automated solder deposition at multiple sites
US8404582B2 (en) * 2010-05-04 2013-03-26 International Business Machines Corporation Structure and method for manufacturing interconnect structures having self-aligned dielectric caps

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617373A (en) * 1968-05-24 1971-11-02 Western Electric Co Methods of making thin film patterns
DE2040180B2 (de) * 1970-01-22 1977-08-25 Intel Corp, Mountain View, Calif. (V.St.A.) Verfahren zur verhinderung von mechanischen bruechen einer duennen, die oberflaeche eines halbleiterkoerpers ueberdeckende isolierschichten ueberziehenden elektrisch leitenden schicht
US3948706A (en) * 1973-12-13 1976-04-06 International Business Machines Corporation Method for metallizing ceramic green sheets
US4008115A (en) * 1976-02-25 1977-02-15 Dennison Manufacturing Company Method for making durable overcoated labels
DE2723499A1 (de) * 1977-05-25 1978-12-07 Licentia Gmbh Verfahren zum herstellen eines fensters in einer isolierschicht bei halbleiteranordnungen

Also Published As

Publication number Publication date
EP0016925B1 (de) 1982-09-01
DE3060787D1 (en) 1982-10-28
JPS55118687A (en) 1980-09-11
CA1132857A (en) 1982-10-05
IT1151078B (it) 1986-12-17
EP0016925A1 (de) 1980-10-15
JPS5814078B2 (ja) 1983-03-17
US4206254A (en) 1980-06-03

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