IT8022603A0 - Procedimento per la determinazione del contenuto di ossigeno di barre di silicio. - Google Patents

Procedimento per la determinazione del contenuto di ossigeno di barre di silicio.

Info

Publication number
IT8022603A0
IT8022603A0 IT8022603A IT2260380A IT8022603A0 IT 8022603 A0 IT8022603 A0 IT 8022603A0 IT 8022603 A IT8022603 A IT 8022603A IT 2260380 A IT2260380 A IT 2260380A IT 8022603 A0 IT8022603 A0 IT 8022603A0
Authority
IT
Italy
Prior art keywords
procedure
determining
oxygen content
silicon bars
bars
Prior art date
Application number
IT8022603A
Other languages
English (en)
Other versions
IT1174671B (it
Inventor
Victor Cazcarra
Andre Schwab
Pierre Zunino
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT8022603A0 publication Critical patent/IT8022603A0/it
Application granted granted Critical
Publication of IT1174671B publication Critical patent/IT1174671B/it

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/041Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/834Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge further characterised by the dopants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00Gettering within semiconductor bodies
    • H10P36/03Gettering within semiconductor bodies within silicon bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00Gettering within semiconductor bodies
    • H10P36/20Intrinsic gettering, i.e. thermally inducing defects by using oxygen present in the silicon body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/40Treatments of semiconductor bodies to modify their internal properties, e.g. to produce internal imperfections
    • H10P95/402Treatments of semiconductor bodies to modify their internal properties, e.g. to produce internal imperfections of silicon bodies
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/024Defect control-gettering and annealing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
IT22603/80A 1979-06-29 1980-06-06 Procedimento per la determinazione del contenuto di ossigeno di barre di silicio IT1174671B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7917302A FR2460479A1 (fr) 1979-06-29 1979-06-29 Procede de caracterisation de la teneur en oxygene des barreaux de silicium tires selon la methode czochralski

Publications (2)

Publication Number Publication Date
IT8022603A0 true IT8022603A0 (it) 1980-06-06
IT1174671B IT1174671B (it) 1987-07-01

Family

ID=9227471

Family Applications (1)

Application Number Title Priority Date Filing Date
IT22603/80A IT1174671B (it) 1979-06-29 1980-06-06 Procedimento per la determinazione del contenuto di ossigeno di barre di silicio

Country Status (7)

Country Link
US (1) US4344815A (it)
EP (1) EP0020993B1 (it)
JP (1) JPS5830279B2 (it)
CA (1) CA1138674A (it)
DE (1) DE3068008D1 (it)
FR (1) FR2460479A1 (it)
IT (1) IT1174671B (it)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618575A (en) * 1979-07-24 1981-02-21 Kadoman Nagahamatani Shoten:Kk Processed sea tangle and processing of the same
DE3069547D1 (en) * 1980-06-26 1984-12-06 Ibm Process for controlling the oxygen content of silicon ingots pulled by the czochralski method
US4342616A (en) * 1981-02-17 1982-08-03 International Business Machines Corporation Technique for predicting oxygen precipitation in semiconductor wafers
NL8102101A (nl) * 1981-04-29 1982-11-16 Philips Nv Werkwijze voor het optrekken van een siliciumstaaf en halfgeleiderinrichting vervaardigd uit de siliciumstaaf.
JPS5814538A (ja) * 1981-07-17 1983-01-27 Fujitsu Ltd 半導体装置の製造方法
US4429047A (en) 1981-08-28 1984-01-31 Rca Corporation Method for determining oxygen content in semiconductor material
US4437922A (en) 1982-03-26 1984-03-20 International Business Machines Corporation Method for tailoring oxygen precipitate particle density and distribution silicon wafers
US4459159A (en) * 1982-09-29 1984-07-10 Mara William C O Method for making semi-insulating substrate by post-process heating of oxygenated and doped silicon
JPS59120076A (ja) * 1982-12-27 1984-07-11 Takeyoshi Maeda 海藻類を主原料とする珍味食品の製造装置
JPS59187765A (ja) * 1983-04-07 1984-10-24 Maruka:Kk 珍味の製造方法
US4505759A (en) * 1983-12-19 1985-03-19 Mara William C O Method for making a conductive silicon substrate by heat treatment of oxygenated and lightly doped silicon single crystals
JPS60190288U (ja) * 1984-05-23 1985-12-17 朝日 七郎 とろろ昆布加工装置
EP0165364B1 (fr) * 1984-06-20 1988-09-07 International Business Machines Corporation Procédé de standardisation et de stabilisation de tranches semiconductrices
JPS6156889U (it) * 1984-09-19 1986-04-16
US4859938A (en) * 1986-05-05 1989-08-22 Intel Corporation Novel technique to detect oxydonor generation in IC fabrication
JPH0787187B2 (ja) * 1987-08-13 1995-09-20 古河電気工業株式会社 GaAs化合物半導体基板の製造方法
JPH02263793A (ja) * 1989-04-05 1990-10-26 Nippon Steel Corp 酸化誘起積層欠陥の発生し難いシリコン単結晶及びその製造方法
US5096839A (en) * 1989-09-20 1992-03-17 Kabushiki Kaisha Toshiba Silicon wafer with defined interstitial oxygen concentration
JPH0750713B2 (ja) * 1990-09-21 1995-05-31 コマツ電子金属株式会社 半導体ウェーハの熱処理方法
JP2719851B2 (ja) * 1991-01-29 1998-02-25 信越半導体株式会社 シリコン単結晶棒の評価方法
JP2572512B2 (ja) * 1992-09-24 1997-01-16 信越半導体株式会社 拡散型シリコン素子基板の製造方法
GB2279586A (en) * 1993-01-06 1995-01-11 Nippon Steel Corp Method and apparatus for predicting crystal quality of single-crystal semiconductor
US5485803A (en) * 1993-01-06 1996-01-23 Nippon Steel Corporation Method of predicting crystal quality of semiconductor single crystal and apparatus thereof
US5795381A (en) * 1996-09-09 1998-08-18 Memc Electrical Materials, Inc. SIO probe for real-time monitoring and control of oxygen during czochralski growth of single crystal silicon
KR100240023B1 (ko) * 1996-11-29 2000-01-15 윤종용 반도체 웨이퍼 열처리방법 및 이에 따라 형성된 반도체 웨이퍼
KR100252214B1 (ko) * 1997-04-23 2000-04-15 윤종용 반도체장치 제조용 베어 웨이퍼 분석방법
US6635587B1 (en) * 1999-09-23 2003-10-21 Memc Electronic Materials, Inc. Method for producing czochralski silicon free of agglomerated self-interstitial defects
KR101045309B1 (ko) * 2004-02-03 2011-06-29 신에쯔 한도타이 가부시키가이샤 반도체 웨이퍼의 제조 방법 및 반도체 잉곳의 절단 위치결정 시스템
FR2964459B1 (fr) * 2010-09-02 2012-09-28 Commissariat Energie Atomique Procede de cartographie de la concentration en oxygene
FR2974180B1 (fr) * 2011-04-15 2013-04-26 Commissariat Energie Atomique Procede de determination de la concentration en oxygene interstitiel.
FR2989168B1 (fr) * 2012-04-06 2014-03-28 Commissariat Energie Atomique Determination de la concentration en oxygene interstitiel dans un echantillon semi-conducteur
FR3027676B1 (fr) 2014-10-22 2016-12-09 Commissariat Energie Atomique Procede de caracterisation de la concentration en oxygene interstitiel dans un lingot semi-conducteur
FR3027675B1 (fr) 2014-10-22 2017-11-24 Commissariat Energie Atomique Procede de caracterisation de la concentration en oxygene interstitiel dans un lingot semi-conducteur
JP7067267B2 (ja) * 2018-05-23 2022-05-16 信越半導体株式会社 原料結晶の抵抗率の測定方法及びfzシリコン単結晶の製造方法
JP7240827B2 (ja) * 2018-07-02 2023-03-16 信越半導体株式会社 原料結晶の抵抗率の測定方法及びfzシリコン単結晶の製造方法
CN113655094B (zh) * 2021-08-06 2024-01-19 上海新昇半导体科技有限公司 一种确定硅片导电类型的方法
CN113721076A (zh) * 2021-08-09 2021-11-30 上海新昇半导体科技有限公司 一种硅片电阻率的测量方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725148A (en) * 1970-08-31 1973-04-03 D Kendall Individual device tuning using localized solid-state reactions
US4140570A (en) * 1973-11-19 1979-02-20 Texas Instruments Incorporated Method of growing single crystal silicon by the Czochralski method which eliminates the need for post growth annealing for resistivity stabilization
FR2435818A1 (fr) * 1978-09-08 1980-04-04 Ibm France Procede pour accroitre l'effet de piegeage interne des corps semi-conducteurs

Also Published As

Publication number Publication date
EP0020993B1 (fr) 1984-05-30
JPS569300A (en) 1981-01-30
CA1138674A (en) 1983-01-04
EP0020993A1 (fr) 1981-01-07
IT1174671B (it) 1987-07-01
US4344815A (en) 1982-08-17
DE3068008D1 (en) 1984-07-05
FR2460479A1 (fr) 1981-01-23
JPS5830279B2 (ja) 1983-06-28

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