IT8022603A0 - Procedimento per la determinazione del contenuto di ossigeno di barre di silicio. - Google Patents
Procedimento per la determinazione del contenuto di ossigeno di barre di silicio.Info
- Publication number
- IT8022603A0 IT8022603A0 IT8022603A IT2260380A IT8022603A0 IT 8022603 A0 IT8022603 A0 IT 8022603A0 IT 8022603 A IT8022603 A IT 8022603A IT 2260380 A IT2260380 A IT 2260380A IT 8022603 A0 IT8022603 A0 IT 8022603A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- determining
- oxygen content
- silicon bars
- bars
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/834—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge further characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P36/00—Gettering within semiconductor bodies
- H10P36/03—Gettering within semiconductor bodies within silicon bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P36/00—Gettering within semiconductor bodies
- H10P36/20—Intrinsic gettering, i.e. thermally inducing defects by using oxygen present in the silicon body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/40—Treatments of semiconductor bodies to modify their internal properties, e.g. to produce internal imperfections
- H10P95/402—Treatments of semiconductor bodies to modify their internal properties, e.g. to produce internal imperfections of silicon bodies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/024—Defect control-gettering and annealing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7917302A FR2460479A1 (fr) | 1979-06-29 | 1979-06-29 | Procede de caracterisation de la teneur en oxygene des barreaux de silicium tires selon la methode czochralski |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8022603A0 true IT8022603A0 (it) | 1980-06-06 |
| IT1174671B IT1174671B (it) | 1987-07-01 |
Family
ID=9227471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT22603/80A IT1174671B (it) | 1979-06-29 | 1980-06-06 | Procedimento per la determinazione del contenuto di ossigeno di barre di silicio |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4344815A (it) |
| EP (1) | EP0020993B1 (it) |
| JP (1) | JPS5830279B2 (it) |
| CA (1) | CA1138674A (it) |
| DE (1) | DE3068008D1 (it) |
| FR (1) | FR2460479A1 (it) |
| IT (1) | IT1174671B (it) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5618575A (en) * | 1979-07-24 | 1981-02-21 | Kadoman Nagahamatani Shoten:Kk | Processed sea tangle and processing of the same |
| DE3069547D1 (en) * | 1980-06-26 | 1984-12-06 | Ibm | Process for controlling the oxygen content of silicon ingots pulled by the czochralski method |
| US4342616A (en) * | 1981-02-17 | 1982-08-03 | International Business Machines Corporation | Technique for predicting oxygen precipitation in semiconductor wafers |
| NL8102101A (nl) * | 1981-04-29 | 1982-11-16 | Philips Nv | Werkwijze voor het optrekken van een siliciumstaaf en halfgeleiderinrichting vervaardigd uit de siliciumstaaf. |
| JPS5814538A (ja) * | 1981-07-17 | 1983-01-27 | Fujitsu Ltd | 半導体装置の製造方法 |
| US4429047A (en) | 1981-08-28 | 1984-01-31 | Rca Corporation | Method for determining oxygen content in semiconductor material |
| US4437922A (en) | 1982-03-26 | 1984-03-20 | International Business Machines Corporation | Method for tailoring oxygen precipitate particle density and distribution silicon wafers |
| US4459159A (en) * | 1982-09-29 | 1984-07-10 | Mara William C O | Method for making semi-insulating substrate by post-process heating of oxygenated and doped silicon |
| JPS59120076A (ja) * | 1982-12-27 | 1984-07-11 | Takeyoshi Maeda | 海藻類を主原料とする珍味食品の製造装置 |
| JPS59187765A (ja) * | 1983-04-07 | 1984-10-24 | Maruka:Kk | 珍味の製造方法 |
| US4505759A (en) * | 1983-12-19 | 1985-03-19 | Mara William C O | Method for making a conductive silicon substrate by heat treatment of oxygenated and lightly doped silicon single crystals |
| JPS60190288U (ja) * | 1984-05-23 | 1985-12-17 | 朝日 七郎 | とろろ昆布加工装置 |
| EP0165364B1 (fr) * | 1984-06-20 | 1988-09-07 | International Business Machines Corporation | Procédé de standardisation et de stabilisation de tranches semiconductrices |
| JPS6156889U (it) * | 1984-09-19 | 1986-04-16 | ||
| US4859938A (en) * | 1986-05-05 | 1989-08-22 | Intel Corporation | Novel technique to detect oxydonor generation in IC fabrication |
| JPH0787187B2 (ja) * | 1987-08-13 | 1995-09-20 | 古河電気工業株式会社 | GaAs化合物半導体基板の製造方法 |
| JPH02263793A (ja) * | 1989-04-05 | 1990-10-26 | Nippon Steel Corp | 酸化誘起積層欠陥の発生し難いシリコン単結晶及びその製造方法 |
| US5096839A (en) * | 1989-09-20 | 1992-03-17 | Kabushiki Kaisha Toshiba | Silicon wafer with defined interstitial oxygen concentration |
| JPH0750713B2 (ja) * | 1990-09-21 | 1995-05-31 | コマツ電子金属株式会社 | 半導体ウェーハの熱処理方法 |
| JP2719851B2 (ja) * | 1991-01-29 | 1998-02-25 | 信越半導体株式会社 | シリコン単結晶棒の評価方法 |
| JP2572512B2 (ja) * | 1992-09-24 | 1997-01-16 | 信越半導体株式会社 | 拡散型シリコン素子基板の製造方法 |
| GB2279586A (en) * | 1993-01-06 | 1995-01-11 | Nippon Steel Corp | Method and apparatus for predicting crystal quality of single-crystal semiconductor |
| US5485803A (en) * | 1993-01-06 | 1996-01-23 | Nippon Steel Corporation | Method of predicting crystal quality of semiconductor single crystal and apparatus thereof |
| US5795381A (en) * | 1996-09-09 | 1998-08-18 | Memc Electrical Materials, Inc. | SIO probe for real-time monitoring and control of oxygen during czochralski growth of single crystal silicon |
| KR100240023B1 (ko) * | 1996-11-29 | 2000-01-15 | 윤종용 | 반도체 웨이퍼 열처리방법 및 이에 따라 형성된 반도체 웨이퍼 |
| KR100252214B1 (ko) * | 1997-04-23 | 2000-04-15 | 윤종용 | 반도체장치 제조용 베어 웨이퍼 분석방법 |
| US6635587B1 (en) * | 1999-09-23 | 2003-10-21 | Memc Electronic Materials, Inc. | Method for producing czochralski silicon free of agglomerated self-interstitial defects |
| KR101045309B1 (ko) * | 2004-02-03 | 2011-06-29 | 신에쯔 한도타이 가부시키가이샤 | 반도체 웨이퍼의 제조 방법 및 반도체 잉곳의 절단 위치결정 시스템 |
| FR2964459B1 (fr) * | 2010-09-02 | 2012-09-28 | Commissariat Energie Atomique | Procede de cartographie de la concentration en oxygene |
| FR2974180B1 (fr) * | 2011-04-15 | 2013-04-26 | Commissariat Energie Atomique | Procede de determination de la concentration en oxygene interstitiel. |
| FR2989168B1 (fr) * | 2012-04-06 | 2014-03-28 | Commissariat Energie Atomique | Determination de la concentration en oxygene interstitiel dans un echantillon semi-conducteur |
| FR3027676B1 (fr) | 2014-10-22 | 2016-12-09 | Commissariat Energie Atomique | Procede de caracterisation de la concentration en oxygene interstitiel dans un lingot semi-conducteur |
| FR3027675B1 (fr) | 2014-10-22 | 2017-11-24 | Commissariat Energie Atomique | Procede de caracterisation de la concentration en oxygene interstitiel dans un lingot semi-conducteur |
| JP7067267B2 (ja) * | 2018-05-23 | 2022-05-16 | 信越半導体株式会社 | 原料結晶の抵抗率の測定方法及びfzシリコン単結晶の製造方法 |
| JP7240827B2 (ja) * | 2018-07-02 | 2023-03-16 | 信越半導体株式会社 | 原料結晶の抵抗率の測定方法及びfzシリコン単結晶の製造方法 |
| CN113655094B (zh) * | 2021-08-06 | 2024-01-19 | 上海新昇半导体科技有限公司 | 一种确定硅片导电类型的方法 |
| CN113721076A (zh) * | 2021-08-09 | 2021-11-30 | 上海新昇半导体科技有限公司 | 一种硅片电阻率的测量方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3725148A (en) * | 1970-08-31 | 1973-04-03 | D Kendall | Individual device tuning using localized solid-state reactions |
| US4140570A (en) * | 1973-11-19 | 1979-02-20 | Texas Instruments Incorporated | Method of growing single crystal silicon by the Czochralski method which eliminates the need for post growth annealing for resistivity stabilization |
| FR2435818A1 (fr) * | 1978-09-08 | 1980-04-04 | Ibm France | Procede pour accroitre l'effet de piegeage interne des corps semi-conducteurs |
-
1979
- 1979-06-29 FR FR7917302A patent/FR2460479A1/fr active Pending
-
1980
- 1980-05-02 CA CA000351200A patent/CA1138674A/en not_active Expired
- 1980-05-13 EP EP80102649A patent/EP0020993B1/fr not_active Expired
- 1980-05-13 DE DE8080102649T patent/DE3068008D1/de not_active Expired
- 1980-05-20 JP JP55066052A patent/JPS5830279B2/ja not_active Expired
- 1980-06-06 IT IT22603/80A patent/IT1174671B/it active
- 1980-06-09 US US06/158,003 patent/US4344815A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0020993B1 (fr) | 1984-05-30 |
| JPS569300A (en) | 1981-01-30 |
| CA1138674A (en) | 1983-01-04 |
| EP0020993A1 (fr) | 1981-01-07 |
| IT1174671B (it) | 1987-07-01 |
| US4344815A (en) | 1982-08-17 |
| DE3068008D1 (en) | 1984-07-05 |
| FR2460479A1 (fr) | 1981-01-23 |
| JPS5830279B2 (ja) | 1983-06-28 |
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