IT8048703A0 - Procedimento ed apparecchiatura per la nichelatura chimica di pezzi metallici - Google Patents
Procedimento ed apparecchiatura per la nichelatura chimica di pezzi metalliciInfo
- Publication number
- IT8048703A0 IT8048703A0 IT8048703A IT4870380A IT8048703A0 IT 8048703 A0 IT8048703 A0 IT 8048703A0 IT 8048703 A IT8048703 A IT 8048703A IT 4870380 A IT4870380 A IT 4870380A IT 8048703 A0 IT8048703 A0 IT 8048703A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- equipment
- nickel plating
- metal pieces
- chemical nickel
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 229910052759 nickel Inorganic materials 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/168—Control of temperature, e.g. temperature of bath, substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacture And Refinement Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BG7943647A BG32650A1 (en) | 1979-05-18 | 1979-05-18 | Method for chemical nickelplating of metal parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT8048703A0 true IT8048703A0 (it) | 1980-05-16 |
Family
ID=3906083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT8048703A IT8048703A0 (it) | 1979-05-18 | 1980-05-16 | Procedimento ed apparecchiatura per la nichelatura chimica di pezzi metallici |
Country Status (9)
| Country | Link |
|---|---|
| BG (1) | BG32650A1 (cs) |
| CS (1) | CS241955B1 (cs) |
| DD (1) | DD160945A3 (cs) |
| DE (1) | DE3018511C2 (cs) |
| FR (1) | FR2456786A1 (cs) |
| GB (1) | GB2050435B (cs) |
| HU (1) | HU182797B (cs) |
| IT (1) | IT8048703A0 (cs) |
| RO (1) | RO79638A (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150307994A1 (en) * | 2014-04-29 | 2015-10-29 | Lam Research Corporation | ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS |
| US20150307995A1 (en) * | 2014-04-29 | 2015-10-29 | Lam Research Corporation | ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1179734A (fr) * | 1957-07-23 | 1959-05-27 | Procédé et appareillage perfectionnés de nickelage chimique | |
| US3709715A (en) * | 1966-05-31 | 1973-01-09 | Dow Chemical Co | Electroless nickel plating of hollow containers |
| DE1621344A1 (de) * | 1967-08-04 | 1971-05-13 | Siemens Ag | Bad und Verfahren zum chemischen Vernickeln eines festen Koerpers aus Metall,Kunststoff oder Keramik |
| US3934054A (en) * | 1969-08-25 | 1976-01-20 | Electro Chemical Engineering Gmbh | Electroless metal plating |
-
1979
- 1979-05-18 BG BG7943647A patent/BG32650A1/xx unknown
-
1980
- 1980-05-07 CS CS803263A patent/CS241955B1/cs unknown
- 1980-05-14 FR FR8010945A patent/FR2456786A1/fr active Granted
- 1980-05-14 DD DD80221246A patent/DD160945A3/xx not_active IP Right Cessation
- 1980-05-14 DE DE3018511A patent/DE3018511C2/de not_active Expired
- 1980-05-16 GB GB8016257A patent/GB2050435B/en not_active Expired
- 1980-05-16 IT IT8048703A patent/IT8048703A0/it unknown
- 1980-05-16 HU HU801220A patent/HU182797B/hu unknown
- 1980-05-17 RO RO80101164A patent/RO79638A/ro unknown
Also Published As
| Publication number | Publication date |
|---|---|
| HU182797B (en) | 1984-03-28 |
| RO79638A (ro) | 1982-08-17 |
| FR2456786A1 (fr) | 1980-12-12 |
| FR2456786B1 (cs) | 1984-12-07 |
| DE3018511C2 (de) | 1983-12-15 |
| BG32650A1 (en) | 1982-09-15 |
| DE3018511A1 (de) | 1980-11-27 |
| DD160945A3 (de) | 1984-07-04 |
| GB2050435B (en) | 1983-02-16 |
| CS241955B1 (en) | 1986-04-17 |
| GB2050435A (en) | 1981-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IT1113412B (it) | Procedimento eletttrolitico ed apparecchiatura per la preparazione di ipoalogenito di metallo alcalino | |
| IT1205236B (it) | Procedimento ed apparecchiatura per rivestire con lega per saldatura | |
| IT1114801B (it) | Procedimento ciclico per l'applicazione di rivestimenti metallici su pezzi metallici | |
| JPS5363227A (en) | Electroplating method of golddcobalt alloy | |
| DE3066182D1 (en) | Method of treating nickel base alloys | |
| AU5461580A (en) | Ni-fe alloy plating bath | |
| IT1116253B (it) | Procedimento per la preparazione delle superfici ferrose per la zincatura galvanica | |
| AU520137B2 (en) | Electrodeposition of iron alloys of nickel and/or copper | |
| NO147994C (no) | Fremgangsmaate til fremstilling av en elektrolytisk utfelling og pletteringsopploesning til utfoerelse av fremgangsmaaten | |
| JPS55134191A (en) | Silver or silver alloy plating bath | |
| JPS5747859A (en) | High temperature plating of metal object | |
| GB2063237B (en) | Inhibiting corrosion of nickel surfaces | |
| JPS5421905A (en) | Reextracting of metal | |
| JPS5693891A (en) | Plating of silverrplatinum metal alloy and product | |
| IT8048703A0 (it) | Procedimento ed apparecchiatura per la nichelatura chimica di pezzi metallici | |
| JPS5653872A (en) | Method of brazing metallic member | |
| JPS52114536A (en) | Method of foliating electroplated layer of nickel alloy and composition and solution used therefor | |
| GB8313515D0 (en) | High nickel austenite alloys | |
| IT7868170A0 (it) | Procedimento e dispositivo per la stagnatura elettrolitica di substrati ferrosi | |
| JPS5659010A (en) | Connection metal equipment | |
| IT1147767B (it) | Procedimento per la lucidatura chimica di metalli e composizione per la sua attuazione | |
| ES493700A0 (es) | Un metodo mejorado y su equipo para la electrodeposicion de metales preciosos sobre componentes | |
| JPS52107239A (en) | Cobaltttin alloy plating bath | |
| IT8148630A0 (it) | Procedimento ed apparecchiatura per formare leghe metalliche | |
| JPS5299932A (en) | Method of dryyreplenishing chemical plating solution |