IT8167917A0 - Contenitore per semiconduttori - Google Patents

Contenitore per semiconduttori

Info

Publication number
IT8167917A0
IT8167917A0 IT8167917A IT6791781A IT8167917A0 IT 8167917 A0 IT8167917 A0 IT 8167917A0 IT 8167917 A IT8167917 A IT 8167917A IT 6791781 A IT6791781 A IT 6791781A IT 8167917 A0 IT8167917 A0 IT 8167917A0
Authority
IT
Italy
Prior art keywords
semiconductors
container
Prior art date
Application number
IT8167917A
Other languages
English (en)
Inventor
William S Phy
Original Assignee
Fairchild Camera Instr Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera Instr Co filed Critical Fairchild Camera Instr Co
Publication of IT8167917A0 publication Critical patent/IT8167917A0/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
IT8167917A 1980-07-02 1981-07-01 Contenitore per semiconduttori IT8167917A0 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16545780A 1980-07-02 1980-07-02

Publications (1)

Publication Number Publication Date
IT8167917A0 true IT8167917A0 (it) 1981-07-01

Family

ID=22598970

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8167917A IT8167917A0 (it) 1980-07-02 1981-07-01 Contenitore per semiconduttori

Country Status (6)

Country Link
JP (1) JPS5745263A (it)
DE (1) DE3123844A1 (it)
FR (1) FR2486307A1 (it)
GB (1) GB2079534A (it)
IT (1) IT8167917A0 (it)
NL (1) NL8102871A (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3380082D1 (en) * 1982-10-21 1989-07-20 Abbott Lab A method of establishing electrical connections at a semiconductor device
US4547795A (en) * 1983-03-24 1985-10-15 Bourns, Inc. Leadless chip carrier with frangible shorting bars
JPS6263455A (ja) * 1985-09-13 1987-03-20 Hitachi Cable Ltd リ−ドフレ−ムの製造方法
JPS6422043U (it) * 1987-07-30 1989-02-03
WO1989008324A1 (en) * 1988-02-29 1989-09-08 Digital Equipment Corporation Alignment of leads for ceramic integrated circuit packages
US4987475A (en) * 1988-02-29 1991-01-22 Digital Equipment Corporation Alignment of leads for ceramic integrated circuit packages
FR2750798B1 (fr) * 1996-07-02 1998-11-06 Sgs Thomson Microelectronics Boitier a faible cout pour circuits integres fabriques en petite quantite

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1288983A (it) * 1968-11-06 1972-09-13
US3550766A (en) * 1969-03-03 1970-12-29 David Nixen Flat electronic package assembly
GB1258870A (it) * 1969-09-29 1971-12-30
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same

Also Published As

Publication number Publication date
NL8102871A (nl) 1982-02-01
JPS5745263A (en) 1982-03-15
FR2486307A1 (fr) 1982-01-08
DE3123844A1 (de) 1982-04-08
GB2079534A (en) 1982-01-20

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