IT8720766A0 - Componente elettrico a circuito piazzola di supporto per chip per integrato. - Google Patents
Componente elettrico a circuito piazzola di supporto per chip per integrato.Info
- Publication number
- IT8720766A0 IT8720766A0 IT8720766A IT2076687A IT8720766A0 IT 8720766 A0 IT8720766 A0 IT 8720766A0 IT 8720766 A IT8720766 A IT 8720766A IT 2076687 A IT2076687 A IT 2076687A IT 8720766 A0 IT8720766 A0 IT 8720766A0
- Authority
- IT
- Italy
- Prior art keywords
- electrical component
- integrated chip
- circuit support
- component circuit
- support pitch
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/331—Shapes of die-attach connectors
- H10W72/334—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT8720766A IT1215538B (it) | 1987-06-03 | 1987-06-03 | Componente elettrico a circuito piazzola di supporto per chip per integrato. |
| EP88201014A EP0293970A3 (en) | 1987-06-03 | 1988-05-20 | Pad for supporting a chip of an integrated-circuit electronic component |
| JP63128559A JPS63310151A (ja) | 1987-06-03 | 1988-05-27 | 集積回路電子部品のチップの支持パッド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT8720766A IT1215538B (it) | 1987-06-03 | 1987-06-03 | Componente elettrico a circuito piazzola di supporto per chip per integrato. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8720766A0 true IT8720766A0 (it) | 1987-06-03 |
| IT1215538B IT1215538B (it) | 1990-02-14 |
Family
ID=11171754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT8720766A IT1215538B (it) | 1987-06-03 | 1987-06-03 | Componente elettrico a circuito piazzola di supporto per chip per integrato. |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0293970A3 (it) |
| JP (1) | JPS63310151A (it) |
| IT (1) | IT1215538B (it) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878605A (ja) * | 1994-09-01 | 1996-03-22 | Hitachi Ltd | リードフレームおよびそれを用いた半導体集積回路装置 |
| JP3384901B2 (ja) * | 1995-02-02 | 2003-03-10 | 三菱電機株式会社 | リードフレーム |
| JPH08236683A (ja) * | 1995-02-28 | 1996-09-13 | Nec Corp | リードフレーム |
| JPH0992776A (ja) * | 1995-09-28 | 1997-04-04 | Mitsubishi Electric Corp | リードフレームおよび半導体装置 |
| US5818103A (en) * | 1997-03-28 | 1998-10-06 | Nec Corporation | Semiconductor device mounted on a grooved head frame |
| JP5689462B2 (ja) * | 2010-05-12 | 2015-03-25 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0146330A3 (en) * | 1983-12-12 | 1986-08-13 | Texas Instruments Incorporated | Integrated circuit device with textured bar pad |
| JPS6113650A (ja) * | 1984-06-28 | 1986-01-21 | Nec Corp | 混成集積回路装置 |
| JPS6116555A (ja) * | 1984-07-03 | 1986-01-24 | Hitachi Chem Co Ltd | プラスチツク封止型半導体装置 |
| JPS61184854A (ja) * | 1985-02-13 | 1986-08-18 | Oki Electric Ind Co Ltd | 樹脂封止形半導体装置 |
-
1987
- 1987-06-03 IT IT8720766A patent/IT1215538B/it active
-
1988
- 1988-05-20 EP EP88201014A patent/EP0293970A3/en not_active Withdrawn
- 1988-05-27 JP JP63128559A patent/JPS63310151A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0293970A2 (en) | 1988-12-07 |
| JPS63310151A (ja) | 1988-12-19 |
| IT1215538B (it) | 1990-02-14 |
| EP0293970A3 (en) | 1989-04-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970628 |