IT8720766A0 - Componente elettrico a circuito piazzola di supporto per chip per integrato. - Google Patents

Componente elettrico a circuito piazzola di supporto per chip per integrato.

Info

Publication number
IT8720766A0
IT8720766A0 IT8720766A IT2076687A IT8720766A0 IT 8720766 A0 IT8720766 A0 IT 8720766A0 IT 8720766 A IT8720766 A IT 8720766A IT 2076687 A IT2076687 A IT 2076687A IT 8720766 A0 IT8720766 A0 IT 8720766A0
Authority
IT
Italy
Prior art keywords
electrical component
integrated chip
circuit support
component circuit
support pitch
Prior art date
Application number
IT8720766A
Other languages
English (en)
Other versions
IT1215538B (it
Inventor
Peter Wragg
Original Assignee
Sgs Microelettronica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Microelettronica Spa filed Critical Sgs Microelettronica Spa
Priority to IT8720766A priority Critical patent/IT1215538B/it
Publication of IT8720766A0 publication Critical patent/IT8720766A0/it
Priority to EP88201014A priority patent/EP0293970A3/en
Priority to JP63128559A priority patent/JPS63310151A/ja
Application granted granted Critical
Publication of IT1215538B publication Critical patent/IT1215538B/it

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/411Chip-supporting parts, e.g. die pads
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07351Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/331Shapes of die-attach connectors
    • H10W72/334Cross-sectional shape, i.e. in side view
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
IT8720766A 1987-06-03 1987-06-03 Componente elettrico a circuito piazzola di supporto per chip per integrato. IT1215538B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT8720766A IT1215538B (it) 1987-06-03 1987-06-03 Componente elettrico a circuito piazzola di supporto per chip per integrato.
EP88201014A EP0293970A3 (en) 1987-06-03 1988-05-20 Pad for supporting a chip of an integrated-circuit electronic component
JP63128559A JPS63310151A (ja) 1987-06-03 1988-05-27 集積回路電子部品のチップの支持パッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8720766A IT1215538B (it) 1987-06-03 1987-06-03 Componente elettrico a circuito piazzola di supporto per chip per integrato.

Publications (2)

Publication Number Publication Date
IT8720766A0 true IT8720766A0 (it) 1987-06-03
IT1215538B IT1215538B (it) 1990-02-14

Family

ID=11171754

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8720766A IT1215538B (it) 1987-06-03 1987-06-03 Componente elettrico a circuito piazzola di supporto per chip per integrato.

Country Status (3)

Country Link
EP (1) EP0293970A3 (it)
JP (1) JPS63310151A (it)
IT (1) IT1215538B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878605A (ja) * 1994-09-01 1996-03-22 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置
JP3384901B2 (ja) * 1995-02-02 2003-03-10 三菱電機株式会社 リードフレーム
JPH08236683A (ja) * 1995-02-28 1996-09-13 Nec Corp リードフレーム
JPH0992776A (ja) * 1995-09-28 1997-04-04 Mitsubishi Electric Corp リードフレームおよび半導体装置
US5818103A (en) * 1997-03-28 1998-10-06 Nec Corporation Semiconductor device mounted on a grooved head frame
JP5689462B2 (ja) * 2010-05-12 2015-03-25 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0146330A3 (en) * 1983-12-12 1986-08-13 Texas Instruments Incorporated Integrated circuit device with textured bar pad
JPS6113650A (ja) * 1984-06-28 1986-01-21 Nec Corp 混成集積回路装置
JPS6116555A (ja) * 1984-07-03 1986-01-24 Hitachi Chem Co Ltd プラスチツク封止型半導体装置
JPS61184854A (ja) * 1985-02-13 1986-08-18 Oki Electric Ind Co Ltd 樹脂封止形半導体装置

Also Published As

Publication number Publication date
EP0293970A2 (en) 1988-12-07
JPS63310151A (ja) 1988-12-19
IT1215538B (it) 1990-02-14
EP0293970A3 (en) 1989-04-26

Similar Documents

Publication Publication Date Title
DE3786844D1 (de) Packung fuer integrierte schaltung.
DE3885112D1 (de) Gehäuse einer integrierten Schaltung.
DE3853814D1 (de) Integrierte Halbleiterschaltung.
DE3879804D1 (de) Integrierte halbleiterschaltungsvorrichtung.
DE3772078D1 (de) Gehaeuse fuer integrierte schaltung.
DE3877846D1 (de) Abdeckstreifen fuer eine reihenanordnung fuer elektronische bauelemente.
IT8322983A0 (it) Procedimento per fabbricare un dispositivo a circuito integrato a semiconduttori.
DE3779971D1 (de) Verbinder fuer eine gedruckte leiterplatte.
IT8421908A0 (it) Dispositivo a circuito integrato a semiconduttore.
DE68921088D1 (de) Integrierte Halbleiterschaltung.
DE3773456D1 (de) Verbindungsgeraet fuer integrierte schaltung.
DE3782775D1 (de) Integrierte halbleiterschaltung.
IT8520269A0 (it) Dispositivo a circuito integrato a semiconduttori e procedimento per la produzione di esso.
DE3887849D1 (de) Integrierte Schaltungspackung.
DE3776049D1 (de) Elektronische gedaechtnisstuetze.
DE3884492D1 (de) Integrierte halbleiterschaltungsanordnung.
DE3889570D1 (de) Halbleiterschaltung.
DE3677165D1 (de) Integrierte halbleiterschaltungsanordnung.
DE3684364D1 (de) Integrierte halbleiterschaltung.
DE3763221D1 (de) Reservevorrichtung fuer elektronischen verteiler.
IT8519790A0 (it) Procedimento per effettuare la saldatura di componenti elettronici su un supporto.
ES546383A0 (es) Dispositivo de circuito integrado.
IT8720766A0 (it) Componente elettrico a circuito piazzola di supporto per chip per integrato.
DE3675666D1 (de) Integrierte halbleiterschaltungsanordnung.
DE68910445D1 (de) Integrierter Halbleiterschaltkreis.

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970628