IT9067561A0 - Processo di ramatura privo di cianuro - Google Patents

Processo di ramatura privo di cianuro

Info

Publication number: IT9067561A0
Authority: IT; Italy
Prior art keywords: cyanide; copper plating; plating process; free copper; free
Prior art date: 1989-07-24

Application number

IT9067561A

Other languages

English (en)

Other versions

IT1240490B (it

IT9067561A1 (it

Inventor

George A Kline

Original Assignee

Omi Int Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-07-24

Filing date

1990-07-18

Publication date

1990-07-18

1990-07-18 Application filed by Omi Int Corp filed Critical Omi Int Corp

1990-07-18 Publication of IT9067561A0 publication Critical patent/IT9067561A0/it

1992-01-18 Publication of IT9067561A1 publication Critical patent/IT9067561A1/it

1993-12-17 Application granted granted Critical

1993-12-17 Publication of IT1240490B publication Critical patent/IT1240490B/it

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Electroplating Methods And Accessories (AREA)
Conductive Materials (AREA)
Removal Of Specific Substances (AREA)
Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

IT67561A 1989-07-24 1990-07-18 Processo di ramatura privo di cianuro IT1240490B (it)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US07/382,441 US4933051A (en)	1989-07-24	1989-07-24	Cyanide-free copper plating process

Publications (3)

Publication Number	Publication Date
IT9067561A0 true IT9067561A0 (it)	1990-07-18
IT9067561A1 IT9067561A1 (it)	1992-01-18
IT1240490B IT1240490B (it)	1993-12-17

Family

ID=23508963

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IT67561A IT1240490B (it)	1989-07-24	1990-07-18	Processo di ramatura privo di cianuro

Country Status (8)

Country	Link
US (1)	US4933051A (it)
JP (1)	JP3131648B2 (it)
AU (1)	AU647402B2 (it)
DE (1)	DE4023444C2 (it)
FR (1)	FR2649996B1 (it)
GB (1)	GB2234260B (it)
IT (1)	IT1240490B (it)
MX (1)	MX164110B (it)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5273637A (en) *	1989-08-09	1993-12-28	Poly Techs, Inc.	Electrodeposition coating system
GB9005337D0 (en) *	1990-03-09	1990-05-02	Dowty Electronic Components	Electrodeposition of lithium
CA2053342A1 (en) *	1990-10-22	1992-04-23	Robert A. Tremmel	Nickel electroplating process with reduced nickel ion build up
US5100517A (en) *	1991-04-08	1992-03-31	The Goodyear Tire & Rubber Company	Process for applying a copper layer to steel wire
US5266212A (en) *	1992-10-13	1993-11-30	Enthone-Omi, Inc.	Purification of cyanide-free copper plating baths
GB2337765A (en) *	1998-05-27	1999-12-01	Solicitor For The Affairs Of H	Aluminium diffusion of copper coatings
US6054037A (en) *	1998-11-11	2000-04-25	Enthone-Omi, Inc.	Halogen additives for alkaline copper use for plating zinc die castings
US7273535B2 (en) *	2003-09-17	2007-09-25	Applied Materials, Inc.	Insoluble anode with an auxiliary electrode
US20050145499A1 (en) *	2000-06-05	2005-07-07	Applied Materials, Inc.	Plating of a thin metal seed layer
TWI268966B (en) *	2001-06-07	2006-12-21	Shipley Co Llc	Electrolytic copper plating method
JP4806498B2 (ja) *	2001-08-01	2011-11-02	凸版印刷株式会社	プリント配線基板の製造装置および製造方法
US7422673B2 (en) *	2003-05-22	2008-09-09	Ufs Corporation	Membrane electrode assemblies and electropaint systems incorporating same
US7252706B2 (en) *	2003-06-17	2007-08-07	Phibro-Tech, Inc.	Inhibition of calcium and magnesium precipitation from wood preservatives
US7105879B2 (en) *	2004-04-20	2006-09-12	Taiwan Semiconductor Manufacturing Co., Ltd.	Write line design in MRAM
US7803257B2 (en)	2004-10-22	2010-09-28	Taiwan Semiconductor Manufacturing Company	Current-leveling electroplating/electropolishing electrode
US20090035603A1 (en) *	2006-02-07	2009-02-05	Hitachi Metals, Ltd.,	Method for producing rare earth metal-based permanent magnet having copper plating film on surface thereof
US20080156652A1 (en) *	2006-12-28	2008-07-03	Chang Gung University	Cyanide-free pre-treating solution for electroplating copper coating layer on zinc alloy surface and a pre-treating method thereof
US20090250352A1 (en) *	2008-04-04	2009-10-08	Emat Technology, Llc	Methods for electroplating copper
CN103388164A (zh) *	2013-08-09	2013-11-13	湖北德美科技有限公司	一种无氰碱铜电镀工艺及配方
CN105177684A (zh) *	2015-07-17	2015-12-23	武汉吉和昌化工科技股份有限公司	一种无氰碱性镀铜的不溶性阳极及其电镀工艺

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US1465034A (en) *	1921-11-03	1923-08-14	Frank L Antisell	Process for the electrolytic deposition of copper
DE1496917A1 (de) *	1964-09-22	1969-05-22	Monsanto Co	Elektrolytbaeder sowie Verfahren fuer die Herstellung galvanischer UEberzuege
US3474011A (en) *	1967-08-03	1969-10-21	American Bank Note Co	Electroplating method and apparatus
BE791401A (fr) *	1971-11-15	1973-05-14	Monsanto Co	Compositions et procedes electrochimiques
US3833486A (en) *	1973-03-26	1974-09-03	Lea Ronal Inc	Cyanide-free electroplating
US3928147A (en) *	1973-10-09	1975-12-23	Monsanto Co	Method for electroplating
JPS5321048A (en) *	1976-08-10	1978-02-27	Nippon Electric Co	Constant current density plating device
DE3012168A1 (de) *	1980-03-27	1981-10-01	Schering Ag Berlin Und Bergkamen, 1000 Berlin	Verfahren zur galvanischen abscheidung von kupferniederschlaegen
CA1190514A (en) *	1981-06-25	1985-07-16	George R. Scanlon	High speed plating of flat planar workpieces
DE3144128C1 (de) *	1981-11-06	1983-06-09	Bayerische Motoren Werke AG, 8000 München	Vorrichtung zum galvanischen Abscheiden eines Metalls auf einem metallischen Werkstueck
US4469564A (en) *	1982-08-11	1984-09-04	At&T Bell Laboratories	Copper electroplating process
FR2540153B1 (fr) *	1982-10-12	1987-02-13	Roquette Freres	Composition et procede de couchage du papier et du carton, procede de preparation de la composition et papier et carton ainsi obtenus
DE3347593A1 (de) *	1983-01-03	1984-07-05	Omi International Corp., Warren, Mich.	Waessriger alkalischer cyanidfreier kupferelektrolyt und verfahren zur galvanischen abscheidung einer kornverfeinerten duktilen und haftfesten kupferschicht auf einem leitfaehigen substrat
US4469569A (en) *	1983-01-03	1984-09-04	Omi International Corporation	Cyanide-free copper plating process
US4462874A (en) *	1983-11-16	1984-07-31	Omi International Corporation	Cyanide-free copper plating process
SU1157146A1 (ru) *	1983-07-25	1985-05-23	Предприятие П/Я М-5353	Способ гальванического меднени и одновременной очистки электролита от примесей
US4521282A (en) *	1984-07-11	1985-06-04	Omi International Corporation	Cyanide-free copper electrolyte and process
US4762601A (en) *	1986-11-10	1988-08-09	Morton Thiokol, Inc.	Copper bath for electroless plating having excess counter-cation and process using same
JPS63317698A (ja) *	1987-06-20	1988-12-26	Toyota Motor Corp	電気めっき液の金属イオン濃度と水素イオン濃度の制御装置
US4906340A (en) *	1989-05-31	1990-03-06	Eco-Tec Limited	Process for electroplating metals
EP0871213A3 (en) *	1997-03-27	1999-03-03	Siemens Aktiengesellschaft	Method for producing vias having variable sidewall profile

1989
- 1989-07-24 US US07/382,441 patent/US4933051A/en not_active Expired - Fee Related
1990
- 1990-07-16 FR FR9009041A patent/FR2649996B1/fr not_active Expired - Fee Related
- 1990-07-18 IT IT67561A patent/IT1240490B/it active IP Right Grant
- 1990-07-20 MX MX21681A patent/MX164110B/es unknown
- 1990-07-20 JP JP02192841A patent/JP3131648B2/ja not_active Expired - Fee Related
- 1990-07-23 AU AU59704/90A patent/AU647402B2/en not_active Ceased
- 1990-07-24 DE DE4023444A patent/DE4023444C2/de not_active Expired - Fee Related
- 1990-07-24 GB GB9016194A patent/GB2234260B/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
AU647402B2 (en)	1994-03-24
GB2234260B (en)	1994-01-12
FR2649996A1 (fr)	1991-01-25
GB2234260A (en)	1991-01-30
US4933051A (en)	1990-06-12
FR2649996B1 (fr)	1993-03-19
DE4023444A1 (de)	1991-01-31
IT1240490B (it)	1993-12-17
IT9067561A1 (it)	1992-01-18
GB9016194D0 (en)	1990-09-05
JP3131648B2 (ja)	2001-02-05
JPH0375400A (ja)	1991-03-29
DE4023444C2 (de)	1995-02-23
MX164110B (es)	1992-07-16
AU5970490A (en)	1991-01-24

Legal Events

Date	Code	Title	Description
1993-12-17	0001	Granted
1999-10-27	TA	Fee payment date (situation as of event date), data collected since 19931001	Effective date: 19960729

Publication	Publication Date	Title
IT9067561A0 (it)	1990-07-18	Processo di ramatura privo di cianuro
BR8100970A (pt)	1981-08-25	Banho para eletrodeposicao de cobre e processo
FI972472L (fi)	1997-08-11	Kuparipinnoite
DE3672284D1 (de)	1990-08-02	Stromloses plattierungsverfahren.
BR9007193A (pt)	1991-11-26	Processo de recuperacao de metais nobres
DE69613286D1 (de)	2001-07-19	Elektroplattierungsverfahren
DE69122910D1 (de)	1996-12-05	Verfahren zur Kupfer-Elektroplattierung
DE69414324D1 (de)	1998-12-10	Elektrobeschichtungsverfahren
DE69002656D1 (de)	1993-09-16	Formaldehydfreie stromlose kupferplattierloesung.
AT380902B (de)	1986-07-25	Goldplattierungsbad
DE69007500D1 (de)	1994-04-28	Lösung für stromlose Kupferplattierung.
BR8800115A (pt)	1988-08-23	Processo para tratamento de solucao aquosa
DE69015689D1 (de)	1995-02-16	Stromloses Plattierverfahren.
DE69306189D1 (de)	1997-01-09	Verbesserte stromlose Kupferplattierung
BR8404612A (pt)	1985-08-06	Processo de deposicao de cobre metalico
IT1237526B (it)	1993-06-08	Processo di preparazione di un intermedio per il diltiazem
GB8529856D0 (en)	1986-01-15	Cyanide-free copper plating process
DE59105753D1 (de)	1995-07-27	Galvanisierungsverfahren.
DE3874106D1 (de)	1992-10-01	Mechanisches plattierungsverfahren.
BR9202478A (pt)	1993-02-09	Processo de producao de um padrao metalico
IT8367131A0 (it)	1983-02-07	Procedimento di elettroplaccatura particolarmente cromatura
BR9001748A (pt)	1991-06-04	Processo para fabricacao de bastao de cobre
IT1250913B (it)	1995-04-21	Processo di sottomurazione
IT9067997A0 (it)	1990-12-12	Procedimento per la purificazione di bagni di nichelatura
DE69121597D1 (de)	1996-10-02	Plattierungsverfahren