ITMI20061960A1 - Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato - Google Patents

Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato

Info

Publication number
ITMI20061960A1
ITMI20061960A1 ITMI20061960A ITMI20061960A1 IT MI20061960 A1 ITMI20061960 A1 IT MI20061960A1 IT MI20061960 A ITMI20061960 A IT MI20061960A IT MI20061960 A1 ITMI20061960 A1 IT MI20061960A1
Authority
IT
Italy
Prior art keywords
multilayer
semi
finished
layers
optical alignment
Prior art date
Application number
Other languages
English (en)
Inventor
Bruno Ceraso
Original Assignee
Cedal Equipment Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cedal Equipment Srl filed Critical Cedal Equipment Srl
Priority to ITMI20061960 priority Critical patent/ITMI20061960A1/it
Priority to PCT/IT2006/000834 priority patent/WO2008044254A1/en
Priority to TW96100476A priority patent/TW200817128A/zh
Publication of ITMI20061960A1 publication Critical patent/ITMI20061960A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
ITMI20061960 2006-10-13 2006-10-13 Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato ITMI20061960A1 (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ITMI20061960 ITMI20061960A1 (it) 2006-10-13 2006-10-13 Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato
PCT/IT2006/000834 WO2008044254A1 (en) 2006-10-13 2006-12-04 Automatic machine for optical alignment and inductive bonding of the layers of a semi-finished multilayer printed circuit
TW96100476A TW200817128A (en) 2006-10-13 2007-01-05 Automatic machine for optical alignment and inductive bonding of the layers of a semi-finished multilayer printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI20061960 ITMI20061960A1 (it) 2006-10-13 2006-10-13 Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato

Publications (1)

Publication Number Publication Date
ITMI20061960A1 true ITMI20061960A1 (it) 2008-04-14

Family

ID=38136076

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI20061960 ITMI20061960A1 (it) 2006-10-13 2006-10-13 Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato

Country Status (3)

Country Link
IT (1) ITMI20061960A1 (it)
TW (1) TW200817128A (it)
WO (1) WO2008044254A1 (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013015157A1 (ja) * 2011-07-27 2013-01-31 住友重機械工業株式会社 基板製造装置及び基板製造方法
CN107870252B (zh) * 2017-12-21 2024-01-23 深圳市新啟电子科技有限公司 一种用于电子元器件的测试夹具
CN108673637B (zh) * 2018-01-23 2024-07-09 深圳市隆阳自动化设备有限公司 一种偏心定位机构及具有偏心定位机构的对位冲床系统
CN108724047B (zh) * 2018-06-21 2020-08-14 邵东智能制造技术研究院有限公司 一种老虎钳的翻转方法及老虎钳夹持装置
CN110682271B (zh) * 2019-09-03 2023-04-04 贵州航天电器股份有限公司 一种用于圆形连接器生产线载具更换销钉的设备及方法
CN111712055B (zh) * 2020-08-22 2020-11-24 东莞栢能电子科技有限公司 一种pcb双面拼板的控制装置
CN112935749B (zh) * 2021-03-04 2024-05-31 广西玉柴机器股份有限公司 一种柴油机托盘自动翻转装置
CN113490350A (zh) * 2021-07-28 2021-10-08 湖南维胜科技电路板有限公司 一种pcb板及其压合工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2190757B1 (es) * 2001-12-28 2005-07-16 Chemplate Materials, S.L. Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo.
US20040055131A1 (en) * 2002-09-24 2004-03-25 Abid Ghuman Method of assembling vehicles in a flexible manufacturing system

Also Published As

Publication number Publication date
WO2008044254A1 (en) 2008-04-17
TW200817128A (en) 2008-04-16

Similar Documents

Publication Publication Date Title
EP2313923A4 (en) MANUFACTURE OF A DEVICE WITH INTEGRATED 3D CIRCUIT
ITMI20070523A1 (it) Circuito automatico a involucro stampato
DE602007013703D1 (de) Mehrschichtiges abbildbares element mit sulfonamidharz
FI20075572A0 (fi) Sulatettu komponenttinen monikerrospiirilevy ja sen valmistusmenetelmä
EP2152973A4 (en) LINE MARKING DEVICE WITH AUTOMATIC TRACING
DK2803374T3 (da) Autoinjektorindretning med en fleksibel beholder
EP2288746A4 (en) LATENT ELASTIC COMPOSITE OF MULTILAYER FILM
EP2259921A4 (en) METHOD FOR PRODUCING A COATED PCB
EP2259668A4 (en) METHOD FOR PRODUCING A MULTILAYER CONDUCTOR PLATE
DE602009000480D1 (de) Elektronikvorrichtung mit Projektormodul
DE602006004168D1 (de) Externes Fixierelement mit einer rauhen, abgetragenen Oberfläche
DE502007002499D1 (de) Bauteil mit einer panzerung
EP2033417A4 (en) FOLDABLE DEVICE WITH THIN PROFILE
EP2450187A4 (en) MULTILAYER POLYESTER FILM
PL2219862T3 (pl) Element wielowarstwowy zawierający warstwę funkcyjną o regulowanych elektrycznie właściwościach optycznych
DE602007007169D1 (de) Kupplungsanordnung mit Führungselement
EP2015324A4 (en) FILM CAPACITOR
EP2130783A4 (en) MULTILAYER POLYESTER CONTAINER AND METHOD FOR PRODUCING THE SAME
DE602007002325D1 (de) Filtervorrichtung mit Ansaugpumpe
BRPI0812579A2 (pt) Método de fabricação de placas de circuito
BRPI0822241A2 (pt) Artigos multicamadas de fluoropolímero
IT1390783B1 (it) Struttura di lampada a led con circuito elettronico interno perfezionata
DE602005002539D1 (de) Integrierte schaltung mit einer sehr kleinen lesediode
EP2137847A4 (en) INTEGRATED MULTIMODE CIRCUIT FOR USE IN OPTOELECTRONIC DEVICES
ATE467570T1 (de) Klappschachtel mit integrierten zusätzlichen flächen