ITMI20072399A1 - Scheda sonde migliorata per collaudare circuiti integrati - Google Patents

Scheda sonde migliorata per collaudare circuiti integrati

Info

Publication number
ITMI20072399A1
ITMI20072399A1 IT002399A ITMI20072399A ITMI20072399A1 IT MI20072399 A1 ITMI20072399 A1 IT MI20072399A1 IT 002399 A IT002399 A IT 002399A IT MI20072399 A ITMI20072399 A IT MI20072399A IT MI20072399 A1 ITMI20072399 A1 IT MI20072399A1
Authority
IT
Italy
Prior art keywords
integrated circuits
probe board
test integrated
board improved
improved
Prior art date
Application number
IT002399A
Other languages
English (en)
Inventor
Alberto Pagani
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT002399A priority Critical patent/ITMI20072399A1/it
Priority to EP08863657A priority patent/EP2235546A1/en
Priority to EP18151529.7A priority patent/EP3339868A1/en
Priority to CN200880127253.8A priority patent/CN101946182B/zh
Priority to US12/809,964 priority patent/US8604816B2/en
Priority to PCT/EP2008/068047 priority patent/WO2009080760A1/en
Publication of ITMI20072399A1 publication Critical patent/ITMI20072399A1/it
Priority to US14/080,112 priority patent/US20140070834A1/en
Priority to US15/290,386 priority patent/US10060972B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62M—RIDER PROPULSION OF WHEELED VEHICLES OR SLEDGES; POWERED PROPULSION OF SLEDGES OR SINGLE-TRACK CYCLES; TRANSMISSIONS SPECIALLY ADAPTED FOR SUCH VEHICLES
    • B62M25/00—Actuators for gearing speed-change mechanisms specially adapted for cycles
    • B62M25/02—Actuators for gearing speed-change mechanisms specially adapted for cycles with mechanical transmitting systems, e.g. cables, levers
    • B62M25/04—Actuators for gearing speed-change mechanisms specially adapted for cycles with mechanical transmitting systems, e.g. cables, levers hand actuated
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
IT002399A 2007-12-20 2007-12-20 Scheda sonde migliorata per collaudare circuiti integrati ITMI20072399A1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT002399A ITMI20072399A1 (it) 2007-12-20 2007-12-20 Scheda sonde migliorata per collaudare circuiti integrati
EP08863657A EP2235546A1 (en) 2007-12-20 2008-12-19 Improved probe card for testing integrated circuits
EP18151529.7A EP3339868A1 (en) 2007-12-20 2008-12-19 Improved probe card for testing integrated circuits
CN200880127253.8A CN101946182B (zh) 2007-12-20 2008-12-19 用于测试集成电路的改进探针卡
US12/809,964 US8604816B2 (en) 2007-12-20 2008-12-19 Probe card for testing integrated circuits
PCT/EP2008/068047 WO2009080760A1 (en) 2007-12-20 2008-12-19 Improved probe card for testing integrated circuits
US14/080,112 US20140070834A1 (en) 2007-12-20 2013-11-14 Probe card for testing integrated circuits
US15/290,386 US10060972B2 (en) 2007-12-20 2016-10-11 Probe card for testing integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT002399A ITMI20072399A1 (it) 2007-12-20 2007-12-20 Scheda sonde migliorata per collaudare circuiti integrati

Publications (1)

Publication Number Publication Date
ITMI20072399A1 true ITMI20072399A1 (it) 2009-06-21

Family

ID=40315632

Family Applications (1)

Application Number Title Priority Date Filing Date
IT002399A ITMI20072399A1 (it) 2007-12-20 2007-12-20 Scheda sonde migliorata per collaudare circuiti integrati

Country Status (5)

Country Link
US (3) US8604816B2 (it)
EP (2) EP2235546A1 (it)
CN (1) CN101946182B (it)
IT (1) ITMI20072399A1 (it)
WO (1) WO2009080760A1 (it)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20072399A1 (it) * 2007-12-20 2009-06-21 St Microelectronics Srl Scheda sonde migliorata per collaudare circuiti integrati
US8564319B2 (en) * 2010-06-17 2013-10-22 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card for simultaneously testing multiple dies
TWI435083B (zh) * 2010-07-27 2014-04-21 Mpi Corp Combination probe head for vertical probe card and its assembly alignment method
US8723538B2 (en) * 2011-06-17 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Probe head formation methods employing guide plate raising assembly mechanism
JP6220596B2 (ja) * 2013-08-01 2017-10-25 東京エレクトロン株式会社 プローバ
US9508618B2 (en) * 2014-04-11 2016-11-29 Globalfoundries Inc. Staggered electrical frame structures for frame area reduction
US20150369842A1 (en) * 2014-06-19 2015-12-24 Francis T. McQuade Probe card for testing semiconductor wafers
US9927463B2 (en) 2015-10-20 2018-03-27 International Business Machines Corporation Wafer probe alignment
TWI596344B (zh) * 2016-04-27 2017-08-21 旺矽科技股份有限公司 Replaceable probe module probe card and its assembly method and probe module replacement side law
TW201825917A (zh) * 2016-11-10 2018-07-16 美商川斯萊緹公司 具有晶粒級及接針級順應性之探針卡總成及其相關聯系統與方法
US10175296B2 (en) * 2016-12-07 2019-01-08 Intel Corporation Testing a board assembly using test cards
IT201600127581A1 (it) * 2016-12-16 2018-06-16 Technoprobe Spa Testa di misura per un’apparecchiatura di test di dispositivi elettronici con migliorate proprietà di filtraggio
CN120009582A (zh) * 2019-02-21 2025-05-16 维耶尔公司 用于微装置检验的探针结构
IT201900014211A1 (it) * 2019-08-07 2021-02-07 Technoprobe Spa Testa di misura a sonde verticali perfezionata
CN111638442A (zh) * 2020-06-10 2020-09-08 深圳市道格特科技有限公司 Mems工艺制备的悬臂梁探针卡及制备方法
CN111766418B (zh) * 2020-08-14 2021-01-19 强一半导体（苏州）有限公司 Mems探针卡
CN114397482A (zh) * 2021-12-20 2022-04-26 百及纳米科技(上海)有限公司 探针装置与探针控制设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US6672875B1 (en) * 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
JP4476467B2 (ja) 2000-11-06 2010-06-09 東京エレクトロン株式会社 コンタクタの組立装置及び組立方法
US20060091510A1 (en) * 2004-03-11 2006-05-04 Chipmos Technologies (Bermuda) Ltd. Probe card interposer
TWI287634B (en) * 2004-12-31 2007-10-01 Wen-Chang Dung Micro-electromechanical probe circuit film, method for making the same and applications thereof
US7498825B2 (en) * 2005-07-08 2009-03-03 Formfactor, Inc. Probe card assembly with an interchangeable probe insert
US20070085554A1 (en) * 2005-10-14 2007-04-19 Chipmos Technologies (Bermuda) Ltd. Replaceable modular probe head
US7573276B2 (en) * 2006-11-03 2009-08-11 Micron Technology, Inc. Probe card layout
ITMI20072399A1 (it) * 2007-12-20 2009-06-21 St Microelectronics Srl Scheda sonde migliorata per collaudare circuiti integrati
ITMI20080365A1 (it) * 2008-03-05 2009-09-06 St Microelectronics Srl Collaudo di circuiti integrati mediante poche sonde di collaudo
US7750651B2 (en) * 2008-03-07 2010-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer level test probe card
US8441272B2 (en) * 2008-12-30 2013-05-14 Stmicroelectronics S.R.L. MEMS probe for probe cards for integrated circuits
IT1398204B1 (it) * 2010-02-16 2013-02-14 St Microelectronics Srl Sistema e metodo per eseguire il test elettrico di vie passanti nel silicio (tsv - through silicon vias).
US9207259B2 (en) * 2011-06-10 2015-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card for probing integrated circuits

Also Published As

Publication number Publication date
US20140070834A1 (en) 2014-03-13
US20170030966A1 (en) 2017-02-02
US10060972B2 (en) 2018-08-28
WO2009080760A1 (en) 2009-07-02
US8604816B2 (en) 2013-12-10
CN101946182B (zh) 2014-02-26
EP3339868A1 (en) 2018-06-27
US20100308855A1 (en) 2010-12-09
CN101946182A (zh) 2011-01-12
EP2235546A1 (en) 2010-10-06

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