ITMI20131692A1 - Procedimento di produzione per un componente micromeccanico e componente micromeccanico - Google Patents

Procedimento di produzione per un componente micromeccanico e componente micromeccanico

Info

Publication number
ITMI20131692A1
ITMI20131692A1 IT001692A ITMI20131692A ITMI20131692A1 IT MI20131692 A1 ITMI20131692 A1 IT MI20131692A1 IT 001692 A IT001692 A IT 001692A IT MI20131692 A ITMI20131692 A IT MI20131692A IT MI20131692 A1 ITMI20131692 A1 IT MI20131692A1
Authority
IT
Italy
Prior art keywords
micromechanical component
production procedure
micromechanical
component
procedure
Prior art date
Application number
IT001692A
Other languages
English (en)
Inventor
Mirko Hattass
Friedjof Heuck
Christoph Schelling
Benjamin Schmidt
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20131692A1 publication Critical patent/ITMI20131692A1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523—Etching material
    • B81C1/00531—Dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00595—Control etch selectivity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00619—Forming high aspect ratio structures having deep steep walls
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5769—Manufacturing; Mounting; Housings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0133—Wet etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
IT001692A 2012-10-16 2013-10-14 Procedimento di produzione per un componente micromeccanico e componente micromeccanico ITMI20131692A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012218845.2A DE102012218845A1 (de) 2012-10-16 2012-10-16 Herstellungsverfahren für ein mikromechanisches Bauteil und mikromechanisches Bauteil

Publications (1)

Publication Number Publication Date
ITMI20131692A1 true ITMI20131692A1 (it) 2014-04-17

Family

ID=50383232

Family Applications (1)

Application Number Title Priority Date Filing Date
IT001692A ITMI20131692A1 (it) 2012-10-16 2013-10-14 Procedimento di produzione per un componente micromeccanico e componente micromeccanico

Country Status (5)

Country Link
US (1) US9233841B2 (it)
CN (1) CN103723675B (it)
DE (1) DE102012218845A1 (it)
FR (1) FR2997693B1 (it)
IT (1) ITMI20131692A1 (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014223329A1 (de) 2014-11-14 2016-05-19 Robert Bosch Gmbh Mikromechanische Feder für Inertialsensor
DE102014223926A1 (de) 2014-11-25 2016-05-25 Robert Bosch Gmbh Verfahren zum Herstellen eines MEMS-Bauelements mit zwei miteinander verbundenen Substraten und entsprechendes MEMS-Bauelement

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017885A (en) * 1973-10-25 1977-04-12 Texas Instruments Incorporated Large value capacitor
US4253230A (en) * 1979-02-09 1981-03-03 The United States Of America As Represented By The Secretary Of The Navy Silicon barrier Josephson junction configuration
US5592736A (en) * 1993-09-03 1997-01-14 Micron Technology, Inc. Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads
US5705321A (en) * 1993-09-30 1998-01-06 The University Of New Mexico Method for manufacture of quantum sized periodic structures in Si materials
US5883012A (en) * 1995-12-21 1999-03-16 Motorola, Inc. Method of etching a trench into a semiconductor substrate
US6787052B1 (en) * 2000-06-19 2004-09-07 Vladimir Vaganov Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers
KR101260981B1 (ko) * 2004-06-04 2013-05-10 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치
DE102007031549B4 (de) * 2007-07-06 2021-07-08 Robert Bosch Gmbh Vorrichtung aus einkristallinem Silizium und Verfahren zur Herstellung einer Vorrichtung aus einkristallinem Silizium
CN101244303B (zh) * 2008-02-22 2010-09-01 清华大学 微型实心或空心硅针、硅针阵列及其制造方法
US8828243B2 (en) * 2010-09-02 2014-09-09 Applied Nanostructures, Inc. Scanning probe having integrated silicon tip with cantilever
CN102279289B (zh) * 2011-03-09 2012-12-26 大连理工大学 一种基于(110)单晶硅的微悬臂梁探针制作方法
CN102275868B (zh) * 2011-08-15 2014-02-19 中国人民解放军国防科学技术大学 硅微机械结构的预埋掩模湿法腐蚀工艺

Also Published As

Publication number Publication date
FR2997693B1 (fr) 2019-07-12
CN103723675A (zh) 2014-04-16
US9233841B2 (en) 2016-01-12
DE102012218845A1 (de) 2014-04-17
US20140103497A1 (en) 2014-04-17
FR2997693A1 (fr) 2014-05-09
CN103723675B (zh) 2017-12-29

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