ITTO20030269A1 - Procedimento per la fabbricazione di un dispositivo - Google Patents

Procedimento per la fabbricazione di un dispositivo

Info

Publication number
ITTO20030269A1
ITTO20030269A1 IT000269A ITTO20030269A ITTO20030269A1 IT TO20030269 A1 ITTO20030269 A1 IT TO20030269A1 IT 000269 A IT000269 A IT 000269A IT TO20030269 A ITTO20030269 A IT TO20030269A IT TO20030269 A1 ITTO20030269 A1 IT TO20030269A1
Authority
IT
Italy
Prior art keywords
procedure
manufacture
Prior art date
Application number
IT000269A
Other languages
English (en)
Inventor
Lorenzo Baldo
Sarto Marco Del
Mauro Marchi
Simone Sassolini
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT000269A priority Critical patent/ITTO20030269A1/it
Priority to US10/821,263 priority patent/US7399652B2/en
Publication of ITTO20030269A1 publication Critical patent/ITTO20030269A1/it
Priority to US12/136,722 priority patent/US8193550B2/en
Priority to US13/456,990 priority patent/US8679887B2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00484—Processes for releasing structures not provided for in group B81C1/00476
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3584—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H10W20/211—Through-semiconductor vias, e.g. TSVs
    • H10W20/217—Through-semiconductor vias, e.g. TSVs comprising ring-shaped isolation structures outside of the via holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/033—Comb drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/045—Optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
    • G02B6/357—Electrostatic force

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
IT000269A 2003-04-08 2003-04-08 Procedimento per la fabbricazione di un dispositivo ITTO20030269A1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT000269A ITTO20030269A1 (it) 2003-04-08 2003-04-08 Procedimento per la fabbricazione di un dispositivo
US10/821,263 US7399652B2 (en) 2003-04-08 2004-04-08 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained
US12/136,722 US8193550B2 (en) 2003-04-08 2008-06-10 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained
US13/456,990 US8679887B2 (en) 2003-04-08 2012-04-26 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000269A ITTO20030269A1 (it) 2003-04-08 2003-04-08 Procedimento per la fabbricazione di un dispositivo

Publications (1)

Publication Number Publication Date
ITTO20030269A1 true ITTO20030269A1 (it) 2004-10-09

Family

ID=33516016

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000269A ITTO20030269A1 (it) 2003-04-08 2003-04-08 Procedimento per la fabbricazione di un dispositivo

Country Status (2)

Country Link
US (3) US7399652B2 (it)
IT (1) ITTO20030269A1 (it)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7767493B2 (en) 2005-06-14 2010-08-03 John Trezza Post & penetration interconnection
US7781886B2 (en) 2005-06-14 2010-08-24 John Trezza Electronic chip contact structure
US7851348B2 (en) 2005-06-14 2010-12-14 Abhay Misra Routingless chip architecture
US7786592B2 (en) 2005-06-14 2010-08-31 John Trezza Chip capacitive coupling
US7534722B2 (en) 2005-06-14 2009-05-19 John Trezza Back-to-front via process
US7942182B2 (en) 2005-06-14 2011-05-17 Cufer Asset Ltd. L.L.C. Rigid-backed, membrane-based chip tooling
US7560813B2 (en) 2005-06-14 2009-07-14 John Trezza Chip-based thermo-stack
US7521806B2 (en) 2005-06-14 2009-04-21 John Trezza Chip spanning connection
US7838997B2 (en) 2005-06-14 2010-11-23 John Trezza Remote chip attachment
US7687400B2 (en) 2005-06-14 2010-03-30 John Trezza Side stacking apparatus and method
US8456015B2 (en) 2005-06-14 2013-06-04 Cufer Asset Ltd. L.L.C. Triaxial through-chip connection
US7687397B2 (en) 2006-06-06 2010-03-30 John Trezza Front-end processed wafer having through-chip connections
KR101175393B1 (ko) * 2006-10-17 2012-08-20 쿠퍼 에셋 엘티디. 엘.엘.씨. 웨이퍼 비아 형성
US7670874B2 (en) 2007-02-16 2010-03-02 John Trezza Plated pillar package formation
US7850060B2 (en) * 2007-04-05 2010-12-14 John Trezza Heat cycle-able connection
US7748116B2 (en) * 2007-04-05 2010-07-06 John Trezza Mobile binding in an electronic connection
US20080261392A1 (en) * 2007-04-23 2008-10-23 John Trezza Conductive via formation
US7960210B2 (en) * 2007-04-23 2011-06-14 Cufer Asset Ltd. L.L.C. Ultra-thin chip packaging
US10551613B2 (en) 2010-10-20 2020-02-04 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US9036231B2 (en) * 2010-10-20 2015-05-19 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US9278853B2 (en) * 2011-03-28 2016-03-08 Miramems Sensing Technology Co., Ltd. Manufacturing process of MEMS device
FR2977885A1 (fr) * 2011-07-12 2013-01-18 Commissariat Energie Atomique Procede de realisation d'une structure a electrode enterree par report direct et structure ainsi obtenue
US9385634B2 (en) 2012-01-26 2016-07-05 Tiansheng ZHOU Rotational type of MEMS electrostatic actuator
CN104609359B (zh) * 2013-11-05 2016-03-16 中芯国际集成电路制造(上海)有限公司 电容式mems惯性传感器的形成方法
TWI560827B (en) * 2014-09-15 2016-12-01 Siliconware Precision Industries Co Ltd Semiconductor package and its carrier structure and method of manufacture
ITUB20155997A1 (it) 2015-11-30 2017-05-30 St Microelectronics Srl Struttura micromeccanica ad attuazione biassiale e relativo dispositivo mems
DE102020114347B3 (de) * 2020-05-28 2021-10-28 Infineon Technologies Ag MEMS-Vorrichtungen mit Federelement und Kammantrieb sowie zugehörige Herstellungsverfahren

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5187399A (en) * 1991-12-19 1993-02-16 The Trustees Of Princeton University Levitated micromotor
JPH10289876A (ja) 1997-04-16 1998-10-27 Hitachi Ltd レーザ結晶化方法及びそれを用いた半導体装置並びに応用機器
US6143583A (en) * 1998-06-08 2000-11-07 Honeywell, Inc. Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
US6984571B1 (en) * 1999-10-01 2006-01-10 Ziptronix, Inc. Three dimensional device integration method and integrated device
EP1122720A1 (en) * 2000-02-02 2001-08-08 STMicroelectronics S.r.l. Process for manufacturing a group comprising at least two elements, one whereof includes an encapsulated micro-integrated structure, and thereby obtained group
US20010051014A1 (en) * 2000-03-24 2001-12-13 Behrang Behin Optical switch employing biased rotatable combdrive devices and methods
DE60035179T2 (de) * 2000-04-28 2008-02-21 Stmicroelectronics S.R.L., Agrate Brianza Struktur zur elektrischen Verbindung eines ersten mit einem darüberliegenden zweiten Halbleitermaterial, diese elektrische Verbindung verwendendes Komposit und ihre Herstellung
US6483962B1 (en) * 2000-05-24 2002-11-19 Vlad J. Novotny Optical cross connect switching array system with optical feedback
US7079299B1 (en) * 2000-05-31 2006-07-18 The Regents Of The University Of California Staggered torsional electrostatic combdrive and method of forming same
US6995034B2 (en) * 2000-12-07 2006-02-07 Reflectivity, Inc Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
EP1217656A1 (en) * 2000-12-20 2002-06-26 STMicroelectronics S.r.l. Process for manufacturing components in a semiconductor material with reduction in the starting wafer thickness
US6590850B2 (en) * 2001-03-07 2003-07-08 Hewlett-Packard Development Company, L.P. Packaging for storage devices using electron emissions
US6794271B2 (en) * 2001-09-28 2004-09-21 Rockwell Automation Technologies, Inc. Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge
US6621096B2 (en) * 2001-05-21 2003-09-16 Hewlett-Packard Develpoment Company, L.P. Device isolation process flow for ARS system
US6440820B1 (en) * 2001-05-21 2002-08-27 Hewlett Packard Company Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor wafer
US6686642B2 (en) * 2001-06-11 2004-02-03 Hewlett-Packard Development Company, L.P. Multi-level integrated circuit for wide-gap substrate bonding
US6713367B2 (en) * 2001-08-28 2004-03-30 The Board Of Trustees Of The Leland Stanford Junior University Self-aligned vertical combdrive actuator and method of fabrication
US6961221B1 (en) * 2001-12-18 2005-11-01 Western Digital (Fremont), Inc. Piezoelectric microactuators with substantially fixed axis of rotation and magnified stroke
US6835947B2 (en) * 2002-01-31 2004-12-28 Hewlett-Packard Development Company, L.P. Emitter and method of making
US6872319B2 (en) * 2002-09-30 2005-03-29 Rockwell Scientific Licensing, Llc Process for high yield fabrication of MEMS devices
SG111972A1 (en) * 2002-10-17 2005-06-29 Agency Science Tech & Res Wafer-level package for micro-electro-mechanical systems
US7098117B2 (en) * 2002-10-18 2006-08-29 The Regents Of The University Of Michigan Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices
US7034370B2 (en) * 2002-11-22 2006-04-25 Advanced Nano Systems, Inc. MEMS scanning mirror with tunable natural frequency
US6936524B2 (en) * 2003-11-05 2005-08-30 Akustica, Inc. Ultrathin form factor MEMS microphones and microspeakers
US7326629B2 (en) * 2004-09-10 2008-02-05 Agency For Science, Technology And Research Method of stacking thin substrates by transfer bonding

Also Published As

Publication number Publication date
US20080272447A1 (en) 2008-11-06
US8193550B2 (en) 2012-06-05
US8679887B2 (en) 2014-03-25
US20120208343A1 (en) 2012-08-16
US20040256686A1 (en) 2004-12-23
US7399652B2 (en) 2008-07-15

Similar Documents

Publication Publication Date Title
FR2854322B1 (fr) Tetine
DK1605897T3 (da) Polyethelen-glycol-link-glp-1-forbindelser
DK1569712T3 (da) Forbindelsesindretning
EP1642377A4 (en) VIBRATION DEVICE
IS7471A (is) Ný efnasambönd
DE602004031845D1 (de) Ng
ATE368042T1 (de) Cephemverbindungen
DE502004011133D1 (de) Uteils
IS7879A (is) Ný efnasambönd
IS7381A (is) Efnasambönd
IS7414A (is) Oxó-azabísýklísk efnasambönd
NO20045659L (no) Forbindelser
EP1664117A4 (en) IMMUNOGENIC
IS7827A (is) Ný efnasambönd
IS8089A (is) Efnasambönd
DE602004018799D1 (de) Ng
DE502004005544D1 (de) Mikrodosiereinrichtung
DE602004030875D1 (de) Duschkopf
ITMI20020198A0 (it) (per)aloeteri
ITUD20040054A1 (it) Procedimento per la realizzazione di un
ITMI20030479A1 (it) Procedimento per la preparazione di un ciano-isobenzofurano.
ITMI20031994A1 (it) Procedimento per la preparazione di fludarabina fosfato
NO20031736D0 (no) Forbindelser
NO20054432D0 (no) Determination of the orientation of a dowhole device
ITVR20030088A1 (it) Procedimento per la realizzazione di fasce anti-implosione per cinescopi