ITTO20030836A1 - Dispositivo di allineamento. - Google Patents

Dispositivo di allineamento.

Info

Publication number: ITTO20030836A1
Authority: IT; Italy
Prior art keywords: alignment device; alignment
Prior art date: 2002-10-24

Application number

IT000836A

Other languages

English (en)

Inventor

Shuji Kurokawa

Original Assignee

Lintec Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-10-24

Filing date

2003-10-23

Publication date

2004-04-25

2003-10-23 Application filed by Lintec Corp filed Critical Lintec Corp

2004-04-25 Publication of ITTO20030836A1 publication Critical patent/ITTO20030836A1/it

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
- B23Q1/50—Movable or adjustable work or tool supports using particular mechanisms with rotating pairs only, the rotating pairs being the first two elements of the mechanism
- B23Q1/52—Movable or adjustable work or tool supports using particular mechanisms with rotating pairs only, the rotating pairs being the first two elements of the mechanism a single rotating pair
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/18—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for positioning only
- B23Q3/183—Centering devices

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Machine Tool Sensing Apparatuses (AREA)
Length Measuring Devices By Optical Means (AREA)

IT000836A 2002-10-24 2003-10-23 Dispositivo di allineamento. ITTO20030836A1 (it)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2002309260		2002-10-24
JP2003203526A JP4408351B2 (ja)	2002-10-24	2003-07-30	アライメント装置

Publications (1)

Publication Number	Publication Date
ITTO20030836A1 true ITTO20030836A1 (it)	2004-04-25

Family

ID=29586064

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IT000836A ITTO20030836A1 (it)	2002-10-24	2003-10-23	Dispositivo di allineamento.

Country Status (10)

Country	Link
US (1)	US7274452B2 (it)
JP (1)	JP4408351B2 (it)
KR (1)	KR100984490B1 (it)
CN (1)	CN100345273C (it)
DE (1)	DE10349694A1 (it)
GB (1)	GB2395841B (it)
IT (1)	ITTO20030836A1 (it)
MY (1)	MY136923A (it)
SG (1)	SG106159A1 (it)
TW (1)	TWI284623B (it)

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JP2006156616A (ja) *	2004-11-29	2006-06-15	Jel:Kk	基板保持装置
JP2008041985A (ja) *	2006-08-08	2008-02-21	Tokyo Ohka Kogyo Co Ltd	サポートプレート
JP4809744B2 (ja) *	2006-09-19	2011-11-09	東京エレクトロン株式会社	ウエハの中心検出方法及びその方法を記録した記録媒体
JP5025545B2 (ja) *	2008-03-28	2012-09-12	株式会社東京精密	ウェーハの位置決め検出装置および位置決め方法
JP5015848B2 (ja) *	2008-04-08	2012-08-29	リンテック株式会社	アライメント装置
JP5180801B2 (ja) *	2008-12-17	2013-04-10	リンテック株式会社	アライメント装置及びアライメント方法
JP5438963B2 (ja) *	2008-12-26	2014-03-12	リンテック株式会社	板状部材の位置認識装置および位置認識方法
JP5324231B2 (ja) *	2009-01-08	2013-10-23	日東電工株式会社	半導体ウエハのアライメント装置
JP5324232B2 (ja) *	2009-01-08	2013-10-23	日東電工株式会社	半導体ウエハのアライメント装置
US8406918B2 (en) *	2009-12-21	2013-03-26	WD Media, LLC	Master teaching jig
JP5477133B2 (ja) *	2010-04-09	2014-04-23	日新イオン機器株式会社	ウェーハハンドリング方法およびイオン注入装置
JP5534926B2 (ja) *	2010-05-06	2014-07-02	リンテック株式会社	位置検出装置及びこれを用いたアライメント装置
CN103192463A (zh) *	2012-01-05	2013-07-10	沈阳新松机器人自动化股份有限公司	透光夹持式预对准机
JP2013153108A (ja)	2012-01-26	2013-08-08	Yaskawa Electric Corp	基板位置決め装置
JP2013157462A (ja) *	2012-01-30	2013-08-15	Yaskawa Electric Corp	伝達機構、基板位置決め装置およびロボット
CN104137249B (zh) *	2012-04-25	2017-11-14	应用材料公司	晶片边缘的测量和控制
JP2012209571A (ja) *	2012-06-15	2012-10-25	Tokyo Seimitsu Co Ltd	ウェーハのエッジ検出装置
CN103515268A (zh) *	2012-06-19	2014-01-15	Tel太阳能公司	用于真空加工系统中的基板放置的方法和设备
JP6204008B2 (ja) *	2012-09-14	2017-09-27	株式会社ディスコ	加工装置
CN103302520A (zh) *	2013-07-08	2013-09-18	贵州航天红光机械制造有限公司	薄壁半球体零件外表面加工用真空吸附装置
JP6316082B2 (ja) *	2014-04-30	2018-04-25	株式会社Ｓｃｒｅｅｎホールディングス	基板処理装置および基板処理方法
CN105537974A (zh) *	2015-12-15	2016-05-04	铜陵铜官府文化创意股份公司	可移动旋转工作台
JP6672053B2 (ja) *	2016-04-18	2020-03-25	株式会社ディスコ	ウェーハの加工方法
JP6284996B1 (ja) *	2016-11-04	2018-02-28	Ｔｏｗａ株式会社	検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法
TWI632982B (zh) *	2017-07-03	2018-08-21	陽程科技股份有限公司	Plate retaining device
JP6998149B2 (ja) *	2017-08-08	2022-01-18	株式会社ディスコ	レーザー加工方法
CN112313789B (zh)	2018-06-22	2024-04-16	日商乐华股份有限公司	对准器以及对准器的修正值计算方法
JP7312579B2 (ja) *	2019-03-15	2023-07-21	株式会社東京精密	偏心量検出装置及び偏心量検出方法
CN113460474A (zh) *	2021-08-03	2021-10-01	苏州玥朗自动化科技有限公司	浮动支撑装置
CN114643656A (zh) *	2022-03-18	2022-06-21	江苏京创先进电子科技有限公司	一种用于晶圆环切工艺的切割工作台
KR102646888B1 (ko)	2023-10-12	2024-03-12	(주)오아시스비즈니스	딥러닝 기반의 예측 모델을 이용하여 매장에 대한 수익을 예측하고 예측된 정보를 활용하는 전자 장치 및 이의 방법
CN117359390B (zh) *	2023-10-26	2026-02-27	无锡市蚨瑞精密机电设备有限公司	一种机床主轴角摆误差测量方法

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JPS57198642A (en) *	1981-05-30	1982-12-06	Toshiba Corp	Wafer position detection device
JPS60146674A (ja)	1984-01-05	1985-08-02	Canon Inc	チヤツク装置
US5289263A (en) *	1989-04-28	1994-02-22	Dainippon Screen Mfg. Co., Ltd.	Apparatus for exposing periphery of an object
US5194743A (en) *	1990-04-06	1993-03-16	Nikon Corporation	Device for positioning circular semiconductor wafers
JP2874280B2 (ja) *	1990-05-16	1999-03-24	株式会社ニコン	周縁露光装置及び周縁露光方法
JP2760918B2 (ja) *	1992-02-03	1998-06-04	大日本スクリーン製造株式会社	ノッチ付ウエハの位置検出装置
JP2602415B2 (ja) *	1994-06-16	1997-04-23	山形日本電気株式会社	ウェーハ位置決め装置
US5648854A (en) *	1995-04-19	1997-07-15	Nikon Corporation	Alignment system with large area search for wafer edge and global marks
CN1072398C (zh)	1997-03-26	2001-10-03	财团法人工业技术研究院	芯片接合方法与装置
US6124215A (en) *	1997-10-06	2000-09-26	Chartered Semiconductor Manufacturing Ltd.	Apparatus and method for planarization of spin-on materials
JPH11160031A (ja) *	1997-12-01	1999-06-18	Dainippon Screen Mfg Co Ltd	膜厚測定装置
JP2000021956A (ja) *	1998-07-02	2000-01-21	Mecs Corp	ノッチ合わせ機
US6529274B1 (en) *	1999-05-11	2003-03-04	Micron Technology, Inc.	System for processing semiconductor products
JP3938655B2 (ja) *	2000-08-25	2007-06-27	東レエンジニアリング株式会社	アライメント装置
JP3963300B2 (ja) *	2000-11-07	2007-08-22	株式会社安川電機	ウエハの外周位置検出方法およびその方法を実行させるプログラムを記録したコンピュータ読み取り可能な記録媒体ならびにウエハの外周位置検出装置。
KR100387524B1 (ko) *	2001-01-26	2003-06-18	삼성전자주식회사	반도체 웨이퍼 위치 상태 감지 시스템과 이를 이용하는 반도체장치 제조 설비 및 그에 따른 웨이퍼 위치 상태 감지방법
JP2002329769A (ja) *	2001-04-27	2002-11-15	Lintec Corp	アライメント装置
JP4201564B2 (ja) *	2001-12-03	2008-12-24	日東電工株式会社	半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
JP2003174077A (ja) *	2001-12-04	2003-06-20	Lintec Corp	吸着保持装置

2003
- 2003-07-30 JP JP2003203526A patent/JP4408351B2/ja not_active Expired - Fee Related
- 2003-10-13 GB GB0323959A patent/GB2395841B/en not_active Expired - Fee Related
- 2003-10-20 SG SG200306263A patent/SG106159A1/en unknown
- 2003-10-21 MY MYPI20033999A patent/MY136923A/en unknown
- 2003-10-21 TW TW092129181A patent/TWI284623B/zh not_active IP Right Cessation
- 2003-10-21 US US10/689,525 patent/US7274452B2/en not_active Expired - Lifetime
- 2003-10-22 KR KR1020030073695A patent/KR100984490B1/ko not_active Expired - Fee Related
- 2003-10-23 IT IT000836A patent/ITTO20030836A1/it unknown
- 2003-10-24 CN CNB2003101043491A patent/CN100345273C/zh not_active Expired - Fee Related
- 2003-10-24 DE DE10349694A patent/DE10349694A1/de not_active Withdrawn

Also Published As

Publication number	Publication date
DE10349694A1 (de)	2004-05-13
GB2395841A (en)	2004-06-02
KR20040036583A (ko)	2004-04-30
TW200412317A (en)	2004-07-16
GB0323959D0 (en)	2003-11-19
JP2004200643A (ja)	2004-07-15
US20040136000A1 (en)	2004-07-15
SG106159A1 (en)	2004-09-30
KR100984490B1 (ko)	2010-09-30
GB2395841B (en)	2006-01-04
CN100345273C (zh)	2007-10-24
US7274452B2 (en)	2007-09-25
CN1499602A (zh)	2004-05-26
JP4408351B2 (ja)	2010-02-03
TWI284623B (en)	2007-08-01
MY136923A (en)	2008-11-28

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ITMI20030461A1 (it)	2003-09-14	Dispositivo di visualizzazione.
ITMI20032170A1 (it)	2004-06-22	Tagliacimosse.
NO20051497D0 (no)	2005-03-21	Beta-laktamaseinhibitorprodrug.
ITTO20020090A0 (it)	2002-02-01	Dispositivo di illuminazione.
ITSV20030015A1 (it)	2003-10-06	Dispositivo di giunzione.
ES1051172Y (es)	2002-11-01	Dispositivo ambientador.
ITTO20020264A0 (it)	2002-03-25	Dispositivo acquastop perfezionato.
ES1052590Y (es)	2003-05-01	Quiosco-consigna.
ES1050910Y (es)	2002-10-01	Dispositivo abrefrascos.
ITTO20030081A1 (it)	2003-08-19	Dispositivo di misura.
ES1055979Y (es)	2004-06-01	Dispositivo sujeta-pales.
ES1055896Y (es)	2004-05-16	Dispositivo antivibrador.
ITCN20030005A1 (it)	2004-09-08	Dispositivo anti-turbolenza.
BR0216026B1 (pt)	2011-04-05	dispositivo acoplador.
ITMO20020357A1 (it)	2004-06-14	Dispositivo di sicurezza.
ES1053550Y (es)	2003-08-01	Dispositivo expositor.
ES1051276Y (es)	2002-11-01	Dispositivo publicitario.
ITVA20020061A1 (it)	2004-05-26	Dispositivo di desalinizzazione.
ES1052761Y (es)	2003-06-01	Dispositivo ambientador.
ITBZ20020012A1 (it)	2003-09-15	Limitatore di coppia.
ES1050426Y (es)	2002-07-16	Dispositivo elevador - nivelador.
ES1049664Y (es)	2002-05-16	Dispositivo autohinchador.