ITTO960486A0 - Dispositivo dissipatore per circuiti integrati. - Google Patents

Dispositivo dissipatore per circuiti integrati.

Info

Publication number
ITTO960486A0
ITTO960486A0 ITTO960486A ITTO960486A ITTO960486A0 IT TO960486 A0 ITTO960486 A0 IT TO960486A0 IT TO960486 A ITTO960486 A IT TO960486A IT TO960486 A ITTO960486 A IT TO960486A IT TO960486 A0 ITTO960486 A0 IT TO960486A0
Authority
IT
Italy
Prior art keywords
heat sink
integrated circuits
sink device
circuits
integrated
Prior art date
Application number
ITTO960486A
Other languages
English (en)
Original Assignee
Magneti Marelli Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magneti Marelli Spa filed Critical Magneti Marelli Spa
Priority to IT96TO000486A priority Critical patent/IT1285396B1/it
Publication of ITTO960486A0 publication Critical patent/ITTO960486A0/it
Priority to EP97108845A priority patent/EP0812015A1/en
Priority to BR9702405A priority patent/BR9702405A/pt
Publication of ITTO960486A1 publication Critical patent/ITTO960486A1/it
Application granted granted Critical
Publication of IT1285396B1 publication Critical patent/IT1285396B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Amplifiers (AREA)
  • Electronic Switches (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT96TO000486A 1996-06-04 1996-06-04 Dispositivo dissipatore per circuiti integrati. IT1285396B1 (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT96TO000486A IT1285396B1 (it) 1996-06-04 1996-06-04 Dispositivo dissipatore per circuiti integrati.
EP97108845A EP0812015A1 (en) 1996-06-04 1997-06-03 A heat dissipator for integrated circuits
BR9702405A BR9702405A (pt) 1996-06-04 1997-06-03 Dessipador de calor para circuitos integrados e processo de fabricação de substrato de interconexão incluindo pelo menos um circuito integrado e um dissipador de calor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT96TO000486A IT1285396B1 (it) 1996-06-04 1996-06-04 Dispositivo dissipatore per circuiti integrati.

Publications (3)

Publication Number Publication Date
ITTO960486A0 true ITTO960486A0 (it) 1996-06-04
ITTO960486A1 ITTO960486A1 (it) 1997-12-04
IT1285396B1 IT1285396B1 (it) 1998-06-03

Family

ID=11414693

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96TO000486A IT1285396B1 (it) 1996-06-04 1996-06-04 Dispositivo dissipatore per circuiti integrati.

Country Status (3)

Country Link
EP (1) EP0812015A1 (it)
BR (1) BR9702405A (it)
IT (1) IT1285396B1 (it)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2793350B1 (fr) * 1999-05-03 2003-08-15 St Microelectronics Sa Protection d'une puce semiconductrice
SE9902998L (sv) * 1999-08-25 2001-02-26 Ericsson Telefon Ab L M Kylare
JP2004523921A (ja) * 2001-03-16 2004-08-05 アアビッド・サーマロイ・エルエルシー ヒートシンク
WO2003094586A1 (de) * 2002-04-29 2003-11-13 Siemens Aktiengesellschaft Leiterplatte mit smd-bauelement und kühlkörper
JP3738755B2 (ja) * 2002-08-01 2006-01-25 日本電気株式会社 チップ部品を備える電子装置
ITMI20111217A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Sistema contenitore/dissipatore per componente elettronico
ITMI20111219A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Sistema con dissipatore di calore condiviso
ITMI20111218A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo di potenza ad elevata velocita? di commutazione
ITMI20111216A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo elettronico di potenza ad elevata dissipazione di calore e stabilita?
ITMI20111214A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo di potenza a spessore ridotto
ITMI20111208A1 (it) * 2011-06-30 2012-12-31 St Microelectronics Srl Sistema con dissipatore di calore stabilizzato
US20150280515A1 (en) 2014-03-28 2015-10-01 Black & Decker Inc. Integrated Electronic Switch and Control Module for a Power Tool
US10541588B2 (en) 2017-05-24 2020-01-21 Black & Decker Inc. Electronic power module for a power tool having an integrated heat sink
CN109413853A (zh) * 2018-09-07 2019-03-01 杭州嘉楠耘智信息科技有限公司 一种计算电路板以及包括该计算电路板的计算设备
CN119212204A (zh) * 2018-10-18 2024-12-27 上海嘉楠捷思信息技术有限公司 一种电路板以及包括该电路板的计算设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
JPS5478982A (en) * 1977-12-06 1979-06-23 Fujitsu Ltd Semiconductor device and its manufacture
JPS5721845A (en) * 1980-07-15 1982-02-04 Nec Corp Mounting structure for miniaturized electronic parts
JPH01117049A (ja) * 1987-10-30 1989-05-09 Hitachi Ltd 集積回路素子冷却装置
JPH0448768A (ja) * 1990-06-15 1992-02-18 Fujitsu Ltd 半導体装置及びその製造方法
JPH07109867B2 (ja) * 1991-04-15 1995-11-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体チツプの冷却構造
JP3039584B2 (ja) * 1992-07-03 2000-05-08 株式会社日立製作所 半導体集積回路モジュールの組立方法
JPH07263618A (ja) * 1994-03-24 1995-10-13 Nippondenso Co Ltd 混成集積回路装置

Also Published As

Publication number Publication date
ITTO960486A1 (it) 1997-12-04
EP0812015A1 (en) 1997-12-10
BR9702405A (pt) 1998-09-08
IT1285396B1 (it) 1998-06-03

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Legal Events

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