ITUD910155A1 - Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento - Google Patents

Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento

Info

Publication number
ITUD910155A1
ITUD910155A1 IT000155A ITUD910155A ITUD910155A1 IT UD910155 A1 ITUD910155 A1 IT UD910155A1 IT 000155 A IT000155 A IT 000155A IT UD910155 A ITUD910155 A IT UD910155A IT UD910155 A1 ITUD910155 A1 IT UD910155A1
Authority
IT
Italy
Prior art keywords
procedure
green
processing
device adopting
tape circuits
Prior art date
Application number
IT000155A
Other languages
English (en)
Inventor
Gisulfo Baccini
Original Assignee
Gisulfo Baccini
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gisulfo Baccini filed Critical Gisulfo Baccini
Priority to ITUD910155A priority Critical patent/IT1252949B/it
Publication of ITUD910155A0 publication Critical patent/ITUD910155A0/it
Priority to DE69201428T priority patent/DE69201428T2/de
Priority to EP92113643A priority patent/EP0535338B1/en
Priority to US07/931,314 priority patent/US5314711A/en
Publication of ITUD910155A1 publication Critical patent/ITUD910155A1/it
Application granted granted Critical
Publication of IT1252949B publication Critical patent/IT1252949B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)
ITUD910155A 1991-09-30 1991-09-30 Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento IT1252949B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ITUD910155A IT1252949B (it) 1991-09-30 1991-09-30 Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento
DE69201428T DE69201428T2 (de) 1991-09-30 1992-08-11 Verfahren zur Verarbeitung von Schaltungen des Greentape-Typs und Vorrichtung zur Durchführung des Verfahrens.
EP92113643A EP0535338B1 (en) 1991-09-30 1992-08-11 A method to process green-tape type circuits, and device that employs the method
US07/931,314 US5314711A (en) 1991-09-30 1992-08-18 Method and apparatus for printing green-tape foil circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD910155A IT1252949B (it) 1991-09-30 1991-09-30 Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento

Publications (3)

Publication Number Publication Date
ITUD910155A0 ITUD910155A0 (it) 1991-09-30
ITUD910155A1 true ITUD910155A1 (it) 1993-03-30
IT1252949B IT1252949B (it) 1995-07-06

Family

ID=11420913

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD910155A IT1252949B (it) 1991-09-30 1991-09-30 Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento

Country Status (4)

Country Link
US (1) US5314711A (it)
EP (1) EP0535338B1 (it)
DE (1) DE69201428T2 (it)
IT (1) IT1252949B (it)

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* Cited by examiner, † Cited by third party
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JP2504277B2 (ja) * 1990-04-19 1996-06-05 株式会社村田製作所 積層型セラミック電子部品用セラミックグリ―ンシ―トの製造方法および装置
IT1259732B (it) * 1992-07-07 1996-03-26 Gisulfo Baccini Dispositivo di prelievo, sovrapposizione e bloccaggio di fogli per circuiti green-tape
US5716481A (en) * 1994-10-31 1998-02-10 Tdk Corporation Manufacturing method and manufacturing apparatus for ceramic electronic components
US5948200A (en) * 1996-07-26 1999-09-07 Taiyo Yuden Co., Ltd. Method of manufacturing laminated ceramic electronic parts
IT1310557B1 (it) * 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronicimultistrato
IT1310555B1 (it) 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronici
US6641860B1 (en) 2000-01-03 2003-11-04 T-Ink, L.L.C. Method of manufacturing printed circuit boards
US6762380B2 (en) * 2001-06-29 2004-07-13 Icorp Membrane switch circuit layout and method for manufacturing
JP2004087561A (ja) * 2002-08-23 2004-03-18 Fuji Mach Mfg Co Ltd 多層基板製造工程集約機
DE10335230A1 (de) * 2003-08-01 2005-02-17 Man Roland Druckmaschinen Ag Verfahren zur Herstellung von RFID Etiketten
ITUD20050196A1 (it) * 2005-11-17 2007-05-18 Gisulfo Baccini Apparecchiatura per la produzione di celle fotovoltaiche sottili in silicio e di circuiti elettronici in materiale rigido e flessibile
DE102006015686C5 (de) 2006-03-27 2013-05-29 Thieme Gmbh & Co. Kg Verfahren zum Transportieren von Druckgut und Drucktisch für Flachbettdruckmaschine
DE102006051558A1 (de) * 2006-11-02 2008-05-08 Manz Automation Ag Siebdruckanlage
DE102007003224A1 (de) * 2007-01-15 2008-07-17 Thieme Gmbh & Co. Kg Bearbeitungslinie für plattenartige Elemente, insbesondere Solarzellen, und Verfahren zum Bearbeiten von plattenartigen Elementen
US20100307022A1 (en) * 2007-06-26 2010-12-09 Gisulfo Baccini Drying apparatus and method for silicon-based electronic circuits
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
ITUD20070156A1 (it) † 2007-09-04 2009-03-05 Baccini S P A Disositivo di posizionamento per posizionare uno o piu' wafer a base di silicio, in particolare per celle fotovoltaiche, in un'unita' di deposizione del metallo
ITUD20070195A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Procedimento di produzione e controllo di piastre per elettronica e relativo apparato
US8215473B2 (en) * 2008-05-21 2012-07-10 Applied Materials, Inc. Next generation screen printing system
US20090308860A1 (en) * 2008-06-11 2009-12-17 Applied Materials, Inc. Short thermal profile oven useful for screen printing
ITUD20080141A1 (it) * 2008-06-19 2009-12-20 Baccini S P A Sistema di trasporto di precisione per stampa serigrafica
IT1392993B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica
EP2256796A1 (de) * 2009-05-29 2010-12-01 Hennecke Systems GmbH Vorrichtung zum Transport von Wafern und/oder Solarzellen
WO2012024330A2 (en) * 2010-08-17 2012-02-23 Bloom Energy Corporation Method for solid oxide fuel cell fabrication
TW201448326A (zh) 2013-03-15 2014-12-16 Bloom Energy Corp 抗磨損固體氧化物燃料電池電極墨水
US11794412B2 (en) 2019-02-20 2023-10-24 General Electric Company Method and apparatus for layer thickness control in additive manufacturing
US11498283B2 (en) 2019-02-20 2022-11-15 General Electric Company Method and apparatus for build thickness control in additive manufacturing
US11179891B2 (en) 2019-03-15 2021-11-23 General Electric Company Method and apparatus for additive manufacturing with shared components
US11707883B2 (en) 2020-11-20 2023-07-25 General Electric Company Foil interaction device for additive manufacturing
US11865780B2 (en) 2021-02-26 2024-01-09 General Electric Company Accumalator assembly for additive manufacturing
US12589549B2 (en) 2021-04-27 2026-03-31 General Electric Company Systems and methods for additive manufacturing
US11951679B2 (en) 2021-06-16 2024-04-09 General Electric Company Additive manufacturing system
US11731367B2 (en) 2021-06-23 2023-08-22 General Electric Company Drive system for additive manufacturing
US11958249B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US11958250B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US11826950B2 (en) 2021-07-09 2023-11-28 General Electric Company Resin management system for additive manufacturing
US12370741B2 (en) 2021-08-13 2025-07-29 General Electric Company Material deposition assembly for additive manufacturing
US12296535B2 (en) 2021-08-24 2025-05-13 General Electric Company Attachment structure for additive manufacturing
US11813799B2 (en) 2021-09-01 2023-11-14 General Electric Company Control systems and methods for additive manufacturing
EP4249216A1 (en) 2022-03-23 2023-09-27 General Electric Company Systems and methods for additive manufacturing
US12403654B2 (en) 2022-09-30 2025-09-02 General Electric Company Systems and methods for additive manufacturing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA931024A (en) * 1970-12-19 1973-07-31 H. Prange Bernard Method and apparatus for silk screening a pattern on an underlying substrate
US4307661A (en) * 1979-04-20 1981-12-29 Mccorquodale Machine Systems Limited Printer with sheet feeder having registering station and suction conveyor
US4362486A (en) * 1980-10-07 1982-12-07 International Business Machines Corporation Automatic multilayer ceramic (MLC) screening machine
US4695482A (en) * 1986-01-21 1987-09-22 Weiswurm Klaus D Method and apparatus for coating of circuit boards
DE3602350C2 (de) * 1986-01-27 1994-08-18 Weber Marianne Verfahren und Anlage zum beidseitigen Beschichten von Platten mit flüssigem Beschichtungsmaterial
GB2209521A (en) * 1987-09-09 1989-05-17 Era Patents Ltd Green tape
US4900580A (en) * 1987-10-22 1990-02-13 Klaus Grah Process for the electrostatic lacquering of printed circuit boards
US5079193A (en) * 1988-08-01 1992-01-07 E. I. Du Pont De Nemours And Company Encapsulant composition
US4845839A (en) * 1988-10-31 1989-07-11 Hamilton Standard Controls, Inc. Method of making a resistive element
JPH02310996A (ja) * 1989-05-26 1990-12-26 Hitachi Ltd セラミック多層配線基板の製造方法
JP2852342B2 (ja) * 1989-08-22 1999-02-03 松下電器産業株式会社 スクリーン印刷方法
US5080929A (en) * 1990-04-02 1992-01-14 Delco Electronics Corporation Method and apparatus for through hole substrate printing
DE4030055A1 (de) * 1990-09-22 1992-03-26 Bosch Gmbh Robert Verfahren zum herstellen einer schaltung

Also Published As

Publication number Publication date
US5314711A (en) 1994-05-24
DE69201428T2 (de) 1995-09-14
EP0535338A1 (en) 1993-04-07
DE69201428D1 (de) 1995-03-23
ITUD910155A0 (it) 1991-09-30
IT1252949B (it) 1995-07-06
EP0535338B1 (en) 1995-02-15

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19950927