JP2000077363A - Cutting method - Google Patents

Abstract

(57) [Summary] (with correction) [PROBLEMS] After cutting a workpiece of a semiconductor article such as a chip size package in a state of being housed in a predetermined jig,
A method for efficiently washing and drying is provided. The chip size package is a workpiece.
Is stored in a predetermined jig 7 and placed on the chuck table 4.
While holding, the cutting blade 3 cuts or cuts into pellets of a predetermined size. After the completion of this step, the jig is carried out together with the object to be cut from the chuck table, and the jig is immersed in the cleaning tank 20 containing the relatively high-temperature cleaning water 22 to perform cleaning while applying ultrasonic waves. After cleaning,
The jig is carried out of the cleaning tank together with the workpiece, and both are simultaneously dried by a method such as hot air blow.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a CSP, for example.
The present invention relates to a cutting method for cutting a workpiece (semiconductor article) housed in a jig such as a (chip size package), and washing and drying the workpiece after being cut while being held in the jig. Things.

[0002]

2. Description of the Related Art In recent years, CSP semiconductor articles have been in demand. Such a CSP is obtained by arranging a plurality of semiconductor pellets in a matrix, solidifying the semiconductor pellets in a plate shape with a resin, and packaging them. When the CSP is used for an electric device such as a personal computer or an audio device, it must be divided into chip sizes for each semiconductor pellet and subjected to cleaning in order to eliminate contamination and the like.

[0003]

However, the CSP
After being divided in a state where it is housed in a predetermined jig in advance, even if it is attempted to perform spin cleaning while being housed in the jig, when the jig is relatively heavy, and when high speed rotation is given There is a problem that spin cleaning and spin drying cannot be performed by a spin cleaning means incorporated in a dicing apparatus as in the related art because of the possibility that semiconductor pellets may be scattered.

Therefore, there is a problem that how to efficiently clean and dry the workpiece after cutting the workpiece in a state where the workpiece is housed in a predetermined jig such as a CSP or the like.

[0005]

SUMMARY OF THE INVENTION As a specific means for solving the above-mentioned problems of the prior art, the present invention provides at least a holding means for holding a workpiece, and cutting water provided on the workpiece held by the holding means. Cutting means for performing cutting while supplying
A cutting method for cutting a workpiece by a cutting device including: a holding step of holding a workpiece accommodated in a jig by a holding means; and cutting the workpiece held by the holding means by the cutting means. A cutting step, after the cutting step is completed, an unloading step of unloading the jig together with the workpiece from the holding means, and transferring the unloaded jig to a cleaning tank containing relatively high-temperature cleaning water. A washing step of immersing and applying ultrasonic waves to wash the divided work pieces, and after the washing is completed, the jig is taken out of the cleaning tank together with the work pieces and the work piece is taken together with the jigs. And a drying step of drying the same.

In the cutting method according to the present invention, the workpiece is a CSP, and the temperature of the relatively high-temperature cleaning water is 40.
C. or higher, and the drying step includes a hot air blow for blowing hot air to the workpiece.

A cutting method according to the present invention sequentially performs a cutting step, a cleaning step, and a drying step while a workpiece such as a CSP is housed in a predetermined jig.
By performing ultrasonic cleaning using cleaning water heated to a relatively high temperature in the cleaning process, it is possible to efficiently perform cleaning without using a spin cleaning / spin drying means that has been generally performed, and to use high-temperature cleaning water. The heat storage due to the immersion causes a self-drying phenomenon to occur in the workpiece, so that the workpiece can be dried quickly.

[0008]

Next, the present invention will be described in more detail with reference to the illustrated embodiments. First, a cutting apparatus for performing the cutting method shown in FIG.
The dicing apparatus 1 includes a spindle unit 2 capable of moving forward and backward in the Y-axis direction and vertically moving in the Z-axis direction accurately and arbitrarily. The tip side of the spindle unit 2 faces the cutting area A. A circular cutting blade 3 serving as a cutting means is attached to an end of the work, and the workpiece placed on the chuck table 4 serving as a holding means is fixed by the cutting blade 3 to a predetermined size. Cutting or cutting into pellets. In this case, the spindle unit 2 and the chuck table 4
By relatively moving in the X-axis direction, precision cutting of the region to be cut is performed.

As shown in FIG. 2, the CSP 5, which is a workpiece, is formed by arranging a plurality of semiconductor pellets, solidifying them in a rectangular plate shape with resin, and packaging. Lines 6 which are regions to be cut corresponding to the respective semiconductor pellets are displayed in a grid pattern. Then, the CSP 5 is accommodated in a predetermined jig 7.

The jig 7 is formed of, for example, plastic or light metal, and has a tray shape having a rising wall 8 on a peripheral edge. The rising wall 8 is provided at a position corresponding to the line 6 to be cut. A groove 9 is provided, and a plurality of holes 10 are provided at the bottom in alignment. The height of the rising wall 8 is substantially the same as or slightly lower than the thickness of the CSP 5, and the plurality of holes 10 are provided at positions corresponding to substantially the center of each semiconductor pellet.

As described above, the CSP 5, which is a workpiece, is supplied to the dicing apparatus 1 for cutting and cutting in a state of being housed in the jig 7, and the cutting area A is conventionally supplied by the supplying means. Is supplied on the chuck table 4 of the above. For example, as a means for this purpose, a dicing apparatus includes a loading / unloading means for taking out jigs 7 one by one from a cassette 11 on which a large number of jigs 7 each containing a workpiece are mounted, and accommodating them in their original positions. 12 and
The jig 7 carried out by the carrying-in / out means 12 to the mounting area B is transported to the chuck table 4, and a turning arm 13 is carried out from the chuck table 4 to the mounting area B after processing.

Further, the dicing apparatus 1 is provided with a photographing device 14 such as a CCD camera for aligning a region of the CSP 5 to be cut in the cutting region A to be cut. After the workpiece or jig is imaged and the alignment of the area to be cut is completed by image processing such as pattern matching,
The cutting process is performed by the cutting blade 3 in a state where the CSP 5 to be processed is stored in the jig 7.

Further, when the CSP 5 of the work is cut by the cutting blade 3, it is necessary to supply cutting water to a cutting portion including the work. For this purpose, a cutting water supply nozzle 15 is provided. ing. Cutting water supply nozzle 15
Is generally disposed opposite to both sides of the cutting blade 3 via a foil cover 16 attached to the tip end side of the spindle unit 2, and is supplied by spraying cutting water from both sides of the cutting blade 2. is there. Note that the wheel cover 16 is provided with blade monitoring means for monitoring the state of the cutting blade 3.

A workpiece that has been cut in the cutting area A;
That is, the CSP 5 accommodated in the jig 7 is transported to the cleaning area C by an appropriate jig transporting unit and is subjected to cleaning. This jig transporting means is provided with an arm 17 which can move forward and backward in the Y-axis direction and the X-axis direction, and which can hold the jig 7 at its tip and can move up and down (Z
(In the axial direction). And
The jig conveying means conveys the workpiece from the cutting area A to the cleaning area C and from the cleaning area C to the mounting area B.

With the dicing apparatus 1 having such a configuration, the CSP 5 to be processed is placed on the chuck table 4 as holding means in a state of being stored in the jig 7, and after alignment, cutting water is supplied. , Cutting blade 3
Thus, cutting is performed along the cutting line 6. Even if the CSP 5 is completely cut vertically and horizontally from end to end in the cutting process, the cutting blade 3 escapes into the groove 9 provided on the rising wall 8 of the jig 7. Cutting can be performed in perfect condition without damaging the surface.

Although the CSP 5 and the jig 7 after the cutting process have contaminants such as cutting chips adhered thereto, the CSP 5 and the jig 7 are carried out to the cleaning area C by the jig conveying means and subjected to the cleaning process. In the cleaning step in this case, for example, a cleaning tank 20 having the configuration shown in FIG. 3 is used. This cleaning tank 20 has a part, for example, an ultrasonic generator 2
1 is a so-called ultrasonic cleaning device equipped with an appropriate buffer member or the like around the entire periphery of the ultrasonic cleaning device,
It is installed in the cleaning area C so that ultrasonic vibration is not transmitted to the surroundings.

A predetermined amount of relatively high-temperature cleaning water 22 of 40 ° C. or more is stored in the cleaning tank 20, and a jig for storing the CSP 5 of the cut workpiece in the cleaning tank 20. 7 is immersed in the water, and the ultrasonic generator 2
Ultrasonic waves are propagated to the cleaning water 22 by the drive of 1 and the ultrasonic vibrations are used to clean the CSP 5 and the contamination adhered to the jig 7. In this case, the jig 7 containing the CSP 5 is held in a suspended state by the holding portion 18 of the jig transporting means, and the holding portion 18 descends to
It is preferable that the jig 7 is immersed in the state of being floated at an intermediate position in 2 and subjected to cleaning.

The cleaning time in this case varies depending on the strength of the ultrasonic wave, but is, for example, about 3 to 5 minutes, and the cleaning time can be appropriately set as required. The CSP 5 and the jig 7 thus completed the cleaning process.
Is transported out of the cleaning tank 20 and supplied to the next drying step.

In this drying step, as shown in FIG. 4, the CSP 5 and the jig 7 are blown against the CSP 5 and the jig 7 by using an appropriate dryer 23 to be dried. In this drying, the CSP 5 and the jig 7 are heated to the temperature of the cleaning water by being immersed in the relatively high-temperature cleaning water 22 in the previous cleaning step.
In addition, a self-drying phenomenon of the jig 7 occurs, and further drying is promoted. Incidentally, in FIG. 1, the holding portion 1 of the jig conveying means is used.
It is preferable that the jig 7 is held in a suspended state at 8 and dried by the dryer 23. Therefore, it is better to provide the dryer 23 at a position close to the cleaning area C.

As described above, cutting is performed while the CSP 5 is housed in the jig 7, and after the cutting, ultrasonic cleaning using high-temperature cleaning water can be performed without using spin cleaning means. In addition to performing efficient cleaning, efficient drying by the self-drying phenomenon and hot-air drying can be performed without performing spin drying in the subsequent drying step. Then, the arm 17 of the jig conveying means is used.
Is moved in the X-axis direction and the dried CS stored in the jig
P is transported to the mounting area B.

[0021]

As described above, in the cutting method according to the present invention, at least the holding means for holding the work, and the cutting performed while supplying the cutting water to the work held by the holding means. And a cutting means for cutting the workpiece by a cutting device, comprising: a holding step of holding the workpiece held in the jig by the holding means; and A cutting step of cutting by the cutting means, an unloading step of unloading the jig together with the workpiece from the holding means after completion of the cutting step, and a relatively high-temperature washing water for storing the unloaded jig is stored. A cleaning step of immersing the workpiece in a cleaning tank and applying ultrasonic waves to wash the divided workpiece, and after the cleaning is completed, the jig is taken out of the cleaning tank together with the workpiece and the cleaning is performed. A drying step of drying the workpiece together with the tool. In particular, it is possible to efficiently perform cleaning without using spin cleaning / spin drying means conventionally performed by performing ultrasonic cleaning using cleaning water heated to a relatively high temperature in the cleaning step, and In addition, there is an excellent effect that a self-drying phenomenon occurs in a workpiece due to heat storage due to immersion in high-temperature cleaning water, and quick drying can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cutting device for performing a cutting method of the present invention.

FIG. 2 is a perspective view showing a workpiece and a jig cut by the cutting device.

FIG. 3 is a perspective view showing an example of a cleaning device for performing the cutting method of the present invention.

FIG. 4 is a perspective view showing an example of a drying unit in a drying step for performing the same method.

[Explanation of symbols]

1. Cutting device 2. Spindle unit 3.
... Cutting blade, 4 ... Chuck table, 5 ... CSP to be processed, 6 ... Line indicating area to be cut, 7 ... Jig, 8 ... Rising wall, 9 ... Groove, 10 ... ... Hole, 11 ... Cartridge, 12 ...
... Carry-in / out means, 13 ... Revolving arm, 14 ... Imaging device, 15 ... Cutting water supply nozzle, 16 ... Foil cover, 17 ... Arm, 18 ... Holding unit, 20 ... Cleaning tank, 21 ... ... Ultrasonic generator, 22 ... Washing water, 2
3 ... dryer, 24 ... warm air, A ... cutting area, B ... mounting area, C ... washing area.

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] September 17, 1998 (1998.9.1)
7)

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG.

Claims (2)

[Claims] An object to be processed by a cutting apparatus including at least a holding means for holding a workpiece and a cutting means for performing cutting while supplying cutting water to the workpiece held by the holding means. A holding step of holding the workpiece accommodated in the jig by the holding means; a cutting step of cutting the workpiece held by the holding means by the cutting means; After completion, an unloading step of unloading the jig together with the workpiece from the holding means, and immersing the unloaded jig in a cleaning tank containing relatively high-temperature cleaning water and applying ultrasonic waves. At least a cleaning step of cleaning the divided workpiece, and a drying step of carrying out the jig together with the workpiece from the cleaning tank and drying the workpiece together with the jig after the cleaning is completed. A cutting method characterized by including: 2. The workpiece is a CSP, the temperature of the relatively high temperature cleaning water is 40 ° C. or higher, and the drying step includes a hot air blow for blowing hot air on the workpiece. The cutting method described in the above.