JP2000208357A - Chip-type film capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip-type film capacitor for maintaining a mounting state stable to the bending or vibration of a circuit board at face-mounting the chip-type film capacitor on the circuit board or the like, without subjecting it to plating processing to an electrode part made of metallikon metal. SOLUTION: Electrode parts 12 made of a metallikon metal are formed at the both edges of a film capacitor element 11, and metallic terminals 15 are connected with the electrode parts 12 in the chip-type film capacitor 10. The metallic terminals 15 are respectively provided with at least two leg parts 15-1 and 15-2 obtained by bending metallic wires, and the metallic terminals 15 are welded and mounted on the electrode parts 12 at the both edges of the film capacitor element 11, so that the end parts of the leg parts 15-1 and 15-2 project slightly from the bottom face of the film capacitor element 11. Also, metal plating processing is carried out to the metallic terminals 15, and resin adhesive 16 is applied to prescribed parts which include the welded parts to form reinforced parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type film capacitor which can be directly mounted on a circuit board or the like by reflow soldering or the like.

[0002]

2. Description of the Related Art Conventionally, chip type film capacitors have been developed and put into practical use as small film capacitors which can be directly mounted on a circuit board by surface reflow soldering or the like. FIG. 1 is a view showing an example of the appearance of a conventional chip-type film capacitor of this type. FIG.
(B) is a side view. As shown in the figure, a chip type film capacitor 10 has a metal capacitor film 11 formed by winding a metallized film on a resin film.
Are formed. Since the electrode portion 12 is surface-mounted on a circuit board, the lower surface of the electrode portion 12 is
A step Δd is provided so as to slightly protrude from the lower surface of the first member.

[0003] The electrode portion 12 made of the above metallikon metal
Is formed by spraying a molten metal to both ends of the film capacitor element 11, and the step Δd
There is a problem that a complicated process must be performed in order to form the electrode portion 12 by providing the semiconductor device. Further, since the surface of the electrode portion 12 made of metallikon metal is oxidized, it cannot be directly soldered. To enable soldering, the electrode portion 12 must be plated with a metal that can be soldered. This metal plating process requires complicated and difficult processing steps.

[0004] Further, since the electrode portion 12 is made of metallikon metal, the shape of the electrode portion 12 varies, and when the chip-type film capacitor is directly surface-mounted on a circuit board,
There is a problem that the electrode portion 12 is not in close contact with the soldering portion and a soldering failure occurs, which causes inconvenience.

Further, in this structure, when mounted on a circuit board, when the circuit board is bent by applying a bending force, an excessive force is applied to the chip-type film capacitor element 11 and a soldered portion, and the circuit board becomes unstable. There is.

FIG. 2 is a view showing an example of the appearance of another type of conventional chip type film capacitor. As shown in the figure, the chip type film capacitor 10 has a structure in which metal terminals 13 each having a metal plate formed in a U-shaped cross section are fitted to and welded to the electrode portions 12 made of metallikon metal at both ends of the film capacitor element 11. By soldering the bottom surface of the metal terminal 13 to a soldering portion of the circuit board, direct surface mounting is possible.

The chip type film capacitor 10 provided with the metal terminals 13 formed in the above-described U-shaped cross section has the
Is formed of metallikon metal, the shape thereof varies, and the electrode portion 12 cannot be inserted into the metal terminal 13 in some cases. Further, in order that all the electrode portions 12 can be inserted into the metal terminals 13, the metal terminals 13 must be large.

FIG. 3 is a view showing an appearance example of another conventional chip type film capacitor. As shown, the chip type film capacitor 10 is a film capacitor element 1.
A metal terminal 14 having a cantilever structure is welded and attached to the electrode portions 12 made of metallikon metal at both ends of the metal terminal 14.
Is soldered to the surface of the circuit board directly.

The chip type film capacitor 10 having the structure in which the metal terminal 14 having the cantilever structure is welded to the metal terminal 1
Since the circuit board 4 has a cantilever structure, when a vibration is applied to the circuit board, the chip-type film capacitor 10 also vibrates, and there is a problem that it is weak to vibration.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is not necessary to apply a plating treatment to an electrode portion made of metallikon metal, and to perform bending or bending of a substrate when it is surface-mounted on a circuit board or the like. An object of the present invention is to provide a chip-type film capacitor capable of maintaining a stable mounting state against vibration.

[0011]

In order to solve the above-mentioned problems, according to the first aspect of the present invention, an electrode portion made of metallikon metal is formed at both ends of a film capacitor element, and a metal terminal is connected to the electrode portion. In the chip type film capacitor having the above structure, the metal terminal is formed by bending a metal wire and has at least two legs, and the ends of the legs are connected to the electrodes at both ends of the film capacitor element of the metal terminal. It is characterized in that it is mounted by welding so as to slightly protrude from the bottom surface of the capacitor element.

As described above, the metal wire having a shape having at least two legs is welded and attached to the metallikon metal electrode portions at both ends of the film capacitor element. The metal terminal can be stably mounted without being influenced by the above, and the chip type film capacitor can be surface-mounted on a substrate such as a circuit substrate by soldering the legs of the metal terminal. At this time, since it is not necessary to solder the metallicon metal electrode portion, there is no need for plating the electrode portion. Moreover, metal terminals are formed by bending metal wires,
Since one electrode is supported by at least two legs, the film capacitor element is supported by at least four legs, and is stable even when bending force or vibration is applied to the substrate. The mounting state can be maintained.

The invention described in claim 2 is the first invention.
Wherein the metal terminals are plated with solderable metal.

As described above, since the metal terminals are plated with solderable metal, the metal terminals can be easily soldered.

[0015] The invention described in claim 3 is based on claim 1.
Or in the chip-type film capacitor according to 2,
A reinforcing portion coated with a resin adhesive is provided in a predetermined range including a welded portion of the metal terminal of the electrode portion.

Since the welded portion of the metal terminal is reinforced with the resin adhesive as described above, even if a force is applied to the metal terminal, the metal terminal is easily detached or the metallikon metal electrode is damaged. Never.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 4 is a view showing the appearance of the chip type film capacitor according to the present invention. As shown in the drawing, a chip type film capacitor 10 according to the present invention has electrode portions 12 made of metallikon metal formed at both ends of a film capacitor element 11, and metal terminals 15 made of a metal wire are attached to both electrode portions 12 by welding. Have been. The metal terminal 15 is formed by bending a single metal wire, for example, a solder-plated copper-coated steel wire into a V-shape to form two legs 15-1 and 15-15.
-2, and the legs 15-1 and 15-2 are formed by being bent outward in the horizontal direction on the way.

The V-shaped portion A of the metal terminal 15 formed by bending the metal wire as described above is attached to the electrode portion 12 by welding. At this time, the legs 15-1, 15-
Part 15-1a in which the middle of 2 is bent outward in the horizontal direction,
15-2 a is slightly projected from the bottom surface of the film capacitor element 11. Thereby, the bent portion 15-
When 1a and 15-2a are soldered to the substrate, a gap is formed between the bottom surface of the film capacitor element 11 and the substrate surface. Further, a resin adhesive 16 such as an epoxy resin is applied to a predetermined range including the welded portion and cured to reinforce the welded portion. Thereby, the welded portion of the metal terminal 15 is reinforced, and even if an external force is applied to the metal terminal 15, the metal terminal 15 does not easily come off or the metallikon metal electrode portion 12 is not damaged.

The above-mentioned chip type film capacitor 1
When 0 is mounted on the substrate, the two electrode portions 12 are stably supported by the two legs 15-1 and 15-2, respectively, and a stable mounting state is maintained even when vibration is applied to the substrate. it can. Further, since the metal terminal 15 is formed of a metal wire, when a bending force is applied to the substrate and the substrate is bent, a bending force is also applied to the metal terminal 15, but the leg 15-1 formed of the metal wire. , 15-2 are deformed to absorb this bending force, so that no excessive force is applied to the film capacitor element 11 and a stable mounting state can be maintained.

The film capacitor element 11 is formed by winding a metallized film formed by evaporating metal on the surface of a resin film a predetermined number of times, and spraying a molten metal to both ends of the wound body to form an electrode portion 12. . The film capacitor element 11 is vacuum impregnated with a low-viscosity epoxy resin and cured. In the conventional chip type film capacitor shown in FIG. 1, it is necessary to perform plating on the electrode portion 12, and in order to prevent the plating solution from penetrating into the film capacitor element 11, vacuum impregnation of the low-viscosity epoxy resin is performed. Although it was necessary to perform the process twice, the plating process is not performed on the electrode portion 12, so that only one vacuum impregnation process of the low-viscosity epoxy resin is required.

FIG. 5 is a view showing the appearance of a chip type film capacitor according to the present invention. As shown in the figure, in a chip type film capacitor 10 according to the present invention, a metal terminal 15 made of a metal wire is attached to an electrode portion 12 made of a metallikon metal at both ends of a film capacitor element 11 by welding. The metal terminal 15 is formed by bending a single metal wire upward with a straight portion 15a having a predetermined length (slightly shorter than the width of the film capacitor element 11) interposed therebetween, thereby forming two legs 15-1, 15-. 2 and the legs 15-1,
The middle of 15-2 is bent outward in the horizontal direction.

The portions A and B where the two legs 15-1 and 15-2 of the metal terminal 15 formed by bending the metal wire as described above are partially bent in the horizontal direction are attached to the electrode portion 12 by welding. . At this time, the linear portion 15a of the metal terminal 15 slightly protrudes from the bottom surface of the film capacitor element 11. Thereby, when the linear portion 15a is soldered to the substrate, a gap is formed between the bottom surface of the film capacitor element 11 and the substrate surface. Further, a resin adhesive 16 such as an epoxy resin is applied to a predetermined range including the welded portion and hardened to reinforce the welded portion. Thereby, the welded portion of the metal terminal 15 is reinforced, and even if an external force is applied to the metal terminal 15, the metal terminal 15 is not easily detached or the metallikon metal electrode portion 12 is not damaged.

The above-mentioned chip type film capacitor 1
When 0 is mounted on the substrate, the two electrode portions 12 are stably supported by the two legs 15-1 and 15-2, respectively, so that a stable mounting state can be maintained even when vibration is applied to the substrate. . Further, since the metal terminal 15 is formed of a metal wire, when a bending force is applied to the substrate and the substrate is bent, a bending force is also applied to the metal terminal 15.
Since 5-1 and 15-2 are deformed and absorb this bending force, no excessive force is applied to the film capacitor element 11, and a stable mounting state can be maintained. The structure of the film capacitor element 11 is the same as that of FIG.

FIG. 6 is a view showing the appearance of a chip type film capacitor according to the present invention. As shown in the figure, in a chip type film capacitor 10 according to the present invention, a metal terminal 15 made of a metal wire is attached to an electrode portion 12 made of a metallikon metal at both ends of a film capacitor element 11 by welding. The metal terminal 15 is formed by bending a single metal wire into a U-shape with a straight portion 15a having a predetermined length interposed therebetween to form two legs 1.
5-1, 15-2, and the legs 15-1, 15
-2 is formed by bending the middle part in the horizontal outer direction.

The central portion A of the straight portion 15a of the metal terminal 15 formed by bending the metal wire as described above is bent and attached to the electrode portion 12 by welding. At this time, the portions 15-1a and 15-2a of the legs 15-1 and 15-2, which are formed by bending the middle of the legs 15-1 and 15-2 in the horizontal direction, are connected to the film capacitor elements 11-1 and 15-2a.
Slightly protrude from the side (bottom) of. Thereby, when the bent portions 15-1a and 15-2a are soldered to the substrate, a gap is formed between the bottom surface of the film capacitor element 11 and the substrate surface. Further, a resin adhesive 16 such as an epoxy resin is applied to a predetermined range including the welded portion and hardened to reinforce the welded portion. Thereby, the welded portion of the metal terminal 15 is reinforced, and even if an external force is applied to the metal terminal 15, the metal terminal 15 is easily detached or the metallicon metal electrode portion 1 is removed.
2 does not break.

The above-mentioned chip type film capacitor 1
When 0 is mounted on the substrate, the two electrode portions 12 are stably supported by the two legs 15-1 and 15-2, respectively, and a stable mounting state is maintained even when vibration is applied to the substrate. it can. Further, since the metal terminal 15 is formed of a metal wire, a bending force is applied to the substrate and the bending force is applied to the metal terminal 15 as described above even when the substrate is bent. -2 is deformed to absorb this bending force, so that no excessive force is applied to the film capacitor element 11 and a stable mounting state can be maintained. The structure of the film capacitor element 11 is the same as that of FIG.

FIG. 7 is a view showing the appearance of a chip type film capacitor according to the present invention. This chip type film capacitor 10 is a chip type film capacitor 1 shown in FIG.
The difference from 0 is that the metal terminal 15 bends one metal wire into a U-shape with a straight portion 15a having a predetermined length in between to form two legs 15-1 and 15-2. Legs 15-1, 1
The point 5-2 is formed by bending in the horizontal inward direction, and the other points are substantially the same. The operation and effect are substantially the same as those in FIG.

FIG. 8 is a view showing the appearance of a chip type film capacitor according to the present invention. This chip type film capacitor 10 is different from the chip type film capacitor 10 shown in FIGS.
1, 15-2, is formed by being horizontally bent outward in the longitudinal direction of the film capacitor element 11,
Other points are substantially the same. The operation and effect thereof are also substantially the same as those in FIGS. 6 and 7, and the description thereof is omitted.

FIG. 9 is a view showing the appearance of a chip type film capacitor according to the present invention. This chip-type film capacitor 10 is different from the chip-type film capacitor 10 shown in FIGS. 6, 7 and 8 in that the middle of the legs 15-1 and 15-2 of the metal terminal 15 is the film capacitor element 1
1 is formed by bending horizontally inward in the longitudinal direction, and the bent portions 15-1a and 15-2a are located at the bottom of the film capacitor element 11, and the other points are substantially the same. . The operation and effect are also substantially the same as those in the case of FIGS. 6, 7 and 8, and the description thereof will be omitted.

In the above embodiment, the metal terminals 1
5 has a shape having two legs 15-1 and 15-2, but is not limited to this. For example, as shown in FIG. 10, four legs 15-1 to 15-4 are provided. May be formed by bending a metal wire so as to have

The metal terminal 15 is formed by using a metal wire of a solderable metal, is formed by bending using a metal wire plated with metal, or is formed by plating the metal terminal 15 after bending. When the metal terminal 15 is soldered by reflow soldering or the like, the soldering can be performed well.

[0032]

As described above, according to the first aspect of the present invention, a metal terminal is formed by bending a metal wire on metallikon metal electrode portions at both ends of a film capacitor element and having at least two legs. The following excellent effects can be obtained by welding.

The metal terminal can be stably mounted without being affected by the shape of the metallicon metal electrode portion. By soldering the legs of the metal terminal, the chip type film capacitor can be mounted on a circuit board or the like. It can be surface mounted on a substrate.

In addition, when the surface mounting is performed, since the electrode portion of the metallikon metal is not directly soldered, it is not necessary to perform the plating process on the electrode portion, and a complicated plating process for plating the electrode portion can be omitted, and the manufacturing process can be omitted. Cost can be reduced.

The metal terminal is formed by bending a metal wire.
Since each of the electrode portions is supported by at least two legs, the film capacitor element is supported by the substrate by the four legs, and even if bending force or vibration is applied to the substrate,
A stable mounting state can be maintained.

According to the second aspect of the present invention, since the metal terminal is further plated with metal, an excellent effect that soldering of the metal terminal is facilitated in addition to the above-mentioned effect is obtained.

According to the third aspect of the present invention, since the welded portion of the metal terminal is reinforced with the resin adhesive, in addition to the above effects, even if a force is applied to the metal terminal, the metal terminal can be easily formed. An excellent effect is obtained that the metal part is not detached or the metallicon metal electrode is not damaged.

[Brief description of the drawings]

FIG. 1 is a view showing an example of the appearance of a conventional chip-type film capacitor. FIG. 1 (a) is a front view, and FIG. 1 (b) is a side view.

FIG. 2 is a view showing an example of the appearance of a conventional chip-type film capacitor.

FIG. 3 is a view showing an example of the appearance of a conventional chip-type film capacitor.

FIG. 4 is a view showing the appearance of a chip-type film capacitor according to the present invention.

FIG. 5 is a view showing the appearance of a chip-type film capacitor according to the present invention.

FIG. 6 is a view showing the appearance of a chip-type film capacitor according to the present invention.

FIG. 7 is a view showing the appearance of a chip-type film capacitor according to the present invention.

FIG. 8 is a view showing the appearance of a chip-type film capacitor according to the present invention.

FIG. 9 is a view showing the appearance of a chip type film capacitor according to the present invention.

FIG. 10 is a view showing the appearance of a chip-type film capacitor according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Chip-type film capacitor 11 Film capacitor element 12 Electrode part 13 Metal terminal 14 Metal terminal 15 Metal terminal 16 Resin adhesive

Claims (3)

[Claims] 1. A chip type film capacitor having a structure in which metal film metal electrodes are formed at both ends of a film capacitor element and metal terminals are connected to the electrode portions, wherein the metal terminals are formed by bending at least two metal wires. The metal terminal is welded and attached to the electrodes at both ends of the film capacitor element so that the ends of the legs slightly project from the bottom surface of the film capacitor element. Chip type film capacitor. 2. The chip type film capacitor according to claim 1, wherein said metal terminal is plated with a metal which can be soldered. 3. The chip-type film capacitor according to claim 1, wherein a reinforcing portion formed by applying a resin adhesive is provided in a predetermined range including a welded portion of the metal terminal of the electrode portion. Chip type film capacitor.