JP2000235636A - 欠陥情報を利用した情報媒体 - Google Patents

欠陥情報を利用した情報媒体

Info

Publication number
JP2000235636A
JP2000235636A JP35222599A JP35222599A JP2000235636A JP 2000235636 A JP2000235636 A JP 2000235636A JP 35222599 A JP35222599 A JP 35222599A JP 35222599 A JP35222599 A JP 35222599A JP 2000235636 A JP2000235636 A JP 2000235636A
Authority
JP
Japan
Prior art keywords
card
semiconductor chip
light
defect
code signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35222599A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000235636A5 (de
Inventor
Kazuo Takeda
一男 武田
Aritoshi Sugimoto
有俊 杉本
Takanori Ninomiya
隆典 二宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP35222599A priority Critical patent/JP2000235636A/ja
Publication of JP2000235636A publication Critical patent/JP2000235636A/ja
Publication of JP2000235636A5 publication Critical patent/JP2000235636A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G06K19/083—Constructional details
    • G06K19/086—Constructional details with markings consisting of randomly placed or oriented elements, the randomness of the elements being useable for generating a unique identifying signature of the record carrier, e.g. randomly placed magnetic fibers or magnetic particles in the body of a credit card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/106—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols digital information, e.g. bar codes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/201—Marks applied to devices, e.g. for alignment or identification located on the periphery of wafers, e.g. orientation notches or lot numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP35222599A 1998-12-14 1999-12-10 欠陥情報を利用した情報媒体 Pending JP2000235636A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35222599A JP2000235636A (ja) 1998-12-14 1999-12-10 欠陥情報を利用した情報媒体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-354155 1998-12-14
JP35415598 1998-12-14
JP35222599A JP2000235636A (ja) 1998-12-14 1999-12-10 欠陥情報を利用した情報媒体

Publications (2)

Publication Number Publication Date
JP2000235636A true JP2000235636A (ja) 2000-08-29
JP2000235636A5 JP2000235636A5 (de) 2006-03-23

Family

ID=26579590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35222599A Pending JP2000235636A (ja) 1998-12-14 1999-12-10 欠陥情報を利用した情報媒体

Country Status (1)

Country Link
JP (1) JP2000235636A (de)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006068987A (ja) * 2004-09-01 2006-03-16 Toppan Printing Co Ltd 偽造防止担体およびその認証方法
JP2006095834A (ja) * 2004-09-29 2006-04-13 Toppan Printing Co Ltd 情報読み取り方法
JP2007008498A (ja) * 2005-06-29 2007-01-18 Hitachi Ltd 無線ｉｃタグを内包した結束バンド
WO2007072796A1 (ja) * 2005-12-19 2007-06-28 International Frontier Technology Laboratory, Inc. 放射性物質チップにより真贋判別可能なカード
AT504658B1 (de) * 2007-01-26 2008-07-15 Czak Christian Dkfm Sicherungsobjekt
JP2008176607A (ja) * 2007-01-19 2008-07-31 Tdk Corp メモリカードの特定方法
JP2011509449A (ja) * 2007-12-20 2011-03-24 コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブ 有機ダイオードベースの識別・認証装置の製造方法、装置、及び使用方法
US9460316B2 (en) 2013-06-13 2016-10-04 Kabushiki Kaisha Toshiba Authentication device, authentication method, and computer program product
US9712166B2 (en) 2015-03-17 2017-07-18 Kabushiki Kaisha Toshiba Data generating device and authentication system
JP2017130759A (ja) * 2016-01-19 2017-07-27 株式会社東芝 情報処理システムおよび半導体素子
US9794073B2 (en) 2014-12-26 2017-10-17 Kabushiki Kaisha Toshiba Information processing system and semiconductor device
US9852281B2 (en) 2014-09-19 2017-12-26 Kabushiki Kaisha Toshiba Authentication system, authentication device, and authentication method
US9950553B2 (en) 2016-06-10 2018-04-24 Master Dynamic Limited Process of forming an identification marking, and an identification marking formed by way of such a process
US9983818B2 (en) 2013-09-18 2018-05-29 Toshiba Memory Corporation Individual identification device, storage device, individual identification system, method of individual identification, and program product
US10218518B2 (en) 2016-09-12 2019-02-26 Kabushiki Kaisha Toshiba Authentication server, authentication system, and authentication method
US10298407B2 (en) 2016-03-16 2019-05-21 Kabushiki Kaisha Toshiba Data generation apparatus, electronic device, and authentication system
JP7286029B1 (ja) * 2022-03-30 2023-06-02 三菱電機株式会社 半導体デバイス、半導体デバイスの製造方法及び半導体デバイスの識別方法
JP2024121934A (ja) * 2023-02-28 2024-09-09 三菱電機株式会社 半導体装置の固有情報生成方法、半導体装置の固有情報管理方法および半導体装置の製造装置
CN120955068A (zh) * 2025-10-15 2025-11-14 华南理工大学 一种检测Si位错的测试结构以及Si位错检测方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259096A (ja) * 1985-09-10 1987-03-14 カシオ計算機株式会社 Ｉｃカ−ド
JPH0573738A (ja) * 1991-04-16 1993-03-26 Nhk Spring Co Ltd 対象物の識別構造
WO1997035162A1 (en) * 1996-03-15 1997-09-25 Hitachi, Ltd. Method and device for measuring defect of crystal on crystal surface
JPH10326334A (ja) * 1997-05-23 1998-12-08 Nisetsuto Kk Ｉｃカードおよびその認証装置
JPH11190702A (ja) * 1997-12-26 1999-07-13 Hitachi Ltd ウエハ検査装置
JPH11223607A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 結晶欠陥計測方法及び結晶欠陥計測装置
JPH11237225A (ja) * 1997-11-28 1999-08-31 Hitachi Ltd 欠陥検査装置
JPH11241996A (ja) * 1998-02-26 1999-09-07 Hitachi Ltd 結晶欠陥計測装置およびその方法
JPH11513831A (ja) * 1995-10-23 1999-11-24 ギーゼッケ ウント デフリエント ゲーエムベーハー データキャリアの信頼性試験方法
JPH11514466A (ja) * 1995-09-19 1999-12-07 シュラムバーガー アンデュストリエ ソシエテ アノニム 集積回路に関連した暗号キーを決定する方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259096A (ja) * 1985-09-10 1987-03-14 カシオ計算機株式会社 Ｉｃカ−ド
JPH0573738A (ja) * 1991-04-16 1993-03-26 Nhk Spring Co Ltd 対象物の識別構造
JPH11514466A (ja) * 1995-09-19 1999-12-07 シュラムバーガー アンデュストリエ ソシエテ アノニム 集積回路に関連した暗号キーを決定する方法
JPH11513831A (ja) * 1995-10-23 1999-11-24 ギーゼッケ ウント デフリエント ゲーエムベーハー データキャリアの信頼性試験方法
WO1997035162A1 (en) * 1996-03-15 1997-09-25 Hitachi, Ltd. Method and device for measuring defect of crystal on crystal surface
JPH10326334A (ja) * 1997-05-23 1998-12-08 Nisetsuto Kk Ｉｃカードおよびその認証装置
JPH11237225A (ja) * 1997-11-28 1999-08-31 Hitachi Ltd 欠陥検査装置
JPH11190702A (ja) * 1997-12-26 1999-07-13 Hitachi Ltd ウエハ検査装置
JPH11223607A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 結晶欠陥計測方法及び結晶欠陥計測装置
JPH11241996A (ja) * 1998-02-26 1999-09-07 Hitachi Ltd 結晶欠陥計測装置およびその方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006068987A (ja) * 2004-09-01 2006-03-16 Toppan Printing Co Ltd 偽造防止担体およびその認証方法
JP2006095834A (ja) * 2004-09-29 2006-04-13 Toppan Printing Co Ltd 情報読み取り方法
JP2007008498A (ja) * 2005-06-29 2007-01-18 Hitachi Ltd 無線ｉｃタグを内包した結束バンド
WO2007072796A1 (ja) * 2005-12-19 2007-06-28 International Frontier Technology Laboratory, Inc. 放射性物質チップにより真贋判別可能なカード
JP2008176607A (ja) * 2007-01-19 2008-07-31 Tdk Corp メモリカードの特定方法
AT504658B1 (de) * 2007-01-26 2008-07-15 Czak Christian Dkfm Sicherungsobjekt
JP2011509449A (ja) * 2007-12-20 2011-03-24 コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブ 有機ダイオードベースの識別・認証装置の製造方法、装置、及び使用方法
US9460316B2 (en) 2013-06-13 2016-10-04 Kabushiki Kaisha Toshiba Authentication device, authentication method, and computer program product
US9983818B2 (en) 2013-09-18 2018-05-29 Toshiba Memory Corporation Individual identification device, storage device, individual identification system, method of individual identification, and program product
US9852281B2 (en) 2014-09-19 2017-12-26 Kabushiki Kaisha Toshiba Authentication system, authentication device, and authentication method
US9794073B2 (en) 2014-12-26 2017-10-17 Kabushiki Kaisha Toshiba Information processing system and semiconductor device
US9712166B2 (en) 2015-03-17 2017-07-18 Kabushiki Kaisha Toshiba Data generating device and authentication system
JP2017130759A (ja) * 2016-01-19 2017-07-27 株式会社東芝 情報処理システムおよび半導体素子
US10298407B2 (en) 2016-03-16 2019-05-21 Kabushiki Kaisha Toshiba Data generation apparatus, electronic device, and authentication system
US9950553B2 (en) 2016-06-10 2018-04-24 Master Dynamic Limited Process of forming an identification marking, and an identification marking formed by way of such a process
US10218518B2 (en) 2016-09-12 2019-02-26 Kabushiki Kaisha Toshiba Authentication server, authentication system, and authentication method
JP7286029B1 (ja) * 2022-03-30 2023-06-02 三菱電機株式会社 半導体デバイス、半導体デバイスの製造方法及び半導体デバイスの識別方法
WO2023188115A1 (ja) * 2022-03-30 2023-10-05 三菱電機株式会社 半導体デバイス、半導体デバイスの製造方法及び半導体デバイスの識別方法
JP2024121934A (ja) * 2023-02-28 2024-09-09 三菱電機株式会社 半導体装置の固有情報生成方法、半導体装置の固有情報管理方法および半導体装置の製造装置
CN120955068A (zh) * 2025-10-15 2025-11-14 华南理工大学 一种检测Si位错的测试结构以及Si位错检测方法

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