JP2000243769A - Semiconductor device manufacturing method and molding apparatus used therefor - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To prevent the occurrence of burrs attached to the side surfaces of outer leads. SOLUTION: A lead seal 41 formed of an elastic body and formed in a comb tooth shape is provided in a holding hole 40 formed at an end of the upper mold cavity recessed part 33 on the tie bar 3 side on a mating surface of an upper mold cavity block 31. Is held. Lead seal 41 between adjacent outer leads 4, 5, and 6 when tightening
Is inserted and compressed and deformed, and the lead seal 41 is brought into close contact with the opposing side surfaces of the outer lead, thereby preventing the resin from leaking from the cavity to the outer lead and preventing the resin from adhering to the side surface of the outer lead. To prevent burrs. [Effect] By preventing burrs from being generated on the side surfaces of the outer leads, the deburring step can be omitted, the production cost can be reduced, and secondary obstacles derived from the deburring step can be avoided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for manufacturing a semiconductor device, and more particularly to a technique for molding a resin-sealed body of a resin-sealed package. The present invention relates to a technique which is effective for use in molding a resin sealing body.

[0002]

2. Description of the Related Art A transfer molding apparatus is used for molding a resin sealing body of a power transistor. In general,
The transfer molding device includes a molding die composed of an upper die and a lower die that are mold-matched to each other, and a cavity for molding a resin sealing body is submerged in a mating surface of the upper die and the lower die. . A gate connected to a pot via a runner is provided on one of the mating surfaces of the upper mold and the lower mold, and a liquid resin (hereinafter, referred to as a molding material) is formed in the cavity.
It is called resin. ) So that it can be injected.
Then, after the lead frame is arranged and sandwiched between the mating surfaces of the upper mold and the lower mold so as to surround the semiconductor pellet in which the power transistor element is formed, the resin is filled into the cavity through the runner and the gate. Thereby, a resin sealing body is formed on the lead frame.

When a resin molding is formed on a lead frame by a transfer molding device, the resin leaks between adjacent outer leads of the resin molding from between the mating surfaces of the lead frame and the upper and lower dies. Therefore, resin burrs (hereinafter, referred to as thick burrs) are generated between adjacent outer leads. Therefore, a dam block to be inserted between the adjacent outer leads at the time of mold matching is provided on the mating surface of the upper mold or the lower mold, and a gap between the adjacent outer leads is filled by the dam block, so that the gap between the adjacent outer leads is thick. In some cases, a transfer molding device that prevents burrs from occurring is used.

Japanese Patent Application Laid-Open No. 64-69 discloses an example of a molding apparatus for molding a resin sealing body of a transistor.
No. 318 publication.

[0005]

However, in the molding technique using a mold having a dam block protruding, the resin leaks into a clearance set between the adjacent outer leads and the dam block, thereby causing the outer leads to leak. (Hereinafter referred to simply as “burr”) is generated on the side surface (the opposing surface of both adjacent outer leads).

If the burrs remain on the side surfaces of the outer leads, not only the appearance becomes poor, but also the outer lead exterior finishing process (Lead Finishing Ping).
process), a failure such as the plating film not being applied occurs. For this reason, this burr is used in the deburring step (D
It is generally removed by an ebullering process. Conventionally, burrs have been removed by a deburring device such as a shot blast device after molding of the resin sealing body.

However, removing burrs in the deburring step not only increases the number of unnecessary steps, but also increases the possibility of damaging the appearance of the resin sealing body and outer leads. Moreover, 100% of burrs cannot be removed by the conventional deburring method.

An object of the present invention is to provide a technique for manufacturing a semiconductor device capable of preventing the occurrence of burrs.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, a lead seal formed by an elastic body is interposed between adjacent outer leads.

According to the above-mentioned means, the lead seal interposed between the adjacent outer leads is brought into close contact with the side surfaces of the outer leads with elastic force, thereby preventing the resin from leaking from the cavity to the outer leads.
Since it is possible to prevent adhesion to the side surface of the outer lead, it is possible to prevent burrs from being generated on the side surface of the outer lead.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

In the present embodiment, the method for manufacturing a semiconductor device according to the present invention is used as a method for manufacturing a power transistor (hereinafter referred to as a power transistor) having a resin-sealed package with a header. The molding apparatus according to the present invention is configured as a transfer molding apparatus for molding a resin sealed body of a power transistor.

A resin-sealed object (hereinafter, referred to as a work) 1 which is a work of the transfer molding apparatus according to the present embodiment.
5 is configured as shown in FIG. Here, the work 15 will be described. The work 15 includes the multiple lead frames 1. The multiple lead frames 1 are formed integrally by press working using a material having good conductivity and heat conductivity such as a copper-based material (copper or copper alloy). ing. The multiple lead frame 1 has a plurality of unit lead frames 1a arranged in a line and connected to each other, and is formed in a substantially rectangular plate in plan view.

The unit lead frame 1a has an outer frame (frame) 2 formed in a rectangular plate shape, and the outer frames 2, 2 of the adjacent unit lead frames 1a, 1a are connected to each other to form a multi-unit. The continuous lead frame 1 is integrally formed. A tie bar 3 is arranged in parallel on one side of the outer frame 2, and a first outer lead 4, a second outer lead 5, and a third outer lead 6 are equally spaced in the longitudinal direction between the outer frame 2 and the tie bar 3. And are erected at right angles to each other. A first inner lead 7 and a second inner lead 8 are formed on the tie bar 3 so as to be integrally continuous at positions opposite to the first outer lead 4 and the second outer lead 5 located at both left and right ends. The tips of the inner leads 7 and 8 extend in parallel with the tie bar 3. At a position opposite to the third outer lead 6 located at the center of the tie bar 3, a header suspension lead 9 as a third inner lead is formed so as to be integrally continuous with the header suspension lead 9. 10 are integrally formed.

In the multiple lead frame 1, plate members (so-called irregularly shaped members) having different thicknesses are used so that the thickness of the header 10 is thicker (for example, twice or more) than other portions, and is subjected to press working. It is integrally formed. That is, the header 10 is integrally formed in a substantially T-shaped plate shape which is thicker than other portions of the unit lead frame 1a. The header suspension lead 9 is formed with a crank-shaped bent portion 11, and the height of the header 10 is lower than the height of the inner leads 7 and 8 by the bent portion 11 by substantially the thickness of the pellet. Has become. In FIG. 1, 2a
Is a section frame interposed between adjacent unit lead frames 1a, 1a.

A pellet bonding operation and a wire bonding operation are performed on the multiple lead frames 1 for each unit lead frame 1a. First, a semiconductor pellet (hereinafter, referred to as a pellet) 13 in which a power transistor element is formed in a so-called pre-process in a manufacturing process of a semiconductor device is provided with a solder material, a silver (Ag) paste, a gold-silicon eutectic layer on a header 10. Pellet bonding is performed by the bonding layer 12 formed from the above. Next, wires 14, 14 are wire-bonded between the two bonding pads of the pellet 13 and the first inner lead 7 and the second inner lead 8. As a result, the power transistor elements formed in the pellet 13 are connected to the bonding pad of the pellet 13 and each wire 1.
4, the inner leads 7, 8 and the back surface of the pellet 13, the bonding layer 12, the header 10, and the header suspension lead 9 are electrically drawn out to the outside. Then, the work 15 configured as described above is transferred to the transfer molding apparatus 20.
Supplied to

As shown in FIGS. 2 to 4, the transfer molding apparatus 20 includes an upper mold center block 21, a lower mold center block 22, a pair of upper mold cavity blocks 31, 31, and a pair of lower mold blocks. Mold cavity block 3
2, 32. These blocks are respectively held by an upper heat block 27 and a lower heat block 28 via an upper mold holder and a lower mold holder, and are configured to be mutually clamped by a cylinder device.

A slot-shaped pot (hereinafter, referred to as a stick pot) 23 for accommodating a tablet, which will be described later, is opened on the mating surface of the upper die center block 21. The length is supported. A plunger 24 advanced and retracted by a cylinder device is provided in the stick pot 23 in a liquid resin (hereinafter, referred to as a resin) formed by melting a tablet.
Is inserted so as to be able to be delivered. The cross-sectional shape of the plunger 24 is formed in a rectangular shape corresponding to the stick pot 23.

A long groove-shaped cull 25 corresponding to the stick pot 23 is provided on the mating surface of the lower die center block 22.
It is submerged at a position facing the stick pot 23,
The center line of the cull 25 is parallel to the center line of the stick pot 23. On both sides of the long side of the cull 25, a plurality of main runners 26 are arranged and disposed at intervals in the longitudinal direction, and one end of each main runner 26 is
Connected to each other. The other end of each main runner 26 is connected to one end of a sub-runner 36 described later.

A pair of upper mold cavity blocks 31, 31 are disposed on both long sides (hereinafter, referred to as front and rear sides) of the upper mold center block 21, respectively. On the rear side, a pair of lower mold cavity blocks 32, 32 are disposed so as to face both upper mold cavity blocks 31, 31, respectively. Since the pair of upper mold cavity blocks 31 and 31 and the pair of lower mold cavity blocks 32 and 32 are symmetrical in the front-rear direction, one of the front and rear cavities will be described as a representative.

The mating surface (parting surface) of the upper mold cavity block 31 and the lower mold cavity block 32
A plurality of sets of upper cavity recesses 33 and lower cavity recesses 34 are provided so as to cooperate with each other to form a cavity 35. The upper mold cavity recess 33 is formed on the upper side of the header 10 of the work 15 so as to mold the upper portion of the resin sealing body. The lower mold cavity recess 34 accommodates the header 10 and forms the resin sealing body. Is formed so as to form the lower portion.
A plurality of sub-runners 36 each having one end connected to the main runner 26 are provided on the mating surface of the lower mold cavity block 32, and the other end of each sub-runner 36 is connected to the gate 3.
7 is connected to each lower mold cavity concave portion 34.

In the area of the lower die cavity concave portion 34 group row on the mating surface of the lower die cavity block 32, a relief concave portion 38 is a rectangle slightly larger than the outer shape of the multiple lead frame 1 and is substantially equal in thickness. It is submerged at a certain depth in dimensions.

A lead seal holding hole 40 having a rectangular cross section is provided near the upper die center block 21 side of the upper die cavity recess 33 on the mating surface of the upper die cavity block 31. Are set up in the vertical direction so as to extend along the edges of the. Fluorine rubber having a Shore (HS) hardness of 70 ° is used for the lead seal holding hole 40, and a lead seal 41 formed as shown in FIG. 5 is fitted from above and held. I have.

As shown in FIG. 5, the lead seal 41 is formed in a vertically long panel shape, and the first seal portion 42, the second seal portion 43, the left end seal portion 44, and the right end The seal part 45 is integrally formed in a comb shape. The first seal portion 42 is formed in a quadrangular prism shape that fills a gap between the first outer lead 4 and the third outer lead 6, and the second seal portion 43 is
It is formed in a quadrangular prism shape that fills a gap between the first outer lead 6 and the third outer lead 6. The left end seal portion 44 is formed so as to press against the left end surface of the first outer lead 4, and the right end seal portion 45 is formed so as to press against the right end surface of the second outer lead 5. At the upper end of the lead seal 41, a positioning portion 46 is provided so as to be engaged with the upper end of the lead seal holding hole 40.

As shown in FIGS. 4 and 6A, when the lead seal 41 is fitted and held in the lead seal holding hole 40, the first seal portion 42, the second seal portion 43, The left end seal part 44 and the right end seal part 45 are formed from the mating surface of the upper mold cavity block 31.
It is in a state of projecting more than the thickness of the multiple lead frame 1.

A header seal holding hole 50 having a substantially square cross section is formed in a vertical direction at a portion where the header 10 abuts on the bottom surface of the lower mold cavity concave portion 34. The header seal holding hole 50 is made of fluoro rubber having a Shore (HS) hardness of 70 °, and a header seal 51 as an exposed surface seal formed as shown in FIG. 7 is fitted and held. It has become.

As shown in FIG. 7, the header seal 51 is formed in the shape of a quadrangular prism having a substantially square shape in a plan view. The portions 53 are each provided in the shape of a rectangular protrusion. The outer diameter of the left and right first seal portions 52 is set to be equal to or larger than the outer diameter of the header 10. The left and right second seal portions 53 are arranged so as to correspond to the base of the T-shaped horizontal member of the header 10. Header seal 51
A positioning part 54 is provided in the middle of the header seal holding hole 50.
Is formed in a side groove shape that engages with the middle part of

As shown in FIG. 4, when the header seal 51 is fitted and held in the header seal holding hole 50, the first seal portion 52 and the second seal portion 5 are provided.
Reference numeral 3 denotes a state in which it protrudes very slightly from the bottom surface of the lower mold cavity recessed portion 34.

As shown in FIG. 8, in this embodiment, a tablet supply device 60 for supplying a tablet and a work 15 are supplied to one side (hereinafter referred to as an upstream side) of the transfer molding device 20. A loading device 70 is provided in order from the upstream side, and an unloading device 80 that discharges a workpiece (hereinafter, referred to as a molded body) after molding of the resin sealing body is provided downstream of the transfer molding apparatus 20. ing. In addition, in order to match the working time with the tablet feeding device 60, the loading device 70, and the unloading device 80, usually,
A plurality of transfer molding apparatuses 20 are installed in series.

As shown in FIGS. 8 and 9, the tablet supply device 60 includes a hopper 61 in which a powder resin 67 is accommodated. The outlet of the hopper 61 has a pair of sliding cuts 62, 62. To be able to face. The pair of slides 62, 62 are moved in the horizontal direction by a motor 63.
A pair of tableting tools 64, 64 that are raised and lowered by a cylinder device 65 are opposed to above the 2. The sliding cutter 62 and the tableting tool 64 can form a stick-shaped tablet (hereinafter referred to as a stick tablet) 68 by squeezing the powder resin 67 put into the sliding cutter 62 from the hopper 61 by the tableting tool 64. Are formed respectively. On one side of the cylinder device 65, a handler 66 for transporting the compacted stick tablet 68 to the transfer molding device 20 is provided.

As shown in FIG. 9, after a powder resin 67 made of an epoxy resin, a filler or the like is put into the sliding cutter 62 from the hopper 61, the powder resin 67 put into the sliding cutter 62 is used as a tableting tool. When tamped by 64, a stick tablet 68 is formed.
The total volume of the stick tablet 68 is set slightly larger than the total volume of all the cavity groups. According to the tablet supply device 60 according to the present embodiment, since two stick tablets 68 can be formed at the same time, the effect that the production efficiency is high can be obtained. Also, the length of the stick tablet 68 is the multiple lead frame 1
, The breakage can be prevented and the total volume can be easily set.

As shown in FIG. 8, an actual rack 71 is set in the loading device 70, and the actual rack 71 is provided with a plurality of works 15 from which a resin sealing body is to be formed. Is housed. The loading device 70 is provided with a handler 72 for taking out a predetermined number of workpieces 15 from the actual rack 71 and loading the work 15 into the transfer molding device 20.

The unloading device 80 is an empty rack 81
The empty rack 81 is configured to be able to accommodate a plurality of resin-sealed-body-molded works (hereinafter, referred to as finished products) 17. The unloading device 80 includes the finished product 1 from the transfer molding device 20.
A handler for taking out the 7 and storing it in the empty rack 81 is provided.

Next, the operation of the transfer molding apparatus according to the above configuration will be described, and the resin sealing body molding step in the method for manufacturing a power transistor according to one embodiment of the present invention will be described.

When the resin molded body is molded by the transfer molding apparatus 20 having the above-described configuration, the work 15
Are set and positioned in the relief recesses 38 of the lower mold cavity block 32. When the work 15 is positioned, the pellet 13 of the unit lead frame 1a is accommodated in the lower cavity recess 34, and the header 10 comes into contact with the bottom surface of the lower cavity recess 34.

The upper mold center block 21 and both upper mold cavity blocks 31, 31, and the lower mold center block 2
When the mold block 2 and both lower mold cavity blocks 32, 32 are clamped, a cavity 35 is formed by the upper mold cavity recess 33 and the lower mold cavity recess 34.

Subsequently, the stick tablet 68 formed by the tablet supply device 60 is put into the stick pot 23 of the upper center block 21. At this time, since the stick tablet 68 corresponds to the length of the work 15, it does not break or break. The stick tablet 68 put into the stick pot 23 is heated by the upper and lower heat blocks 27 and 28 and starts to melt to become a liquid resin 69.

As shown in FIG. 10, when the plunger 24 is advanced in the stick pot 23, the stick tablet 68 is melted and becomes a liquid resin 69.
Is the cull 25 laid down facing the stick pot 23
As shown in FIG. 11, each of the main runners 26 and the sub-runner 36 is pushed out by the pushing force of the plunger 24 to flow through each of the main runners 26 and the sub-runners 36 to fill the cavities 35 from the respective gates 37. .

After the injection, the resin 69 is thermally cured to form the resin sealing body 16, and the upper mold center block 21 and both upper mold cavity blocks 31, 31 and the lower mold center block 22 and both lower molds 22 are formed. Cavity block 3
The molds 2 and 32 are opened, and the resin sealing body 16 is released by the ejector pins as shown in FIG. 2, so that the finished product 17 is in a molded state. The pellet 13, the inner leads 7, 8, 9, the respective bonding wires 14 and the header 1 are provided inside the resin sealing body 16.
0 is in a resin-sealed state.

The released finished product 17 is unloaded from the transfer molding device 20 and stored in the unloading device 80.

By the way, the upper mold cavity block 31
Is clamped to the lower mold cavity block 32, as shown in FIG. 11, the multiple lead frames 1 of the work 15 are brought into contact with the upper mold cavity block 31 and the lower mold cavity block 32. The lower surface of the header 10 is sandwiched between the lower mold cavity recesses 34.
Is pressed against the header seal 51 on the bottom surface of the
A sealing state is brought into close contact with the elastic force of 1.

As described above, when the lower surface of the header 10 is in close contact with and sealed by the header seal 51,
The resin 69 injected into the cavity 35 is
Is prevented from wrapping around the lower surface of the header 10, thereby preventing the occurrence of burrs on the outer edge of the header 10. That is, burrs generated when the resin 69 goes around the lower surface of the header 10 can be prevented by the header seal 51.

As shown in FIG. 6B,
The first seal portion 42 of the lead seal 41 of the upper mold cavity block 31 is compressed and deformed by the mating surface of the lower mold cavity block 31 in a state of being fitted in a gap between the first outer lead 4 and the third outer lead 6. Accordingly, the first outer lead 4 and the third outer lead 6 are brought into close contact with both side surfaces with the elastic force. Similarly, the second seal portion 43 is fitted in the gap between the second outer lead 5 and the third outer lead 6, and is compressed and deformed by the mating surface of the lower mold cavity block 31 to have its elastic force. As a result, both sides of the second outer lead 5 and the third outer lead 6 are brought into close contact with each other.

The first seal portion 42 comes into close contact with both side surfaces of the first outer lead 4 and the third outer lead 6, and the second seal portion 43 comes into close contact with both side surfaces of the second outer lead 5 and the third outer lead 6, respectively. The resin 69 filled in the cavity 35 is prevented from leaking into the gap between the first outer lead 4 and the third outer lead 6 and the gap between the second outer lead 5 and the third outer lead 6, respectively. In addition, both side surfaces of the first outer lead 4 and the third outer lead 6 and the second seal portion 43 are prevented from adhering to both side surfaces of the second outer lead 5 and the third outer lead 6, respectively. That is, the burrs generated on both side surfaces of the first outer lead 4 and the both side surfaces of the third outer lead 6 due to the resin 69 leaking between the adjacent outer leads are as follows.
This can be prevented by the lead seal 51.

FIG. 12 is a graph showing the effect of the lead seal to prevent burr on the outer lead.

In FIG. 12, the vertical axis represents the length (m) of the burr formed on the side surface of the outer lead from the outer edge of the resin sealing body.
m) is taken, and the horizontal axis represents the resin injection pressure (kg / cm
² ) has been taken. (A) is a conventional example in which a lead seal is not used, and (b) is a case in which a lead seal formed of silicone rubber having a hardness of 30 ° is used.
(C) shows a case where a lead seal made of silicon rubber with a hardness of 50 ° is used, (d) shows a case where a lead seal made of silicone rubber with a hardness of 70 ° is used, and (e) shows a case where a hardness of 50 is used. (F) is a hardness of 7 when a lead seal made of fluoro rubber of
The case where a lead seal formed of 0 ° fluoro rubber is used is shown.

As is clear from the comparison between (a) and (b) to (f), the length of the burr can be reduced when the lead seal is used as compared with the case where the lead seal is not used. In particular,
When a lead seal made of fluoro rubber is used, the length of the burr can be extremely reduced. Further, when a lead seal made of fluorine rubber having a hardness of 70 ° is used, the length of the burr can be stably reduced.

According to the above embodiment, the following effects can be obtained.

1) A lead seal is inserted between adjacent outer leads and compressed and deformed, and the lead seal is brought into close contact with both opposing side surfaces of the outer lead, thereby preventing the resin from leaking from the cavity to the outer lead. Further, since it is possible to prevent the outer leads from being attached to the side surfaces, it is possible to prevent burrs from being generated.

2) By preventing burrs from being generated on the side surfaces of the outer leads, the deburring step can be omitted, so that not only the production cost can be reduced, but also the outer leads due to accidental falling off of the burrs. It is possible to avoid secondary obstacles such as dents in the deburring process that occur in the deburring step.

3) By attaching a lead seal to the mating surface of the mold in advance, the lead seal can be automatically interposed between adjacent outer leads.
Modification of the transfer molding operation procedure can be avoided.

4) By laying a header seal on the bottom surface of the concave portion of the lower mold cavity, the lower surface of the header can be sealed. Therefore, the generation of burrs due to the resin going around the lower surface of the header is prevented by the header seal. be able to.

5) By using a stick pot, the total length of the main runner can be set short, so that the amount of resin used can be reduced and the effective use efficiency of the resin can be increased.

6) By making the length of the stick tablet correspond to the length of the work, damage to the stick tablet can be prevented, and the total volume of the stick tablet can be easily set.

FIG. 13 is an enlarged partial cross-sectional view showing a method for molding a resin sealing body according to another embodiment of the present invention.
Shows the state before the mold clamping, and (b) shows the state after the mold clamping.

This embodiment is different from the above embodiment in that
The point is that a tape type lead seal formed into a tape shape by an elastic material is used. That is, the tape type lead seal 47 is formed in a tape shape using fluorine rubber having a hardness of 70 °, and as shown in FIG. It is laid on the tea block 32.

As shown in FIG. 13 (b), when the upper mold cavity block 31 is clamped to the lower mold cavity block 32, the tape-shaped lead seal 47 is compressed and deformed. The outer leads 4, the second outer leads 5, and the third outer leads 6 are in a sealed state in which they are in close contact with both side surfaces. As a result, the resin 69 filled in the cavity 35 is removed from the gap between the first outer lead 4 and the third outer lead 6 and the second outer lead 5.
Of the first outer lead 4 and the third outer lead 6, and the second sealing portion 43 is provided on both sides of the second outer lead 5 and the third outer lead 6. Is prevented from adhering to each other. That is, burrs generated on both side surfaces of the first outer lead 4 and both side surfaces of the third outer lead 6 due to the resin 69 leaking between the adjacent outer leads can be prevented by the tape type lead seal 47.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

For example, it is desirable that the specific configuration of the lead seal is appropriately set in accordance with various conditions such as the shape, number and pitch of outer leads to be sealed, mold clamping pressure, resin injection pressure, and the like.

The header seal can be omitted.

The pot or tablet is not limited to the stick shape, but may be an ordinary shape or a multi-pot system.

In the above description, the case where the invention made by the present inventor is mainly applied to the manufacturing technique of the power transistor, which is the field of application as the background, has been described. The present invention can be applied to all manufacturing technologies of semiconductor devices such as a semiconductor integrated circuit device having a package.

[0065]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

The resin is prevented from leaking from the cavity between the outer leads by interposing the lead seal between the adjacent outer leads and making the lead seal adhere to the opposing side surfaces of the outer leads. Since the adhesion can be prevented, the occurrence of burrs can be prevented.

By preventing the burr from being generated on the side surface of the outer lead, the deburring step can be omitted, so that not only the production cost can be reduced, but also the outer lead due to accidental falling off of the burr can be prevented. Secondary obstacles such as dents derived in the deburring step can be avoided beforehand.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view showing a part of a main part of a transfer molding apparatus according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing the entire main part.

FIG. 3 is a partially omitted side sectional view passing through a gate.

FIG. 4 is a partially omitted side sectional view passing through a cavity.

FIG. 5 shows a lead seal, wherein (a) is a front view,
(B) is a side view, and (c) is a bottom view.

FIGS. 6A and 6B are enlarged partial sectional views for explaining the operation of the lead seal, in which FIG. 6A shows a state before mold clamping and FIG. 6B shows a state after mold clamping.

FIG. 7 shows a header seal, wherein (a) is a front view,
(B) is a side view, and (c) is a plan view.

FIG. 8 is a perspective view showing an arrangement of a transfer molding apparatus.

FIGS. 9A and 9B are perspective views for explaining the operation of the tablet supply device, wherein FIG. 9A shows a sliding cutting step and FIG. 9B shows a tamping step.

FIG. 10 is a partially omitted side sectional view passing through a gate showing a resin sealing body forming step.

FIG. 11 is a partially omitted side cross-sectional view showing a resin sealing body forming step and passing through a cavity.

FIG. 12 is a graph showing an effect of preventing a burr of an outer lead by a lead seal.

FIGS. 13A and 13B are enlarged partial cross-sectional views illustrating a method of molding a resin-sealed body according to another embodiment of the present invention, wherein FIG. 13A shows a state before mold clamping and FIG. 13B shows a state after mold clamping.

[Explanation of symbols]

1 ... multiple lead frame, 1a ... unit lead frame,
2 ... Outer frame, 2a ... Section frame, 3 ... Tie bar, 4,
5, 6: outer lead, 7, 8: inner lead, 9: header suspension lead (inner lead), 10: header, 11
... bending part, 12 ... bonding layer, 13 ... pellet, 1
4 ... bonding wire, 15 ... work (resin sealed object), 16 ... resin sealed body, 17 ... finished product (resin sealed body molded work), 20 ... transfer molding device (molding device), 21 ... top Mold center block, 22: Lower mold center block, 23: Stick pot, 24: Plunger,
25 ... cull, 26 ... main runner, 27, 28 ... heat block, 31 ... upper mold cavity block, 32 ... lower mold cavity block, 33 ... upper mold cavity concave part, 34 ... lower mold cavity concave part, 35 ... Cavity, 36 ... Subrunner, 37 ... Gate, 38 ... Escape recess, 39 ... Dam block, 40 ... Lead seal holding hole,
41 ... lead seal, 42 ... first seal part, 43 ... second seal part, 44 ... left end seal part, 45 ... right end seal part,
46 positioning part, 47 tape-type lead seal, 50
... header seal holding hole, 51 ... header seal (exposed surface seal), 52 ... first seal part, 53 ... second seal part, 5
4 positioning unit, 60 tablet supply device, 61 hopper, 62 sliding cut, 63 motor, 64 tableting tool, 6
5: Cylinder device, 66: Handler, 67: Powder resin, 68: Stick tablet, 69: Resin, 70
… Loading device, 71… real rack, 72… handler, 80… unloading device, 81… empty rack.

Continuation of the front page (72) Inventor Masaaki Yoshizawa 5-2-1, Josuihonmachi, Kodaira-shi, Tokyo Inside the Semiconductor Division, Hitachi, Ltd. (72) Inventor Takuichi Kiyozuka 5-chome, Josuihoncho, Kodaira-shi, Tokyo No. 20 Hitachi Semiconductor Co., Ltd. Semiconductor Business Headquarters (72) Inventor Katsuo Arai 5-2-1 Kamimihoncho, Kodaira-shi, Tokyo F-Terminus Hitachi Semiconductor Co., Ltd. F-term (reference) 5F061 AA01 BA01 CA21 DA01 DA03 DA06 DE02 EA02 5F067 AA09 DE14

Claims (13)

[Claims] 1. A method of manufacturing a semiconductor device, comprising: forming a resin seal by interposing a lead seal formed of an elastic body between adjacent outer leads. 2. The method for manufacturing a semiconductor device according to claim 1, wherein said lead seal is attached to a molding die in advance. 3. The method of manufacturing a semiconductor device according to claim 1, wherein said lead seal formed in a tape shape is laid on a mating surface of a molding die when said resin sealing body is molded. 4. A molding apparatus characterized in that a lead seal formed of an elastic body and closely attached to a side surface of an outer lead is attached near a cavity on a mating surface of a molding die. 5. The lead seal according to claim 4, wherein the lead seal is formed in a comb-like shape which is fitted between adjacent outer leads and is compressed and deformed to be in close contact with a side surface of the outer lead. Molding equipment. 6. The molding apparatus according to claim 4, wherein the lead seal is formed of fluoro rubber. 7. The lead seal has a Shore hardness of 70.
The molding apparatus according to claim 4, 5 or 6, wherein the molding apparatus is made of fluorine rubber having an angle of? 8. A molding apparatus, wherein an exposed surface seal formed of an elastic body and in close contact with an exposed surface of an object to be resin-sealed is mounted in a cavity of a molding die. 9. The molding apparatus according to claim 8, wherein the exposed surface seal is configured to be in close contact with a header of the resin sealing material. 10. The molding apparatus according to claim 8, wherein the exposed surface seal is formed of fluoro rubber. 11. The exposed face seal has a Shore hardness of 7
The molding apparatus according to claim 8, 9 or 10, wherein the molding apparatus is formed of 0 ° fluoro rubber. 12. A molding apparatus, characterized in that a slot-shaped stick pot having a length corresponding to the length of an object to be resin-sealed is opened in a molding die. 13. The molding apparatus according to claim 12, wherein a stick tablet having a length corresponding to the length of the object to be sealed is put into the stick pot.