JP2000243787A - TAB tape and BGA type semiconductor device using the same - Google Patents

Abstract

(57) [Problem] To eliminate the necessity of disconnecting a wiring lead from a power supply line side when connecting a semiconductor chip and a wiring lead.
Accordingly, it is an object of the present invention to provide a TAB tape and a BGA type semiconductor device using the TAB tape, in which the occurrence of a short circuit in package manufacturing is eliminated in principle. A slit (5) is formed on the wiring lead (3) between the wiring lead (3) and the power supply line (4) so as to separate the wiring lead (3) and the power supply line (4) after electroplating. And the plurality of inner leads 3a are made independent from each other. This eliminates the need to disconnect the wiring lead from the power supply line side when connecting the terminal electrode of the semiconductor chip and the wiring lead, and in principle eliminates the occurrence of short-circuiting of the lead during package manufacturing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a TAB (Tape Aut)
and a BGA type semiconductor device using the tape.

[0002]

2. Description of the Related Art There is a semiconductor device of a BGA (Ball Grid Array) package for performing surface mounting on a printed circuit board using solder balls. The features of this BGA type semiconductor device are:
Since the entire surface of the package can be electrically connected to the printed circuit board, QFP (Qu
Compared to a device connected on each side of the package, such as an ad flat package, the number of pins (multi-terminals) can be increased without reducing the pitch between terminals (leads). In particular, those using a TAB tape as a package structural material are suitable for thinning and miniaturization.
CSP (Chip Size Pa) such as BGA (trademark of Tessera, USA)
ckage) is possible.

The μBGA package is a CSP of a tape BGA type, and has a structure in which an elastomer (low elastic resin) is interposed between a chip and a TAB tape, and further, the chip and the TAB tape are connected by S-shaped leads. .
In the μBGA technology, since an elastomer is interposed between the chip and the TAB tape, thermal stress generated between the package and the printed board can be reduced, and the life of the solder ball joint can be improved.

FIG. 4 shows an assembly process for manufacturing a semiconductor device having a μBGA structure using a TAB tape.

A wiring pattern 1 including wiring leads 3 and lands 12 on one surface of a tape base 10 made of an insulating film.
The elastomer 20 is attached to the TAB tape 1 provided with No. 1 to form a TAB tape 30 with an elastomer for BGA (FIG. 4A).

[0006] This TAB tape with elastomer for BGA 3
The semiconductor chip 2 is mounted at 0 (FIG. 4B).
The semiconductor chip 2 is an elastomer 2 which is a double-sided adhesive film.
0 is adhered to the TAB tape 30.

Next, the inner leads 3a of the TAB tape 30 with elastomer for BGA are formed in an S shape by a bonding tool, and are connected to the electrode pads 7 as terminal electrodes of the semiconductor chip 2 (FIG. 4C). That is, the bonding tool 8 (FIG. 6) cuts the notch of the inner lead 3a, further forms the inner lead 3a in an S-shape, and performs bonding on the electrode pad 7 of the semiconductor chip 2 by heat and ultrasonic waves.

Next, the electrode pads 7 and the leads 3a of the bonded semiconductor chip 2 are sealed with a sealing resin 40 (FIG. 4D).

Then, the solder balls 50 are mounted on the lands 12 of the TAB tape 1 (FIG. 4E), and laser marking or printing is performed on the chip surface (FIG. 4F). Finally, it is cut into individual pieces by punching out from a TAB tape 30 with an elastomer for BGA to obtain a μBGA package.

As described above, the μBG using the TAB tape
In the A package, as one means for achieving a reduction in thickness and size, a general wire bonding method is not used for electrical connection between the wiring leads 3 of the TAB tape and the electrode pads 7 of the semiconductor chip 2, and FIG. As shown in FIG. 6, a bonding window (bonding window) 6 is provided in a portion of the TAB tape located immediately above the electrode pad 7 of the semiconductor chip 2, and the portion is bridged through the inner lead 3a of the wiring lead 3 in FIG. As described above, a method is used in which one side of the wiring lead 3 is cut off by the bonding tool 8 and directly hit the electrode pad 7 of the semiconductor chip 2 (inner lead bonding).

[0011]

The wiring leads of the TAB tape generally use Cu foil, but Au is electroplated for the above connection method. In order to perform this plating, in the manufacturing process of the TAB tape, as shown in FIG. 5, each wiring lead 3 connected to the electrode pad 7 of the semiconductor chip is in a state of being connected by the power supply line 4.

Further, even after the package is cut off from the TAB tape, since the power supply line exists in the package in the prior art, when the terminal electrode is connected to the wiring lead (inner lead bonding), one side of the wiring lead is used. (The power supply line side) will be short-circuited between the terminal electrodes unless it is cut securely.

In order to surely cut one side (the power supply line side) of the wiring lead, it is necessary to fix the tape portion at the package end with a jig in the inner lead bonding step. However, the package size (tape size) tends to approach the size of the chip as much as possible, which reduces the amount of tape fixing allowance and makes it difficult to reliably fix and eventually cut the leads during bonding. There is a possibility that contact (short) of the cut inner lead may occur, which may be a fatal problem in the function of the product.

An object of the present invention is to eliminate the above-mentioned disadvantages of the prior art and eliminate the necessity of cutting the wiring leads from the power supply line side in the inner lead bonding step. An object of the present invention is to provide a highly reliable TAB tape and a BGA type semiconductor device using the TAB tape, in which short-circuiting due to cutting cannot occur in principle in package manufacturing.

[0015]

In order to achieve the above object, a TAB tape according to the present invention is provided on a tape base, in which individual wirings including a plurality of inner leads electrically connected to terminal electrodes of a semiconductor chip are provided. A TAB tape provided with a lead and a common power supply line for performing electroplating on these wiring leads, wherein the plurality of inner leads are passed over a bonding window provided on a tape base material, and In a TAB tape configured so that inner leads are connected to terminal electrodes of a semiconductor chip in a window, a shape intersecting the plurality of wiring leads between the bonding window and the common power supply line after electroplating. A slit is provided to separate the wiring lead from the power supply line, and the plurality of inner leads are respectively supplied with the slit. It is obtained to be independent (claim 1).

Further, the BGA type semiconductor device of the present invention is characterized in that individual wiring leads including a plurality of inner leads electrically connected to terminal electrodes of a semiconductor chip are formed on a tape base material, and these wiring leads are electroplated. Using TAB tape provided with a common power supply line for applying
A semiconductor chip provided on a wiring lead side surface of the TAB tape via an elastomer, and forming a bonding window in a tape base in a portion where the plurality of inner leads are present; In a BGA type semiconductor device in which inner leads existing in a form of being bridged over a window are connected to terminal electrodes of a semiconductor chip, after the electroplating, the plurality of inner leads are connected between the bonding window and the common power supply line. A slit is provided so as to intersect with the wiring lead, and the slit separates the wiring lead from the power supply line, makes the plurality of inner leads electrically independent from each other, and cuts the inner lead bridged over the bonding window. It is connected to the terminal electrode of the semiconductor chip without any change (claim 3).

The gist of the present invention is that the slit formed to separate the wiring lead and the power supply line after the electroplating is formed on the wiring lead between the wiring lead and the power supply line, and the plurality of inner leads are formed. That is, each lead is independent. This eliminates the necessity of cutting the wiring lead from the power supply line side when connecting the terminal electrode of the semiconductor chip and the wiring lead, so that the occurrence of a short circuit of the lead in package manufacturing can be eliminated in principle.

In the TAB tape or BGA type semiconductor device of the present invention, the slit may be provided so as to form an outline of the semiconductor device. The feature of this mode is that the position of the power supply line for applying Au plating to the wiring lead of the TAB tape is arranged outside the package, so that when connecting the terminal electrode of the semiconductor chip and the wiring lead, the wiring is formed. There is no need to cut the lead from the power supply line side, and the short circuit in package manufacturing can be eliminated in principle.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment.

FIG. 1 shows a TAB according to an embodiment of the present invention.
FIG. 5A is a top view showing a state in which the semiconductor chip 2 is mounted on the tape 1 by using an elastomer 20 as shown in FIG. 4A, and wiring leads 3 and power supply lines 4 are shown on the outermost surface for easy understanding. I have.

The TAB tape 1 is provided on a tape substrate 10 made of an insulating film and provided on the tape substrate 10.
Individual wiring leads 3 including a plurality of inner leads 3a electrically connected to the electrode pads 7 as terminal electrodes of the semiconductor chip 2, and the wiring leads 3 which are also provided on the tape base 10 and are subjected to electroplating And a common power supply line 4. Further, the TAB tape 1 has a bonding window 6 formed in the tape base 10 at a portion where the plurality of inner leads 3a exist.

As described above, in the TAB tape 1, the bonding window 6 is formed in the tape base 10 at the portion where the plurality of inner leads 3a are present. As a result, the plurality of inner leads 3a Window 6
Existed. The plurality of inner leads 3a extend at the same width, and a notch serving as a cutting position is not provided in the middle of the inner leads 3a as in the related art.

In FIG. 1, the wiring leads 3 and the power supply lines 4 are connected to the wiring patterns 1 in the TAB tape manufacturing process.
After the completion of the Au plating, the wiring is divided by slits 5 provided so as to intersect with the wiring leads 3. In other words, the outer shape line of the semiconductor device formed by the slit 5 for separating the wiring lead 3 and the power supply line 4 after the electroplating is determined so as to come on the wiring lead 3 between the wiring lead 3 and the power supply line 4. The plurality of inner leads 3a are separated by the slits 5 so as to be electrically independent from each other. That is, T
The wiring pattern 3 is formed such that the power supply line 4 does not exist on the side of the surface area of the tape base material 10 of the AB tape 1 where the semiconductor chip 2 is mounted (inside the package surrounded by the outline of the semiconductor device). Are located.

FIG. 2 is a cross-sectional view of the bonding portion in the inner lead bonding step, showing a state where the bonding tool 8 has just descended to the electrode pad 7 and bonding has been completed. As shown in FIG. 2, the inner lead 3 a laid over the bonding window 6 is pressed and connected to an electrode pad 7 as a terminal electrode of a semiconductor chip by a bonding tool 8. At this time, the inner lead 3a is conventionally cut, but in the present invention, the inner lead 3a is crimped to the electrode pad 7 without being cut.

That is, in the related art, as shown in FIG. 5, the power supply line 4 exists in the surface area of the tape base material 10 of the TAB tape 1 on the mounting side of the semiconductor chip 2, that is, in the semiconductor package. As a result, in the related art, as shown in FIG. 6, when the bonding tool 8 just goes down to the electrode pad 7 and completes the bonding, the power supply line 4 is present in the semiconductor package. If the lead 3 is not surely cut off on the power supply line 4 side, an electrical short will occur,
It becomes completely defective as a product. Therefore, since it is necessary to cut the lead, it is necessary to add a notch to the lead in order to determine the cutting position. In order to provide the notch in the lead, it is necessary to increase the width of the lead, which hinders the progress of narrowing the pitch. Further, conventionally, in order to reliably cut one side (the power supply line 4 side) of the wiring lead 3 in the inner lead bonding step, it is necessary to secure a tape fixing allowance to fix the tape portion at the package end with a jig. Yes,
This is an obstacle to reducing the package size.

However, in this embodiment, the power supply line 4 does not exist in the package as shown in FIG.
Are electrically independent from each other, in the inner lead bonding step shown in FIG.
There is no need to cut on the side (outside the package). In addition, since it is not necessary to attach a notch to each wiring lead 3 for cutting, the pitch of the leads can be reduced.

FIG. 3 shows that the semiconductor chip 2 is mounted on the TAB tape 1 by using the elastomer 20 in accordance with the manufacturing method already described with reference to FIGS. 4 shows a semiconductor device having a BGA structure in a state where an inner lead bonding step of electrically cutting the semiconductor chip 2 through the slits 5 and electrically connecting to the electrode pads 7 of the semiconductor chip 2 seen through the bonding window 6 is completed. It is. Since the inner leads 3a do not need to be cut in the inner lead bonding step,
Even if the fixing margin of the TAB tape 1 is reduced due to downsizing of the CSP or the like, there is essentially no danger of the inner leads 3a coming into contact.

[0028]

As described above, according to the present invention, the following excellent effects can be obtained.

According to the first or third aspect of the invention, T
In an AB tape or a BGA type semiconductor device formed using the same, a slit formed to separate a wiring lead from a power supply line after electroplating is formed on a wiring lead between the wiring lead and the power supply line. Since the plurality of inner leads are made independent from each other, it is not necessary to disconnect the wiring leads from the power supply line side when connecting the terminal electrodes of the semiconductor chip and the wiring leads. Can be eliminated in principle.

According to the second or fourth aspect of the present invention, in the BGA type semiconductor device formed by using the TAB tape or the TAB tape, the slit forms an outline of the semiconductor device. , T in the semiconductor device
There is no common power supply line for applying Au plating to the wiring leads in the AB tape manufacturing process. Therefore, since the wiring leads are electrically independent, there is no need to cut the wiring leads during the inner lead bonding, and a short-circuit failure due to a lead disconnection failure (uncut) at the time of bonding, which has been a problem in the prior art. Can be eliminated in principle.

[Brief description of the drawings]

FIG. 1 is a partial plan view showing a BGA type semiconductor device of the present invention with a semiconductor chip mounted on a TAB tape, in which wiring leads and power supply lines are shown on the outermost surface for easy understanding. FIG.

FIG. 2 is a cross-sectional view showing an inner lead bonding step of the BGA type semiconductor device according to the present invention, showing a state where a bonding tool has just descended to an electrode pad portion and bonding has been completed.

FIG. 3 is a partial plan view showing the BGA type semiconductor device of the present invention in a state where an inner lead bonding step has been completed, and wiring leads and power supply lines are shown on the outermost surface for easy understanding. FIG.

FIG. 4 is a diagram showing a part of the manufacturing process of the BGA type semiconductor device used in the present invention.

FIG. 5 is a partial plan view showing a conventional BGA type semiconductor device with a semiconductor chip mounted on a TAB tape, in which wiring leads and power supply lines are shown on the outermost surface for easy understanding. FIG.

FIG. 6 is a cross-sectional view showing an inner lead bonding step of a conventional BGA type semiconductor device, showing a state in which a bonding tool has just descended to an electrode pad portion serving as a terminal electrode and bonding has been completed.

FIG. 7 is a partial plan view showing a conventional BGA type semiconductor device in a state where an inner lead bonding step is completed, and shows wiring leads and power supply lines on the outermost surface for easy understanding. It is.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 TAB tape 2 Semiconductor chip 3 Wiring lead 3a Inner lead 4 Power supply line 5 Slit 6 Bonding window 7 Electrode pad (terminal electrode) 8 Bonding tool 10 Tape base material 20 Elastomer 30 TAB tape with BGA elastomer 40 Sealing resin 50 Solder ball

Claims (4)

[Claims] An individual wiring lead including a plurality of inner leads electrically connected to terminal electrodes of a semiconductor chip on a tape base material, and a common power supply line for electroplating the wiring leads. Wherein the plurality of inner leads are wound over a bonding window provided on the tape base material, and the inner leads are connected to terminal electrodes of the semiconductor chip in the bonding window. In the above TAB tape, after electroplating, a slit is provided between the bonding window and the common power supply line so as to intersect the plurality of wiring leads, and the wiring lead and the power supply line are separated by the slit. TAB tape characterized in that the inner leads are electrically independent of each other. 2. The TAB tape according to claim 1, wherein said slit is provided so as to form an outline of a semiconductor device. 3. A semiconductor device comprising: a plurality of individual wiring leads including a plurality of inner leads electrically connected to terminal electrodes of a semiconductor chip on a tape base; and a common power supply line for performing electroplating on the wiring leads. A BGA type semiconductor device using a TAB tape provided with: a semiconductor chip is provided via an elastomer on a surface of the TAB tape on a wiring lead side, and a tape base in a portion where the plurality of inner leads exist is provided. In a BGA type semiconductor device in which a bonding window is formed and an inner lead existing in a state of being bridged over the bonding window is connected to a terminal electrode of a semiconductor chip, after the electroplating, the bonding window and the A slit is provided between the common power supply line and the plurality of wiring leads so that the wiring lead and the power supply line are formed by the slit. Wherein the plurality of inner leads are electrically independent from each other, and the inner leads extended over the bonding window are connected to terminal electrodes of a semiconductor chip without cutting. . 4. The BGA type semiconductor device according to claim 3, wherein said slit forms an outline of the semiconductor device.