JP2000280404A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JP2000280404A JP2000280404A JP11089875A JP8987599A JP2000280404A JP 2000280404 A JP2000280404 A JP 2000280404A JP 11089875 A JP11089875 A JP 11089875A JP 8987599 A JP8987599 A JP 8987599A JP 2000280404 A JP2000280404 A JP 2000280404A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- prepreg
- sheet
- paper base
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 239000005011 phenolic resin Substances 0.000 abstract description 13
- 229920000742 Cotton Polymers 0.000 abstract description 5
- 239000000835 fiber Substances 0.000 abstract description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229920000728 polyester Polymers 0.000 abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 239000002657 fibrous material Substances 0.000 abstract description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract description 2
- 150000002989 phenols Chemical class 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 239000000123 paper Substances 0.000 description 13
- 239000002966 varnish Substances 0.000 description 7
- 238000004080 punching Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 239000002655 kraft paper Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 239000011188 CEM-1 Substances 0.000 description 2
- 101100257127 Caenorhabditis elegans sma-2 gene Proteins 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、耐衝撃性に優れた
熱硬化性樹脂積層板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a thermosetting resin laminate having excellent impact resistance.
【０００２】[0002]
【従来の技術】電子機器は工場の出荷時に完璧な商品で
あってもトラック、貨車等で輸送される場合、振動によ
る衝撃、荷役時の落下衝撃等で損傷をきたし所期の製品
目的を達成できないケースがある。特に紙基材フェノー
ル樹脂積層板を回路基板として用いた電子機器の場合、
輸送時の衝撃により回路板が損傷するケースがあり、耐
衝撃性に優れた積層板の要求が強まっている。従来、輸
送中の品質を確実なものにしなければならない場合、回
路基板として表面層にガラスクロスを用いたＣＥＭ−１
タイプのものを使用する手段がとられることが多いが、
ＣＥＭ−１はフェノール樹脂積層板に比べ打ち抜き加工
性の低下、コスト上昇という問題が生じる。2. Description of the Related Art Even when perfect electronic products are shipped from factories, even if they are transported by truck or freight car, they are damaged by the impact of vibration, the impact of dropping during cargo handling, etc., and achieve the intended product purpose. There are cases where it is not possible. Especially in the case of electronic equipment using a paper base phenol resin laminate as a circuit board,
In some cases, the circuit board is damaged by the impact during transportation, and the demand for a laminate having excellent impact resistance is increasing. Conventionally, when quality during transportation must be ensured, CEM-1 using glass cloth as a surface layer as a circuit board has been proposed.
Often, a means of using a type is used,
CEM-1 has the problems of reduced punching workability and increased cost as compared to phenolic resin laminates.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、打ち抜き加
工性の低下やコスト上昇を生じることなく、耐衝撃性に
優れた熱硬化性樹脂積層板を得ることを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a thermosetting resin laminate excellent in impact resistance without lowering the punching workability and increasing the cost.
【０００４】[0004]
【課題を解決するための手段】本発明は、紙基材に熱硬
化性樹脂を含浸乾燥し、この含浸紙を所定枚数重ねて、
加熱・加圧成形する積層板の製造方法において、銅箔と
紙基材プリプレグとの間にネット状シート基材プリプレ
グを１枚以上配置することを特徴とする熱硬化性樹脂積
層板の製造方法に関する。According to the present invention, a paper base material is impregnated with a thermosetting resin and dried.
A method for producing a laminate which is subjected to heat and pressure molding, wherein one or more net-like sheet substrate prepregs are disposed between a copper foil and a paper substrate prepreg. About.
【０００５】本発明に用いるネット状シート基材は、綿
等の有機天然繊維、ポリエステル繊維等の合成繊維など
のシート状の繊維材料からなり、ネット状に織られたも
のであればよく、加熱加圧して積層板に成形された後に
ネット状の形状を有するものが耐衝撃性の向上に特に効
果的であり、その他の特長については特に限定するもの
ではないが、特に合成繊維の場合、ネットの編み目が小
さいと織布と同様に打ち抜き加工性の低下が生じること
があるので、この場合、編み目は１ｍｍ以上が好まし
い。厚みは通常の積層板に使用されるものと同様に０．
２ｍｍ又はそれ以下が好ましい。The net-like sheet substrate used in the present invention may be made of a sheet-like fibrous material such as organic natural fibers such as cotton and synthetic fibers such as polyester fibers. Those having a net-like shape after being formed into a laminate by pressing are particularly effective in improving impact resistance, and other features are not particularly limited. If the stitches are small, the punching workability may decrease as in the case of the woven fabric. In this case, the stitches are preferably 1 mm or more. The thickness is set to 0.1 as in the case of a normal laminated plate.
2 mm or less is preferred.
【０００６】熱硬化性樹脂としては、通常フェノール、
クレゾール等のフェノール類とホルムアルデヒドを反応
させたフェノール樹脂で、必要に応じて桐油などで変性
することもよく、また、これらのフェノール樹脂にビス
フェノール型エポキシ樹脂を混合したものを用いること
も可能である。また、エポキシ樹脂、不飽和ポリエステ
ル樹脂なども使用できる。さらに、難燃効果を持たせる
ため、難燃剤を添加してもよい。As the thermosetting resin, usually, phenol,
It is a phenol resin obtained by reacting phenols such as cresol with formaldehyde, and may be modified with tung oil or the like as necessary.It is also possible to use a mixture of these phenol resins with a bisphenol-type epoxy resin. . Further, an epoxy resin, an unsaturated polyester resin, or the like can be used. Further, a flame retardant may be added to provide a flame retardant effect.
【０００７】上記の熱硬化性樹脂を溶剤に溶解し、適当
な濃度及び粘度に調整したものをネット状シート基材に
含浸乾燥してプリプレグを得、同様に適当な濃度及び粘
度に調整したものを紙基材に含浸乾燥して紙基材プリプ
レグを得る。紙基材プリプレグを所要枚数重ね、銅箔と
紙基材プリプレグとの間に前記ネット状シート基材プリ
プレグを１枚以上配置し、通常の条件にて加熱加圧成形
することにより目的とする耐衝撃性の優れた熱硬化性樹
脂を得る。A prepreg obtained by dissolving the above-mentioned thermosetting resin in a solvent and adjusting the concentration and viscosity to an appropriate value is obtained by impregnating and drying the net-like sheet substrate, and similarly adjusting the concentration and the viscosity to an appropriate value. Is impregnated into a paper base and dried to obtain a paper base prepreg. A required number of paper base prepregs are stacked, one or more of the net-shaped sheet base prepregs are arranged between the copper foil and the paper base prepreg, and heated and pressed under ordinary conditions to achieve the desired resistance. A thermosetting resin having excellent impact properties is obtained.
【０００７】ネット状シート基材に熱硬化性樹脂を含浸
させ、得られたプリプレグを銅箔と紙基材プリプレグを
所要枚数重ねたプリプレグとの間に１枚以上配置して加
熱加圧成形することにより、積層板の強度は増大し、耐
衝撃性が向上する。この理由は、積層板に衝撃が加わっ
た場合、ネット状シート基材の強度と柔軟性のため、こ
の部分で衝撃力が分散しクラックの発生を抑える、と考
えられる。従って、衝撃による回路基板の保護のために
は、ネット状シート基材プリプレグは、銅箔と紙基材プ
リプレグの間に配置されていることが重要である。A net-shaped sheet base material is impregnated with a thermosetting resin, and one or more obtained prepregs are placed between a copper foil and a prepreg formed by stacking a required number of paper base prepregs, and are subjected to heat and pressure molding. This increases the strength of the laminate and improves the impact resistance. It is considered that the reason for this is that when an impact is applied to the laminate, the impact force is dispersed at this portion due to the strength and flexibility of the net-shaped sheet base material, thereby suppressing the occurrence of cracks. Therefore, it is important that the net-like sheet base prepreg is disposed between the copper foil and the paper base prepreg in order to protect the circuit board by impact.
【０００９】[0009]
【実施例】〔含浸用フェノール樹脂ワニスの製造〕フェ
ノール１２００ｇ及び桐油１０００ｇをｐ−トルエンス
ルホン酸の存在下で反応させ、２５％アンモニア水を添
加後、パラホルムアルデヒド２００ｇを加えてさらに反
応させ、トルエンで希釈して、樹脂分５０％のフェノー
ル樹脂ワニスを得た。[Production of phenolic resin varnish for impregnation] 1200 g of phenol and 1000 g of tung oil were reacted in the presence of p-toluenesulfonic acid, 25% aqueous ammonia was added, and 200 g of paraformaldehyde was added to further react. To give a phenolic resin varnish with a resin content of 50%.
【００１０】〔実施例１〕ネット状シート基材として厚
み０．１５ｍｍの綿布基材に前記のフェノール樹脂ワニ
スを含浸乾燥させ綿布基材プリプレグを得た。同様にク
ラフト紙に前記フェノール樹脂ワニスを含浸乾燥させて
紙基材プリプレグを得た。銅箔と前記綿布基材プリプレ
グ１枚と紙基材プリプレグ７枚を重ね合わせ加熱加圧成
形して、板厚 １.６mm厚の銅張積層板を得た。Example 1 A cotton cloth base material having a thickness of 0.15 mm as a net-like sheet base material was impregnated with the phenol resin varnish and dried to obtain a cotton cloth base material prepreg. Similarly, kraft paper was impregnated with the phenol resin varnish and dried to obtain a paper base prepreg. A copper foil, one piece of the above-mentioned cotton cloth base material prepreg, and seven pieces of paper base material prepreg were superposed and heated and pressed to obtain a copper-clad laminate having a thickness of 1.6 mm.
【００１１】〔実施例２〕ネット状シート基材としてポ
リエステル繊維からなる厚み０．２ｍｍ、編み目２ｍｍ
の寒冷紗に前記フェノール樹脂ワニスを含浸乾燥させて
プリプレグを得た。同様にクラフト紙に前記フェノール
樹脂ワニスを含浸乾燥させて紙基材プリプレグを得た。
以下、実施例１と同様にして １.６mm厚の銅張積層板を
得た。[Example 2] A net-like sheet substrate made of polyester fiber having a thickness of 0.2 mm and a stitch of 2 mm
Was impregnated with the phenol resin varnish and dried to obtain a prepreg. Similarly, kraft paper was impregnated with the phenol resin varnish and dried to obtain a paper base prepreg.
Thereafter, a 1.6 mm-thick copper-clad laminate was obtained in the same manner as in Example 1.
【００１２】〔比較例１〕クラフト紙に前記フェノール
樹脂ワニスを含浸させて紙基材プリプレグを得た。この
紙基材プリプレグ８枚と銅箔とを重ね合わせ、加熱加圧
成形して １.６mm厚の銅張積層板を得た。Comparative Example 1 A kraft paper was impregnated with the phenol resin varnish to obtain a paper base prepreg. Eight sheets of this paper base prepreg and a copper foil were overlaid and molded under heat and pressure to obtain a 1.6 mm thick copper-clad laminate.
【００１３】これら各例で得られた積層板の特性評価結
果を表１に示す。 表 １ 実施例１ 実施例２ 比較例１ 曲げ強さ（Ｎ／mm2） １９３ １８８ １４５ 耐衝撃性（kJ/m2） ９．７ ７．７ ３．６ 打抜き加工性 良好 良好 良好 Table 1 shows the results of evaluation of the characteristics of the laminates obtained in these examples. Table 1 Example 1 Example 2 Comparative Example 1 Flexural strength (N / mm 2 ) 193 188 145 Impact resistance (kJ / m 2 ) 9.7 7.7 3.6 Punching workability Good Good Good
【００１４】（測定方法） １．曲げ強さ：ＪＩＳ Ｃ ６４８１による ２．耐衝撃性：ＪＩＳ Ｋ ６９１１による ３．打抜き加工性:ＡＳＴＭ Ｄ６１７−４４による(Measurement method) Flexural strength: according to JIS C6481 2. Impact resistance: according to JIS K 6911 Punching workability: According to ASTM D617-44
【００１５】[0015]
【発明の効果】表１から明らかなように、本発明により
得られたフェノール樹脂積層板は、従来のものと比較し
て、打抜き加工性を低下させることなく、耐衝撃性が向
上していることがわかる。As is clear from Table 1, the phenolic resin laminate obtained according to the present invention has improved impact resistance without lowering the punching workability as compared with the conventional one. You can see that.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F100 AB17C AJ04 AK01A AK01B AK33 AK41 BA03 BA07 BA10A BA10C BA11 DG10A DG13B DH01 EJ82A EJ82B GB43 JB13A JB13B JK10 JL01 4F204 AA36 AD03 AD06 AD16 AG01 AG03 AH36 FB01 FB22 FG03 FG09 FN11 FN17 FQ01 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F100 AB17C AJ04 AK01A AK01B AK33 AK41 BA03 BA07 BA10A BA10C BA11 DG10A DG13B DH01 EJ82A EJ82B GB43 JB13A JB13B JK10 JL01 4F204 AA36 AD03 AD06 AD16 F01 AG03 F03 AG01
Claims (1)
の含浸紙を所定枚数重ねて、加熱加圧成形する積層板の
製造方法において、銅箔と紙基材プリプレグとの間にネ
ット状シート基材プリプレグを１枚以上配置することを
特徴とする熱硬化性樹脂積層板の製造方法。1. A method of manufacturing a laminate, in which a paper base material is impregnated with a thermosetting resin and dried, and a predetermined number of the impregnated paper sheets are stacked and heated and pressed to form a laminate, between a copper foil and a paper base prepreg. A method for producing a thermosetting resin laminate, comprising arranging one or more net-like sheet base prepregs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11089875A JP2000280404A (en) | 1999-03-30 | 1999-03-30 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11089875A JP2000280404A (en) | 1999-03-30 | 1999-03-30 | Manufacture of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000280404A true JP2000280404A (en) | 2000-10-10 |
Family
ID=13982952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11089875A Pending JP2000280404A (en) | 1999-03-30 | 1999-03-30 | Manufacture of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000280404A (en) |
-
1999
- 1999-03-30 JP JP11089875A patent/JP2000280404A/en active Pending
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