JP2000294311A - Electric connector and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric connector which can be used for an LGA(land grid array), BGA(ball grid array) or the like and a method for manufacturing the same by suppressing variations of connecting resistance of terminals, and reducing a compressive load. SOLUTION: In an electric connector, a plurality of conductive metal fine wires 2, each having a flat, globular contact 3 at one end and a globular contact 6 at the other end, are provided in a thickness direction of an elastic insulative layer 1 in such a manner that both contacts are exposed from the obverse and reverse thereof. Inverted dish-like plating layers 4a, 4b, 4c are disposed in such a manner as to cover the flat, globular contact 3 of the conductive metal fine wire 2, and further, semi-spherical plating layers 7a, 7b are disposed in such a manner as to cover the globular contact 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electrical connector used for inspection or connection of a land grid array type or ball grid array type IC package and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a surface mount type I having a large number of input / output terminals has been proposed.
As shown in FIG. 7, a plurality of terminals 22...
A quat flat package (hereinafter, abbreviated as QFP) 23 having a structure from which the above is taken out is used. To respond to the recent increase in the number of terminals in this QFP,
In order to make the mounting area as small as possible, it is necessary to reduce the terminal pitch by suppressing the size of the IC package to a certain size or less. Recently, a terminal pitch of about 0.4 mm has been used. However, such a multi-terminal Q
The FP has a problem that the terminals are easily deformed because the terminal pitch is very small. Furthermore, since it is difficult to align a large number of terminals, there have been problems such as difficulty in securing connection reliability in a manufacturing process, an inspection process, and a mounting process.

Recently, as shown in FIGS. 8 and 9,
A land-like electrode 24 is provided on the entire back surface of the IC package body 21.
Alternatively, a land grid array type IC package in which terminals composed of solder ball electrodes 25 are arranged in a grid shape (hereinafter, referred to as a “land grid array type IC package”).
An LGA (abbreviated as LGA) 26 and a ball grid array type IC package (hereinafter abbreviated as BGA) 27 have been developed and are being put to practical use.

In connecting the LGA 26 and the BGA 27, an electric connector 28 shown in FIG. 10 is conventionally used. The electrical connector 28 includes an elastic insulating layer 31. In the thickness direction, a large number of conductive metal wires 32 whose middle portions are bent as shown in the drawing penetrate, and are connected and buried using a general-purpose ball bonder. A flat spherical contact portion 33 that contacts the land-shaped electrode 24 of the LGA 26 is provided at one end of each conductive metal thin wire 32, and a ball that contacts the substrate electrode 35 of the test board 34 is provided at the other end. Contact part 36
Are formed with their outer surfaces exposed from the elastic insulating layer 31.

[0005]

SUMMARY OF THE INVENTION
Is disposed between the LGA 26 and the inspection board 34 so as to be able to conduct, and the elastic insulating layer 31 is pressed by pressing the LGA 26.
Is compressed, and the LGA 26 and the inspection board 34 are electrically connected to each other for inspection or the like. However, when the electrical connector 28 is compressed in a direction to be shifted laterally as shown in FIG. 11, the flat spherical contact portion 33 and the ball-shaped contact portion 3 are compressed.
6 are buried in the elastic insulating layer 31 so that the contact portions 33, 3
No. 6, the contact between the land-like electrode 24 and the substrate electrode 35 becomes incomplete, and the connection resistance is likely to vary.

When the number of terminals increases, the compressive load required to obtain stable conduction increases. However, considering the flatness of LGA (maximum 0.15 mm), the amount of compression of the electrical connector is 0.15 mm or more. Is required. However, with respect to a flat LGA having almost no electrode protrusion, there is no escape of the elastic insulating layer during compression, and the compression load increases to reduce the LGA.
The GA may be damaged.
GA has a problem that it is difficult to use a conventional electric connector.

[0007] Therefore, the present invention suppresses the variation of the connection resistance of each terminal, reduces the compressive load, and provides a multi-pole LGA,
An object of the present invention is to provide an electrical connector that can be used for a BGA or the like and a method for manufacturing the same.

[0008]

The electric connector according to the present invention comprises a plurality of conductive metal wires each having a flat spherical contact portion at one end and a spherical contact portion at the other end.
An electrical connector penetrating the elastic insulating layer by exposing the contact portions from both front and back surfaces in a thickness direction of the elastic insulating layer. In addition to providing a layer, a hemispherical plating layer is provided to cover the contact portion of the stadium.

In the method for manufacturing an electrical connector according to the present invention, a plurality of dish-shaped recesses are provided on a substrate, and a plating layer is provided in each of the dish-shaped recesses. After the contact portion is provided, a step of implanting each conductive metal thin wire in each of the plating layers at the flat spherical contact portion, a step of forming a spherical contact portion at the other end of each conductive metal thin wire, A step of hardening and forming the elastic insulating layer from the surface of the substrate and the plating layer, a step of exposing the spherical contact portion of each conductive metal wire from the elastic insulating layer, and a hemispherical surface on each spherical contact portion exposed from the elastic insulating layer. Of forming a plating layer.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory longitudinal sectional view illustrating an embodiment of an electric connector according to the present invention. Reference numeral 1 denotes an elastic insulating layer, and a plurality of conductive metal wires 2 for obtaining electrical connection with external terminals of an IC package and electrodes of an inspection board are penetrated in the thickness direction. At one end of the conductive metal thin wire 2, there is a flat spherical contact portion 3, which covers the contact portion 3 and has a contact area extending in the horizontal direction. Plating layers 4a to 4c are provided to form pad-shaped terminal portions 5 as a whole. At the other end of the conductive metal thin wire 2, there is a spherical contact portion 6, which covers the contact portion 6 and extends the contact area in the vertical direction. The plating layers 7a to 7b are provided to similarly form the hemispherical terminal portions 8.

The flat spherical contact portion 3 and the spherical contact portion 6 of the conductive metal thin wire 2 are provided so as to be partially exposed from both the front and back surfaces of the elastic insulating layer 1, respectively. Bonding with the plating layers 4 and 7 is performed by an arbitrary method such as welding or adhesion. Each conductive metal wire 2 is preferably bent as shown in the figure, so that when the flat spherical contact portion 3 is repeatedly pressed, the conductive metal wire 2 embedded in the elastic insulating layer 1 is damaged. Is prevented.

The elastomer material used for forming the elastic insulating layer 1 is preferably one which exhibits fluidity before curing, forms a crosslinked structure after curing, and has rubber-like elasticity at around room temperature even after curing. For example, silicone rubber, fluorinated rubber, polybutadiene rubber, polyisoprene rubber,
Examples include polyurethane rubber, chloroprene rubber, polyester rubber, styrene-butadiene copolymer rubber, natural rubber, and the like, and foam materials in which closed or open cells are formed from these materials. In particular, silicone rubber, which is excellent in electrical insulation after curing, heat resistance, and compression set, is preferable. Among them, it is possible to inject a material without breaking the arrangement of the conductive metal wires, and to perform leveling in a short time. Because it can be performed, the properties before curing are liquid and low viscosity, and the viscosity is 1,000 P or less, particularly 200 P or less,
Usually, 5P or more is good. If the hardness of the obtained elastic insulating layer 1 is too high, the load at the time of compression connection increases, and if it is too low, the compression set increases.
In particular, 20 to 50 ° H is desirable.

The conductive thin metal wires 2 include gold, gold alloy, platinum, copper, aluminum, aluminum-silicon alloy,
Wires made of brass, phosphor bronze, beryllium copper, nickel, tungsten, stainless steel, etc., and wires plated with gold, gold alloy, nickel, etc. are used. A gold wire excellent in quality is preferred. About wire diameter,
Although there is no particular limitation, minimize the load at the time of connection,
It is preferable that the diameter is small as long as the connection stability is not adversely affected. More specifically, those having a diameter of 100 μm or less used in ordinary wire bonding are preferable because they are easily available. In particular, it is desirable to use a wire of φ20 to 80 μm.

From the viewpoints of preventing bending during joining and connection and reducing the load, the shape of the conductive metal thin wire is substantially N-shaped, square-shaped, horizontal S-shaped, horizontal U-shaped, horizontal Ω-shaped. Formed. In addition, when there is a linear portion such as a substantially N-shape, the thickness of the electric connector is as thin as 0.5 to 2 mm, and the elastic portion of the insulating layer is used for inspection and compression of connection. The length is preferably 0.2 to 0.5 mm, particularly preferably 0.2 to 0.3 mm.

The first plating layer 4a constituting the plate-shaped plating layer 4 can be made of gold, silver, palladium, a palladium-nickel alloy, nickel, rhodium, ruthenium, or the like. Since this plating layer 4a is a layer that comes into contact with the external terminals of the IC package, gold plating having low contact resistance is preferable, and in the case of an inspection application that is repeatedly pressed, hard gold plating is preferable in terms of wear resistance. . The thickness of the plating layer 4a is preferably 0.1 to 2 μm, but more preferably 0.1 to 1 μm in consideration of contact resistance, wear resistance and cost.

The second plating layer 4b cannot be said to have sufficient abrasion resistance when repeatedly compressed by using the plating layer 4a made of the first hard gold plating alone, and if the plating is made thick only with the hard gold plating, cost and productivity are increased. Further, in practical use, nickel or nickel alloy, which is harder than hard gold plating, is preferably used from the viewpoints of strength increase and cost reduction because it cannot be used. The thickness of the plating layer 4b is 2 to 50 μm
However, considering strength and cost, it is 5 to 30 μm.
Is more preferred. Since the third plating layer 4c has poor bonding properties with the second plating layer 4b, gold, silver, palladium or the like is preferably used for the purpose of improving wire bonding properties. Among them, gold plating is most preferable. The thickness of the plating layer 4c is preferably 0.05 to 1 μm, but is 0.1 to 0.5 μm in consideration of wire bonding properties and cost.
m is more preferred.

The first plating layer 7a constituting the hemispherical plating layer 7 is for increasing the amount of protrusion of the spherical contact portion 6 from the elastic insulating layer 1 and increasing the diameter thereof. ,
Tin, nickel, etc. can be used, but the wear resistance of the plating layer,
Hard nickel plating is preferred in terms of cost and plating growth speed. The thickness of the plating layer is preferably as large as possible, but is preferably 100 μm or less from the viewpoint of cost. However, when the thickness is 30 μm or less, the amount of protrusion from the elastic insulating layer 1 becomes insufficient, and there is a possibility that the elastic insulating layer 1 may be depressed during compression. Second plating layer 7
b may be normal gold plating for mounting and connection of an IC package that is not repeatedly used, but for connection for inspection, hard gold plating is 0.1 to 2 μm from the viewpoint of preventing damage and abrasion of contact portions. It is better to apply.

Next, an embodiment of a method for manufacturing an electrical connector according to the present invention will be described with reference to FIGS. FIG. 2A to FIG. 2D show a plate-shaped plating layer 4 attached to one end of the conductive thin metal wire 2.
The method of obtaining from the substrate 9 is shown in the order of steps. For this, first, as shown in FIG.
An etching resist film 10 is formed in a portion other than the portion where the dish-shaped concave portion 11 is to be finally provided in accordance with the pitch and arrangement of the external terminals of the C package, and the etching resist film 10 is formed on the other surface so as to cover the entire surface. Form. Then Figure 2
As shown in FIG. 2B, the thickness of the substrate 9 'is reduced to 40 by an iron chloride solution.
The dished recess 11 is formed by etching to a depth of about 70%. Subsequently, as shown in FIG. 2C, the etching resist film 10 is used as it is as a plating resist, and the plating layer 4, particularly the first plating layer 4a, the second plating layer 4b, Third plating layer 4
c are sequentially formed. Finally, as shown in FIG. 2D, the etching resist film 10 is peeled off with a sodium hydroxide solution to produce a bonding substrate 9.

At this time, the bonding substrate 9 to be applied is
Examples of the material include copper, copper alloy, iron-nickel alloy and the like. Among them, particularly, thermal expansion is small, workability (bonding property, low distortion property and etching property when forming an elastic insulating layer), cost. In view of this, an iron-nickel alloy is preferable. The thickness of the bonding substrate 9 can be used within the range of 0.05 to 0.5 mm as its own strength, but if the thickness is less than 0.1 mm, the depth of the dish-shaped concave portion 11 that can be formed by etching is reduced. As a result, the amount of protrusion of the pad-like terminal portion 5 from the surface of the elastic insulating layer 1 decreases, and the pad-like terminal portion 5 becomes insufficient in terms of load. On the other hand, if the thickness exceeds 0.25 mm, the etching time becomes longer, leading to an increase in cost.

The size and outer shape of the dish-shaped recess 11 are L
For GA and BGA, land-shaped electrodes and solder ball electrodes are generally 0.2 to 0.75 mm square or φ0.3 to 0.3 mm.
75 mm, it is necessary to consider the positional accuracy of the solder ball electrode and the position of the terminal part while ensuring the insulation between the terminals. Therefore, the shape should be circular, oval, square, polygonal, or elliptical. It may be formed appropriately, and in particular, in the case of a circular shape, it is preferable that the diameter is in the range of φ0.2 to 0.8 mm at the bottom of the dish-shaped recess. Further, the depth of the dish-shaped recess is preferably set to 40 to 70% of the thickness of the substrate 9 '. If this is less than 40%, the amount of protrusion of the pad-like terminal portion 5 is small, and the amount of protrusion is insufficient from the viewpoint of load when the amount of compression of the connector is 0.15 mm or more. On the other hand, if it exceeds 70%, the strength of the substrate may be insufficient or through holes may be generated.

FIG. 3 shows a process of implanting a plurality of conductive metal wires 2 of the above-mentioned material, wire diameter and shape on the plate-shaped plating layer 4 of the bonding substrate 9 by a general-purpose wire bonder. FIG. 4 shows a step of forming a spherical contact portion 6 by irradiating a laser to the other end of each conductive metal wire 2 after bonding. Further, FIG. 5 shows that the elastic insulating layer 1 is hardened on the surfaces of the bonding substrate 9 and the flat-plated plating layer 4 so that the spherical contact portions 6 of the conductive metal wires 2 are exposed from the elastic insulating layer 1. Specifically, a molding frame (not shown) is arranged in advance along the periphery of the substrate 9, and the above-described elastomer material for forming an elastic insulating layer is injected until the spherical contact portion is covered. After curing, the well-known laser irradiation is performed, and as shown in FIG.
This is performed by processing so as to expose 0.1 mm.

As the molding frame used here, general-purpose engineering plastic materials, ceramic materials or metal materials can be appropriately selected and used. As an engineering plastic material, polyetherimide (hereinafter referred to as PE) with excellent dimensional stability and heat resistance
I), polyphenylene sulfide (hereinafter, referred to as I)
PPS), polyether sulfone (hereinafter referred to as P
(Abbreviated as ES).

FIG. 6 shows a step of forming a hemispherical plating layer 7 on the spherical contact portion 6 exposed from the elastic insulating layer 1,
Specifically, the first plating layer 7a is coated on the surface of the spherical contact portion 6 where the bonding substrate 9 is exposed as an electrode by 30-1.
A second plating layer 7
b is applied to a thickness of 0.1 to 2 μm to form hemispherical terminal portions 8. Finally, the non-plated portion of the bonding substrate 9 is removed by a known etching process, and the pad-shaped terminal portion 5 is taken out, whereby the electrical connector of the present invention illustrated in FIG. 1 is obtained.

According to the present invention, since both the pad-shaped terminal portion 5 and the hemispherical terminal portion 8 are formed in a large size, the terminal portions 5 and 8 are not buried in the elastic insulating layer 1 by compression. In addition, the problem that the connection resistance of each terminal varies can be reliably solved. Both terminals 5, 8 on both sides
Is greatly projected from the elastic insulating layer 1, so that stress is concentrated on both terminal portions 5, 8 to realize a stable connection with low contact resistance, and furthermore, the load is extremely small even when compressed by 0.15 mm or more. can do.

In particular, in the case of an LGA having a flat plate shape with almost no electrode protrusion, a relief area of the elastic insulating layer 1 is generated during compression, and the load can be suppressed to a very small value even when the LGA is compressed by 0.15 mm or more. Further, by applying hard gold plating to the surfaces of both the pad-shaped terminal portion 5 and the hemispherical terminal portion 8, it is expected that the semi-spherical terminal portion 8 is prevented from being worn. As a result, even if the electrical connector is continuously used with a compression amount of 0.15 mm or more, it is possible to significantly suppress the increase in the connection resistance of each terminal, and to greatly improve the durability of the electrical connector. Can be.

[0026]

[Embodiment 1] An embodiment of an electrical connector of the present invention for LGA inspection will be described below. First, as shown in FIG. 2A, a 0.15 mm thick, 50 mm long, 50 mm wide iron-nickel alloy (nickel 41%) substrate has a central surface thereof,
40 rows each vertically and horizontally with a pitch of 1 mm (total 1,60
0) leaving a 0.4 mm square portion in the matrix of
A casein resist layer having a thickness of about 7 μm was formed, and a casein resist layer having a thickness of about 7 μm was formed on the rear surface of the substrate so as to cover the entire surface. As shown in FIGS. 2b to 2d, this was etched with a ferric chloride solution to a depth of 0.075 mm from the surface. Of nickel plating was applied as a plating layer of 20 μm, and then gold plating was applied as a third plating layer of 0.2 μm. Subsequently, the casein resist layer was peeled off with a 5% sodium hydroxide solution to obtain a bonding substrate.

Next, in the center of the gold plating portion which is the third plating layer, a diameter of 50 mm is applied using a general-purpose ball bonder.
The gold wires of μm were arranged by bonding in a matrix of 40 rows (1,600 in total) in each of vertical and horizontal directions at a pitch of 1 mm.
The gold wire at this time is about 0.3 m vertically as shown in FIG.
m, offset by 0.5 mm at an angle of 45 °, and further extended in the vertical direction. Then FIG.
As shown in Table 2, the tips of all of these gold wires were irradiated with argon laser light to form spherical contact portions with a diameter of 100 μm at the tips, and the heights of the contacts were made uniform at 1.0 mm. Further, a PEI molding frame having a length and width of 50 mm, a height of 1.1 mm and a width of 5 mm was arranged along the outer edge of the substrate.

Next, as shown in FIG. 5, the rubber hardness after curing is 25 ° H (JIS) in the frame of the molding frame.
A) Two-component silicone rubber: KE1216A / B [Shin-Etsu Chemical Co., Ltd., trade name] 50 parts by weight and colorant: K-Color-BK
-02 [Shin-Etsu Chemical Co., Ltd., trade name] A mixture with 10 parts by weight was injected in an amount 0.1 mm higher than the tip of the spherical contact portion of the gold wire, and was cured by heating at 120 ° C. for 30 minutes. .

Next, the silicon rubber covering the spherical contact portion of the gold wire is removed by scanning irradiation with a YAG laser beam until the spherical contact portion of the gold wire projects 50 μm from the silicone rubber surface as shown in FIG. Subsequently, the spherical contact portion of the gold wire exposed by the electrolytic method using the bonding substrate as an electrode was plated with 75 μm of nickel, and hard gold was further plated thereon with 2 μm. Subsequently, the substrate is etched with a ferric chloride solution to form a top φ0.3.
mm, a bottom φ0.4 mm and a protruding amount of 0.075 mm expose a pad-shaped terminal portion having a substantially trapezoidal cross section.
After this was sufficiently washed, an after-curing treatment was performed at 200 ° C. for 1 hour to obtain an electric connector of the present invention.

This electrical connector is 0.15 m between an LGA having gold-plated land electrodes of φ0.5 mm at a pitch of 1 mm and a matrix of 40 columns each in the vertical and horizontal directions and the inspection board.
m, a stable continuity is obtained, the resistance variation of each electrode is as small as 10 to 20 mΩ, and the load is 15
It was as low as gf / pin, and there was no problem in conducting an electrical property test of LGA. Further, the electrical connection was continuously confirmed by repeatedly compressing with a compression amount of 0.15 mm, and no point where the resistance exceeded 100 mΩ was generated even when the electrical connection exceeded 100,000 times.

[Embodiment 2] An embodiment of the electrical connector of the present invention for BAG connection will be described below. As shown in FIG. 2A, a 0.15 mm thick, 35 mm long, 35 mm wide iron-nickel alloy (41% nickel) substrate has a central part surface,
20 rows each in vertical and horizontal directions at a pitch of 1.27 mm (total 40
A casein resist layer having a thickness of about 7 μm was formed in the matrix shape of 0) while leaving φ0.6 mm, and a casein resist layer having a thickness of about 7 μm was formed so as to cover the entire back surface. As shown in FIG. 2B to FIG. 2D, this was etched with a ferric chloride solution to a depth of 0.075 mm from the surface, and gold plating was applied as a first plating layer to the recessed portion by etching at 0.5 μm. Nickel plating was applied as a second plating layer at 5 μm, and then gold plating was applied as a third plating layer at 0.2 μm. Subsequently, the casein resist layer was peeled off with a 5% sodium hydroxide solution to obtain a bonding substrate.

In the center of the gold-plated portion, which is the third plating layer, gold wires having a diameter of 50 μm are arranged at a pitch of 1.27 mm using a general-purpose ball bonder at a pitch of 1.27 mm in a matrix of 20 columns in each of vertical and horizontal directions (total number 400). Bonding was arranged. At this time, as shown in FIG. 3, the gold wire used was a shape that was vertically offset by about 0.3 mm, offset by 0.5 mm at an angle of 45 °, and further extended in the vertical direction.
Next, the ends of all of these gold wires were irradiated with argon laser light, and as shown in FIG.
A spherical contact portion of m was formed, and the height was uniformed to be 1.2 mm. Furthermore, along the outer edge on this substrate, 35 mm in length and width, 1.3 mm in height, 5 m in width
m, a PEI molding frame having a rubber hardness of 25 ° H (JIS) after curing is set in the frame of the molding frame.
A) Two-part silicone rubber: KE1216A / B [Shin-Etsu Chemical Co., Ltd., trade name] 50 parts by weight and colorant: K-Color-
A mixture with 10 parts by weight of BK-02 [trade name, manufactured by Shin-Etsu Chemical Co., Ltd.] was injected at a temperature of 120 ° C. at 0.1 ° C., as shown in FIG. It was cured by heat treatment for 30 minutes.

Next, as shown in FIG. 6, the silicon rubber covering the spherical contact portion of the gold wire is removed by scanning irradiation with a YAG laser beam until the spherical contact portion of the gold wire projects from the silicone rubber surface by 50 μm. Then, nickel plating of 40 μm was applied to the spherical contact portion of the gold wire exposed by electrolytic plating using the bonding substrate as an electrode,
Further, a gold plating of 0.5 μm was applied thereon. Subsequently, the bonding substrate was etched with a ferric chloride solution to form pad-shaped terminal portions having a top diameter of 0.5 mm, a bottom diameter of 0.6 mm, and a protrusion of 0.075 mm. Thereafter, after sufficient washing, an after-curing treatment was performed at 200 ° C. for 1 hour to obtain an electric connector of the present invention.

This electric connector is provided with solder ball electrodes having a diameter of 0.75 mm and a height of 0.6 mm at a pitch of 1.27 mm.
When compression was performed by 0.2 mm between the BGA and the test board having a matrix of 20 columns each in the vertical and horizontal directions, stable conduction was obtained, the resistance variation of each electrode was as small as 15 to 25 mΩ, and the load was as low as 10 gf / pin. There was no problem in conducting an electrical property test of the. Comparison of the connection resistance at the time of compression, the load at the time of compression, and the number of times of repeated use of the electrical connector of the above embodiment and the conventional electrical connector resulted in the results shown in Table 1.

[0035]

[Table 1]

[0036]

According to the electric connector of the present invention, the variation of the connection resistance of each terminal is suppressed, and the multi-pole LGA, BGA
And the like, and since each terminal portion is large even when used repeatedly, it is possible to cope with displacement due to compression. Further, since the positional accuracy and the variation of the electrodes of the IC package and the inspection board can be sufficiently coped with, the stable connection can be achieved.

[Brief description of the drawings]

FIG. 1 is an explanatory longitudinal sectional view of an electric connector of the present invention.

FIGS. 2A to 2D respectively show a step of providing a plating layer on a substrate in the method for manufacturing an electrical connector of the present invention;
It is a longitudinal section explanatory view shown in order of a process.

FIG. 3 is an explanatory longitudinal sectional view showing a state in which a conductive thin metal wire is implanted as a flat spherical contact portion on a plating layer on a bonding substrate in the method for manufacturing an electrical connector of the present invention.

FIG. 4 is an explanatory longitudinal sectional view showing a state in which a spherical contact portion is formed at the upper end of the conductive metal thin wire obtained in FIG. 3;

FIG. 5 is a longitudinal section showing a state in which an elastic insulating layer is hardened and formed on the surfaces of the bonding substrate and the plating layer such that the spherical contact portion of the conductive metal thin wire obtained in FIG. 4 is exposed from the elastic insulating layer; FIG.

6A and 6B are states before and after a step of forming a hemispherical plating layer on a spherical contact portion of a conductive metal wire exposed from the elastic insulating layer obtained in FIG. 5, respectively. FIG.

FIG. 7 is a perspective view of a conventionally used QFP.

FIG. 8 is a plan view of an LGA conventionally used.

FIG. 9 is a perspective view of a BGA conventionally used.

FIG. 10 is an explanatory longitudinal sectional view showing a use state of a conventional electric connector.

FIG. 11 is an explanatory longitudinal sectional view showing a state of a conventional electric connector when pressurized.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Elastic insulating layer 2 ... Conductive thin metal wire 3 ... Flat spherical contact part 4, 4a, 4b, 4c ... Plate-shaped plating layer 5 ... Pad-shaped terminal part 6 ... Spherical contact part 7, 7a, 7b ... hemispherical plating layer 8 ... hemispherical terminal part 9 ... bonding substrate 9 '... substrate 10 ... etching resist film 27 ... BGA 11 ... dish-shaped recess 28 ... electric connector 21 ... IC package body 31 ... elastic insulating layer 22 ... Terminals 32 ... Conducting metal wires 23 ... QFP 33 ... Spherical contact parts 24 ... Land-shaped electrodes 34 ... Inspection board 25 ... Solder ball electrodes 35 ... Board electrodes 26 ... LGA 36 ... Ball-shaped contact parts

Claims (2)

[Claims] 1. A plurality of conductive metal wires each having a flat spherical contact portion at one end and a spherical contact portion at the other end are formed on both sides of the elastic insulating layer in the thickness direction of the elastic insulating layer. An electrical connector penetrated by exposing both contact portions from
An electrical connector comprising a flat spherical contact portion of a thin conductive metal wire and a protruding dish-shaped plating layer, and a semi-spherical plating layer covering a spherical contact portion. A step of providing a plurality of dish-shaped recesses on the substrate and providing a plating layer in each of the dish-shaped recesses; providing a flat spherical contact portion at one end of the plurality of conductive metal wires; Implanting a conductive thin metal wire on each of the plating layers at the flat spherical contact portion; forming a spherical contact portion on the other end of each conductive metal thin wire; elastically deforming the surface of the substrate and the plating layer; A step of curing and forming an insulating layer, a step of exposing spherical contact portions of each conductive metal wire from the elastic insulating layer, and a step of forming a hemispherical plating layer on each spherical contact portion exposed from the elastic insulating layer. A method for manufacturing an electrical connector, comprising: