JP2000294577A - Semiconductor device - Google Patents

Abstract

(57) [Problem] To provide a semiconductor device having a small thickness and no occurrence of edge short-circuit. SOLUTION: In a semiconductor device including a semiconductor element 1 held on a resin substrate 2 which can be easily deformed by pressurization or pressurization and heating, a dicing surface 1a of the semiconductor element 1 is not exposed from the resin substrate 2 and the semiconductor element 1 The semiconductor element 1 is buried in the resin substrate 2 while deforming the resin substrate 2 by pressing or heating the semiconductor element 1 so that one connection terminal 1 d can be connected to the external circuit 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a semiconductor element is held on a resin substrate which can be easily deformed by pressing or heating under pressure.

[0002]

2. Description of the Related Art A typical example of a semiconductor device in which a semiconductor element is held on a resin substrate which can be easily deformed by pressurization or pressurization and heating is a data carrier such as an IC card or an IC tag.

An IC which is a typical example of a conventional data carrier
In the card, as shown in FIG. 5, a capacitor 51 and an antenna coil 52 are formed by a photolithographic method from a copper layer of a double-sided copper-clad polyimide substrate, and connection lands (not shown) of these and external connection of an IC chip 53 are formed. It has a structure in which bump terminals (not shown) are connected via an anisotropic conductive film (not shown). Further, a protective film is laminated via an adhesive layer having a thickness enough to embed the IC chip protruding from the polyimide substrate. A protective film is also laminated on the back surface of the double-sided copper-clad polyimide substrate via an adhesive layer.

[0004]

However, the conventional data carrier such as an IC card uses an expensive double-sided copper-clad polyimide substrate, so that it is difficult to reduce the manufacturing cost. . In addition, a protective film is laminated on the surface of the polyimide substrate via an adhesive layer having a thickness sufficient to embed an IC chip protruding from the polyimide substrate, and a protective film is laminated on the back surface of the polyimide substrate via an adhesive layer. Therefore, there is a problem that the thickness of a data carrier such as an IC card is increased, and the handleability is reduced. Moreover, in the case of the conventional IC card, as shown in FIG. 6, the connection terminals 61 on the polyimide substrate 60 and the external connection bump terminals 63 of the IC chip 62 are connected by heating and pressing via the anisotropic conductive film 64. The dicing surface 6 of the IC chip 62 is exposed.
2a (especially, the dicing edge 62b) bites into the connection terminal 61 on the polyimide substrate 60, and there is a problem that a short circuit (hereinafter, referred to as an edge short circuit) may occur.

An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide a data carrier (for example, I
It is an object of the present invention to provide a semiconductor device that can be manufactured at low cost without increasing the thickness of a semiconductor device such as a C card or an IC tag, without causing an edge short of a semiconductor element (IC chip).

[0006]

SUMMARY OF THE INVENTION The present inventor has disclosed a resin substrate which can be easily deformed by pressing or heating by pressing or heating the semiconductor element with a heating / pressing tool such as a bonding head. Embedded in the semiconductor device while deforming it, it was found that the dicing surface of the semiconductor device could not be exposed and the connection terminal of the semiconductor device could be connected to an external circuit, and the present invention was completed.

That is, the present invention relates to a semiconductor device including a semiconductor element held on a resin substrate which can be easily deformed by pressurization or heating under pressure, wherein the dicing surface of the semiconductor element is not exposed from the resin substrate and A semiconductor element embedded in a resin substrate so that the connection terminal can be connected to an external circuit.

[0008] Further, as preferred specific embodiments of the semiconductor device, a semiconductor element and a capacitor held on a resin substrate which can be easily deformed by pressurization or pressurization and heating, and a semiconductor element formed on the surface of the resin substrate and formed And a data carrier having an antenna coil connected to a capacitor: the semiconductor element is mounted on a resin substrate so that the dicing surface of the semiconductor element is not exposed from the resin substrate and the connection terminals of the semiconductor element can be connected to an external circuit. A data carrier, wherein the capacitor is embedded in a resin substrate; and the antenna coil comprises a printed circuit or a winding.

Further, according to the present invention, a semiconductor element is mounted on a predetermined portion of a resin substrate surface such that a connection terminal surface thereof faces upward, and a dicing surface of the semiconductor element is not exposed from the resin substrate surface and the semiconductor element is not exposed. Manufacturing a semiconductor device by embedding a semiconductor element in a resin substrate while deforming the resin substrate by pressing or heating the semiconductor element so that the connection terminal of the semiconductor device can be connected to an external circuit. Provide a way.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.

FIG. 1 is a sectional view of a preferred example of a semiconductor device according to the present invention. In the semiconductor device of FIG. 1, a semiconductor element 1 such as an IC chip has a resin substrate 2 (for example, a thermoplastic resin substrate, a part of a thermosetting resin substrate, an unstretched resin substrate) which can be easily deformed by pressurization or pressurization and heating. Film, etc.). Here, the semiconductor element 1 is embedded so that the dicing surface 1 a is not exposed from the resin substrate 2. In particular, in order to completely prevent the dicing edge 1b from being exposed, it is preferable to embed the semiconductor element 1 so that the peripheral portion 1c is not exposed. Since the semiconductor element 1 is embedded in the resin substrate 2 in this manner, the problem of edge short-circuit does not occur in the semiconductor device of the present invention.

The connection terminals 1 d (for example, bumps and lands) of the semiconductor element 1 embedded in the resin substrate 2 need to be connectable to the external circuit 3.

The structure of a semiconductor device according to the present invention
The above-mentioned semiconductor element 1 can be realized by deforming the resin substrate 2 while pressing or heating the semiconductor element 1 itself by a heating and pressing means such as a bonding head and burying the resin substrate 2 in the resin substrate 2.

In the semiconductor device of the present invention, as shown in FIG. 1, it is preferable that the surface of the semiconductor element 1 on the side of the connection terminal 1d and the surface of the resin substrate 2 are at substantially the same level. Thereby, the semiconductor device can be made thinner. Further, when the level is substantially the same plane, a printed circuit can be formed at low cost as the external circuit 3 directly on the connection terminal 1d of the semiconductor element 1 by a printing method such as screen printing using a known silver paste or the like. In addition, the use of the anisotropic conductive adhesive (film) can be omitted, and the production cost can be reduced.

If necessary, a protective film 5 is preferably laminated on the external circuit 3 of the resin substrate 2 via an adhesive layer 4 as shown in FIG.

In the semiconductor device of FIG. 1 described above, an example is shown in which the external circuit 3 is formed by a printing method.
2 (in the figure, 21 is an insulating substrate, 22 is an external circuit and 23
Represents connection terminals such as bumps). As shown in FIG. 5, the connection terminal 1d of the semiconductor element 1 and the connection terminal 23 of the external circuit 22 manufactured by an arbitrary method are connected to each other by an anisotropic conductive adhesive 24.
May be connected via a. Here, the region other than the semiconductor element 1 may be bonded with the insulating adhesive 25.

FIG. 3 shows an IC card as a data carrier as a specific application example of the semiconductor device of the present invention.

In this IC card, the semiconductor element 31 and the capacitor 32 are similar to the semiconductor element of FIG.
It has a structure in which the antenna coil 34 is buried inside and formed on the surface of the resin substrate 33 by a printing method. Here, the semiconductor element 31 is buried so that its dicing surface (not shown) is not exposed from the resin substrate 33. However, the connection terminal (not shown) of the semiconductor element 31 is
And the resin substrate 3 so that it can be connected to the antenna coil 34.
3 is not embedded. Further, it is preferable that the connection terminal side surface of the semiconductor element 31, the connection terminal side surface of the capacitor 32, and the surface of the resin substrate 33 are at substantially the same plane level. Further, it is preferable to laminate a protective film (not shown) on the side surface of the antenna coil 34 of the resin substrate 33.

Note that a winding may be used as the antenna coil 34. In this case, it is preferable to dispose the winding so as to be embedded in the resin substrate 33.

The data carrier such as the IC card described above does not have the problem of edge short of the semiconductor element, has a small thickness, and can be manufactured at a low cost, similarly to the semiconductor device of FIG.

The semiconductor device of the present invention can be manufactured through the steps described below.

First, the semiconductor element 41 is placed on a predetermined portion of the surface of the resin substrate 42 which can be easily deformed by pressurization or pressurization and heating so that the connection terminal 41a faces upward (FIG. 4 (a)). )).

Next, the dicing surface 41 of the semiconductor element 41
Pressing or heating the semiconductor element 41 with the bonding head 43 so that b is not exposed on the surface of the resin substrate 42;
The semiconductor element 41 is embedded in the resin substrate 42 while deforming the resin substrate 42 (FIG. 4B). At this time, the connection terminal 41a of the semiconductor element 41 is exposed on the surface of the resin substrate 42 so that the connection terminal 41a can be connected to an external circuit.

Further, if necessary, various electronic components, for example, the capacitor 44 are pressed or heated by the bonding head 43 to embed the capacitor 44 in the resin substrate 42 while deforming the resin substrate 42 (FIG. 1). 4 (c)).

Subsequently, the connection terminal 41a of the semiconductor element 41
Then, a circuit 45 including an antenna coil (not shown) is formed by a printing method to connect the connection terminal 44a of the capacitor 44 (FIG. 4D).

Further, if necessary, a protective film 47 is laminated on the surface of the resin substrate 42 on the semiconductor element 41 side via an adhesive layer 46 (FIG. 4E).

The semiconductor device according to the present invention has the above-described IC
It is particularly suitable for data carriers such as cards and IC tags, but is not limited thereto.

It is to be noted that known components can be appropriately selected and used for the respective components constituting the semiconductor device of the present invention, for example, the sizes and materials of the semiconductor elements, resin substrates, connection terminals, capacitors and the like.

[0029]

According to the present invention, a semiconductor device such as a data carrier (for example, an IC card or an IC tag) is not thickened, and an edge short circuit of a semiconductor element (an IC chip) is not caused. Can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a semiconductor device of the present invention.

FIG. 2 is a schematic sectional view of a semiconductor device of the present invention.

FIG. 3 is a schematic perspective view of a data carrier of the present invention.

FIG. 4 is a manufacturing process diagram of the semiconductor device of the present invention.

FIG. 5 is a schematic perspective view of a conventional IC card.

FIG. 6 is an explanatory diagram of an edge short circuit occurring in a conventional IC card.

[Explanation of symbols]

Reference Signs List 1 semiconductor element, 2 resin substrate, 3 external circuit, 4 adhesive layer, 5 protective film

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor ▲ Matsutaka Takashi 12-3 Satsukicho, Kanuma-shi, Tochigi Sony Chemical Co., Ltd. (72) Inventor Toshiyuki 12-3 Satsukicho, Kanuma-shi, Tochigi Sony Chemical stock In-house F term (reference) 5B035 AA00 AA04 AA11 BA05 BB09 BC00 CA01 CA08 CA12 CA23 CA31 5F047 AA17 CA01 CB05 FA52 5F061 AA01 BA03 CA26 FA03

Claims (11)

[Claims] In a semiconductor device including a semiconductor element held on a resin substrate which can be easily deformed by pressurization or heating under pressure, a dicing surface of the semiconductor element is not exposed from the resin substrate, and a connection terminal of the semiconductor element is formed. A semiconductor device, wherein a semiconductor element is embedded in a resin substrate so as to be connectable to an external circuit. 2. The semiconductor device according to claim 1, wherein the surface of the connection terminal side of the semiconductor element and the surface of the resin substrate are substantially at the same plane level. 3. The semiconductor device according to claim 1, wherein a connection terminal of the semiconductor element is connected to a printed circuit or a winding disposed on a surface of the resin substrate. 4. The semiconductor device according to claim 3, wherein a protective film is laminated on a surface of the resin substrate on a printed circuit or winding side. 5. The semiconductor device according to claim 1, wherein a connection terminal of the semiconductor element is connected to a terminal of a circuit formed on a surface of the external circuit via an anisotropic conductive adhesive. 6. A semiconductor element and a capacitor held on a resin substrate which can be easily deformed by pressurization or pressurization and heating;
In a data carrier having an antenna coil formed on a surface of a resin substrate and connected to a semiconductor element and a capacitor: a dicing surface of the semiconductor element is not exposed from the resin substrate, and a connection terminal of the semiconductor element can be connected to an external circuit. That the semiconductor element is embedded in the resin substrate; that the capacitor is embedded in the resin substrate; and that the antenna coil is composed of a printed circuit or a winding. Characteristic data carrier. 7. The data carrier according to claim 6, wherein the surface of the connection terminal of the semiconductor element, the surface of the connection terminal of the capacitor, and the surface of the resin substrate are substantially at the same plane level. 8. The data carrier according to claim 7, wherein a protective film is laminated on the side of the antenna coil of the resin substrate. 9. An IC card or an IC tag.
9. The data carrier according to any one of items 1 to 8. 10. A semiconductor element is mounted on a predetermined portion of a surface of a resin substrate such that a connection terminal surface thereof faces upward, a dicing surface of the semiconductor element is not exposed from the resin substrate surface, and a connection terminal of the semiconductor element is not provided. So that it can be connected to external circuits,
A method of manufacturing a semiconductor device, comprising embedding a semiconductor element in a resin substrate while deforming the resin substrate by pressurizing or heating the semiconductor element. 11. A circuit for connecting to a connection terminal of a semiconductor element is formed on a resin substrate by a printing method.
The manufacturing method as described.