JP2000299566A - Electronic control device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an electronic control device comprising a heating part integrally. SOLUTION: An EDU module 14 comprising a heating part 23 is formed on a base 20 integrally. The EDU module 14 is mounted on a space 19 of an ECU motherboard 13 where parts 17 and 18, etc., constitute the electronic circuit for control process. The ECU motherboard 13 where the EDU module 14 is mounted is housed in a case formed of the ECU case 11 and ECU lid 12. The surface of heating part 23 adheres to the inside surface of the ECU case 11, allowing the heating part 23 to be secured with a bolt 28.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic control unit that performs an electric control process and drives an external device according to a result of the process.

[0002]

2. Description of the Related Art Conventionally, a structure in which a mechanical operation is performed by electronic control, which is called so-called mechatronics, has been widely used. For example, electronic control is often used in vehicles such as automobiles. In an electronic control device for a vehicle, a control circuit portion and a drive circuit portion of a load are integrated on the same circuit board, and control units such as an engine control, a transmission control, and a brake control are provided as units called ECUs. The functions are distributed and mounted.

In recent years, electronic control of vehicles has been expanded.
For example, an electronic drive unit called EDU as shown in FIG. 3 is sometimes used to perform engine control. That is, the EDU 2 is provided separately from the ECU 1, and the ECU 1 and the EDU 2 are connected by the harness 3 in which connection wires are bundled. Input signals from various sensors installed in the engine room are input to the ECU 1 via the harness 4. The EDU 2 is connected to the inside of the engine room by a harness 5. Harness 5
It is connected to a battery which is a power source in the engine room, a fuel injection injector controlled by an output from the EDU 2, and the like. In order to perform such connection using a harness, the ECU 1 is provided with connectors 1a and 1b,
The EDU 2 is provided with connectors 2a and 2b. Connectors 3a and 3b are provided at both ends of the harness 3, and the connector 3a can be attached to the connector 1a of the ECU 1.
The connector 3b can be attached to the connector 2a of the EDU2. The harness 4 is provided with a connector 4a.
It can be attached to one connector 1b. Harness 5
A connector 5a is provided and can be attached to the connector 2b of the EDU2.

As shown in FIG. 3, providing the ECU 1 and the EDU 2 separately is because the voltage handled by the EDU 2 is high and the control board and peripheral products are affected by noise.
This is because the power is large and the calorific value is large, and it is impossible to form the ECU 1 on the same circuit board. Also, if the ECU 1 and the EDU 2 are separated, a plurality of types of the EDU 2 can be selectively used according to a difference in output, and
U1 can be commonly used.

FIG. 4 shows a state in which the EDU 2 shown in FIG. 3 is arranged in an engine room. When the EDU 2 is disposed in the engine room, the length of the harness 3 that connects the ECU 1 and the EDU 2 increases, but the length of the harness 5 that connects the EDU 2 to the battery and the injector can be reduced.

The ECU 1 and the EDU as shown in FIGS.
Prior art that combines and integrates such a control portion and a power portion, although it is arranged separately from the device 2, is disclosed in, for example, JP-A-7-297561. In this prior art, a control unit and a power unit are separately formed and stacked to form a single electronic control device like a multi-box.

[0007]

As shown in FIGS. 3 and 4, the ECU 1 and the EDU 2 constituting the electronic control unit need to be installed separately, so that they can be used in a vehicle compartment or an engine room of a vehicle. Narrow space. Further, if they are formed separately, they must be connected to each other by a harness 3, and connectors 3a and 3b are provided at both ends of the harness for connection with the harness 3, and the ECU 1 and the EDU 2 are connected to each other. It is necessary to provide the connectors 1b and 2b for the connection. The harness 3 and the connectors 1b and 2b are unnecessary if the ECU 1 and the EDU 2 are integrated. When the ECU 1 and the EDU 2 are separated, a new connection harness and connector are required as described above. A separate ECU 1 and EDU as shown in FIGS.
In the configuration using 2, the number of housings, harnesses, and connectors increases, the cost of materials increases, and the assembling effort also increases.

In a configuration in which a control unit and a power unit are directly combined as in the prior art of Japanese Patent Application Laid-Open No. 7-297561, a harness for connecting the control unit and the power unit can be omitted, but a connector for connection is required. Since the control unit and the power unit are stacked and integrated, the required volume is the same as when separately configured.

An object of the present invention is to form a circuit part for performing an electronic control process and a drive circuit part for generating a large amount of heat as separate units and combine them into a single unit. An object of the present invention is to provide an electronic control device capable of simplifying a configuration for connection between them.

[0010]

According to the present invention, there is provided an electronic control unit for performing a control process by an electronic circuit and deriving an output for driving an external device in accordance with a result of the control process, wherein the electronic circuit for performing the control process is mounted. A control circuit board having a temporary space, and a drive circuit for amplifying a signal from the control circuit board to amplify electric power to drive an external device, and a drive unit mounted in the space of the control circuit board And a housing that houses a control circuit board on which the drive unit is mounted, and that can thermally radiate heat to the drive unit.

According to the present invention, in the electronic control device, an electronic circuit for performing control processing is mounted on a control circuit board, and a space is partially provided. In the space of the control circuit board, a drive unit in which a drive circuit for amplifying power from a signal from the control circuit board to drive an external device is integrated is mounted. Since the drive circuit is integrated, it can be replaced according to external drive requirements.
The heat generated by the drive unit can be dissipated by thermal coupling with the control circuit board and the housing that houses the drive unit while the drive unit is mounted on the control circuit board, so that heat can be released to the electronic circuit that performs control processing. The effect can be reduced. Since the drive unit is directly mounted on the control circuit board, there is no need to use a connector for connection, the number of parts can be reduced, and the drive unit is housed in the housing, so the drive unit alone No housing is required, and the size of the entire housing can be reduced.

In the present invention, the drive unit is housed in a case integrally formed with a connector, mounted on the control circuit board, and housed in the housing. It is characterized by protruding outside.

According to the present invention, the connector formed integrally with the drive unit protrudes out of the housing while being mounted on the control circuit board and housed in the housing.
It can be used as it is as an external connector.

Further, in the present invention, the drive unit includes a high thermal conductivity substrate on which a heat-generating component is mounted on a bare chip, and a heat sink to which the high thermal conductivity substrate is attached and fixed to the housing.

According to the present invention, a drive unit is formed including a heat sink and a high thermal conductivity substrate on which a heat-generating component is mounted on a bare chip, and the heat sink is fixed to the housing. The heat can be sufficiently dissipated in the housing through this, and the temperature rise inside the housing can be suppressed.

Further, in the present invention, the control circuit board is provided with a connector which is integrally formed and protrudes to the outside when housed in the housing, and the conductive connection terminal of the connector is provided with the control circuit. It is characterized by being integrally embedded in a substrate.

According to the present invention, an electrical connection can be made between the control circuit board and the outside of the housing by the connector having the control circuit board formed integrally with the control circuit board. Since it is integrated and embedded, it is possible to save the trouble of mounting a separate connector and making an electrical connection.

[0018]

FIG. 1 shows an overall assembly configuration of an electronic control unit 10 according to an embodiment of the present invention. The electronic control unit 10 includes an ECU motherboard 13 as a control circuit board and an EDU module 1 as a drive unit in an ECU case 11 and an ECU lid 12 as a housing.
4 are stored. ECU motherboard 13
Has a connector 15, and the connector 15 is provided with a conductive connection terminal 16. On the ECU motherboard 13, components 17, 18 constituting an electronic circuit for performing control processing are provided.
Are provided, and a space 19 for mounting the EDU module 14 is provided.

In the EDU module 14, components 21, 22 are mounted on a base 20 formed of an electrically insulating synthetic resin.
Are mounted, and the heat generating portion 23 is further mounted. Heating part 2
The surface of 3 is flattened, and a screw hole 24 is formed. The heating section 23 is provided with a connector 25 for external connection and a terminal 26 for making an electrical connection with the ECU motherboard 13. The base 20 is supported by legs 27 with a gap from the front surface of the ECU motherboard 13, and can be fixed by bolts 28 from the rear surface side of the ECU motherboard 13.

The ECU motherboard 13 can be housed in the ECU case 11 with the EDU module 14 fixed on the ECU motherboard 13 with bolts 28. When the ECU motherboard 13 is housed in the ECU case 11, the surface of the heat generating portion 23 of the EDU module 14 comes into close contact with the inner surface of the top surface of the ECU case 11. ECU
From outside the top of the case 11, insert the bolt 29,
By screwing the screw holes 24, the heat generating portion 23 can be fixed, and the surface of the heat generating portion 23 and the surface of the ECU case 11 can be brought into close contact. ECU motherboard 13
In the state stored in the CU case 11, the ECU lid 1
2 is installed, the EDU module 1
4 can be formed. In the electronic control unit 10, if the EDU module 14 is replaced, it is possible to cope with different power output specifications.
An electronic circuit portion for control processing on the U motherboard 13 can be shared.

The ECU case 11 is also provided with holes 31 and 32 for allowing the connector 15 on the ECU motherboard 13 and the connector 25 formed integrally with the EDU module 14 to protrude to the outside as they are. . By attaching the connector 15, the base 20, and the connector 25 to the ECU motherboard 13 at once, the number of assembly steps can be reduced. further,
If the size of the housing formed by the ECU case 11 and the ECU lid 12 is the same as that of a normal ECU, EC
The U case 11 and the ECU lid 12 can be standardized. Further, since the EDU module 14 is built in, a space for mounting a separate EDU is not required, and a mounting member or the like for fixing the EDU to a mounting location is not required.

FIG. 2 shows the configuration of the heat generating section 23 used in the EDU module 14 of FIG. In the heat generating portion 23, a semiconductor chip 40 for high power control is provided with a high thermal conductivity substrate 41.
Is mounted on the surface by die bonding with solder or a conductive adhesive. As the high thermal conductivity substrate 41, a ceramic substrate having a high thermal conductivity (a material mainly composed of aluminum nitride, aluminum oxide, or the like as the ceramic substrate) is used. Electrical connection between the surface of the high thermal conductivity substrate 41 in which the semiconductor chip 40 is die-bonded with solder or a conductive adhesive and an external circuit is performed by wire-bonding a bonding wire 42 to the surface. On the high thermal conductivity substrate 41, the surface opposite to the surface to which the semiconductor chip 40 is die-bonded and the bonding wires 42 are wire-bonded is in close contact with the heat sink 43. Since the heat sink 43 can be in close contact with the inner surface of the top surface of the ECU case 11, heat generated from the semiconductor chip 40 can be radiated in the ECU case 11 via the high thermal conductivity substrate 41 and the heat sink 43.

In the above description, the electronic control unit is described as an ECU mounted on a vehicle. However, the present invention is similarly applied to an electronic control unit such as a production facility such as a factory or an air conditioning facility such as a building. Can be.

[0024]

As described above, according to the present invention, the drive unit is formed separately from the electronic circuit for performing the control processing, and is housed in the same housing, and the heat of the drive unit is radiated using the housing. It can be carried out. Since the drive unit does not need to be provided with its own housing, the size of the entire housing is reduced, and the heat generated from the drive unit affects the electronic circuits that perform control processing due to heat dissipation using the housing. Can be suppressed.

Further, according to the present invention, since a connector for external connection can be formed integrally with the drive unit, the configuration for electrical connection can be simplified and the labor required for assembly can be reduced. it can.

Further, according to the present invention, the drive unit includes a high thermal conductivity substrate on which a heat-generating component is mounted on a bare chip, and a heat sink, and the heat sink is fixed to the housing. To dissipate heat,
The electronic circuit for performing the control process can be operated without being affected by heat while suppressing the temperature rise inside the housing.

According to the present invention, the control circuit board and the connector for external connection are integrally formed, and the terminal for conductive connection is integrally embedded in the circuit board for control. The electrical connection related to the above can be simplified, the number of parts used can be reduced, and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is an electronic control unit 1 according to an embodiment of the present invention.
FIG. 3 is an exploded perspective view showing a schematic combination state of 0.

FIG. 2 is a cross-sectional view illustrating a configuration of a heat generating unit 23 in FIG.

FIG. 3 is a block diagram showing a schematic arrangement state of a conventional electronic control device in which an ECU and an EDU are configured separately.

FIG. 4 is a schematic block diagram showing another configuration of a conventional electronic control device in which an ECU and an EDU are separate bodies.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electronic control apparatus 11 ECU case 12 ECU cover 13 ECU motherboard 14 EDU module 15, 29 connector 16 Conduction connection terminal 19 Space 20 Base 23 Heat generation part 24 Screw hole 27, 28 Volt 40 Semiconductor chip 41 High thermal conductivity board 43 Heat sink

Claims (4)

[Claims] An electronic control device that performs control processing by an electronic circuit and derives an output for driving an external device in accordance with a result of the control processing, wherein the electronic circuit that performs the control processing is mounted and a control circuit partially having a space A board, a drive circuit for amplifying a signal from the control circuit board for power to drive an external device are integrated, and a drive unit mounted in the space of the control circuit board, and a drive unit are mounted. An electronic control device comprising: a housing that houses a control circuit board and that can thermally radiate heat by being coupled to a drive unit. 2. The drive unit is housed in a case in which a connector is integrally formed, and is mounted on the control circuit board and housed in the housing. The electronic control device according to claim 1, wherein the electronic control device protrudes from the electronic control unit. 3. The driving unit according to claim 1, wherein the driving unit includes a high thermal conductivity substrate on which a heat-generating component is mounted as a bare chip, and a heat sink to which the high thermal conductivity substrate is attached and fixed to the housing. 2
Electronic control device according to the above. 4. The control circuit board includes a connector that is integrally formed and protrudes to the outside when housed in the housing, and a conductive connection terminal of the connector is provided inside the control circuit board. The electronic control device according to any one of claims 1 to 3, wherein the electronic control device is embedded integrally with the electronic control unit.