JP2000299577A - Structure and method for mounting printed wiring board - Google Patents
Structure and method for mounting printed wiring boardInfo
- Publication number
- JP2000299577A JP2000299577A JP11106030A JP10603099A JP2000299577A JP 2000299577 A JP2000299577 A JP 2000299577A JP 11106030 A JP11106030 A JP 11106030A JP 10603099 A JP10603099 A JP 10603099A JP 2000299577 A JP2000299577 A JP 2000299577A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- mounting
- housing
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 239000006258 conductive agent Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000012856 packing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 15
- 239000011888 foil Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はプリント配線板の実
装構造及びその実装方法に関し、特に装置の筐体にプリ
ント配線板を実装するための実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a printed wiring board and a mounting method thereof, and more particularly to a mounting structure for mounting a printed wiring board on a housing of an apparatus.
【０００２】[0002]
【従来の技術】従来、この種の実装構造においては、一
般的に、プリント配線板を装置の筐体に実装する際に、
プリント配線板を取付けねじで装置の筐体内に固定する
ようになっている。2. Description of the Related Art Conventionally, in this type of mounting structure, generally, when a printed wiring board is mounted on a housing of an apparatus,
The printed wiring board is fixed in the housing of the apparatus with mounting screws.
【０００３】上記のような筐体自体あるいはプリント配
線板の実装構造としては、実開昭６１−１４２４８５号
公報や実開平３−３７８６号公報等に開示された実装構
造がある。As a mounting structure of the housing itself or the printed wiring board as described above, there are mounting structures disclosed in Japanese Utility Model Laid-Open No. Sho 61-142485 and Japanese Utility Model Laid-Open No. Hei 3-3786.
【０００４】[0004]
【発明が解決しようとする課題】上述した従来の実装構
造では、プリント配線板を装置の筐体に固定するための
取付けねじがプリント配線板の上面に飛び出してしまう
ので、その取付けねじの頭部に相対する側の装置筐体と
干渉（接触）してしまう。In the above-described conventional mounting structure, the mounting screws for fixing the printed wiring board to the housing of the apparatus are protruded from the upper surface of the printed wiring board. (Contact) with the device housing on the side opposite to the device housing.
【０００５】この場合、その干渉を防止するためにプリ
ント配線板と装置筐体との間隔を十分にとる必要があ
り、特に携帯端末等の小型の装置にプリント配線板を実
装する際にはプリント配線板と装置筐体との間隔を十分
にとることが困難であるため、装置の小型軽量化を達成
することができないという問題が発生してしまう。In this case, it is necessary to provide a sufficient space between the printed wiring board and the apparatus housing in order to prevent the interference. In particular, when the printed wiring board is mounted on a small device such as a portable terminal, the printed wiring board is required. Since it is difficult to provide a sufficient space between the wiring board and the device housing, there is a problem that the size and weight of the device cannot be reduced.
【０００６】そこで、本発明の目的は上記の問題点を解
消し、プリント配線板の高密度実装と装置の小型軽量化
とを図ることができ、装置の電気的特性を向上させるこ
とができるプリント配線板の実装構造及びその実装方法
を提供することにある。Accordingly, an object of the present invention is to solve the above-mentioned problems, achieve high-density mounting of a printed wiring board, reduce the size and weight of the device, and improve the electrical characteristics of the device. An object of the present invention is to provide a mounting structure of a wiring board and a mounting method thereof.
【０００７】[0007]
【課題を解決するための手段】本発明によるプリント配
線板の実装構造は、装置の筐体にプリント配線板を実装
するプリント配線板の実装構造であって、前記プリント
配線板の内層のグランドパターンが露出するまで前記プ
リント配線板の一部を座繰って形成されるざぐり部と、
前記ざぐり部の中心部分に形成されかつ前記プリント配
線板を前記筐体に固定するための取付けねじを挿通させ
る挿通穴とを前記プリント配線板に備え、前記取付けね
じを前記挿通穴に挿通させて前記プリント配線板を前記
筐体にねじ止めするようにしている。A mounting structure of a printed wiring board according to the present invention is a mounting structure of a printed wiring board for mounting a printed wiring board on a housing of an apparatus, wherein a ground pattern of an inner layer of the printed wiring board is provided. A counterbore formed by counter-rotating a part of the printed wiring board until is exposed,
An insertion hole formed in the center portion of the counterbore portion and through which an installation screw for fixing the printed wiring board to the housing is inserted, wherein the mounting screw is inserted through the insertion hole. The printed wiring board is screwed to the housing.
【０００８】本発明によるプリント配線板の実装方法
は、装置の筐体にプリント配線板を実装するプリント配
線板の実装方法であって、前記プリント配線板の内層の
グランドパターンが露出するまで前記プリント配線板の
一部を座繰ってざぐり部を形成し、前記プリント配線板
を前記筐体に固定するための取付けねじを挿通させる挿
通穴を前記ざぐり部の中心部分に形成し、前記取付けね
じを前記挿通穴に挿通させて前記プリント配線板を前記
筐体にねじ止めするようにしている。[0008] A method of mounting a printed wiring board according to the present invention is a method of mounting a printed wiring board on a housing of an apparatus, wherein the printed wiring board is mounted until a ground pattern in an inner layer of the printed wiring board is exposed. A counterbore portion is formed by counterboring a part of the wiring board, and an insertion hole for inserting a mounting screw for fixing the printed wiring board to the housing is formed in a central portion of the counterbore portion, and the mounting screw is formed. The printed wiring board is screwed to the housing by being inserted into the insertion hole.
【０００９】すなわち、本発明のプリント配線板の実装
構造は、装置の筐体にプリント配線板を実装する場合、
特に携帯端末等の小型の装置にプリント配線板を実装す
る場合において、プリント配線板の一部を座繰ってプリ
ント配線板の内層のグランドパターンを露出させ、その
ざぐり部に取付けねじを挿通させてプリント配線板を装
置の筐体にねじ止めしている。That is, when the printed wiring board is mounted on the housing of the apparatus, the mounting structure of the printed wiring board of the present invention is
In particular, when mounting the printed wiring board on a small device such as a portable terminal, a part of the printed wiring board is counter-sunk to expose an inner layer ground pattern of the printed wiring board, and a mounting screw is inserted into the counterbore. The printed wiring board is screwed to the housing of the device.
【００１０】これによって、本発明のプリント配線板の
実装構造では、プリント配線板の高密度実装を可能と
し、装置の小型軽量化を可能とするとともに、装置の電
気的特性を向上させることが可能となる。As a result, in the printed wiring board mounting structure of the present invention, the printed wiring board can be mounted at a high density, the device can be reduced in size and weight, and the electrical characteristics of the device can be improved. Becomes
【００１１】[0011]
【発明の実施の形態】次に、本発明の一実施例について
図面を参照して説明する。図１は本発明の一実施例によ
るプリント配線板の実装構造を示す断面図であり、図２
は本発明の一実施例によるプリント配線板の実装構造に
おけるプリント配線板の固定部分を示す拡大断面図であ
る。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a mounting structure of a printed wiring board according to an embodiment of the present invention.
FIG. 3 is an enlarged sectional view showing a fixed portion of the printed wiring board in the printed wiring board mounting structure according to one embodiment of the present invention.
【００１２】これらの図において、プリント配線板３は
アッパ筐体１とベース筐体２との間に取付けねじ４によ
って組込まれている。プリント配線板３は取付けねじ４
によってベース筐体２に固定されるが、取付けねじ４に
よる取付け位置においてプリント配線板３の内層のグラ
ンド層５が露出するように座繰られたざくり部３ａが設
けられている。In these figures, a printed wiring board 3 is assembled between an upper housing 1 and a base housing 2 by mounting screws 4. The printed wiring board 3 has mounting screws 4
Is fixed to the base housing 2, but a counterbore 3 a is provided so as to expose the ground layer 5 as an inner layer of the printed wiring board 3 at a mounting position by the mounting screw 4.
【００１３】ざくり部３ａの中心部分には取付けねじ４
が挿通される挿通穴８があけられており、またベース筐
体２には取付けねじ４を固定するためのボス７が配設さ
れている。このボス７は取付けねじ４の雄ねじ部９と螺
合する雌ねじ部１０を有している。A mounting screw 4 is provided at the center of the counterbore 3a.
The base case 2 is provided with a boss 7 for fixing the mounting screw 4. The boss 7 has a female screw portion 10 to be screwed with the male screw portion 9 of the mounting screw 4.
【００１４】これら図１及び図２を参照して本発明の一
実施例によるプリント配線板３のアッパ筐体１とベース
筐体２との間への取付け動作について説明する。With reference to FIGS. 1 and 2, the operation of mounting the printed wiring board 3 between the upper housing 1 and the base housing 2 according to one embodiment of the present invention will be described.
【００１５】プリント配線板３は絶縁基材の表面に接着
剤層を介して金属箔を積層し、金属箔の不要部分をエッ
チングによって除去することで任意の電気回路パターン
を形成したものである。The printed wiring board 3 is formed by laminating a metal foil on the surface of an insulating base material via an adhesive layer, and removing an unnecessary portion of the metal foil by etching to form an arbitrary electric circuit pattern.
【００１６】絶縁基材としては一般的にガラスエポキシ
基材やポリミイド系の基材が使用され、金属箔としては
銅箔が使用されている。また、プリント配線板３は厚み
が０．８ｍｍ〜１．６ｍｍ程度の厚みであり、内層にグ
ランド層５及び電源層（図示せず）を有する多層構造と
なっている。A glass epoxy substrate or a polyimide substrate is generally used as the insulating substrate, and a copper foil is used as the metal foil. The printed wiring board 3 has a thickness of about 0.8 mm to 1.6 mm and has a multilayer structure having a ground layer 5 and a power supply layer (not shown) as inner layers.
【００１７】プリント配線板３上にはベース筐体２に固
定するための挿通穴８を有しており、挿通穴８は取付け
ねじ４が挿入可能な径となっている。この挿通穴８を中
心部分に配置し、その周りには取付けねじ４の頭の部分
が挿入できる大きさに、プリント配線板３の表面層が、
内層のグランド層５が露出されるまで座繰られたざくり
部３ａが設けられている。The printed wiring board 3 has an insertion hole 8 for fixing to the base housing 2, and the insertion hole 8 has a diameter that allows the mounting screw 4 to be inserted. This insertion hole 8 is arranged at the center, and the surface layer of the printed wiring board 3 is sized so that the head of the mounting screw 4 can be inserted around it.
A counterbore portion 3a is provided, which is counter-countered until the inner ground layer 5 is exposed.
【００１８】また、プリント配線板３にはベース筐体２
と相対する面に電気部品６が実装され、反対面のアッパ
筐体１に相対する面に電気部品は実装されない片面実装
形態となっている。The printed wiring board 3 includes a base housing 2.
The electrical component 6 is mounted on the surface facing the upper case 1 and the electrical component is not mounted on the surface facing the upper housing 1 on the opposite surface.
【００１９】ベース筐体２は取付けねじ４を固定するた
めのボス７を有し、このボス７は取付けねじ４の雄ねじ
部９と螺合する雌ねじ部１０を有している。また、ベー
ス筐体２及びアッパ筐体１の内側には導電剤を塗布して
おり、外部もしくは内部からの電気ノイズの影響を受け
ない構造となっている。The base case 2 has a boss 7 for fixing the mounting screw 4, and the boss 7 has a female screw portion 10 screwed with the male screw portion 9 of the mounting screw 4. In addition, a conductive agent is applied to the inside of the base case 2 and the upper case 1, so that the structure is not affected by external or internal electric noise.
【００２０】ベース筐体２にプリント配線板３を取付
け、取付けねじ４によってプリント配線板３をベース筐
体２のボス７に固定する。プリント配線板３の取付けね
じ４を挿入する挿通穴８の周辺は取付けねじ４の頭の部
分が挿入できる大きさにのざぐり部３ａが設けられてい
る。The printed wiring board 3 is mounted on the base housing 2, and the printed wiring board 3 is fixed to the boss 7 of the base housing 2 with mounting screws 4. A counterbore 3a is provided around the insertion hole 8 of the printed wiring board 3 in which the mounting screw 4 is inserted.
【００２１】このざぐり部３ａではグランド層５が露出
しているため、取付けねじ４を締めることによって、取
付けねじ４の雄ねじ部９とベース筐体２のボス７の雌ね
じ部１０とが螺合する際に、取付けねじ４の頭の部分と
グランド層５とが密着することになる。Since the ground layer 5 is exposed at the counterbore 3a, the male screw 9 of the mounting screw 4 and the female screw 10 of the boss 7 of the base housing 2 are screwed together by tightening the mounting screw 4. At this time, the head of the mounting screw 4 and the ground layer 5 come into close contact with each other.
【００２２】上記のように、プリント配線板３のグラン
ド層５は取付けねじ４を介してベース筐体２のボス７と
接続されることになるが、ベース筐体２の内側は導電構
造となっているため、プリント配線板３のグランド層５
はベース筐体２のフレームグランドと接続されることに
なり、電気的性能を向上させることができる。As described above, the ground layer 5 of the printed wiring board 3 is connected to the boss 7 of the base case 2 via the mounting screw 4, but the inside of the base case 2 has a conductive structure. The ground layer 5 of the printed wiring board 3
Is connected to the frame ground of the base case 2, and the electric performance can be improved.
【００２３】また、取付けねじ４の頭がプリント配線板
３の内部に埋め込まれる構造になるため、プリント配線
板３の表面に取付けねじ４の頭が露出することがなくな
り、アッパ筐体１とプリント配線板３との間隔を狭める
ことが可能となり、装置におけるプリント配線板３の高
密度実装を可能とし、特に携帯端末等の小型の装置にお
ける小型軽量化を実現することができる。Further, since the head of the mounting screw 4 is embedded in the printed wiring board 3, the head of the mounting screw 4 is not exposed on the surface of the printed wiring board 3, so that the upper housing 1 and the printed The distance from the wiring board 3 can be reduced, so that the printed wiring board 3 can be mounted at high density in the device, and the size and weight of a small device such as a portable terminal can be reduced.
【００２４】[0024]
【発明の効果】以上説明したように本発明によれば、装
置の筐体にプリント配線板を実装する際に、プリント配
線板の取付けねじによる取付け位置を座繰って内層のグ
ランドパターンが露出するように形成されたざくり部を
設け、そのざぐり部に取付けねじの頭部が収納されるよ
うにして筐体にねじ止めすることによって、プリント配
線板の高密度実装及び装置の小型軽量化を図ることがで
き、装置の電気的特性を向上させることができるという
効果がある。As described above, according to the present invention, when the printed wiring board is mounted on the housing of the device, the mounting position of the printed wiring board by the mounting screw is countered and the inner layer ground pattern is exposed. By mounting the counterbore formed as described above and screwing it to the housing such that the head of the mounting screw is housed in the counterbore, the high-density mounting of the printed wiring board and the reduction in size and weight of the device are achieved. And the electrical characteristics of the device can be improved.
【図１】本発明の一実施例によるプリント配線板の実装
構造を示す断面図である。FIG. 1 is a sectional view showing a mounting structure of a printed wiring board according to one embodiment of the present invention.
【図２】本発明の一実施例によるプリント配線板の実装
構造におけるプリント配線板の固定部分を示す拡大断面
図である。FIG. 2 is an enlarged sectional view showing a fixed portion of the printed wiring board in the printed wiring board mounting structure according to one embodiment of the present invention.
１ アッパ筐体 ２ ベース筐体 ３ プリント配線板 ３ａ ざぐり部 ４ 取付けねじ ５ グランド層 ６ 電気部品 ７ ボス ８ 挿通穴 ９ 雄ねじ部 １０ 雌ねじ部 DESCRIPTION OF SYMBOLS 1 Upper housing 2 Base housing 3 Printed wiring board 3a Counterbore part 4 Mounting screw 5 Ground layer 6 Electric component 7 Boss 8 Insertion hole 9 Male screw part 10 Female screw part
Claims (8)
プリント配線板の実装構造であって、前記プリント配線
板の内層のグランドパターンが露出するまで前記プリン
ト配線板の一部を座繰って形成されるざぐり部と、前記
ざぐり部の中心部分に形成されかつ前記プリント配線板
を前記筐体に固定するための取付けねじを挿通させる挿
通穴とを前記プリント配線板に有し、前記取付けねじを
前記挿通穴に挿通させて前記プリント配線板を前記筐体
にねじ止めするようにしたことを特徴とするプリント配
線板の実装構造。1. A printed wiring board mounting structure for mounting a printed wiring board on a housing of an apparatus, wherein a part of the printed wiring board is spotted until a ground pattern of an inner layer of the printed wiring board is exposed. The printed wiring board has a counterbore formed and an insertion hole formed in a central portion of the counterbore and through which an installation screw for fixing the printed wiring board to the housing is inserted. Characterized in that the printed wiring board is screwed into the housing by inserting the printed wiring board into the insertion hole.
を収納可能に配設されたことを特徴とする請求項１記載
のプリント配線板の実装構造。2. The mounting structure for a printed wiring board according to claim 1, wherein the counterbore portion is disposed so as to be able to store a head of the mounting screw.
位置に配設されかつ前記取付けねじに螺合するボス部材
を含むことを特徴とする請求項１または請求項２記載の
プリント配線板の実装構造。3. The printed wiring board according to claim 1, further comprising a boss member disposed in the housing at a position facing the insertion hole and screwed to the mounting screw. Mounting structure.
された導電構造を含み、前記取付けねじ及び前記ボス部
材を介して前記グランド層を前記導電構造に電気的に接
続するようにしたことを特徴とする請求項３記載のプリ
ント配線板の実装構造。4. A conductive structure formed by applying a conductive agent to the inside of the housing, wherein the ground layer is electrically connected to the conductive structure via the mounting screw and the boss member. The printed wiring board mounting structure according to claim 3, wherein:
プリント配線板の実装方法であって、前記プリント配線
板の内層のグランドパターンが露出するまで前記プリン
ト配線板の一部を座繰ってざぐり部を形成し、前記プリ
ント配線板を前記筐体に固定するための取付けねじを挿
通させる挿通穴を前記ざぐり部の中心部分に形成し、前
記取付けねじを前記挿通穴に挿通させて前記プリント配
線板を前記筐体にねじ止めするようにしたことを特徴と
するプリント配線板の実装方法。5. A method of mounting a printed wiring board on a housing of an apparatus, wherein a part of the printed wiring board is spotted until a ground pattern of an inner layer of the printed wiring board is exposed. A counterbore is formed, and an insertion hole through which a mounting screw for fixing the printed wiring board to the housing is inserted is formed in a central portion of the counterbore, and the mounting screw is inserted through the insertion hole to perform the printing. A method of mounting a printed wiring board, wherein the wiring board is screwed to the housing.
頭部を収納するようにしたことを特徴とする請求項５記
載のプリント配線板の実装方法。6. The method according to claim 5, wherein a head of the mounting screw is accommodated in the counterbore.
記筐体の前記挿通穴に対向する位置に配設したことを特
徴とする請求項５または請求項６記載のプリント配線板
の実装方法。7. The method for mounting a printed wiring board according to claim 5, wherein a boss member screwed to the mounting screw is disposed at a position facing the insertion hole of the housing. .
構造を形成し、前記取付けねじ及び前記ボス部材を介し
て前記グランド層を前記導電構造に電気的に接続するよ
うにしたことを特徴とする請求項７記載のプリント配線
板の実装方法。8. A conductive structure is formed by applying a conductive agent to the inside of the housing, and the ground layer is electrically connected to the conductive structure via the mounting screw and the boss member. The method for mounting a printed wiring board according to claim 7, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11106030A JP2000299577A (en) | 1999-04-14 | 1999-04-14 | Structure and method for mounting printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11106030A JP2000299577A (en) | 1999-04-14 | 1999-04-14 | Structure and method for mounting printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000299577A true JP2000299577A (en) | 2000-10-24 |
Family
ID=14423251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11106030A Pending JP2000299577A (en) | 1999-04-14 | 1999-04-14 | Structure and method for mounting printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000299577A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009182204A (en) * | 2008-01-31 | 2009-08-13 | Kyocera Corp | Board mounting structure |
| EP2144483A4 (en) * | 2007-03-29 | 2011-06-08 | Fujitsu Ltd | DISTORTION REDUCTION FIXATION STRUCTURE |
| US8223504B2 (en) | 2008-12-05 | 2012-07-17 | Sanyo Electric Co., Ltd. | Structure for supporting printed wiring board |
| CN106535547A (en) * | 2016-12-07 | 2017-03-22 | 上海华章信息科技有限公司 | Mounting structure of circuit board |
-
1999
- 1999-04-14 JP JP11106030A patent/JP2000299577A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2144483A4 (en) * | 2007-03-29 | 2011-06-08 | Fujitsu Ltd | DISTORTION REDUCTION FIXATION STRUCTURE |
| US7978475B2 (en) | 2007-03-29 | 2011-07-12 | Fujitsu Limited | Strain reduction fixing structure |
| JP2009182204A (en) * | 2008-01-31 | 2009-08-13 | Kyocera Corp | Board mounting structure |
| US8223504B2 (en) | 2008-12-05 | 2012-07-17 | Sanyo Electric Co., Ltd. | Structure for supporting printed wiring board |
| CN106535547A (en) * | 2016-12-07 | 2017-03-22 | 上海华章信息科技有限公司 | Mounting structure of circuit board |
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