JP2000301544A - Manufacture of synthetic resin mold with fine emboss pattern - Google Patents
Manufacture of synthetic resin mold with fine emboss patternInfo
- Publication number
- JP2000301544A JP2000301544A JP11111081A JP11108199A JP2000301544A JP 2000301544 A JP2000301544 A JP 2000301544A JP 11111081 A JP11111081 A JP 11111081A JP 11108199 A JP11108199 A JP 11108199A JP 2000301544 A JP2000301544 A JP 2000301544A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- mold
- synthetic resin
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 35
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 238000005530 etching Methods 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 239000007769 metal material Substances 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 15
- 229910052802 copper Inorganic materials 0.000 abstract description 15
- 239000010949 copper Substances 0.000 abstract description 15
- 239000002023 wood Substances 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005266 casting Methods 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 1
- 239000006082 mold release agent Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 21
- 238000000465 moulding Methods 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000010985 leather Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000010440 gypsum Substances 0.000 description 2
- 229910052602 gypsum Inorganic materials 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は合成樹脂型に係り、
詳しくは成形面にシボ模様、ステッチ模様、木目模様等
の微細凹凸模様が付いた合成樹脂型の製作方法に関する
ものである。The present invention relates to a synthetic resin mold,
More specifically, the present invention relates to a method for manufacturing a synthetic resin mold having a fine uneven pattern such as a grain pattern, a stitch pattern, and a grain pattern on a molding surface.
【０００２】[0002]
【従来の技術】合成樹脂型は、製作期間が短いこと、寸
法精度が高いこと等の特徴により、合成樹脂成形品の試
作用又は少量量産用として広く使用されている。特に、
自動車用合成樹脂部品（例えばインストルメントパネ
ル、コンソールボックス、アームレスト等）の分野にお
いては、合成樹脂型が多用されている。2. Description of the Related Art Synthetic resin molds are widely used for trial production or small-scale mass production of synthetic resin molded products due to the characteristics such as short production period and high dimensional accuracy. In particular,
In the field of synthetic resin parts for automobiles (for example, instrument panels, console boxes, armrests, etc.), synthetic resin molds are frequently used.
【０００３】従来の合成樹脂型は、木等により作製した
マスターモデルの表面にエポキシ樹脂を注型して製作し
ている。その合成樹脂型の成形面は無模様であり、微細
凹凸模様（以下、シボ模様で代表させる）が付けられた
ものはほとんど無かった。なぜなら、合成樹脂は酸等の
薬剤に侵されにくいため、合成樹脂型の成形面に直接シ
ボ模様を加工することは事実上不可能だからである。The conventional synthetic resin mold is manufactured by casting an epoxy resin on the surface of a master model made of wood or the like. The molding surface of the synthetic resin mold had no pattern, and there was almost no pattern with a fine uneven pattern (hereinafter, represented by a grain pattern). This is because it is practically impossible to directly process a grain pattern on a molding surface of a synthetic resin mold because the synthetic resin is hardly affected by a chemical such as an acid.
【０００４】[0004]
【発明が解決しようとする課題】ところが、試作用の合
成樹脂型の場合、本番の量産成形品にはシボ模様が付く
予定であるのに、その合成樹脂型の成形面が無模様であ
ると試作成形品も無模様になり、美感、質感、ボリュー
ム感等の視覚的イメージが予定のものと随分異なってし
まうため、該試作成形品では設計の適否を正確に検討す
ることができない場合があった。そのため、最近はこの
試作用の合成樹脂型に対しても量産成形品に近いシボ模
様付のものが求められるようになってきている。また、
量産用の合成樹脂型の場合、その合成樹脂型の成形面が
無模様であると、当然、成形できる量産成形品は無模様
のものに限定されるため、やはりシボ模様付のものが求
められている。However, in the case of a synthetic resin mold of a trial operation, a production mass-produced product is expected to have a grain pattern, but if the molding surface of the synthetic resin mold is unpatterned. Prototypes also become unpatterned, and visual images such as beauty, texture, and volume are significantly different from those expected.Therefore, it may not be possible to accurately evaluate the suitability of the design with the prototype. Was. For this reason, recently, there is a demand for a synthetic resin mold having a grain pattern similar to that of a mass-produced molded product, even for the trial synthetic resin mold. Also,
In the case of a synthetic resin mold for mass production, if the molding surface of the synthetic resin mold is unpatterned, the mass-produced molded products that can be molded are naturally limited to those with no pattern. ing.
【０００５】そこで、モデルに本皮を貼り付け、該本皮
付モデルの表面にシリコン樹脂を注型して硬化させ、該
シリコン樹脂型に石膏、エポキシ樹脂等を注型してシボ
模様付マスターモデルを作製し、該シボ模様付マスター
モデルの表面にエポキシ樹脂を注型してシボ模様付合成
樹脂型を製作することも考えられる。しかし、モデルに
本皮を貼り付ける作業は、シボ模様合わせが非常に難し
いことから、高度の熟練者でなければ行うことができな
い。また、シボ模様付マスターモデル作製までの工程が
多く、コストが高くなる。[0005] Therefore, a real leather is attached to the model, a silicone resin is cast on the surface of the real leather model and cured, and a gypsum or epoxy resin is poured into the silicon resin mold to form a master with a grain pattern. It is also conceivable to prepare a model and cast an epoxy resin on the surface of the master model with a grain pattern to produce a synthetic resin mold with a grain pattern. However, the work of attaching the real leather to the model can only be performed by highly skilled persons because it is very difficult to match the grain pattern. In addition, there are many steps up to the production of a master model with a grain pattern, which increases the cost.
【０００６】本発明の目的は、上記問題を解決し、成形
面に微細凹凸模様が付いた合成樹脂型を、高度の熟練を
要することなく、少ない工程で簡単かつ安価に製作する
ことができる方法を提供することにある。An object of the present invention is to solve the above-mentioned problems and to provide a method for easily and inexpensively manufacturing a synthetic resin mold having a fine irregular pattern on a molding surface without requiring a high level of skill. Is to provide.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の微細凹凸模様付合成樹脂型の製作方法は、
非金属材料よりなるマスターモデルの表面に金属皮膜を
形成する工程と、該金属皮膜に微細凹凸模様をエッチン
グ加工する工程と、該微細凹凸模様付マスターモデルの
表面に液状合成樹脂を流し込んで硬化させる工程とを含
む。In order to achieve the above object, a method of manufacturing a synthetic resin mold having a fine uneven pattern according to the present invention comprises:
A step of forming a metal film on the surface of the master model made of a non-metallic material, a step of etching a fine uneven pattern on the metal film, and a step of pouring and synthesizing a liquid synthetic resin on the surface of the master model with the fine uneven pattern. And a step.
【０００８】ここで、マスターモデルの「非金属材料」
は、特に限定されず、木、樹脂含浸木、石膏等を例示す
ることができる。また、「金属皮膜」の形成方法は、特
に限定されず、マスターモデルの表面に導電処理を施し
てから電気メッキを行う方法や、無電解メッキ法や、溶
射法等を例示することができる。また、「微細凹凸模
様」の態様は、特に限定されず、シボ模様、ステッチ模
様、木目模様等を例示することができる。Here, the “non-metallic material” of the master model
Is not particularly limited, and examples thereof include wood, resin-impregnated wood, and gypsum. The method for forming the “metal film” is not particularly limited, and examples thereof include a method of performing electroplating after performing a conductive treatment on the surface of the master model, an electroless plating method, a thermal spraying method, and the like. In addition, the mode of the “fine uneven pattern” is not particularly limited, and examples thereof include a grain pattern, a stitch pattern, and a grain pattern.
【０００９】また、「エッチング加工」は、各種の公知
方法又はその改良方法で行うことができ、次の方法
を例示することができる。 金属皮膜に光硬化性（又は光分解性）レジスト樹脂
を塗布し、その上に微細模様を印刷した透明樹脂フィル
ムを被せ、該フィルムの上から露光を施してレジスト樹
脂を光硬化させ、光硬化した以外の部分（又は光分解し
た部分）のレジスト樹脂を溶解除去し、該金属皮膜をエ
ッチング液でエッチングした後、残っているレジスト樹
脂を金属皮膜から除去する。 透明樹脂フィルムとその片面に微細模様で付着され
た光硬化性レジスト樹脂とを備えた転写シートの該光硬
化性レジスト樹脂側を金属皮膜に貼り付け、該転写シー
トの上から露光を施して光硬化性レジスト樹脂を光硬化
させるとともに金属皮膜に接着させ、該透明樹脂フィル
ムを剥がして光硬化性レジスト樹脂を金属皮膜に残し、
該金属皮膜をエッチング液でエッチングした後、該光硬
化性レジスト樹脂を金属皮膜から除去する。The "etching process" can be performed by various known methods or improved methods thereof, and the following methods can be exemplified. A photo-curable (or photo-decomposable) resist resin is applied to the metal film, and a transparent resin film with a fine pattern printed thereon is covered thereon. After dissolving and removing the resist resin other than the part (or the part decomposed by photolysis) and etching the metal film with an etchant, the remaining resist resin is removed from the metal film. The photocurable resist resin side of a transfer sheet comprising a transparent resin film and a photocurable resist resin adhered in a fine pattern to one surface thereof is attached to a metal film, and exposed to light from above the transfer sheet. Photocuring the curable resist resin and bonding it to the metal film, peeling off the transparent resin film and leaving the photocurable resist resin on the metal film,
After etching the metal film with an etchant, the photocurable resist resin is removed from the metal film.
【００１０】また、「液状合成樹脂」としては、二液性
エポキシ樹脂、アクリル樹脂、不飽和ポリエステル樹脂
等を例示することができる。[0010] Examples of the "liquid synthetic resin" include a two-part epoxy resin, an acrylic resin, and an unsaturated polyester resin.
【００１１】[0011]
【発明の実施の形態】以下、本発明を図１に示すような
シボ模様付合成樹脂型１５の製作方法として具体化した
実施形態例について、図２〜図５を参照し、次の工程
（１）〜（４）の順に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention as a method for manufacturing a synthetic resin mold 15 having a grain pattern as shown in FIG. 1 will be described with reference to FIGS. Descriptions will be made in the order of 1) to (4).
【００１２】（１）まず、図２（ａ）に示すように表面
が無模様のマスターモデル１を製作する。本実施例で
は、このマスターモデル１を、樹脂含浸木を機械加工し
て作製した。(1) First, as shown in FIG. 2 (a), a master model 1 having no surface pattern is manufactured. In this example, the master model 1 was manufactured by machining a resin-impregnated wood.
【００１３】（２）図２（ｂ）に示すように、上記マス
ターモデル１の表面に銀鏡反応又は銀粉塗布により導電
処理を施した後、該表面に電気メッキ法により銅皮膜２
を形成する。この銅皮膜２の厚さは後でエッチング加工
するシボ模様の深さによって異なり、例えば深さ１００
μｍのシボ模様を加工したい場合には、銅皮膜２の厚さ
を１５０μｍとする。(2) As shown in FIG. 2 (b), after the surface of the master model 1 is subjected to a conductive treatment by silver mirror reaction or silver powder application, a copper coating 2 is formed on the surface by electroplating.
To form The thickness of the copper film 2 varies depending on the depth of the grain pattern to be etched later.
If it is desired to process a μm grain pattern, the thickness of the copper film 2 is set to 150 μm.
【００１４】（３）次に、図２（ｃ）及び図３（ｅ）に
示すように、上記銅皮膜２に凸部３ａと凹部３ｂとを有
するシボ模様３をエッチング加工する。本実施例では、
このエッチング加工を次の手順〜で行った。(3) Next, as shown in FIGS. 2 (c) and 3 (e), a grain pattern 3 having a convex portion 3a and a concave portion 3b is etched on the copper film 2. In this embodiment,
This etching process was performed according to the following procedures.
【００１５】 銅皮膜２の表面を脱脂、洗浄等して前
処理する。 図３（ａ）に示すように、銅皮膜２に転写シート４
を貼り付ける。この転写シート４は、透明樹脂フィルム
５とその片面にシボ模様で付着された光硬化性レジスト
樹脂６とを備えたもので、さらに、不使用時には光硬化
性レジスト樹脂６に剥離フィルム７が添設されている。
転写シート４から剥離フィルム７を剥がし、図３（ｂ）
に示すように、光硬化性レジスト樹脂６側を銅皮膜２に
押し当てれば、光硬化性レジスト樹脂６の有する粘着性
によって容易に貼り付けることができる。 図３（ｂ）にジグザグの矢印で示すように、転写シ
ート４の上から露光（本実施形態では紫外線ランプを使
用したが、これに限定されない。）を施すと、透明樹脂
フィルム５を通過した光により、光硬化性レジスト樹脂
６は硬化するとともに銅皮膜２に強く接着する。The surface of the copper film 2 is pre-treated by degreasing, washing and the like. As shown in FIG. 3A, the transfer sheet 4 is
Paste. The transfer sheet 4 includes a transparent resin film 5 and a photocurable resist resin 6 attached to one surface of the transfer resin sheet 4 in a crimped pattern. Further, a release film 7 is added to the photocurable resist resin 6 when not in use. Has been established.
Peeling off the release film 7 from the transfer sheet 4, FIG.
As shown in (2), when the photo-curable resist resin 6 is pressed against the copper film 2, the photo-curable resist resin 6 can be easily adhered by the adhesive property. As shown by a zigzag arrow in FIG. 3B, when the transfer sheet 4 was exposed from above (in this embodiment, an ultraviolet lamp was used, but not limited to this), the transfer sheet 4 passed through the transparent resin film 5. The light cures the photocurable resist resin 6 and strongly adheres to the copper film 2 by light.
【００１６】 図３（ｃ）に示すように、透明樹脂フ
ィルム５を剥がすと、光硬化性レジスト樹脂６は銅皮膜
２に奇麗に残る。 図３（ｄ）に示すように、銅皮膜２にエッチング液
を（本実施形態では塩化第二鉄溶液であるが、これに限
定されず、塩化第二銅溶液等でもよい。）を接触させ、
光硬化性レジスト樹脂６間に露出している銅皮膜２（す
なわちシボ模様３の凹部３ｂとなるべき所）をエッチン
グ液でエッチングし、シボ模様３を形成する。エッチン
グ条件は、適宜決定できる。 図３（ｅ）に示すように、光硬化性レジスト樹脂を
溶解、洗浄等の公知の方法で銅皮膜２から除去する。 必要に応じて、シボ模様３の凸部３ａの角を丸味が
付くようにエッチング液でエッチングして仕上げる（図
示略）。As shown in FIG. 3C, when the transparent resin film 5 is peeled off, the photo-curable resist resin 6 remains on the copper film 2 neatly. As shown in FIG. 3D, an etchant (in the present embodiment, a ferric chloride solution, but not limited thereto, may be a cupric chloride solution or the like) is brought into contact with the copper film 2. ,
The copper film 2 exposed between the photocurable resist resins 6 (that is, the portions to become the concave portions 3b of the grain pattern 3) is etched with an etchant to form the grain pattern 3. The etching conditions can be determined as appropriate. As shown in FIG. 3E, the photocurable resist resin is removed from the copper film 2 by a known method such as dissolution and washing. If necessary, the protrusions 3a of the grain pattern 3 are finished by etching with an etchant so that the corners are rounded (not shown).
【００１７】以上のエッチング加工により、図２（ｃ）
及び図３（ｅ）に示すようなシボ模様３付マスターモデ
ル１が得られた。このエッチング加工は、前述した本皮
の貼り付けと比べて簡単であり、高度の熟練を要しな
い。また、少ない工程で安価に作製することができる。
特に、光硬化性レジスト樹脂６が付いた転写シート４の
使用により、レジスト樹脂を塗布する工程が要らないた
め、手間がかからない。なお、上記手順〜を２回以
上繰り返すことにより、シボ模様３を深くしたり段付き
にしたりすることもできる。By the above etching process, FIG.
A master model 1 with a grain pattern 3 as shown in FIG. 3 (e) was obtained. This etching process is simpler than the pasting of the real leather and does not require a high degree of skill. Further, it can be manufactured at low cost with a small number of steps.
In particular, the use of the transfer sheet 4 to which the photocurable resist resin 6 is attached eliminates the need for a step of applying the resist resin, so that no labor is required. In addition, by repeating the above procedure 2 or more times, the grain pattern 3 can be made deep or stepped.
【００１８】（４）図４（ａ）に示すように、シボ模様
３付マスターモデル１の表面に離型剤を塗布し、該表面
に対し所定の空隙を隔てて対峙する面を有する補強用バ
ッキング材１０をセットする。補強用バッキング材１０
は、亜鉛合金、アルミニウム合金等により形成したもの
を例示することができる。１１は見切り形成部材、１２
はシール材である。前記空隙に液状の二液性エポキシ樹
脂１３（アルミニウム粉等を混合してもよい。）を流し
込んで硬化させ、シボ模様付合成樹脂型１５を得た。図
４（ｂ）に示すように、シボ模様付合成樹脂型１５をマ
スターモデル１及び見切り形成部材１１から剥離させ、
図１に示すような補強用バッキング材１０付のシボ模様
付合成樹脂型１５が完成した。(4) As shown in FIG. 4 (a), a release agent is applied to the surface of the master model 1 having the grain pattern 3, and a reinforcing surface having a surface facing the surface with a predetermined gap therebetween. The backing material 10 is set. Backing material for reinforcement 10
Can be exemplified by those formed of a zinc alloy, an aluminum alloy or the like. 11 is a parting member, 12
Is a sealing material. A liquid two-component epoxy resin 13 (aluminum powder or the like may be mixed) was poured into the gap and cured to obtain a synthetic resin mold 15 with a grain pattern. As shown in FIG. 4B, the synthetic resin mold 15 having a grain pattern is peeled from the master model 1 and the parting member 11.
As shown in FIG. 1, a synthetic resin mold 15 having a grain pattern with a reinforcing backing material 10 was completed.
【００１９】なお、本発明は前記実施形態に限定される
ものではなく、発明の趣旨から逸脱しない範囲で適宜変
更して具体化することもできる。It should be noted that the present invention is not limited to the above-described embodiment, and can be embodied with appropriate modifications without departing from the spirit of the invention.
【００２０】[0020]
【発明の効果】本発明に係る微細凹凸模様付合成樹脂型
の製作方法によれば、成形面に微細凹凸模様が付いた合
成樹脂型を、高度の熟練を要することなく、少ない工程
で簡単かつ安価に製作することができるという優れた効
果を奏する。According to the method for producing a synthetic resin mold having a fine uneven pattern according to the present invention, a synthetic resin mold having a fine uneven pattern on a molding surface can be easily and simply manufactured in a small number of steps without requiring a high level of skill. It has an excellent effect that it can be manufactured at low cost.
【図１】本発明の実施形態で製作したシボ模様付合成樹
脂型の斜視図である。FIG. 1 is a perspective view of a synthetic resin mold having a grain pattern manufactured according to an embodiment of the present invention.
【図２】同シボ模様付合成樹脂型の製作に使用するマス
ターモデルを示し、（ａ）は無模様のマスターモデルの
断面図、（ｂ）は銅皮膜を形成したマスターモデルの断
面図、（ｃ）は銅皮膜にシボ模様をエッチング加工した
マスターモデルの断面図である。2A and 2B show a master model used for manufacturing the synthetic resin mold having a grain pattern, wherein FIG. 2A is a cross-sectional view of a master model having no pattern, FIG. 2B is a cross-sectional view of a master model having a copper film formed thereon, (c) is a cross-sectional view of a master model obtained by etching a grain pattern on a copper film.
【図３】（ａ）〜（ｅ）は同エッチング加工の手順を説
明する部分拡大断面図である。FIGS. 3A to 3E are partially enlarged cross-sectional views illustrating a procedure of the etching process.
【図４】（ａ）は同シボ模様付マスターモデルを使用し
てシボ模様付合成樹脂型を注型するときの断面図、
（ｂ）は同シボ模様付マスターモデルから剥がしたシボ
模様付合成樹脂型の断面図である。FIG. 4A is a cross-sectional view of casting a synthetic resin mold with a grain pattern using the master model with the grain pattern.
(B) is sectional drawing of the synthetic resin type with a grain pattern peeled from the master model with the grain pattern.
１ マスターモデル ２ 銅皮膜 ３ シボ模様 ３ａ 凸部 ３ｂ 凹部 ４ 転写シート ５ 透明樹脂フィルム ６ 光硬化性レジスト樹脂 ７ 剥離フィルム １０ 補強用バッキング材 １１ 見切り形成部材 １３ 二液性エポキシ樹脂 １５ シボ模様付合成樹脂型 DESCRIPTION OF SYMBOLS 1 Master model 2 Copper film 3 Grain pattern 3a Convex part 3b Concave part 4 Transfer sheet 5 Transparent resin film 6 Photocurable resist resin 7 Release film 10 Reinforcement backing material 11 Parting-off forming member 13 Two-component epoxy resin 15 Resin mold
Claims (1)
面に金属皮膜を形成する工程と、該金属皮膜に微細凹凸
模様をエッチング加工する工程と、該微細凹凸模様付マ
スターモデルの表面に液状合成樹脂を流し込んで硬化さ
せる工程とを含む微細凹凸模様付合成樹脂型の製作方
法。1. A step of forming a metal film on the surface of a master model made of a non-metallic material, a step of etching a fine uneven pattern on the metal film, and a step of forming a liquid synthetic resin on the surface of the master model with the fine uneven pattern. And a step of pouring and curing the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11111081A JP2000301544A (en) | 1999-04-19 | 1999-04-19 | Manufacture of synthetic resin mold with fine emboss pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11111081A JP2000301544A (en) | 1999-04-19 | 1999-04-19 | Manufacture of synthetic resin mold with fine emboss pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000301544A true JP2000301544A (en) | 2000-10-31 |
Family
ID=14551911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11111081A Pending JP2000301544A (en) | 1999-04-19 | 1999-04-19 | Manufacture of synthetic resin mold with fine emboss pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000301544A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003016013A1 (en) * | 2001-07-30 | 2003-02-27 | Tanazawa Hakkosha Co., Ltd. | Resin coated mold and method of producing the same |
| CN104552678A (en) * | 2014-12-29 | 2015-04-29 | 模德模具(东莞)有限公司 | Manufacturing technology of texture of suture lines of injection molds |
| JP2019195944A (en) * | 2018-05-10 | 2019-11-14 | トヨタ紡織株式会社 | Mold, vehicle interior material manufacturing method, and mold manufacturing method |
-
1999
- 1999-04-19 JP JP11111081A patent/JP2000301544A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003016013A1 (en) * | 2001-07-30 | 2003-02-27 | Tanazawa Hakkosha Co., Ltd. | Resin coated mold and method of producing the same |
| CN104552678A (en) * | 2014-12-29 | 2015-04-29 | 模德模具(东莞)有限公司 | Manufacturing technology of texture of suture lines of injection molds |
| JP2019195944A (en) * | 2018-05-10 | 2019-11-14 | トヨタ紡織株式会社 | Mold, vehicle interior material manufacturing method, and mold manufacturing method |
| JP7023178B2 (en) | 2018-05-10 | 2022-02-21 | トヨタ紡織株式会社 | Molding mold, manufacturing method of interior material for vehicles, and manufacturing method of molding mold |
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