JP2000306864A5 - - Google Patents
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- Publication number
- JP2000306864A5 JP2000306864A5 JP1999115171A JP11517199A JP2000306864A5 JP 2000306864 A5 JP2000306864 A5 JP 2000306864A5 JP 1999115171 A JP1999115171 A JP 1999115171A JP 11517199 A JP11517199 A JP 11517199A JP 2000306864 A5 JP2000306864 A5 JP 2000306864A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- dicing
- hole
- strip
- attachment frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11517199A JP2000306864A (ja) | 1999-04-22 | 1999-04-22 | 短冊ワークダイシング用フィルム取付フレーム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11517199A JP2000306864A (ja) | 1999-04-22 | 1999-04-22 | 短冊ワークダイシング用フィルム取付フレーム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000306864A JP2000306864A (ja) | 2000-11-02 |
| JP2000306864A5 true JP2000306864A5 (fr) | 2005-04-07 |
Family
ID=14656114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11517199A Pending JP2000306864A (ja) | 1999-04-22 | 1999-04-22 | 短冊ワークダイシング用フィルム取付フレーム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000306864A (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4580806B2 (ja) * | 2004-11-30 | 2010-11-17 | アピックヤマダ株式会社 | ワーク支持枠体、ワーク洗浄乾燥装置及び切断装置 |
| JP5199812B2 (ja) * | 2008-09-30 | 2013-05-15 | 株式会社ディスコ | 切削装置 |
| JP2016043503A (ja) * | 2014-08-20 | 2016-04-04 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法、脆性材料基板分断用の基板保持部材、および、脆性材料基板の分断時に使用する粘着フィルム張設用の枠体 |
| JP7486265B2 (ja) | 2020-01-09 | 2024-05-17 | 株式会社ディスコ | 被加工物の加工方法 |
| JP7764666B1 (ja) * | 2025-03-06 | 2025-11-05 | 信越ポリマー株式会社 | ダイシングフレーム |
-
1999
- 1999-04-22 JP JP11517199A patent/JP2000306864A/ja active Pending
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