JP2000345392A5 - - Google Patents
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- Publication number
- JP2000345392A5 JP2000345392A5 JP2000016089A JP2000016089A JP2000345392A5 JP 2000345392 A5 JP2000345392 A5 JP 2000345392A5 JP 2000016089 A JP2000016089 A JP 2000016089A JP 2000016089 A JP2000016089 A JP 2000016089A JP 2000345392 A5 JP2000345392 A5 JP 2000345392A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plating
- solution
- contact
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims 43
- 239000000758 substrate Substances 0.000 claims 37
- 238000000034 method Methods 0.000 claims 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 13
- 229910052802 copper Inorganic materials 0.000 claims 13
- 239000010949 copper Substances 0.000 claims 13
- 239000007788 liquid Substances 0.000 claims 11
- 238000005530 etching Methods 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 150000003464 sulfur compounds Chemical class 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 229910052783 alkali metal Inorganic materials 0.000 claims 1
- 150000001340 alkali metals Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 238000007664 blowing Methods 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000003486 chemical etching Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000000866 electrolytic etching Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 229920000620 organic polymer Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000016089A JP2000345392A (ja) | 1999-01-26 | 2000-01-25 | 銅めっき方法およびその装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1720899 | 1999-01-26 | ||
| JP11-17208 | 1999-01-26 | ||
| JP11-94943 | 1999-04-01 | ||
| JP9494399 | 1999-04-01 | ||
| JP2000016089A JP2000345392A (ja) | 1999-01-26 | 2000-01-25 | 銅めっき方法およびその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000345392A JP2000345392A (ja) | 2000-12-12 |
| JP2000345392A5 true JP2000345392A5 (2) | 2004-12-09 |
Family
ID=27281722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000016089A Pending JP2000345392A (ja) | 1999-01-26 | 2000-01-25 | 銅めっき方法およびその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000345392A (2) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001316866A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | 半導体装置の製造方法および製造装置 |
| JP4762423B2 (ja) * | 2001-03-05 | 2011-08-31 | 石原薬品株式会社 | ボイドフリー銅メッキ方法 |
| JP2009030167A (ja) * | 2007-07-02 | 2009-02-12 | Ebara Corp | 基板処理方法及び基板処理装置 |
| JP6948053B2 (ja) * | 2017-01-12 | 2021-10-13 | 上村工業株式会社 | フィリングめっきシステム及びフィリングめっき方法 |
-
2000
- 2000-01-25 JP JP2000016089A patent/JP2000345392A/ja active Pending
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