JP2000353772A5 - - Google Patents
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- Publication number
- JP2000353772A5 JP2000353772A5 JP1999165090A JP16509099A JP2000353772A5 JP 2000353772 A5 JP2000353772 A5 JP 2000353772A5 JP 1999165090 A JP1999165090 A JP 1999165090A JP 16509099 A JP16509099 A JP 16509099A JP 2000353772 A5 JP2000353772 A5 JP 2000353772A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- heat conductive
- conductive resin
- metal plate
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 description 69
- 239000002184 metal Substances 0.000 description 25
- 239000000758 substrate Substances 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 17
- 229920001187 thermosetting polymer Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011256 inorganic filler Substances 0.000 description 10
- 229910003475 inorganic filler Inorganic materials 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000002788 crimping Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16509099A JP3835949B2 (ja) | 1999-06-11 | 1999-06-11 | 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16509099A JP3835949B2 (ja) | 1999-06-11 | 1999-06-11 | 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000353772A JP2000353772A (ja) | 2000-12-19 |
| JP2000353772A5 true JP2000353772A5 (de) | 2006-07-20 |
| JP3835949B2 JP3835949B2 (ja) | 2006-10-18 |
Family
ID=15805705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16509099A Expired - Fee Related JP3835949B2 (ja) | 1999-06-11 | 1999-06-11 | 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3835949B2 (de) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3830726B2 (ja) * | 2000-04-26 | 2006-10-11 | 松下電器産業株式会社 | 熱伝導基板とその製造方法およびパワーモジュール |
| US6870244B2 (en) | 2000-12-27 | 2005-03-22 | Matsushita Electric Industrial Co., Ltd. | Lead frame and production process thereof and production process of thermally conductive substrate |
| JP4719990B2 (ja) * | 2001-03-02 | 2011-07-06 | パナソニック電工株式会社 | 電子部品の製造方法 |
| JP4459470B2 (ja) * | 2001-04-06 | 2010-04-28 | 信越化学工業株式会社 | 電子部品の放熱構造体及びそれに用いる放熱シート |
| JP4581656B2 (ja) * | 2004-11-30 | 2010-11-17 | パナソニック株式会社 | 放熱板の製造方法 |
| JP4581655B2 (ja) * | 2004-11-30 | 2010-11-17 | パナソニック株式会社 | 放熱板 |
| JP4821854B2 (ja) * | 2006-06-14 | 2011-11-24 | パナソニック株式会社 | 放熱配線基板 |
| KR101271965B1 (ko) | 2011-07-13 | 2013-06-07 | 주식회사 노루코일코팅 | 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판 |
| KR102551743B1 (ko) * | 2018-04-04 | 2023-07-06 | 엘지이노텍 주식회사 | 방열시트와 이를 포함하는 휴대 장치 및 무선 충전 장치 |
| EP4651640A4 (de) * | 2023-01-10 | 2026-04-01 | Nhk Spring Co Ltd | Fördervorrichtung, leiterplattenherstellungsvorrichtung und leiterplattenherstellungsverfahren |
| EP4651644A4 (de) * | 2023-01-10 | 2026-04-15 | Nhk Spring Co Ltd | Vorrichtung zur herstellung einer leiterplatte und verfahren zur herstellung einer leiterplatte |
| CN120570070A (zh) * | 2023-01-10 | 2025-08-29 | 日本发条株式会社 | 电路基板的制造装置及电路基板的制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522282A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Semiconductor device |
| JP3351852B2 (ja) * | 1992-04-20 | 2002-12-03 | 電気化学工業株式会社 | 絶縁材及びそれを用いた回路基板 |
| JPH06120657A (ja) * | 1992-10-01 | 1994-04-28 | Hitachi Chem Co Ltd | 金属ベース基板の製造法 |
| JP3201277B2 (ja) * | 1996-09-11 | 2001-08-20 | 株式会社日立製作所 | 半導体装置 |
| JP3312723B2 (ja) * | 1996-10-09 | 2002-08-12 | 松下電器産業株式会社 | 熱伝導シート状物とその製造方法及びそれを用いた熱伝導基板とその製造方法 |
| JPH1146049A (ja) * | 1997-07-25 | 1999-02-16 | Matsushita Electric Ind Co Ltd | 放熱性樹脂基板およびその製造方法 |
-
1999
- 1999-06-11 JP JP16509099A patent/JP3835949B2/ja not_active Expired - Fee Related
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