|
US6174425B1
(en)
*
|
1997-05-14 |
2001-01-16 |
Motorola, Inc. |
Process for depositing a layer of material over a substrate
|
|
US6793796B2
(en)
|
1998-10-26 |
2004-09-21 |
Novellus Systems, Inc. |
Electroplating process for avoiding defects in metal features of integrated circuit devices
|
|
US6946065B1
(en)
*
|
1998-10-26 |
2005-09-20 |
Novellus Systems, Inc. |
Process for electroplating metal into microscopic recessed features
|
|
US6344419B1
(en)
|
1999-12-03 |
2002-02-05 |
Applied Materials, Inc. |
Pulsed-mode RF bias for sidewall coverage improvement
|
|
US6231743B1
(en)
|
2000-01-03 |
2001-05-15 |
Motorola, Inc. |
Method for forming a semiconductor device
|
|
KR20020078307A
(ko)
|
2001-04-09 |
2002-10-18 |
주식회사 하이닉스반도체 |
반도체 소자의 커패시터 제조 방법
|
|
DE10259365A1
(de)
*
|
2002-04-08 |
2003-10-30 |
Siemens Ag |
Vorrichtung und Verfahren zur Entfernung von Oberflächenbereichen eines Bauteils
|
|
NL1022786C2
(nl)
*
|
2003-02-26 |
2004-08-30 |
Tendris Solutions Bv |
Omzetschakeling, systeem en werkwijze voor het uitvoeren van een elektrochemisch proces.
|
|
DE10311575B4
(de)
*
|
2003-03-10 |
2007-03-22 |
Atotech Deutschland Gmbh |
Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis
|
|
US20070068821A1
(en)
*
|
2005-09-27 |
2007-03-29 |
Takahisa Hirasawa |
Method of manufacturing chromium plated article and chromium plating apparatus
|
|
RU2248416C1
(ru)
*
|
2003-11-04 |
2005-03-20 |
Никифоров Алексей Александрович |
Устройство для микродугового оксидирования
|
|
US20050157475A1
(en)
*
|
2004-01-15 |
2005-07-21 |
Endicott Interconnect Technologies, Inc. |
Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
|
|
DE102004045451B4
(de)
|
2004-09-20 |
2007-05-03 |
Atotech Deutschland Gmbh |
Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
|
|
SE0403047D0
(sv)
*
|
2004-12-14 |
2004-12-14 |
Polymer Kompositer I Goeteborg |
Pulse-plating method and apparatus
|
|
PL377451A1
(pl)
*
|
2005-10-05 |
2007-04-16 |
Instytut Wysokich Ciśnień PAN |
Sposób prowadzenia reakcji i reaktor chemiczny
|
|
EP1890004A1
(de)
|
2006-08-08 |
2008-02-20 |
Siemens Aktiengesellschaft |
Verfahren zum Herstellen einer Nutzschicht aus wiederverwendetem Schichtmaterial
|
|
DE102006044416A1
(de)
*
|
2006-09-18 |
2008-03-27 |
Siemens Ag |
Verfahren zum elektrochemischen Be- oder Entschichten von Bauteilen
|
|
US20080271995A1
(en)
*
|
2007-05-03 |
2008-11-06 |
Sergey Savastiouk |
Agitation of electrolytic solution in electrodeposition
|
|
US8603864B2
(en)
|
2008-09-11 |
2013-12-10 |
Infineon Technologies Ag |
Method of fabricating a semiconductor device
|
|
US11225727B2
(en)
|
2008-11-07 |
2022-01-18 |
Lam Research Corporation |
Control of current density in an electroplating apparatus
|
|
US10011917B2
(en)
|
2008-11-07 |
2018-07-03 |
Lam Research Corporation |
Control of current density in an electroplating apparatus
|
|
US9011706B2
(en)
*
|
2008-12-16 |
2015-04-21 |
City University Of Hong Kong |
Method of making foraminous microstructures
|
|
US9385035B2
(en)
|
2010-05-24 |
2016-07-05 |
Novellus Systems, Inc. |
Current ramping and current pulsing entry of substrates for electroplating
|
|
JP6161863B2
(ja)
*
|
2010-12-28 |
2017-07-12 |
株式会社荏原製作所 |
電気めっき方法
|
|
US9028666B2
(en)
|
2011-05-17 |
2015-05-12 |
Novellus Systems, Inc. |
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
|
|
CN102277603A
(zh)
*
|
2011-08-03 |
2011-12-14 |
深圳大学 |
一种感应热/电沉积制备涂层或薄膜的装置及方法
|
|
CA2929515C
(en)
*
|
2013-11-19 |
2019-12-31 |
Hecker Electronica Potencia Y Procesos S.A. |
Process for superimposing ac over dc used in copper, or other products, electrowinning or electrorefining processes, wherein the ac source is connected between two consecutive cells from the group of electrolytic cells using an inductor to inject ac and a capacitor to close the electrical circuit
|
|
EP3029178A1
(en)
|
2014-12-05 |
2016-06-08 |
ATOTECH Deutschland GmbH |
Method and apparatus for electroplating a metal onto a substrate
|
|
JP7358238B2
(ja)
|
2016-07-13 |
2023-10-10 |
イオントラ インコーポレイテッド |
電気化学的方法、装置及び組成物
|
|
RU2722754C1
(ru)
*
|
2019-04-23 |
2020-06-03 |
Общество с ограниченной ответственностью "Керамик тех" (ООО "Керамик тех") |
Устройство для формирования электрохимическим оксидированием покрытий на вентильных металлах или сплавах
|
|
CN114836797B
(zh)
*
|
2022-05-12 |
2023-08-29 |
广州市慧科高新材料科技有限公司 |
一种基于脉冲搭桥的通孔填孔电镀工艺
|