JP2000512782A - 射出成形ケーシングにおける、集積回路を組み付けるためのシステムキャリア - Google Patents
射出成形ケーシングにおける、集積回路を組み付けるためのシステムキャリアInfo
- Publication number
- JP2000512782A JP2000512782A JP10502105A JP50210598A JP2000512782A JP 2000512782 A JP2000512782 A JP 2000512782A JP 10502105 A JP10502105 A JP 10502105A JP 50210598 A JP50210598 A JP 50210598A JP 2000512782 A JP2000512782 A JP 2000512782A
- Authority
- JP
- Japan
- Prior art keywords
- spring member
- casing
- injection
- lead
- system carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 射出成形ケーシング(5)における、集積回路(4)を組み付けるためのシ ステムキャリア(1)において、少なくとも1つの、ケーシング(5)の外部か ら集積回路(4)へ接触接続するためのコンタクト面(3)を持つリード(2) を備えており、リード(2)の少なくとも1つがばね部材(6)を備えており、 ばね部材がケーシング(5)の射出時に射出成形型(7a、7b)によって圧縮 可能であり、圧縮によってコンタクト面(3)が射出成形型(7a、7b)の内 壁(8)に対して押圧可能であることを特徴とする、射出成形ケーシングにおけ る、集積回路を組み付けるためのシステムキャリア。 2. リード(2)の端部がばね部材(6)に構成されている、請求項1記載のシ ステムキャリア。 3. ばね部材(6)がフック状に構成されており、そのためにケーシング(5) の仕上げ後リード(2)がケーシング内に錨着される、請求項1または2記載の システムキャリア。 4. ばね部材(6)がJ字形に構成されている、請求項3記載のシステムキャリ ア。 5. ばね部材(6)が半円形に構成されている、請求項3記載のシステムキャリ ア。 6. ばね部材(6)が少なくとも部分的にジグザグ状 に構成されている、請求項1から5までのいずれか1項記載のシステムキャリア 。 7. ばね部材(6)がコンタクト面(3)の近くに配置されている、請求項1か ら6までのいずれか1項記載のシステムキャリア。 8. ばね部材(6)が射出成形型(7a、7b)の2つの部分を1つに合わせる ことによって圧縮可能であり、ばね部材(6)がケーシング(5)の厚さに対し て突出する突出部を持つ、請求項1から7までのいずれか1項記載のシステムキ ャリア。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19625228A DE19625228C2 (de) | 1996-06-24 | 1996-06-24 | Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse |
| DE19625228.8 | 1996-06-24 | ||
| PCT/DE1997/001314 WO1997050056A1 (de) | 1996-06-24 | 1997-06-24 | Systemträger für die montage einer integrierten schaltung in einem spritzgussgehäuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000512782A true JP2000512782A (ja) | 2000-09-26 |
| JP3640676B2 JP3640676B2 (ja) | 2005-04-20 |
Family
ID=7797849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50210598A Expired - Fee Related JP3640676B2 (ja) | 1996-06-24 | 1997-06-24 | 射出成形ケーシングにおける、集積回路を組み付けるためのシステムキャリア |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6614100B1 (ja) |
| EP (1) | EP0907928B1 (ja) |
| JP (1) | JP3640676B2 (ja) |
| KR (1) | KR100397081B1 (ja) |
| CN (1) | CN1099703C (ja) |
| DE (2) | DE19625228C2 (ja) |
| WO (1) | WO1997050056A1 (ja) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6001672A (en) | 1997-02-25 | 1999-12-14 | Micron Technology, Inc. | Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
| DE19800646C2 (de) * | 1998-01-09 | 2000-05-04 | Siemens Ag | Trägerelement für einen Halbleiterchip |
| EP0949583A1 (de) * | 1998-04-07 | 1999-10-13 | ESEC Management SA | Elektronikobjekt |
| EP0949582A1 (de) * | 1998-04-07 | 1999-10-13 | ESEC Management SA | Elektronikobjekt |
| SG102638A1 (en) * | 2000-09-15 | 2004-03-26 | Samsung Techwin Co Ltd | Lead frame, semiconductor package having the same, and semiconductor package manufacturing method |
| US7220615B2 (en) * | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
| DE60205655D1 (de) * | 2001-11-23 | 2005-09-22 | Nagraid Sa | Herstellungsverfahren für ein modul mit mindestens einem elektronischen element |
| FR2895548B1 (fr) * | 2005-12-26 | 2008-03-21 | Oberthur Card Syst Sa | Procede de fabrication d'une carte a microcircuit, et carte a microcircuit associee |
| US7380721B2 (en) * | 2006-08-22 | 2008-06-03 | Honeywell International Inc. | Low-cost compact bar code sensor |
| US7768231B2 (en) * | 2006-09-18 | 2010-08-03 | Lg Chem, Ltd. | Battery pack |
| TWI331084B (en) * | 2008-05-12 | 2010-10-01 | Asustek Comp Inc | In-mold decoration device and manufacturing method thereof |
| WO2011044062A1 (en) * | 2009-10-05 | 2011-04-14 | Cardiac Pacemakers, Inc. | Multi-band antenna for implantable device |
| DE102012204630A1 (de) | 2012-03-22 | 2013-09-26 | Robert Bosch Gmbh | Verfahren zur thermoplastischen Umspritzung und thermoplastische Umspritzung |
| JP6357371B2 (ja) * | 2014-07-09 | 2018-07-11 | 新光電気工業株式会社 | リードフレーム、半導体装置及びリードフレームの製造方法 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
| FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
| US4801561A (en) * | 1984-07-05 | 1989-01-31 | National Semiconductor Corporation | Method for making a pre-testable semiconductor die package |
| JPS6394645A (ja) * | 1986-10-08 | 1988-04-25 | Mitsubishi Electric Corp | 電子装置 |
| FR2609821B1 (fr) * | 1987-01-16 | 1989-03-31 | Flonic Sa | Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede |
| US5438481A (en) * | 1987-11-17 | 1995-08-01 | Advanced Interconnections Corporation | Molded-in lead frames |
| JPH01272142A (ja) * | 1988-04-25 | 1989-10-31 | Mitsubishi Electric Corp | 半導体集積回路用ソケット |
| US4961893A (en) * | 1988-04-28 | 1990-10-09 | Schlumberger Industries | Method for manufacturing memory cards |
| US5244840A (en) * | 1989-05-23 | 1993-09-14 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing an encapsulated IC card having a molded frame and a circuit board |
| JPH04284661A (ja) * | 1991-03-13 | 1992-10-09 | Toshiba Corp | 半導体装置 |
| JPH07502141A (ja) * | 1991-09-30 | 1995-03-02 | ゼネラル・ダイナミックス・インフォメーション・システムズ・インコーポレーテッド | めっきしたしなやかなリード線 |
| JP3187106B2 (ja) * | 1991-12-27 | 2001-07-11 | ローム株式会社 | 電気回路素子のパッケージ構造 |
| US5155901A (en) * | 1991-12-30 | 1992-10-20 | Fierkens Richard H J | Integrated circuit lead frame positioner apparatus and method |
| US5328870A (en) * | 1992-01-17 | 1994-07-12 | Amkor Electronics, Inc. | Method for forming plastic molded package with heat sink for integrated circuit devices |
| MY120226A (en) * | 1992-05-25 | 2005-09-30 | Hitachi Ulsi Eng Corp | Thin type semiconductor device, module structure using the device and method of mounting the device on board. |
| WO1994009510A1 (de) * | 1992-10-14 | 1994-04-28 | Micron Technology Inc. | Verfahren und vorrichtung zum formen der anschlussbeinchen von integrierten schaltkreisen |
| JP3117828B2 (ja) * | 1992-12-28 | 2000-12-18 | ローム株式会社 | 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法 |
| JP2927660B2 (ja) * | 1993-01-25 | 1999-07-28 | シャープ株式会社 | 樹脂封止型半導体装置の製造方法 |
| US5474958A (en) * | 1993-05-04 | 1995-12-12 | Motorola, Inc. | Method for making semiconductor device having no die supporting surface |
| JP2560974B2 (ja) * | 1993-06-04 | 1996-12-04 | 日本電気株式会社 | 半導体装置 |
| US5555204A (en) * | 1993-06-29 | 1996-09-10 | Kabushiki Kaisha Toshiba | Non-volatile semiconductor memory device |
| JP2565091B2 (ja) * | 1993-07-01 | 1996-12-18 | 日本電気株式会社 | 半導体装置およびその製造方法 |
| US5767443A (en) * | 1993-07-10 | 1998-06-16 | Micron Technology, Inc. | Multi-die encapsulation device |
| US5420752A (en) * | 1993-08-18 | 1995-05-30 | Lsi Logic Corporation | GPT system for encapsulating an integrated circuit package |
| US5448824A (en) * | 1993-08-27 | 1995-09-12 | Delco Electronics Corporation | Method for forming a lead during molding of an electronic housing |
| JPH07230934A (ja) * | 1994-02-18 | 1995-08-29 | Rohm Co Ltd | 電子部品及びその基板実装構造 |
| KR950027550U (ko) * | 1994-03-07 | 1995-10-18 | 정의훈 | 클로즈 가이드(Cloth guide)의 경사안내로울러 좌. 우 이송장치 |
| US5494562A (en) * | 1994-06-27 | 1996-02-27 | Ciba Corning Diagnostics Corp. | Electrochemical sensors |
| SE514116C2 (sv) * | 1994-10-19 | 2001-01-08 | Ericsson Telefon Ab L M | Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform |
| US5945130A (en) * | 1994-11-15 | 1999-08-31 | Vlt Corporation | Apparatus for circuit encapsulation |
| US5682673A (en) * | 1995-04-17 | 1997-11-04 | Ipac, Inc. | Method for forming encapsulated IC packages |
| US6252302B1 (en) * | 1996-09-19 | 2001-06-26 | Warren M. Farnworth | Heat transfer material for an improved die edge contacting socket |
| JP3175609B2 (ja) * | 1996-11-19 | 2001-06-11 | 日本電気株式会社 | チップ型電子部品 |
| JP3011233B2 (ja) * | 1997-05-02 | 2000-02-21 | 日本電気株式会社 | 半導体パッケージ及びその半導体実装構造 |
| JPH1126678A (ja) * | 1997-06-30 | 1999-01-29 | Oki Electric Ind Co Ltd | 電子部品のリード構造 |
| US5869883A (en) * | 1997-09-26 | 1999-02-09 | Stanley Wang, President Pantronix Corp. | Packaging of semiconductor circuit in pre-molded plastic package |
| US6081424A (en) * | 1998-05-19 | 2000-06-27 | Chrysler Corporation | Mechanism for removing heat from electronic components |
-
1996
- 1996-06-24 DE DE19625228A patent/DE19625228C2/de not_active Expired - Fee Related
-
1997
- 1997-06-24 EP EP97931650A patent/EP0907928B1/de not_active Expired - Lifetime
- 1997-06-24 CN CN97194071A patent/CN1099703C/zh not_active Expired - Fee Related
- 1997-06-24 WO PCT/DE1997/001314 patent/WO1997050056A1/de not_active Ceased
- 1997-06-24 KR KR10-1998-0708621A patent/KR100397081B1/ko not_active Expired - Fee Related
- 1997-06-24 DE DE59705782T patent/DE59705782D1/de not_active Expired - Lifetime
- 1997-06-24 JP JP50210598A patent/JP3640676B2/ja not_active Expired - Fee Related
-
1998
- 1998-12-23 US US09/220,745 patent/US6614100B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE19625228C2 (de) | 1998-05-14 |
| KR100397081B1 (ko) | 2003-10-17 |
| JP3640676B2 (ja) | 2005-04-20 |
| DE59705782D1 (de) | 2002-01-24 |
| WO1997050056A1 (de) | 1997-12-31 |
| DE19625228A1 (de) | 1998-01-02 |
| KR20000010656A (ko) | 2000-02-25 |
| EP0907928A1 (de) | 1999-04-14 |
| US6614100B1 (en) | 2003-09-02 |
| CN1099703C (zh) | 2003-01-22 |
| CN1216623A (zh) | 1999-05-12 |
| EP0907928B1 (de) | 2001-12-12 |
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