JP2000516983A5 - - Google Patents

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Publication number
JP2000516983A5
JP2000516983A5 JP1998511654A JP51165498A JP2000516983A5 JP 2000516983 A5 JP2000516983 A5 JP 2000516983A5 JP 1998511654 A JP1998511654 A JP 1998511654A JP 51165498 A JP51165498 A JP 51165498A JP 2000516983 A5 JP2000516983 A5 JP 2000516983A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998511654A
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Japanese (ja)
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JP2000516983A (en
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Publication date
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Priority claimed from PCT/US1997/013561 external-priority patent/WO1998008906A1/en
Publication of JP2000516983A publication Critical patent/JP2000516983A/en
Publication of JP2000516983A5 publication Critical patent/JP2000516983A5/ja
Pending legal-status Critical Current

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Figure 2000516983
Figure 2000516983
Figure 2000516983
Figure 2000516983
Figure 2000516983
Figure 2000516983

JP10511654A 1996-08-26 1997-08-01 Fluoropolymer-epoxy resin semi-interpenetrating network composition Pending JP2000516983A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US2456696P 1996-08-26 1996-08-26
US60/024,566 1996-08-26
US78247697A 1997-01-10 1997-01-10
US08/782,476 1997-01-10
PCT/US1997/013561 WO1998008906A1 (en) 1996-08-26 1997-08-01 Fluoropolymer-epoxy resin semi-interpenetrating network composition

Publications (2)

Publication Number Publication Date
JP2000516983A JP2000516983A (en) 2000-12-19
JP2000516983A5 true JP2000516983A5 (en) 2005-04-07

Family

ID=26698595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10511654A Pending JP2000516983A (en) 1996-08-26 1997-08-01 Fluoropolymer-epoxy resin semi-interpenetrating network composition

Country Status (5)

Country Link
EP (1) EP0920482A1 (en)
JP (1) JP2000516983A (en)
KR (1) KR100499992B1 (en)
AU (1) AU3904397A (en)
WO (1) WO1998008906A1 (en)

Families Citing this family (27)

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US6518362B1 (en) 1998-02-18 2003-02-11 3M Innovative Properties Company Melt blending polyphenylene ether, polystyrene and curable epoxy
US6235850B1 (en) 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
US6294270B1 (en) 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
JP3987243B2 (en) * 1999-09-10 2007-10-03 スリーエム イノベイティブ プロパティズ カンパニー Adhesive sheet and adhesive sheet for coating
US6359166B1 (en) * 1999-10-08 2002-03-19 3M Innovative Properties Company Oxalate ester blocked phenols
US6387508B1 (en) 2000-09-14 2002-05-14 3M Innovative Properties Company Metal bonding film compositions
DE10051051A1 (en) * 2000-10-14 2002-04-18 Bosch Gmbh Robert One-component casting material, e.g. for insulation of electrical components and for production of fuel tanks, contains epoxy resin, a silicone-containing component, filler and initiator
DE10148909A1 (en) * 2001-09-26 2003-04-30 Inst Polymerforschung Dresden Components, semi-finished products and profiles, made wholly or partly of plastic
WO2007041782A1 (en) * 2005-10-11 2007-04-19 Crc For Advanced Composite Structures Limited A method of binding dry reinforcement fibres
US7553540B2 (en) * 2005-12-30 2009-06-30 E. I. Du Pont De Nemours And Company Fluoropolymer coated films useful for photovoltaic modules
JP5034263B2 (en) * 2006-02-24 2012-09-26 東洋インキScホールディングス株式会社 Energy-sensitive linear acid curable composition
DE102006015499B4 (en) * 2006-03-31 2009-08-27 Radpro International Gmbh thermoluminescence
DE102006057142A1 (en) 2006-12-01 2008-06-05 Henkel Kgaa Metal compounds as initiators
BRPI0907273A2 (en) * 2008-04-14 2015-07-21 Dow Global Technologies Inc Epoxy based curable composition, process for forming an epoxy based curable composition, thermosetting resin and epoxy based part
RU2462493C1 (en) * 2011-04-05 2012-09-27 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Barrier coating composition
KR101857297B1 (en) 2011-12-27 2018-05-14 주식회사 케이씨씨 Resin for electrodeposition coating having trifluoride, method for preparing the same and electrodeposition coating composition comprising the same
US9358185B2 (en) 2012-06-18 2016-06-07 3M Innovative Properties Company Powder composition for air polishing the surface of hard dental tissue
EP2931171B1 (en) 2012-12-17 2018-08-15 3M Innovative Properties Company Device for dispensing a dental material with locking mechanism
EP2742898A1 (en) 2012-12-17 2014-06-18 3M Innovative Properties Company Powder jet device for dispensing a dental material
EP2742897A1 (en) 2012-12-17 2014-06-18 3M Innovative Properties Company Nozzle head, hand piece and powder jet device for applying a dental material
US9169393B2 (en) 2013-07-25 2015-10-27 3M Innovative Properties Company Anticorrosion coatings
GB201421373D0 (en) 2014-12-02 2015-01-14 Cytec Ind Inc Modified amine curing agents, their preparation and use in curable compositions
TWI627192B (en) * 2015-03-13 2018-06-21 Murata Manufacturing Co., Ltd. Atomic layer deposition inhibiting material
JP7221579B2 (en) * 2016-03-22 2023-02-14 富士電機株式会社 resin composition
KR102483123B1 (en) * 2018-10-17 2022-12-29 도요보 가부시키가이샤 Thermally conductive resin composition
CN113549169B (en) * 2021-06-15 2022-12-06 南京工业大学 Phenylfluorenamine polymer hole transport material and preparation method and application thereof
WO2025197246A1 (en) * 2024-03-19 2025-09-25 ユニマテック株式会社 Adhesive composition, coverlay, bonding sheet, and electronic substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1031406A (en) * 1963-11-05 1966-06-02 Acheson Ind Inc Low friction materials
US4169187A (en) * 1977-04-01 1979-09-25 E. I. Du Pont De Nemours And Company Powder coating composition of a mixture of epoxy resins
EP0084771A3 (en) * 1982-01-22 1984-02-22 Allied Corporation Method of making a powdered primer coating composition
DE3602800A1 (en) * 1985-06-07 1986-12-11 agru Alois Gruber + Sohn oHG, Bad Hall METHOD FOR THE SURFACE MODIFICATION OF MOLDED BODIES MADE OF POLYVINYLIDEN FLUORIDE
JPS6241218A (en) * 1985-08-19 1987-02-23 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
BR8802120A (en) * 1987-05-18 1988-12-06 Standard Oil Co Ohio ENCAPSULAR PROCESS ARTICLE
JP2803055B2 (en) * 1989-12-04 1998-09-24 東芝ケミカル株式会社 Heat resistant resin composition for molding
JPH0462557A (en) * 1990-07-02 1992-02-27 Canon Inc Photosensitive composition
JPH05186757A (en) * 1992-01-10 1993-07-27 Sumitomo Metal Ind Ltd Adhesive composition for laminated metal plate

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