JP2001237112A - Manufacturing method of resistor - Google Patents

Abstract

(57) [Problem] To form a slit-shaped first divided portion on a sheet-shaped insulating substrate, no burrs are generated, and thereby, the upper surface of the resistor can be smoothed and the mounting efficiency can be improved. It is an object of the present invention to provide a method of manufacturing a resistor that can be increased. SOLUTION: A plurality of pairs of metal layers 22 are provided.
And a plurality of resistive layers 24 electrically connected to the upper surface electrode layer 23.
Is formed only on the plurality of pairs of metal layers 22 in the sheet-like insulating substrate 21 having the upper surface formed thereon.
A slit-shaped first dividing portion 30 for dividing into 1b is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a resistor, and more particularly to a method for manufacturing a fine resistor.

[0002]

2. Description of the Related Art As a conventional resistor of this type, a resistor disclosed in Japanese Patent Application Laid-Open No. 4-102302 is known.

A conventional resistor and a method for manufacturing the same will be described below with reference to the drawings.

FIG. 12 is a sectional view of a conventional resistor.

[0005] In FIG. 12, reference numeral 1 denotes an insulating individual substrate made of porcelain such as alumina. Reference numeral 2 denotes a pair of first upper electrode layers provided on both right and left ends of the upper surface of the individual substrate 1. Reference numeral 3 denotes a resistance layer provided on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper electrode layers 2. Reference numeral 4 denotes a first protective layer provided so as to cover only the entire resistive layer 3. Reference numeral 5 denotes a trimming groove provided in the resistance layer 3 and the first protection layer 4 for correcting the resistance value. Reference numeral 6 denotes a second protective layer provided only on the upper surface of the first protective layer 4. Reference numeral 7 denotes a pair of second upper electrode layers provided on the upper surfaces of the pair of first upper electrode layers 2 so as to extend to the full width of the individual substrate 1. 8
Are a pair of side electrode layers provided on both side surfaces of the individual substrate 1. Reference numerals 9 and 10 denote a pair of nickel plating layers and a pair of solder plating layers provided on the surfaces of the pair of second upper electrode layers 7 and the pair of side electrode layers 8, respectively. In this case, the solder plating layer 10 is provided lower than the second protective layer 6.

Next, a method of manufacturing the conventional resistor having the above-described structure will be described with reference to the drawings.

FIGS. 13A to 13F are process diagrams showing a conventional method for manufacturing a resistor.

First, as shown in FIG. 13A, a pair of first upper surface electrode layers 2 are formed by coating on the left and right ends of the upper surface of an individual substrate 1 having an insulating property.

Next, as shown in FIG. 13B, a resistive layer 3 is formed on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper electrode layers 2.

Next, as shown in FIG. 13C, after a first protective layer 4 is formed by coating so as to cover only the entire resistive layer 3, the total resistance of the resistive layer 3 is reduced to a predetermined value. A trimming groove 5 is formed in the resistance layer 3 and the first protection layer 4 by a laser or the like so as to fall within the range of the value.

Next, as shown in FIG. 13D, a second protective layer 6 is formed by coating only on the upper surface of the first protective layer 4.

Next, as shown in FIG. 13E, the individual substrate 1 is located on the upper surfaces of the pair of first upper electrode layers 2.
A pair of second upper electrode layers 7 is formed by coating so as to extend to the full width of the upper electrode layer.

Next, as shown in FIG. 13F, a pair of first upper surface electrode layers 2 and a pair of first and second upper surface electrode layers 2 are provided on the right and left side surfaces of the individual substrate 1. , 7 are coated with a pair of side electrode layers 8 so as to be electrically connected.

Finally, the surfaces of the pair of second upper electrode layers 7 and the pair of side electrode layers 8 are nickel-plated and then plated with solder to form a pair of nickel plating layers 9 and a pair of solder layers. The conventional resistor was manufactured by forming the plating layer 10.

Further, the above-mentioned resistors have also been extremely miniaturized. In recent years, very small resistors having a length of 0.6 mm, a width of 0.3 mm and a thickness of 0.25 mm have been manufactured. Have been.

[0016]

According to the above-mentioned conventional configuration and manufacturing method, the length is 0.6 mm × the width 0.3 mm × the thickness 0.2.
The problem when manufacturing a very small resistor of 5 mm will be described.

A conventional sheet-like insulating substrate made of porcelain such as alumina is manufactured by forming a substrate dividing groove in advance before firing the sheet-like insulating substrate, and firing the insulating substrate. For this reason, the substrate division groove formed in advance on the sheet-shaped insulating substrate has a dimensional variation due to a delicate variation in the composition of the sheet-shaped insulating substrate or a delicate variation in the temperature during firing of the sheet-shaped insulating substrate. (This dimensional variation is about 100
With a sheet-shaped insulating substrate of mm × 100 mm, it reaches about 0.5 mm. ).

When a very fine resistor is manufactured using a sheet-shaped insulating substrate having such a dimensional variation, the dimensions of the individual substrate are made extremely fine in both the vertical and horizontal directions. It is necessary to classify into the dimensional ranks and prepare screen printing masks corresponding to the respective dimensional ranks, such as the upper electrode layer 2, the resistive layer 3, the protective layer 4, and the like. It has to be replaced, and as a result, there is a problem that the process becomes very complicated (when the dimensional rank is classified in 0.05 mm increments, 25 ranks each in the vertical and horizontal directions) Therefore, a total of about 600 ranks in vertical and horizontal dimensions is required.)

In order to solve the above-mentioned conventional problems, the present inventors have formed a step of forming a plurality of pairs of upper electrode layers on the upper surface of a sheet-shaped insulating substrate, and partially forming the plurality of pairs of upper electrode layers. A step of forming a plurality of resistance layers so as to overlap, a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and a step of covering at least the plurality of resistance layers. A plurality of slit-shaped first divisions for separating the plurality of pairs of upper electrode layers and dividing the plurality of upper electrode layers into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate having been subjected to the steps of forming a plurality of protective layers. After that, a plurality of pairs of nickel or a nickel-based alloy are formed on the inner surfaces of the plurality of slit-shaped first divided portions in the sheet-shaped insulating substrate in a state where the plurality of slit-shaped first divided portions are formed. Side electrode layer Forming, then, forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, and then, on the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistance layers are individually separated. A method for manufacturing a resistor has been developed in which a plurality of second divided portions are formed in a direction orthogonal to the slit-shaped first divided portion so as to be divided into individual pieces. The point of development of this manufacturing method is to separate a plurality of pairs of upper electrode layers on a sheet-like insulating substrate so that side electrode layers can be formed collectively in the state of a sheet-like insulating substrate. In this case, a plurality of slit-shaped first divisions for dividing the substrate into a plurality of strip-shaped substrates are formed.

However, in the above development contents,
When the first divided portion is formed by the dicing method, large burrs are generated in the diced portion of the upper electrode layer, so that the upper surface of the resistor is not smooth and the mounting efficiency is not improved. Had.

The present invention solves the problems of the above-mentioned development contents. When the slit-shaped first divided portion is formed on the sheet-like insulating substrate, no burrs are generated, and thereby, the upper surface of the resistor is formed. It is an object of the present invention to provide a method for manufacturing a resistor which can smoothen the resistance and improve the mounting efficiency.

[0022]

In order to achieve the above object, a resistor according to the present invention comprises a step of forming a plurality of pairs of metal layers on an upper surface of a sheet-like insulating substrate; Forming a plurality of pairs of upper surface electrode layers and a plurality of resistance layers electrically connected to the metal layer so that both are electrically connected to each other; and forming the plurality of pairs of upper surface electrodes in the plurality of resistance layers. Only the plurality of pairs of metal layers in a sheet-shaped insulating substrate that has been subjected to a step of performing trimming to adjust a resistance value between layers and a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers In addition, a plurality of slit-shaped first divided portions for separating the plurality of pairs of metal layers and dividing the sheet-shaped insulating substrate into a plurality of strip-shaped substrates are formed, and thereafter, the slit-shaped first divided portions are formed. A state in which multiple divisions are formed A plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on inner surfaces of the plurality of slit-shaped first divided portions of the sheet-shaped insulating substrate, and then a plurality of pairs are formed so as to cover the plurality of pairs of side electrode layers. Is formed on the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, and the plurality of resistive layers are individually separated from each other so as to be divided into individual substrates. According to this manufacturing method, when the slit-shaped first divided portion is formed on the sheet-shaped insulating substrate, burrs are generated. Therefore, the upper surface of the resistor can be smoothed and the mounting efficiency can be improved.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to a first aspect of the present invention, there is provided a method for forming a plurality of pairs of metal layers on an upper surface of a sheet-like insulating substrate, and the step of forming the metal layer on the upper surface of the sheet-like insulating substrate. Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers electrically connected to each other, and a resistance value between the plurality of upper electrode layers in the plurality of resistance layers. Performing trimming to adjust the
A step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers; and only the plurality of pairs of metal layers in the sheet-shaped insulating substrate, in which the plurality of pairs of metal layers are separated from each other. A plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates are formed, and then, a plurality of slit-shaped first divided portions are formed in the sheet-shaped insulating substrate. A plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the inner surface of the plurality of slit-shaped first divided portions, and then a plurality of pairs of solder layers are formed so as to cover the plurality of pairs of side electrode layers. Then, on the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistive layers are orthogonal to the slit-shaped first divided portions such that the plurality of resistive layers are individually separated and divided into individual substrates. Multiple in direction According to this manufacturing method, a plurality of pairs of metal layers formed on the upper surface of the sheet-shaped insulating substrate and a plurality of pairs of upper surface electrode layers are electrically connected. In the resistance value measurement at the time of trimming for adjusting the resistance value between the pair of upper electrode layers, the adjacent metal layer can be used in addition to the upper electrode layer. In the case of a resistor, the probe for trimming can be easily brought into contact with the upper surface electrode, and when the slit-shaped first division is formed on the sheet-shaped insulating substrate, only the metal layer is cut off. Since the top electrode layer is not cut, no burrs occur,
As a result, the upper surface of the resistor can be smoothed, so that the mounting efficiency can be improved.

According to a second aspect of the present invention, a plurality of pairs of metal layers are formed on the upper surface of the sheet-shaped insulating substrate, and the upper surface of the sheet-shaped insulating substrate is electrically connected to the metal layer. Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers so that they are electrically connected to each other; and performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing the step of separating the sheet-like insulating substrate into a plurality of strip-like substrates by separating the plurality of pairs of metal layers only into the plurality of pairs of metal layers in the trimmed sheet-like insulating substrate. Slit-shaped first
Forming a plurality of divided portions, forming a plurality of protective layers so as to cover at least the plurality of resistive layers, and forming a sheet-shaped insulating member in which a plurality of slit-shaped first divided portions are formed. A plurality of first slits on the substrate;
Forming a plurality of pairs of side electrode layers of nickel or a nickel-based alloy on the inner surface of the divided portion; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; In a plurality of strip-shaped substrates in an insulating substrate, a plurality of second layers are arranged in a direction orthogonal to the slit-shaped first divided portion so that the plurality of resistance layers are individually separated and divided into individual substrates. According to this manufacturing method, a plurality of pairs of metal layers formed on the upper surface of the sheet-shaped insulating substrate and a plurality of pairs of upper surface electrode layers are electrically connected. With such a configuration, in the resistance value measurement at the time of trimming for adjusting the resistance value between the pair of upper electrode layers, an adjacent metal layer can be used in addition to the upper electrode layer. Trim for fine resistors In the case where the slit-shaped first divided portion is formed on the sheet-shaped insulating substrate, only the metal layer is cut, and the upper electrode layer is not cut. Therefore, no burrs are generated, and thereby, the upper surface of the resistor can be smoothed, so that the mounting efficiency can be improved.

According to a third aspect of the present invention, the thickness of the plurality of pairs of side electrode layers according to the first or second aspect is set to a thickness of 1 to 15 μm. This has the effect that a material having a high value can be obtained.

According to a fourth aspect of the present invention, a plurality of pairs of solder layers according to the first or second aspect are made of a tin or tin alloy-based material. This has the effect that stable soldering can be performed.

According to a fifth aspect of the present invention, the plurality of pairs of metal layers according to the first or second aspect are made of a gold-based material, and the upper electrode layer is made of a silver-based material. The resistance layer is made of a ruthenium oxide-based material. According to this manufacturing method, the resistance layer has an effect of securing resistance characteristics excellent in heat resistance and durability.

According to a sixth aspect of the present invention, the protective layer according to the first or second aspect comprises a first protective layer made of a glass layer covering the resistance layer, and a resin covering the first protective layer. According to this manufacturing method, cracks can be prevented from occurring at the time of laser trimming with the first protective layer made of a glass layer.
Since the current noise can be reduced and the entire resistive layer is covered with the second protective layer mainly composed of a resin, it has an effect of securing a resistance characteristic excellent in moisture resistance.

According to a seventh aspect of the present invention, the plurality of slit-like first divided portions according to the first or second aspect are formed by through holes vertically penetrating a sheet-like insulating substrate. According to this manufacturing method, since the slit-shaped first divided portion is formed as a through hole, when the side surface electrode layer is formed on the sheet-shaped insulating substrate, the slit-shaped first slit formed as the through hole is formed. Has a function that a side electrode layer can be formed on the entire inner surface of the divided portion.

According to an eighth aspect of the present invention, the plurality of slit-shaped first divided portions according to the first or second aspect are formed by dicing. Since a sheet-shaped insulating substrate that does not require dimensional classification is used, it is not necessary to classify the size of individual substrates as in the conventional case, and this eliminates the need for conventional mask replacement process. In addition to this, the dicing has an effect that dicing can be easily performed using a general dicing facility using a semiconductor or the like.

According to a ninth aspect of the present invention, the plurality of second divided portions according to the first or second aspect are formed by dicing. According to this manufacturing method, the size classification of the individual substrate is determined. Since an unnecessary sheet-shaped insulating substrate is used, it is not necessary to classify the size of each individual substrate as in the conventional case, and thus it is possible to eliminate the complicated process of the conventional mask replacement process. Also, dicing has an effect that it can be easily performed by using a general dicing facility with a semiconductor or the like.

According to a tenth aspect of the present invention, the plurality of second divided portions according to the first or second aspect are formed by cutting a sheet-shaped insulating substrate while leaving a thin portion.
According to this manufacturing method, an individual piece is formed in two stages instead of being individualized each time the second divided portion is formed.

According to an eleventh aspect of the present invention, the thin portion according to the tenth aspect is left on the back side of the sheet-shaped insulating substrate. According to this manufacturing method, the second divided portion is formed. Instead of being singulated every time, it has the effect of being singulated in two stages.

According to a twelfth aspect of the present invention, an unnecessary region is formed at an end of the sheet-shaped insulating substrate according to the first or second aspect, and a plurality of slit-shaped first divided portions and a plurality of slit-shaped first divided portions are provided. The second division is not formed in the unnecessary area. According to this manufacturing method, even after the plurality of slit-shaped first divisions are formed, the plurality of strip-shaped substrates remain in the unnecessary area. Since the sheet-shaped insulating substrate is not separated into a plurality of strip-shaped substrates, the unnecessary region portion is not removed even after the plurality of slit-shaped first divided portions are formed. Since the post-process can be performed in the state of the sheet-shaped insulating substrate having the structure, the method has an effect of simplifying the method design, and when a plurality of second divided portions are formed, the plurality of second divided portions are formed. Each time it is formed, Are sectional division, and singulated products are those having an effect of no need of unnecessary to be separated from the region part, separately provide a step that later sorting and unnecessary area portion and products.

According to a thirteenth aspect of the present invention, a plurality of pairs of side electrode layers and a plurality of pairs of solder layers according to the first or second aspect are formed in a sheet-like insulating substrate. According to the manufacturing method, when the side electrode layer is formed, it can be formed on a sheet-like insulating substrate, or when the solder layer is formed by an electroplating method, the potential difference can be reduced, so that a stable This has the function of forming a solder layer.

Hereinafter, a method of manufacturing a resistor according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of a resistor according to an embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a slit-shaped sheet-like insulating substrate made of baked alumina having a purity of 96%, and a slit-shaped first divided portion and a second divided portion orthogonal to the first divided portion. This is a singulated substrate that has been singulated by dividing the substrate. Reference numeral 12 denotes a pair of metal layers mainly formed of gold and formed on the upper surface of the individual substrate 11. Reference numeral 13 denotes a pair of upper electrode layers mainly composed of silver formed on the upper surface of the individual substrate 11 so as to partially overlap the pair of metal layers 12. 1
Reference numeral 4 denotes a ruthenium oxide-based resistance layer formed on the upper surface of the individual substrate 11 so as to partially overlap the pair of upper electrode layers 13. Reference numeral 15 denotes a first protective layer formed of a pre-coated glass layer formed on the upper surface of the resistance layer 14. Reference numeral 16 denotes a trimming groove provided for correcting the resistance value of the resistance layer 14 between the pair of upper electrode layers 13. Reference numeral 17 denotes a second protective layer mainly composed of resin and formed so as to cover the first protective layer 15 made of a pre-coated glass layer. Reference numeral 18 denotes a pair of side electrode layers made of nickel which overlap with a part of the pair of upper electrode layers 13 and cover both side surfaces of the individual substrate 11 and both end portions of the back surface. Reference numeral 19 denotes a solder layer made of tin formed so as to cover a part of the pair of side electrode layers 18 and a part of the pair of upper electrode layers 13.

Next, a description will be given of a method of manufacturing the resistor having the above-described configuration according to an embodiment of the present invention with reference to the drawings.

FIG. 2 is a top view showing a state in which an unnecessary region is formed at the entire peripheral edge of a sheet-like insulating substrate used in manufacturing a resistor according to an embodiment of the present invention.
3 (a) to 3 (f), FIGS. 4 (a) to 4 (f), FIG. 5 (a)
6 (a) to 6 (d), FIGS. 7 (a) to 7 (c), and FIGS. 8 (a) to 8 (c) show a method of manufacturing a resistor according to an embodiment of the present invention. It is a process drawing.

First, as shown in FIGS. 2, 3 (a) and 4 (a), a sheet-like insulating substrate 21 made of fired 96% purity alumina and having a thickness of 0.2 mm and having insulating properties is prepared. prepare. In this case, the sheet-like insulating substrate 21 is formed as shown in FIG.
As shown in (1), an unnecessary area portion 21a which does not become a product at the end of the entire periphery is provided. The unnecessary area 21a is formed in a substantially rectangular shape.

Next, as shown in FIGS. 2, 3 (b) and 4 (b), a plurality of first
By forming a plurality of pairs of metal layers 22 containing gold as a main component by a screen printing method so as to straddle the divided portion of the above, and baking with a baking profile having a peak temperature of 850 ° C.
The metal layer 22 was a stable film.

Next, as shown in FIG. 2, FIG. 3 (c), and FIG. 4 (c), the upper surface of the sheet-shaped insulating substrate 21 is electrically connected to the plurality of pairs of metal layers 22. Pair of upper electrode layers 23 mainly composed of silver by screen printing
Was formed and baked with a baking profile having a peak temperature of 850 ° C., whereby the upper electrode layer 23 was made a stable film.

Next, as shown in FIG. 2, FIG. 3 (d), and FIG. 4 (d), a plurality of ruthenium oxide-based resistance layers 24 are screen-printed so as to straddle a plurality of pairs of upper electrode layers 23. Was formed and baked with a baking profile having a peak temperature of 850 ° C., whereby the resistance layer 24 was made a stable film.

Next, as shown in FIGS. 3E and 4E, a first protective layer 25 made of a plurality of pre-coated glass layers is formed by a screen printing method so as to cover the plurality of resistance layers 24. The first protective layer 25 made of a pre-coated glass layer was formed into a stable film by firing and firing with a firing profile at a peak temperature of 600 ° C.

Next, as shown in FIGS. 3F and 4F, in order to adjust the resistance value of the resistance layer 24 between the plural pairs of upper electrode layers 23 to a constant value, a laser trimming method is used. , And a plurality of trimming grooves 26 were formed.

Next, as shown in FIGS. 5A and 6A, a screen printing method is used to cover the first protective layer 25 composed of a plurality of pre-coated glass layers arranged in the vertical direction on the drawing. A plurality of second protective layers 27 mainly composed of resin
Was formed and was cured with a curing profile at a peak temperature of 200 ° C., so that the second protective layer 27 was a stable film.

Next, as shown in FIGS. 5B and 6B, a plurality of first resist layers 28 are formed by a screen printing method so as to cover the plurality of second protective layers 27. The first resist layer 28 was made a stable film by ultraviolet curing.
Further, a plurality of second resist layers 29 were formed on the back surface of the sheet-shaped insulating substrate 21 by a screen printing method, and the second resist layer 29 was made into a stable film by ultraviolet curing.

Next, as shown in FIGS. 2, 5 (c) and 6 (c), the first resist layer 28 and the second resist layer 2
Except for an unnecessary area 21a formed at the entire peripheral edge of the sheet-shaped insulating substrate 21 on which the substrate 9 is formed, only a plurality of pairs of metal layers 22 are separated and divided into a plurality of strip-shaped substrates 21b. A plurality of first slits 30 are formed by a dicing method. In this case, the plurality of slit-shaped first divided portions 30 are formed at a pitch of 700 μm,
The width of the slit-shaped first divided portion 30 is 120 μm.
m width. Further, the plurality of slit-shaped first divided portions 30 are formed by through holes penetrating the sheet-shaped insulating substrate 21 in the vertical direction. Further, since the sheet-shaped insulating substrate 21 has a plurality of slit-shaped first divided portions 30 formed by dicing except for the unnecessary region portion 21a, the slit-shaped first divided portions 30 are formed. After that, since the plurality of strip-shaped substrates 21b are connected to the unnecessary area portion 21a, they are in a sheet state.

Next, as shown in FIGS. 5 (d) and 6 (d), the entire surface of the sheet-shaped insulating substrate 21 is nickel-plated by using an electroless plating method of plating by dipping in a plating bath. To form side electrode layers 31 having a thickness of about 4 to 6 μm. In this case, a plurality of slit-shaped first divided portions 3
Since 0 is formed by a through hole vertically penetrating the sheet-shaped insulating substrate 21, the side surface electrode layer 31 is formed by applying nickel plating to the entire surface of the sheet-shaped insulating substrate 21 by an electroless plating method. In this case, the side electrode layer 31 is formed from the upper surface side of the sheet-shaped insulating substrate 21 to the back surface side of the sheet-shaped insulating substrate 21 through the entire inner surface of the slit-shaped first divided portion 30 which is a through hole. Things. The side electrode layer 31 is formed of a sheet-shaped insulating substrate 2.
1 is formed so as to cover a part of the exposed upper electrode layer 23 and the first resist layer 28 on the upper surface side, and is formed so as to cover the second resist layer 29 on the back surface side of the sheet-shaped insulating substrate 21. Is what is done.

Next, as shown in FIGS. 7A and 8A, a plurality of first resist layers (not shown) and a plurality of second resist layers (not shown) are peeled off. The pair of side electrode layers 31 are patterned.

Next, as shown in FIGS. 7B and 8B, a plurality of pairs of exposed side surface electrode layers 31 and a plurality of first resist layers (not shown) are formed by electroplating. Z)
A plurality of pairs of solder layers 32 made of tin having a thickness of about 4 to 6 μm are formed so as to cover a part of the upper electrode layer 23 exposed by peeling.

The thickness of the side electrode layer 31 is about 4 to 6 μm.
Although the thickness is not limited to this range, the thickness is appropriately 1 to 15 μm, and in such a configuration, a material having extremely high dimensional accuracy can be obtained.

The solder layer 32 is made of tin. However, the present invention is not limited to this. For example, a tin alloy-based material may be used. It can be attached.

The metal layer 22 is made of a gold-based material, the upper electrode layer 23 is made of a silver-based material, and the resistance layer 24 is made of a ruthenium oxide-based material. It can ensure resistance characteristics excellent in heat resistance and durability.

Further, the protective layer covering the resistance layer 24 and the like
A first protective layer 25 made of a pre-coated glass layer that covers the resistance layer 24, and a second protective layer 27 that mainly covers the trimming groove 26 and covers the trimming groove 26, while covering the first protective layer 25. The first protective layer 25
This prevents the occurrence of cracks at the time of laser trimming and reduces the current noise, and the second protective layer 27 containing the resin as a main component covers the entire resistive layer 24, thereby providing resistance characteristics with excellent moisture resistance. It can be secured.

Finally, as shown in FIG. 2, FIG. 7 (c), and FIG. 8 (c), except for an unnecessary area 21a formed on the entire peripheral edge of the sheet-like insulating substrate 21, In the direction orthogonal to the slit-shaped first divided portion 30, the plurality of resistive layers 24 are individually separated on the plurality of strip-shaped substrates 21 b of the insulated substrate 21 so as to be divided into the individual substrates 21 c. The plurality of second divided portions 33 are formed by using a dicing method. In this case, the plurality of second dividing sections 33 are 400
.mu.m pitch, and the second divided portion 3
3 has a width of 100 μm. Since the plurality of second divided portions 33 are formed on the plurality of strip-shaped substrates 21b by a dicing method except for the unnecessary region portion 21a, each time the plurality of second divided portions 33 are formed. The product that has been cut and divided into individual substrates 21c, and then individualized, is separated from the unnecessary region 21a.

The resistor according to the embodiment of the present invention is manufactured by the steps described above.

The length dimension and width dimension of the resistor manufactured by the above-described process are such that the distance between the slit-shaped first divided portion 30 and the second divided portion 33 formed by the dicing method is accurate (± 0.005 mm). ) And the thickness of the side electrode layer 31 and the solder layer 32 are also accurate, so that the total length and width of the product resistor are exactly 0.6 mm long × 0.3 mm wide. . Metal layer 2
2. The pattern accuracy of the upper electrode layer 23 and the resistance layer 24 does not require the dimensional rank classification of the individual substrates, and it is not necessary to consider the dimensional variation within the dimensional rank of the same individual substrate. The effective area of the layer 24 can be made larger than that of the conventional product. That is, the resistance layer of the conventional product is about 0.20 mm long × 0.19 mm wide.
On the other hand, the resistance layer 24 of the resistor according to the embodiment of the present invention has a length of about 0.25 mm × a width of about 0.24 mm, and has an area of about 1.6 times or more. is there.

The plurality of slit-shaped first divided portions 30
The plurality of second divided portions 33 are formed by using a dicing method, and the sheet-shaped insulating substrate 21 that does not require the dimensional classification of the individual substrate is used. It is not necessary to classify the size of the substrate, and thus it is possible to eliminate the complexity of the process for exchanging the mask as in the related art, and to easily perform dicing using a semiconductor or other general dicing equipment. Things.

The sheet-shaped insulating substrate 21 has an unnecessary area portion 21a which is not finally formed as a product at the peripheral edge.
And the plurality of slit-shaped first divisions 30 and the plurality of second divisions 33 are not formed in the unnecessary area 21a, so that a plurality of slit-shaped first divisions are formed. After forming the portion 30, the plurality of strip-shaped substrates 21
b is connected to the unnecessary area portion 21a, and therefore, the sheet-shaped insulating substrate 21 is not finely divided into the plurality of strip-shaped substrates 21b. Therefore, the plurality of slit-shaped first divided portions 30 are separated. Even after the formation, the post-process can be performed in the state of the sheet-shaped insulating substrate 21 having the unnecessary region 21a, so that the design of the method can be simplified. When a plurality of second divisions 33 are formed,
Each time the plurality of second divisions 33 are formed, the product is cut and divided into individual substrates 21c, and the singulated products are separated from the unnecessary region 21a. The step of sorting later becomes unnecessary.

Further, since the plurality of pairs of side electrode layers 31 and the plurality of pairs of solder layers 32 are formed in the state of the sheet-shaped insulating substrate 21, the side electrode layers 31 are formed on the sheet-shaped insulating substrate 21. Be able to
When the solder layer 32 is formed by the electroplating method, the potential difference can be reduced, whereby the stable solder layer 32 can be formed.

In the above-described embodiment of the present invention, the unnecessary region 21a which does not eventually become a product is formed on the entire peripheral edge of the sheet-shaped insulating substrate 21 so as to form a substantially rectangular shape. Although the configuration has been described, the unnecessary area portion 21a does not necessarily need to be formed on the entire peripheral edge of the sheet-like insulating substrate 21. For example, as shown in FIG. When the unnecessary area portion 21d is formed in the portion, as shown in FIG.
In the case where the unnecessary area portions 21e are formed at both end portions of FIG.
As shown in the figure, even when the unnecessary region 21f is formed at three ends of the sheet-shaped insulating substrate 21, the same operation and effect as those of the embodiment of the present invention can be obtained.

In the above-described embodiment of the present invention, the case where the plurality of second divided portions 33 are formed by the dicing method has been described.
The plurality of second divided portions 33 are formed into a sheet-like insulating substrate 21.
Is formed by cutting any one of the upper surface side, the rear surface side, and the central portion of the sheet-shaped insulating substrate 21 by a laser method, a dicing method, or the like, leaving a thin portion on any of the back surface, the upper surface, and the center. In these cases, individualization is not performed every time the second divided portion 33 is formed, but in two stages.

In one embodiment of the present invention, the first resist layer 28 and the second resist layer 29
After the formation of the first resist layer 28 and the first resist layer 28 and the second resist layer 29
May be formed after forming the slit-shaped first divided portion 30. However, when the first resist layer 28 and the second resist layer 29 are screen-printed after forming the slit-shaped first divided portions 30 as described above, the strength of the sheet-shaped insulating substrate 21 is reduced. It is necessary to reduce the printing pressure during screen printing.

Further, even if the second resist layer 29 is formed immediately after the formation of the first protective layer 25 made of a pre-coated glass layer, the same effect as in the embodiment of the present invention can be obtained.

Further, in one embodiment of the present invention, the first resist layer 28 and the second resist layer 29
The peeling was performed before the formation of the solder layer 32, but this can be performed even after the formation of the solder layer 32.

In one embodiment of the present invention, a gold-based material is used for the metal layer 22, a silver-based material is used for the upper electrode layer 23, and a ruthenium oxide-based material is used for the resistance layer 24. Although they are used, they can obtain the same effects as those of the embodiment of the present invention in other material systems.

In the embodiment of the present invention, the slit-shaped first divided portion 30 and the second divided portion 33 are formed by using the dicing method. Even when the slit-shaped first division 30 and the second division 33 are formed by using division means such as a laser or a water jet, the same operation as in the above-described embodiment of the present invention can be achieved. It is effective.

Further, in one embodiment of the present invention, after forming a plurality of pairs of upper electrode layers 23 on the upper surface of a sheet-shaped insulating substrate 21, a plurality of pairs of upper electrode layers 23 are provided so as to straddle the plurality of pairs of upper electrode layers 23. Although the resistance layer 24 is formed, a plurality of resistance layers 24 are formed on the upper surface of the sheet-shaped insulating substrate 21.
Is formed, a plurality of pairs of upper electrode layers 23 may be formed so as to partially overlap the plurality of resistance layers 24.
The same operation and effect as those of the embodiment of the present invention are provided.

Further, in one embodiment of the present invention, when a plurality of slit-shaped first divisions 30 for dividing into a plurality of strip-shaped substrates 21b are formed, a plurality of pairs of metal layers 22 and a plurality of slits are formed. A pair of upper electrode layers 23, a plurality of resistance layers 24, a plurality of first protective layers 25, a plurality of trimming grooves 2
6, a plurality of second protective layers 27, a plurality of first resist layers 2
8. The sheet-like insulating substrate 2 is formed by separating the plurality of pairs of metal layers 22 only on the plurality of pairs of metal layers 22 in the sheet-like insulating substrate 21 on which the plurality of second resist layers 29 are formed.
Although a plurality of slit-shaped first division portions 30 for dividing 1 into a plurality of strip-shaped substrates 21b have been described, the present invention is not limited to this. For example, other than this, A plurality of pairs of metal layers 22, a plurality of pairs of upper electrode layers 23, and a plurality of resistance layers 2 are formed on a sheet-shaped insulating substrate 21.
4 is formed, and trimming is performed to adjust a resistance value between the plurality of pairs of upper electrode layers 23 in the plurality of resistance layers 24, and then the plurality of pairs of metal layers in the sheet-shaped insulating substrate 21 are formed. In the case where a plurality of slit-shaped first divided portions 30 for separating the plurality of pairs of metal layers 22 and dividing the sheet-shaped insulating substrate 21 into a plurality of strip-shaped substrates 21b are formed only on the substrate 22. In this case, the same effects as those of the embodiment of the present invention can be obtained.

[0072]

As described above, the method of manufacturing a resistor according to the present invention comprises the steps of forming a plurality of pairs of metal layers on the upper surface of a sheet-shaped insulating substrate, and forming the metal layer on the upper surface of the sheet-shaped insulating substrate. Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers electrically connected to each other, and a resistance value between the plurality of upper electrode layers in the plurality of resistance layers. Performing trimming to adjust the
A step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers; and only the plurality of pairs of metal layers in the sheet-shaped insulating substrate, in which the plurality of pairs of metal layers are separated from each other. A plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates are formed, and then, a plurality of slit-shaped first divided portions are formed in the sheet-shaped insulating substrate. A plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the inner surface of the plurality of slit-shaped first divided portions, and then a plurality of pairs of solder layers are formed so as to cover the plurality of pairs of side electrode layers. Then, on the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistive layers are orthogonal to the slit-shaped first divided portions such that the plurality of resistive layers are individually separated and divided into individual substrates. Multiple in direction According to this manufacturing method, a plurality of pairs of metal layers formed on the upper surface of the sheet-shaped insulating substrate and a plurality of pairs of upper surface electrode layers are electrically connected. In the resistance value measurement at the time of trimming for adjusting the resistance value between the pair of upper electrode layers, the adjacent metal layer can be used in addition to the upper electrode layer. In the case of a resistor, the probe for trimming can be easily brought into contact with the upper surface electrode, and when the slit-shaped first division is formed on the sheet-shaped insulating substrate, only the metal layer is cut off. Since the top electrode layer is not cut, no burrs occur,
As a result, since the upper surface of the resistor can be smoothed, the mounting efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a resistor obtained by a method for manufacturing a resistor according to an embodiment of the present invention.

FIG. 2 is a top view showing a state in which an unnecessary region is formed on the entire peripheral edge of a sheet-like insulating substrate used in manufacturing the resistor.

FIGS. 3A to 3F are cross-sectional views showing manufacturing steps of the resistor.

4 (a) to 4 (f) are plan views showing manufacturing steps of the resistor.

5 (a) to 5 (d) are cross-sectional views showing steps of manufacturing the resistor.

FIGS. 6A to 6D are plan views showing manufacturing steps of the resistor.

FIGS. 7A to 7C are cross-sectional views showing manufacturing steps of the resistor.

8A to 8C are plan views showing manufacturing steps of the resistor.

FIG. 9 is a top view showing a state in which an unnecessary region is formed at one end of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 10 is a top view showing a state where unnecessary regions are formed at both ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 11 is a top view showing a state in which unnecessary regions are formed at three ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 12 is a sectional view of a conventional resistor.

13 (a) to 13 (f) are perspective views showing steps of manufacturing a conventional resistor.

[Explanation of symbols]

 11 single-piece substrate 12,22 metal layer 13,23 top electrode layer 14,24 resistance layer 15,25 first protective layer 16,26 trimming groove 17,27 second protective layer 18,31 side electrode layer 19, 32 Solder Layer 21 Sheet-shaped Insulated Substrate 21a, 21d, 21e, 21f Unnecessary Area 21b Strip-shaped Substrate 21c Single-piece Substrate 28 First Resist Layer 29 Second Resist Layer 30 Slit-shaped First Divided Part 33 Second Division of

Continued on the front page (72) Inventor Hiroyuki Saikawa 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 5E032 BA15 BB01 CA02 CC03 CC14 DA01 TA11 TB02

Claims (13)

[Claims] A step of forming a plurality of pairs of metal layers on an upper surface of a sheet-shaped insulating substrate; and a plurality of pairs of upper surface electrode layers electrically connected to the metal layer on an upper surface of the sheet-shaped insulating substrate. Forming a plurality of resistance layers so that both are electrically connected; and performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the resistive layers of the sheet-shaped insulating substrate only in the plurality of pairs of metal layers in the sheet-shaped insulating substrate. A plurality of slit-shaped first divided portions for dividing into a plurality of strip-shaped substrates are formed, and then the plurality of slit-shaped first divided portions are formed on the sheet-shaped insulating substrate in a state where a plurality of slit-shaped first divided portions are formed. Slit-shaped first minute Forming a plurality of pairs of side electrode layers of nickel or a nickel-based alloy on the inner surface of the split part,
A plurality of pairs of solder layers are formed so as to cover a plurality of pairs of side electrode layers, and thereafter, the plurality of resistive layers are individually separated on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, and the individual substrate is formed. A method for manufacturing a resistor, wherein a plurality of second divided portions are formed in a direction orthogonal to the slit-shaped first divided portions so as to be divided into a plurality of second divided portions. A step of forming a plurality of pairs of metal layers on an upper surface of the sheet-shaped insulating substrate; and a plurality of pairs of upper surface electrode layers electrically connected to the metal layer on the upper surface of the sheet-shaped insulating substrate. Forming a plurality of resistance layers so that both are electrically connected, performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and performing the trimming. A slit-shaped first division for separating the plurality of pairs of metal layers and dividing the sheet-shaped insulating substrate into a plurality of strip-shaped substrates only for the plurality of pairs of metal layers in the sheet-shaped insulating substrate that has been performed. Forming a plurality of portions, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and forming the plurality of slit-shaped first divided portions in a sheet-like insulating substrate. The plurality of slips Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on an inner surface of the first divided portion having a shape of; and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers. In a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistive layers are individually separated and divided into individual substrates in a direction orthogonal to the slit-shaped first divided portion. Forming a plurality of second divided portions. 3. The thickness of a plurality of pairs of side electrode layers is 1 to 15 μm.
3. The method for manufacturing a resistor according to claim 1, wherein said resistor has a thickness of m. 4. The method for manufacturing a resistor according to claim 1, wherein the plurality of pairs of solder layers are made of tin or tin alloy material. 5. A plurality of pairs of metal layers are formed of a gold-based material, and a plurality of pairs of upper electrode layers are formed of a silver-based material.
3. The method for manufacturing a resistor according to claim 1, wherein the plurality of resistance layers are formed of a ruthenium oxide-based material. 6. The protection layer according to claim 1, wherein the first protection layer is made of a glass layer covering the resistance layer, and the second protection layer is mainly made of a resin and covers the first protection layer. 3. The method for manufacturing the resistor according to 2. 7. The method for manufacturing a resistor according to claim 1, wherein the plurality of slit-shaped first divided portions are formed by through holes vertically penetrating a sheet-shaped insulating substrate. 8. The method for manufacturing a resistor according to claim 1, wherein the plurality of slit-shaped first divided portions are formed by dicing. 9. The method according to claim 1, wherein the plurality of second divided portions are formed by dicing. 10. The method for manufacturing a resistor according to claim 1, wherein the plurality of second divided portions are formed by cutting the sheet-shaped insulating substrate while leaving a thin portion. 11. The method of manufacturing a resistor according to claim 10, wherein the thin portion is left on the back side of the sheet-shaped insulating substrate. 12. An unnecessary area portion is formed at an end of a sheet-shaped insulating substrate, and a plurality of slit-shaped first and second divided portions are not formed in the unnecessary area portion. A method for manufacturing the resistor according to claim 1. 13. The method according to claim 1, wherein a plurality of pairs of side electrode layers and a plurality of pairs of solder layers are formed in the form of a sheet-shaped insulating substrate.