JP2001352182A - Chassis structure - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a chassis structure that does not require soldering to fix a circuit board. SOLUTION: In a chassis structure including a chassis main body 4 in which a circuit board 6 is housed and a lid 3, a substrate supporting portion 7 for supporting the circuit board 6 is provided inside the chassis main body 4, and the chassis main body 4 is provided. The lid 3 is provided with an elastic pressing portion 5 which presses the circuit board 6 supported by the substrate supporting portion 7 and fixes the circuit board 6 with the substrate supporting member 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chassis structure in which a circuit board is housed and used for electronic equipment.

[0002]

2. Description of the Related Art As a conventional chassis structure used in an electronic device in which a circuit board on which an electric circuit is mounted is housed, there are a perspective view shown in FIG. 11 and a side sectional view shown in FIG.

In FIGS. 11 and 12, a circuit board 6 on which an electric circuit is mounted is housed in a chassis body 4, and a lid 3 is attached to an upper portion of the chassis body 4. The lower part of the circuit board 6 is supported by a board supporting portion 7 provided inside the chassis body 4, and is soldered and fixed to the inner side surface of the chassis body 4 at an upper end by solder 16. Further, the lid 3 is bent inward at a plurality of locations on the outer peripheral portion, and the bent portion 2 bent further outward is engaged with the engaging projection 1 provided on the outer side surface of the chassis body 4. And is fixed to the chassis body 4.

In the production using such a chassis structure, as shown in a production process diagram of FIG. 13, a circuit board 6 on which an electric circuit is mounted is incorporated into a chassis body 4 and immersed in a solder dip tank to perform solder dipping. After that, the curved portion 2 of the lid 3 is attached to the engaging projection 1 on the outer side surface of the chassis main body 4 and attached, thereby completing the product.

[0005]

However, in recent years,
The effect of lead contained in the solder on the environment has become a problem. In this regard, in the related art described above, the circuit board 6 is fixed to the chassis body 4 by soldering to the inner side surface of the chassis body 4 using solder 16. Therefore, in such a conventional technique, a large amount of solder is used, which adversely affects the environment.

On the other hand, although lead-free solders have been developed, they are still inferior to current solders in terms of solderability (fixing strength) and the like, and poor soldering is likely to occur. However, it has not reached the level where it can be actually used.

Further, in the above-mentioned prior art, after the soldering of the circuit board 6 to the chassis body 4 by the solder 16, when the parts mounted on the board 6 need to be frequently replaced due to a defective product, etc. 6 is soldered and fixed to the chassis body 4, so that it is difficult to replace parts.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a chassis structure that does not require soldering to fix a circuit board.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a chassis structure including a chassis main body in which a circuit board is housed and a lid, wherein a board supporting portion for supporting the circuit board is provided. An elastic pressing portion that is provided inside the chassis main body and that presses the circuit board supported by the substrate supporting portion of the chassis main body and that is fixed to the substrate supporting member by being sandwiched and fixed to the lid portion; It is.

According to the present invention, the circuit board can be sandwiched and fixed to the board supporting portion of the chassis main body by pressing the circuit board by the elastic pressing portion of the lid portion, so that solder is not required.

Further, the present invention is characterized in that, in the above-mentioned chassis structure, the lid portion is formed of a conductive plate member, and the elastic pressing portion is formed by bending at least a part of the conductive plate member. Is what you do.

According to the present invention, the elastic pressing portion can be easily formed by bending at least a part of the conductive plate member forming the lid.

Further, according to the present invention, in the above-mentioned chassis structure, the elastic pressing portion is formed by cutting and bending a part of a conductive plate member forming the lid portion.

According to the present invention, the elastic pressing portion can be easily formed by cutting and bending a part of the conductive plate member forming the lid.

Further, according to the present invention, in the above-mentioned chassis structure, the elastic pressing portion is formed by bending a part of the outer peripheral portion of the conductive plate member forming the lid portion, and the outer peripheral portion of the conductive plate member. Is formed with a protruding portion which is fitted and engaged with the fitting slit on the side surface of the chassis body.

According to the present invention, the projecting portion formed on the bent portion of the outer peripheral portion of the conductive plate member forming the lid portion is fitted and engaged with the fitting slit on the side surface of the chassis body,
By fixing the lid to the chassis body and simultaneously pressing the circuit board by the elastic pressing portion, the circuit board can be easily fixed without the need for solder.

Further, the present invention is characterized in that, in the above-mentioned chassis structure, a slit is provided on a side surface of the chassis main body, into which at least a part of the tip of the elastic pressing portion of the lid is inserted.

According to the present invention, since the slit for inserting at least a part of the tip of the elastic pressing portion of the lid is provided on the side surface of the chassis body, the elastic pressing portion can be easily positioned, and the position of the elastic pressing portion can be easily adjusted. Can be suppressed.

Further, according to the present invention, in the above-mentioned chassis structure, a projection portion penetrating a hole portion of a circuit board is provided on a substrate supporting portion of the chassis body, and a projection portion penetrating the circuit board has an elasticity of the lid portion. It is characterized in that the tip of the pressing portion is abutted, or a projection penetrating the circuit board is passed through a hole formed in the elastic pressing portion of the lid.

According to the present invention, the elastic pressing portion formed by bending at least a part of the conductive plate member forming the lid portion slides in the direction of the substrate surface of the circuit board after coming into contact with the circuit board. Such a sliding movement is regulated by the projection provided on the board supporting portion of the chassis main body that penetrates the hole of the circuit board, the force for pressing the circuit board is increased, and the circuit board can be more firmly pressed.

According to the present invention, in the above-mentioned chassis structure, at least one of the substrate supporting portion of the chassis main body and the elastic substrate pressing portion of the lid portion is in contact with a ground electrode of the circuit board. Is what you do.

According to the present invention, at least one of the substrate supporting portion of the chassis body and the elastic substrate pressing portion of the lid contacts the ground electrode of the circuit board. Can be dropped.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

The chassis structure of the first embodiment is shown in FIG. 1 which is a perspective view and FIG. 2 which is a side sectional view.

As shown in FIGS. 1 and 2, the chassis structure of the present embodiment has a circuit board 6 on which an electric circuit is mounted, housed in the chassis body 4, and a board supporting portion 7 for supporting the lower surface of the circuit board 6. Are provided inside the chassis body 4, and the lid 3 is provided with an elastic pressing section 5 which presses the circuit board 6 supported by the board supporting section 7 of the chassis body 4 to sandwich and fix the circuit board 6 with the board supporting member 7. I have.

The cover 3 is made of a conductive plate member.
A plurality of elastic pressing portions 5 are formed by cutting and bending a part of the conductive plate member.

The lid 3 has a plurality of curved portions 2 which are bent inward at a plurality of locations on the four sides of the outer peripheral portion and further bent outward, and are provided on the outer side surface of the chassis body 4 in the same number. It is engaged with the joint projection 1 and is fixed to the chassis body 4.

Next, the production using the chassis structure of the present embodiment will be described with reference to FIGS.

First, a circuit board 6 on which an electric circuit is mounted
Are arranged and incorporated on the substrate support 7 inside the chassis body 4. Then, the curved portion 2 of the cover 3 is attached to the engaging projection 1 on the outer side surface of the chassis 4 so as to press the cover 3 from above the chassis 4 so that the cover 3 is attached to the chassis 3. While being fixed to the main body 4,
The circuit board 6 is sandwiched and fixed by the board supporting portion 7 of the chassis main body 4 and the elastic pressing portion 5 of the lid portion 3 to complete the product. That is, the circuit board 6 can be fixed without performing solder dipping in one step of the lid attaching step.

Therefore, according to the present embodiment, the curved projection 2 of the cover 3 is attached to the engagement projection 1 on the outer side surface of the chassis body 4.
When the circuit board 6 is engaged and attached, the circuit board 6 can be sandwiched and fixed with the board supporting section 7 of the chassis body 4 by pressing the circuit board 6 with the elastic pressing section 5 of the lid section 3, so that solder is not required. This makes it possible to further reduce the number of work steps involved in soldering, thereby reducing costs.

Further, when a defect is found in the finished product, the circuit board 6 can be removed simply by removing the lid 3 from the chassis body 4, so that the parts of the circuit board 6 can be easily replaced.

The board supporting portion 7 of the chassis body 4 is made conductive together with the chassis body 4 and is brought into contact with the ground electrode of the circuit board 6.
May be dropped to the chassis body 4.

Next, as a second embodiment, the elastic pressing portion 5 of the lid 3 in the chassis structure of the first embodiment is described.
The contact portion with will be described.

As shown in the enlarged perspective view of the main part of FIG. 4, a ground electrode 8 is formed at a portion of the circuit board 6 which is in contact with the tip of the elastic pressing portion 5. The cover 3 made of a conductive plate member is grounded through the elastic pressing portion 5 by contact with the cover 3.
Can be dropped.

Therefore, the ground electrode on the surface of the circuit board 8 is connected to the lid 3 made of a conductive plate member through the elastic pressing portion 5.
If the ground electrode is grounded and the ground electrode on the back surface of the circuit board 8 is grounded to the conductive chassis body 5 through the board support, the grounding can be strengthened.

If a chemically stable substance is applied to the contact portion between the elastic pressing portion 5 and the ground electrode 8, deterioration over time due to oxidation or the like can be prevented, and deterioration of electrical characteristics can be prevented.

Next, as a third embodiment, in the chassis structure of the first embodiment, a slit 9 into which at least a part of the tip of the elastic pressing portion 5 of the lid 3 is inserted is provided on the side surface of the chassis body 4. The components to be provided will be described with reference to FIGS.

In FIG. 5, the entire distal end of the elastic pressing portion 5 is inserted into the slit 9 of the chassis body 4. Also, in the one shown in FIG.
0 is provided, and the protrusion 10 is provided in the slit 9 of the chassis body 4.
Is inserted into.

According to the present embodiment, when the cover 3 is pushed into the chassis body 4 in the cover mounting step in FIG. 3 of the first embodiment, a part of the conductive plate member forming the cover 3 is removed. The elastic pressing portion 5 formed by bending is brought into contact with the circuit board 6 and then slid in the direction of the board surface of the circuit board 6 and inserted into the slit 9 of the chassis body 4.
Therefore, the elastic pressing portion 5 can be easily positioned, and variation in the position of the elastic pressing portion 5 can be suppressed. In addition, it is preferable that the corner of the elastic pressing portion 5 inserted into the slit 9 is processed so as to be rounded.

Further, in the configuration shown in FIG. 6, since the movement of the elastic pressing portion 5 is regulated more than in the configuration shown in FIG. 5, the variation in the position can be further suppressed.

In this embodiment, similarly to the second embodiment, the elastic pressing portion 5 may be brought into contact with the ground electrode of the circuit board 6 to be grounded.

Next, as a fourth embodiment, in the chassis structure of the first embodiment, the projecting portion 7 penetrating through the hole 11 of the circuit board 6 is formed in the board supporting portion 7 of the chassis body 4.
FIG. 7 is an enlarged perspective view of a main part of the apparatus provided with a.
This will be described with reference to FIGS.

In FIG. 7, the tip of the elastic pressing portion 5 of the lid 3 is in contact with the projection 7a penetrating the hole 11 of the circuit board 6. In the case shown in FIG.
The protrusion 7a penetrating through the hole 11 of the cover 3 also penetrates the hole 12 formed in the elastic pressing portion 5 of the lid 3. Note that FIG.
7A and 7B show the circuit board 6 and the board supporting portion 7 viewed from the side opposite to the surface pressed by the elastic pressing portion 5 of the lid portion 3 in FIGS.

According to the present embodiment, when the cover 3 is pushed into the chassis body 4 in the cover attaching step in FIG. 3 of the first embodiment, a part of the conductive plate member forming the cover 3 is removed. The bent elastic pressing portion 5 slides in the direction of the substrate surface of the circuit board 6 after coming into contact with the circuit board 6, but is provided on the board supporting portion 7 of the chassis body 4 as shown in FIGS. Such a sliding movement is regulated by the provided projection 7a, the force of pressing the circuit board 6 is increased, and the circuit board 6 can be more firmly pressed.

Further, as shown in FIG.
When the projection 7a penetrating through the hole 11 of the hole also penetrates the hole 12 formed in the elastic pressing portion 5 of the lid 3, the elastic pressing portion 5 is easily positioned, and the elastic pressing portion 5 Can be suppressed.

In the present embodiment, as shown in FIG. 9, the substrate supporting portion 7 of the chassis main body 4 comes into contact with the ground electrode 8 formed on the back surface of the circuit substrate 6, so that the substrate supporting portion of the chassis main body 4 If the conductive member 7 is made conductive together with the chassis main body 4, the ground of the circuit board 6 can be dropped to the chassis main body 4 through the board supporting portion 7.

In this embodiment, similarly to the second embodiment, the elastic pressing portion 5 may be brought into contact with the ground electrode of the circuit board 6 to be grounded. Then, the ground electrode on the surface of the circuit board 8 is
By grounding the lid 3 made of a conductive plate member through the substrate, and grounding the ground electrode on the back surface of the circuit board 8 to the conductive chassis body 4 through the substrate support, the grounding can be enhanced.

Next, as a fifth embodiment, as shown in a side sectional view of a main part of FIG. 10, a part of the outer peripheral portion of the conductive plate member forming the cover 3 is bent to form a plurality of elastic pressing portions 15. And a protruding portion 14 that fits into and engages with the fitting slit 13 on the side surface of the chassis body 4 at the bent portion of the outer peripheral portion of the conductive plate member forming the lid portion 3. Will be described.

In the chassis structure of the present embodiment, the lid 3 can be easily realized by changing the shape of the curved portion 2 of the lid 3 in the first embodiment. Then, the slit 13 corresponding to the projecting portion 14 of the lid 3 may be formed in the chassis main body 4 without forming the engaging projection 1 of the chassis main body 4 in the first embodiment.

Therefore, as compared with the first embodiment, a step of cutting and bending a part of the conductive plate member forming the lid 3 to form the elastic pressing portion 5 can be omitted, and the manufacturing becomes easier.

According to the present embodiment, at the time of fitting the projection 14 of the cover 3 into the slit 13 on the outer side surface of the chassis body 4 and mounting the same, the same as in the first embodiment. By pressing the circuit board 6 by the elastic pressing portion 15 of the lid 3, the circuit board 6 can be sandwiched and fixed with the board supporting portion 7 of the chassis body 4, so that it becomes unnecessary to use solder, and furthermore, the work involved in soldering Since the number of steps can be reduced, the cost can be reduced.

Further, when a defect is found in the finished product, the circuit board 6 can be removed simply by removing the lid 3 from the chassis body 4, so that the parts of the circuit board 6 can be easily replaced.

In this embodiment, similarly to the first embodiment, the board supporting portion 7 of the chassis main body 4 is made conductive together with the chassis main body 4 so as to be in contact with the ground electrode of the circuit board 6 and to support the board. The circuit board 6 through the part 7
May be dropped to the chassis body 4.

Also, in the present embodiment, the above-mentioned second to second embodiments are also used.
The fourth embodiment may be applied.

According to the third and fourth embodiments,
Since the position of the elastic pressing portion that is in contact with the circuit board is firmly fixed and displacement is unlikely to occur, the elastic pressing portion is resistant to shock noise, and is particularly suitable for high-frequency electronic devices.

[0056]

As described above, according to the present invention, no solder is required to fix the circuit board inside the chassis, so that the adverse effect on the environment due to the use of lead-containing solder, which has recently become a problem, is prevented. can do. Further, since a solder dipping step is not required in the manufacturing process of the chassis, the number of working steps can be reduced, and the cost can be reduced. Then, when replacing a component mounted on the circuit board due to a failure or the like, the circuit board can be removed simply by removing the lid from the chassis body, so that the work can be easily performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a chassis structure according to a first embodiment of the present invention.

FIG. 2 is a side sectional view of a main part of the chassis structure of FIG. 1;

FIG. 3 is a manufacturing process diagram in the first embodiment.

FIG. 4 is an enlarged perspective view of a main part of a chassis structure according to a second embodiment.

FIG. 5 is an enlarged perspective view of a main part of a chassis structure according to a third embodiment.

FIG. 6 is an enlarged perspective view of a main part of a chassis structure according to a third embodiment.

FIG. 7 is an enlarged perspective view of a main part of a chassis structure according to a fourth embodiment.

FIG. 8 is an enlarged perspective view of a main part of a chassis structure according to a fourth embodiment.

FIG. 9 is an enlarged perspective view of a main part of a chassis structure according to a fourth embodiment.

FIG. 10 is a side sectional view of a main part of a chassis structure according to a fifth embodiment.

FIG. 11 is a perspective view showing a conventional chassis structure.

FIG. 12 is a side sectional view of a main part of the chassis structure of FIG. 11;

FIG. 13 is a manufacturing process diagram for a conventional chassis structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Engagement projection part 2 Bending part 3 Lid part 4 Chassis main body 5, 15 Elastic pressing part 6 Circuit board 7 Substrate supporting part 7a Protruding part of substrate supporting part 8 Ground electrode 9 Slit 10 Protruding part of elastic pressing part tip 11, 12 Hole 13 Slit for fitting 14 Projection

Claims (7)

[Claims] 1. A chassis structure comprising a chassis body in which a circuit board is housed and a lid, wherein a board supporting portion for supporting the circuit board is provided inside the chassis body, and the board supporting portion of the chassis body is provided. A chassis structure, wherein an elastic pressing portion that presses a circuit board supported by the substrate, and clamps and fixes the circuit board with the board supporting member is provided on the lid portion. 2. The chassis structure according to claim 1, wherein said lid portion is made of a conductive plate member, and said elastic pressing portion is formed by bending at least a part of said conductive plate member. 3. The chassis structure according to claim 2, wherein said elastic pressing portion is formed by cutting and bending a part of a conductive plate member forming said lid portion. 4. The elastic pressing portion is formed by bending a part of an outer peripheral portion of a conductive plate member forming the lid portion, and the chassis is formed on a bent portion of the outer peripheral portion of the conductive plate member. 3. The chassis structure according to claim 2, wherein a protruding portion that fits and engages with the fitting slit on the side surface of the main body is formed. 5. The chassis according to claim 1, wherein a slit into which at least a part of the tip of the elastic pressing portion of the lid is inserted is provided on a side surface of the chassis main body. Construction. 6. A board supporting portion of the chassis main body is provided with a protrusion penetrating a hole of a circuit board, and a tip of the elastic pressing portion of the lid is brought into contact with the protrusion penetrating the circuit board.
The chassis structure according to any one of claims 2 to 5, wherein a protrusion penetrating the circuit board is penetrated through a hole formed in an elastic pressing portion of the lid. 7. The circuit board according to claim 1, wherein at least one of the substrate supporting portion of the chassis main body and the elastic substrate pressing portion of the lid contacts a ground electrode of the circuit board. The chassis structure described in the section.