JP2002043473A - Heat sink of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a manufacturing cost inexpensive by lessening the constituent parts of the heat sink of electronic component and simplifying the structure. SOLUTION: In a heat sink, a plurality of heat dissipating fins 4b (5b) are integrally formed on a plane 4a (5a) at a prescribed interval, a pair of heat sink assembling half bodies 4 (5) forming a fitting groove 4c (5c) fitting and fixing the edge part of the heat dissipating fin 5b (4b) formed on the assembling half body of the other heat sink are prepared between the heat dissipating fins 4b (5b), and the edge part of the heat dissipating fin 5b formed on the assembling half body of the other heat sink is fitted to and fixed on the fitting groove 4c formed on the assembling half body of one heat sink.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting heat-generating electronic components such as transistors, ICs, LSIs, diodes, and thyristors, and conducting and transferring the heat generated by these electronic components to radiate heat from radiating fins. The present invention relates to a radiator for an electronic component as described above.

[0002]

2. Description of the Related Art As shown in FIG. 3A, a conventional radiator for electronic parts and a method of manufacturing the same are provided with a radiator fin support made of a metal such as aluminum having good thermal conductivity, which is prepared in advance. One end 1a of a radiating fin 1 made of metal such as aluminum, which has been prepared in advance, is fitted into a plurality of parallel fitting grooves 2a formed on the plane of the base 2 from above.
The fitting groove 2a is formed so that the one end 1a of the radiation fin 1 can be easily fitted from above. Next, as shown in FIG. 3B, a plurality of caulking grooves 2b formed between the plurality of fitting grooves 2a in which the one end portions 1a of the heat radiation fins 1 are fitted are formed at the tip of the press tool 3. By pressing and caulking, the fitting groove 2a in which the one end 1a of the heat radiation fin 1 is fitted is narrowed. Then, as shown in FIG. 3C, the plurality of radiation fins 1 are fitted and fixed in the plurality of fitting grooves 2a such that one end portions 1a of the fins 1 cannot be removed. Note that the crimping groove 2b against which the tip of the press tool 3 is pressed may have the same shape as the fitting groove 2a into which the one end 1a of the radiating fin 1 is fitted, or may not. Further, an electronic component (not shown) is attached to the outer surface 2c of the radiation fin support base 2.

As shown in FIG. 4, a plurality of radiating fins 13a are integrally formed at predetermined intervals on a plane of a radiating fin supporting base 13 made of a metal such as aluminum having good thermal conductivity, which has been prepared in advance. These radiating fins 1
3a, a fitting groove 13b in which one end 14a of a metal radiating fin 14 made of metal such as aluminum is fitted and fixed.
And caulking grooves 13c, 13c formed on both sides of the fitting groove 13b to reduce the interval between the fitting grooves 13b. A separate radiating fin 14 is formed in the fitting groove 13b of the radiating fin support base 13. And one end 14a of the press tool 1 is fitted to the crimping grooves 13c, 13c formed on both sides of the fitting groove 13b.
5 is pressed and caulked and fixed to form a radiator for electronic components. With such a configuration, one of the heat radiation fins 13a is formed in advance at a predetermined interval integrally with the heat radiation fin support base 13, and
A fitting groove 13b formed between these heat radiation fins 13a
Further, since the one end 14a of the other radiating fin 14 is fitted and fixed, the radiator of the electronic component can be assembled and configured, so that the manufacturing cost is lower than the former conventional radiator.

[0004]

In a conventional radiator for an electronic component such as the former (see FIG. 3), a plurality of parallel fitting grooves 2a formed on a plane of a radiating fin support base 2 are provided.
One end 1a of the radiating fin 1 is fitted one by one, and the caulking grooves 2b formed on both sides of the fitting groove 2a must be pressed by the tip of the press tool 3 and caulked. There was a problem that the manufacturing cost was high. Further, in a conventional radiator for electronic components such as the latter (see FIG. 4), a separate groove is formed in a fitting groove 13b formed between radiating fins 13a integrally formed on a plane of a radiating fin support base 13. One end 14a of the heat radiation fin 14 is fitted one by one, and caulking grooves 13c formed on both sides of the fitting groove 13b.
Has to be pressed and caulked with the tip of the press tool 15, which causes a problem that the manufacturing cost is increased.

[0005] As shown in FIG. 5 (a), a radiating fin is formed by extruding a metal material such as aluminum having good thermal conductivity at a certain wide interval between the facing frame portions 7. It was possible to form a radiator of an electronic component integrally formed with 8. However, FIG.
As shown in the figure, it is impossible to form a radiator of an electronic component in which a radiating fin 10 is integrally formed at a narrow interval between opposed frame portions 9 by extruding a metal material such as aluminum. Met. FIG. 3 or FIG.
It is an object of the present invention to provide a radiator for an electronic component which eliminates the problems of the conventional radiator for an electronic component as shown in FIG. 5 and enables the manufacture of a radiator for an electronic component as shown in FIG. It is the purpose.

[0006]

In order to achieve the above object, the invention according to claim 1 will be described with reference to FIG. 1. Referring to FIG. 1, the radiation fins 4b are arranged at predetermined intervals on a plane 4a (5a).
(5b) are integrally formed, and the radiation fins 4
b (5b), an assembly of a radiator in which a fitting groove 4c (5c) is formed in which a tip of a radiating fin 5b (4b) formed in an assembly half of the other radiator is fitted and fixed. Half 4
A pair of (5) is prepared, and the assembly half 5 of the other radiator is inserted into the fitting groove 4c formed in the assembly half 4 of the one radiator.
A radiator is formed by fitting and fixing the distal end of the radiating fin 5b formed as described above to form a radiator. With this configuration, as before,
One end of the radiating fin is fitted into a plurality of fitting grooves formed on the plane of the radiating fin support base, and caulking grooves formed on both sides of the fitting groove are fixed by pressing with the tip of a press tool. And the manufacturing cost is reduced.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a radiator for an electronic component according to the present invention will be described in detail with reference to the drawings.

As shown in FIG. 2, the radiator of the electronic component according to the first aspect of the present invention has a flat surface 4a formed by extruding a metal material such as aluminum having good heat conductivity.
A plurality of radiating fins 4b are integrally formed at predetermined intervals, and the distal end of the radiating fin 5b formed on the assembly half 5 of the other radiator is fitted and fixed between the radiating fins 4b. The assembly half 4 of the radiator of the electronic component in which the groove 4c is formed is formed.

Further, a radiator assembly half 4 of the electronic component is provided.
Similarly to the above, a plurality of radiating fins 5b are integrally formed at predetermined intervals on the plane 5a, and the tip of the radiating fin 4b formed on the assembly half 4 of the other radiator is interposed between these radiating fins 5b. The assembly half 5 of the radiator of the electronic component in which the fitting groove 5c to be fitted and fixed is formed is formed.

Then, the assembly half 4 of the radiator of the electronic component and the assembly half 5 of the radiator of the electronic component are combined so that the radiating fins 4b, 5b formed thereon are opposed to each other. Fitting groove 4c formed in the container half 4
And a radiating fin 5 formed on the assembly half 5 of the other radiator.
b of the heat radiation fin 4b formed in the assembly half 4 of one radiator and the fitting groove 5c formed in the assembly half 5 of the other radiator. By fitting and fixing through an adhesive (not shown), a radiator H of an electronic component as shown in FIG. 1 can be assembled. In addition, the reference numeral 6 shown in FIG. 1 denotes an outermost radiation fin 4b of the assembly half 4 of one radiator assembled as described above.
Are fixed to the assembly halves 5 of the other radiator.
Reference numeral 6 'denotes a screw for fixing the outermost radiation fin 5b of the assembly half 5 of the other radiator assembled as described above to the assembly half 4 of one radiator.

With this configuration, the plurality of parallel fitting grooves formed on the plane of the radiating fin support base can be
One end of the heat radiation fins is fitted one by one, and the caulking grooves formed on both sides of the fitting grooves do not have to be pressed and caulked with the tip of the press tool to be fixed. In addition, it has become possible to form a radiator of an electronic component in which radiating fins are provided at a small interval between opposed frame portions made of metal such as aluminum.

[0012]

According to the present invention, as described above, a plurality of radiating fins are integrally formed at predetermined intervals on a plane, and the other radiator is formed between the radiating fins. A pair of radiator assembly halves each having a fitting groove in which the distal end portion of the radiating fin is fitted and fixed is prepared, and the other of the fitting halves formed in this one radiator assembly half is The tip of the radiator fin formed in the assembly half of the radiator is fitted and fixed to form the radiator.Therefore, the radiator fin is inserted into a plurality of parallel fitting grooves formed on the plane of the radiator support base. One end is fitted one by one, and the caulking grooves formed on both sides of the fitting grooves do not have to be pressed and caulked with the tip of the press tool, which is advantageous in that the manufacturing cost is reduced. In addition, it is possible to form a radiator of an electronic component in which radiating fins are provided at narrow intervals between opposed metal frame portions.

[Brief description of the drawings]

FIG. 1 is a front view of a radiator of an electronic component according to the present invention.

FIG. 2 is a diagram showing a state in which the electronic component radiator of the present invention is being assembled.

FIG. 3 is a view showing a conventional radiator of an electronic component and a manufacturing process thereof.

FIG. 4 is a view showing another conventional radiator of an electronic component and a manufacturing process thereof.

FIG. 5 is a view showing a radiator of an electronic component on which the present invention is premised.

[Explanation of symbols]

 Reference Signs List 4 radiator assembly half 4a on plane 4b radiating fin 4c fitting groove 5 radiator assembly 5a on plane 5b radiating fin 5c fitting groove 6 screw

Claims (1)

[Claims] 1. A plurality of radiating fins are integrally formed at predetermined intervals on a plane, and a tip of a radiating fin formed on an assembly half of the other radiator is fitted and fixed between the radiating fins. A pair of radiator halves each having a fitting groove formed therein are prepared, and the radiating fins formed in the fitting halves of the one radiator assembly half and the other radiator halves are provided. A radiator for an electronic component, wherein a radiator is formed by fitting and fixing the tip of the radiator.