JP2002105169A5 - - Google Patents

Download PDF

Info

Publication number: JP2002105169A5
Authority: JP; Japan
Prior art keywords: epoxy resin; formula; represented; tertiary octyl; following general
Prior art date: 2000-09-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP2000294106A

Other languages

Other versions

Filing date

2000-09-27

Publication date

2007-11-15

2000-09-27 Application filed filed Critical

2000-09-27 Priority to JP2000294106A priority Critical patent/JP4605420B2/ja

2000-09-27 Priority claimed from JP2000294106A external-priority patent/JP4605420B2/ja

2002-04-10 Publication of JP2002105169A publication Critical patent/JP2002105169A/ja

2007-11-15 Publication of JP2002105169A5 publication Critical patent/JP2002105169A5/ja

2011-01-05 Application granted granted Critical

2011-01-05 Publication of JP4605420B2 publication Critical patent/JP4605420B2/ja

2020-09-27 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

239000003822 epoxy resin Substances 0.000 description 10
229920000647 polyepoxide Polymers 0.000 description 10
QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 5
125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
239000000203 mixture Substances 0.000 description 4
239000003795 chemical substances by application Substances 0.000 description 2
150000005205 dihydroxybenzenes Chemical class 0.000 description 2
125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
150000005206 1,2-dihydroxybenzenes Chemical class 0.000 description 1
CLDZVCMRASJQFO-UHFFFAOYSA-N 2,5-bis(2,4,4-trimethylpentan-2-yl)benzene-1,4-diol Chemical compound CC(C)(C)CC(C)(C)C1=CC(O)=C(C(C)(C)CC(C)(C)C)C=C1O CLDZVCMRASJQFO-UHFFFAOYSA-N 0.000 description 1
239000002994 raw material Substances 0.000 description 1
230000009257 reactivity Effects 0.000 description 1

JP2000294106A 2000-09-27 2000-09-27 エポキシ樹脂組成物及びその硬化物 Expired - Fee Related JP4605420B2 (ja)

Application Number	Priority Date	Filing Date	Title
JP2000294106A JP4605420B2 (ja)	2000-09-27	2000-09-27	エポキシ樹脂組成物及びその硬化物

Application Number	Priority Date	Filing Date	Title
JP2000294106A JP4605420B2 (ja)	2000-09-27	2000-09-27	エポキシ樹脂組成物及びその硬化物

Application Number	Title	Priority Date	Filing Date
JP2000294106A Expired - Fee Related JP4605420B2 (ja)	2000-09-27	2000-09-27	エポキシ樹脂組成物及びその硬化物

Country	Link
JP (1)	JP4605420B2 (fr)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4208068B2 (ja) *	2003-02-14	2009-01-14	日本化薬株式会社	液晶シール剤およびそれを用いた液晶表示セル
JP6809206B2 (ja) *	2016-12-21	2021-01-06	Dic株式会社	エポキシ樹脂、硬化性樹脂組成物及びその硬化物

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH10158362A (ja) *	1996-11-28	1998-06-16	Nippon Kayaku Co Ltd	エポキシ樹脂組成物、硬化物及び半導体装置
JP3998163B2 (ja) *	1998-03-13	2007-10-24	日本化薬株式会社	エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP4678456B2 (ja) *	2000-06-28	2011-04-27	Ｄｉｃ株式会社	エポキシ樹脂組成物
JP2002069154A (ja) *	2000-08-30	2002-03-08	Dainippon Ink & Chem Inc	エポキシ樹脂組成物

2000
- 2000-09-27 JP JP2000294106A patent/JP4605420B2/ja not_active Expired - Fee Related

Publication	Publication Date	Title
JP2001288247A5 (fr)	2007-02-22
JP2011529117A5 (fr)	2012-09-06
JP2005536590A5 (fr)	2006-10-05
JP2013504652A5 (fr)	2013-07-25
JP2013530229A5 (fr)	2014-07-17
JPH1080933A5 (fr)	2005-04-07
JP2003510305A5 (fr)	2007-04-19
TWI338191B (en)	2011-03-01	Positive resist composition and method of forming pattern using the same
JP2009521545A5 (fr)	2010-02-04
DE69930669D1 (de)	2006-05-18	Verfahren zur herstellung von niedermolekularem polyphenylenether harzen durch redistribution
JP2003107710A5 (fr)	2006-01-19
DE60205681T2 (de)	2006-06-14	Lösungsmittelbasiertes Verfahren zur Herstellung latenter Härtungskatalysatoren
JP2002520462A5 (fr)	2006-06-15
ATE525348T1 (de)	2011-10-15	Verfahren zur herstellung von fluorchemischen monoisocyanaten
ATE524505T1 (de)	2011-09-15	Polymerisierbare zusammensetzung und flachdruckplattenvorläufer damit, alkalilösliches polyurethanharz sowie verfahren zur herstellung einer diolverbindung
DE602004017729D1 (de)	2008-12-24	Verfahren zur herstellung von iohexol
JP2008222908A5 (fr)	2010-04-22
JP2002128861A5 (fr)	2004-08-26
JP2002003602A5 (fr)	2007-08-02
CA2521758A1 (fr)	2004-06-17	Composition de resine epoxyde
ATE14428T1 (de)	1985-08-15	Verfahren zur herstellung von bromhaltigen 1,3dioxolen-2-ones.
JP2001100417A5 (fr)	2005-07-07
JP2004217869A5 (fr)	2006-01-26
JPS5738750A (en)	1982-03-03	2,3-bis 3,4-dicarboxybenzoyloxy propyl methacrylate and its preparation
JPH10251374A5 (fr)	2004-11-25