JP2002201450A - Adhesive composition, connecting method of circuit terminal using the same, and connected structure of circuit terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive composition for electric/electronic uses, giving electric connection of low resistance for COG mounting or COF mounting and causing no short circuit, a connecting method of circuit terminals using the same and a connected structure of circuit terminals. SOLUTION: A bonding material, interposed between circuit electrodes opposite to each other and electrically connecting electrodes in the direction of pressurization by pressurizing the circuit electrodes opposite to each other, comprises at least an insulating adhesive layer and an adhesive layer containing electroconductive particles, where each adhesive layer comprises an adhesive composition containing as essential ingredients at least three of (1) an epoxy resin, (2) a latent curing agent, (3) a film-forming material and (4) electroconductive particles and has flowability B/A defined by using the area (A) before heating and pressurization and the area (B) after heating and pressurization, of the bonding material composed of the adhesive layers, of 1.3-2.0.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive composition, and a circuit terminal in a CHIP-ON-GLASS mounting (hereinafter referred to as COG mounting) or a CHIP-ON-FLEX (hereinafter referred to as COF mounting) using the same. The present invention relates to a connection method and a connection structure of circuit terminals.

[0002]

2. Description of the Related Art A liquid crystal driving IC is mounted on a liquid crystal display glass panel by a COG mounting method in which the liquid crystal driving IC is directly joined to the glass panel by a circuit connecting member, or the liquid crystal driving IC has metal wiring. A COF mounting method of bonding to a flexible tape and bonding to a glass panel and a circuit connecting member is used. As the definition of liquid crystal displays has become higher,
The gold bump, which is the electrode of C, has a narrow pitch and a narrow area. For this reason, there is a problem that the conductive particles in the bonding material flow out between the adjacent electrodes, causing a short circuit, and a problem that the number of conductive particles in the bonding material captured on the bumps is reduced, resulting in poor connection. . In order to solve these problems, a method has been developed in which an insulating adhesive layer is formed on at least one surface of a bonding material to prevent a decrease in bonding quality in COG mounting and COF mounting (for example, Japanese Patent Application Laid-Open No. H08-208,1992). -279371).

[0003]

However, when the bump area of the connection member is less than 3000 μm ² , the number of conductive particles in the bonding material captured on the bump is reduced, and a stable connection resistance value is obtained. However, there is a problem that when the filling amount of the particles is increased to increase the short-circuiting rate and the insulation failure occurs, the connection resistance value is lowered. The present invention provides an electric / electronic adhesive composition that provides low-resistance electrical connection to COG mounting and COF mounting and does not cause short circuit, a method for connecting circuit terminals using the same, and a method for connecting circuit terminals. Provides structure.

[0004]

According to the present invention, there is provided a bonding material which is interposed between opposing circuit electrodes, presses the opposing circuit electrodes, and electrically connects the electrodes in the pressing direction. A bonding material comprising at least an insulating adhesive layer and an adhesive layer containing conductive particles, each adhesive layer comprising: (1) an epoxy resin, (2) a latent curing agent, (3) a film forming material,
(4) An adhesive composition containing any three or more of the conductive particles as an essential component, and the area (A) of the bonding material composed of each adhesive layer before heating and pressing and the area after heating and pressing ( An adhesive composition having a fluidity (B) / (A) value of 1.3 to 2.0 expressed using B). The value of the fluidity (B) / (A) expressed using the area (A) of the joining material before the heating and pressing and the area (B) after the heating and pressing is 1.3 to 2.
If the fluidity is less than 1.3, the fluidity is poor and good connection may not be obtained in some cases. Since the number is small, the electric resistance value of the connection portion increases. [2] The bonding material is (1) an epoxy resin, (2) a latent curing agent, (3) an insulating adhesive layer containing a film-forming material as essential components, (1) an epoxy resin, and (2) a latent resin. The adhesive composition according to the above [1], which comprises two layers of a hardening agent, (3) a film forming material, and (4) an adhesive layer containing conductive particles containing conductive particles as an essential component. [3] The adhesive composition according to the above [1] or [2], wherein the surface of the conductive particles is covered with an organic polymer compound. [4] The adhesive composition according to any one of [1] to [3], wherein the thickness of the adhesive layer containing the conductive particles is less than three times the particle size of the conductive particles. The adhesive composition of the present invention can be formed into a multilayer structure decomposed into a layer containing conductive particles and other layers, and at this time, the thickness of the adhesive layer containing the conductive particles depends on the particle size of the conductive particles. It is preferably less than 3 times, more preferably less than 2 times. When the thickness of the adhesive layer containing the conductive particles is three times or more, the amount of the conductive particles flowing out between the adjacent electrodes increases, and the insulating property decreases, which is not preferable. In addition, the present invention relates to [5] a first circuit member having a first connection terminal, and a second circuit member having a second connection terminal, the first connection member and the second connection terminal. The adhesive composition according to any one of the above [1] to [4] is disposed between the first connection terminal and the second connection terminal which are disposed to face each other, and heated and pressed. And a circuit terminal for electrically connecting the first connection terminal and the second connection terminal arranged opposite to each other. [6] The circuit member having at least one connection terminal is I
The method for connecting circuit terminals according to the above [5], which is a C chip. [7] The surface of at least one of the connection terminals is gold, silver, tin,
The circuit terminal connection method according to the above [5] or [6], comprising at least one selected from a platinum group metal and indium-tin oxide (ITO). [8] at least one circuit member surface is silicon nitride,
The method of connecting a circuit terminal according to any one of the above [5] to [7], wherein the circuit terminal is coated or adhered with at least one selected from a silicone compound and a polyimide resin. Further, the present invention provides

[9] The above [5]
To a circuit terminal connection structure obtained by the circuit terminal connection method according to any one of the above [8].

[0005]

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bonding material interposed between opposed circuit electrodes for heating and pressing the opposed circuit electrodes and electrically connecting the electrodes in the pressing direction. And a bonding material containing conductive particles. Each adhesive layer is composed of (1) an epoxy resin, (2) a latent curing agent, (3) a film forming material,
(4) An adhesive composition containing any three or more of the conductive particles as an essential component. The bonding material is composed of an insulating adhesive layer (Z) and an adhesive layer (D) containing conductive particles. The structure is as follows: ZD for two layers, ZD for three layers.
-Z, DZD, and similarly, a configuration having four or more layers can be employed. Then, the value of the fluidity (B) / (A) expressed by using the area (A) before the heating and pressurizing and the area (B) after the heating and pressurizing of the bonding material composed of each adhesive layer is 1 .3 to 2.0. If the fluidity is less than 1.3, the fluidity is poor and good connection may not be obtained. If the fluidity is more than 2.0, the connection terminals, for example, the number of conductive particles trapped on the bumps is small, so The electric resistance value of the part increases. The flowability was measured at a thickness of 0.7 m.
m, using glass of 15 mm × 15 mm, thickness 35 μm
m, 5 mm × 5 mm adhesive composition is sandwiched between these two glasses, and heated and pressed at 200 ° C., 2 MPa, and 10 seconds, and the initial area (A) and the area after heated and pressed (B) From (B) / (A). This area can also be measured using an image processing device or the like. When the thickness of each adhesive layer was different, the thickness of the bonding material was 35 μm in proportion to the thickness.

[0006] The insulating adhesive layer constituting the bonding material is
It is preferable to contain (1) an epoxy resin, (2) a latent curing agent, and (3) a film-forming material as essential components,
Further, the adhesive layer containing the conductive particles includes (1) an epoxy resin, (2) a latent curing agent, (3) a film forming material,
(4) It is preferable to contain conductive particles as an essential component. The conductive particles preferably have the surface of the conductive particles covered with an organic polymer compound, and the coating of the organic polymer compound may be performed by a method usually used in a microcapsule technique. For example, spraying, immersion drying, and the like of a polymer compound on conductive particles are used. The coating thickness may be an insulating property, and may be an extremely thin thickness.
The thickness of the adhesive layer containing conductive particles is preferably less than three times the particle size of the conductive particles. When the thickness of the adhesive layer containing the conductive particles is three times or more, the amount of the conductive particles flowing out between the adjacent electrodes increases, and the insulating property tends to decrease. Since the number is reduced, connection resistance is increased and connection reliability is deteriorated.

[0007] The epoxy resin (1) used in the present invention includes epichlorohydrin and bisphenol A, F, A
Bisphenol-type epoxy resin derived from D or the like, epoxychlorohydrin and epoxy novolak resin derived from phenol novolak or cresol novolak, naphthalene-based epoxy resin having a skeleton containing a naphthalene ring, glycidylamine, glycidyl ether, biphenyl, alicyclic It is possible to use various epoxy compounds having two or more glycidyl groups in one molecule, etc. alone or as a mixture of two or more. It is preferable to use a high-purity epoxy resin in which impurity ions (Na ⁺ , Cl ^−, etc.), hydrolyzable chlorine and the like are reduced to 300 ppm or less for preventing electron migration.

Examples of the latent curing agent (2) used in the present invention include imidazoles, hydrazides, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, and dicyandiamide. These may be used alone or as a mixture, and may be used in combination with a decomposition accelerator, an inhibitor and the like. A microcapsule obtained by coating these curing agents with a polyurethane-based or polyester-based polymer substance or the like is preferable because the pot life is extended.

The (3) film-forming material used in the present invention includes phenoxy resin, polyvinyl formal resin,
Polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, polyurethane resin and the like can be mentioned. Film forming material, when the liquid material is solidified and the constituent composition is in the form of a film,
The film is easy to handle and imparts mechanical properties and the like that are not easily torn, cracked or sticky, and can be handled as a film in a normal state. Phenoxy resins are preferred among the film-forming materials because of their excellent adhesiveness, compatibility, heat resistance, and mechanical strength. The phenoxy resin is a resin obtained by reacting a bifunctional phenol and epihalohydrin to a high molecular weight or by polyaddition of a bifunctional epoxy resin and a bifunctional phenol. Specifically, it is obtained by reacting 1 mol of bifunctional phenols with epihalohydrin 0.985 to 1.015 in a non-reactive solvent at a temperature of 40 to 120 ° C. in the presence of an alkali metal hydroxide. Can be. In addition, from the viewpoint of the mechanical and thermal properties of the resin, in particular, the blending equivalent ratio of the bifunctional epoxy resin and the bifunctional phenol is set such that epoxy group / phenol hydroxyl group = 1.
/0.9 to 1 / 1.1, amides, ethers, ketones having a boiling point of 120 ° C. or more in the presence of a catalyst such as an alkali metal compound, an organic phosphorus compound, or a cyclic amine compound;
Those obtained by heating at 50 to 200 ° C. in a lactone-based or alcohol-based organic solvent at a reaction solid content of 50 parts by weight or less and performing a polyaddition reaction are preferred. Examples of the bifunctional epoxy resin include a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol AD epoxy resin, and a bisphenol S epoxy resin. Bifunctional phenols have two phenolic hydroxyl groups and include, for example, hydroquinones, bisphenols such as bisphenol A, bisphenol F, bisphenol AD, and bisphenol S. The phenoxy resin may be modified with a radically polymerizable functional group. The phenoxy resins may be used alone or as a mixture of two or more.

[0010] The adhesive composition of the present invention comprises acrylic acid,
A copolymer or a copolymer containing at least one of acrylic acid ester, methacrylic acid ester and acrylonitrile as a monomer component can be used, and a copolymer acrylic rubber containing glycidyl acrylate or glycidyl methacrylate containing a glycidyl ether group can be used. The use of a combination of these is preferred because of excellent stress relaxation. The molecular weight (weight average) of these acrylic rubbers is preferably 200,000 or more from the viewpoint of increasing the cohesive strength of the adhesive. The adhesive composition of the present invention further includes a filler, a softener, an accelerator, an antioxidant, a flame retardant, a dye, a thixotropic agent, a coupling agent, a phenol resin, a melamine resin, and isocyanates. It can also be contained. When a filler is contained, it is preferable because an improvement in connection reliability and the like can be obtained. It can be used if the maximum diameter of the filler is smaller than the particle diameter of the conductive particles.
６０60 parts by volume (per 100 parts by volume of adhesive resin component)
Is preferable. If it exceeds 60 parts by volume, the effect of improving reliability may be saturated, and if it is less than 5 parts by volume, the effect of addition is small.

As the coupling agent, ketimine, a vinyl group, an acryl group, an amino group, an epoxy group and an isocyanate group-containing material are preferred from the viewpoint of improving the adhesiveness. Specifically, as a silane coupling agent having an amino group, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltrimethoxysilane Ethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane and the like can be mentioned. Examples of the silane coupling agent having a ketimine include those obtained by reacting a silane coupling agent having an amino group with a ketone compound such as acetone, methyl ethyl ketone, and methyl isobutyl ketone.

The adhesive composition of the present invention can be connected by direct contact of opposing circuit electrodes at the time of connection even without conductive particles, but more stable connection can be obtained when the adhesive composition contains conductive particles. Au, Ag, N as conductive particles
There are metal particles such as i, Cu, solder, and carbon, and the like. In order to obtain a sufficient pot life, the surface layer is preferably made of noble metals such as Au, Ag, and white metal instead of transition metals such as Ni and Cu. More preferred. Further, the surface of a transition metal such as Ni may be coated with a noble metal such as Au.
Further, the conductive layer described above may be formed on a nonconductive glass, ceramic, plastic, or the like by coating or the like, and the outermost layer may be made of a noble metal. When a conductive layer is formed on a plastic by coating, etc., or when it is deformed by fusing and heating and pressing of hot-melt metal particles, the contact area with the electrode increases during connection, and the thickness variation of the circuit terminal of the circuit member is absorbed. This is preferable because the reliability is improved. The thickness of the noble metal coating layer is preferably 100 Å or more in order to obtain good resistance. However, when a layer of a noble metal is formed on a transition metal such as Ni, free radicals are generated due to oxidation-reduction caused by a defect of the noble metal layer or a defect of the noble metal layer caused by mixing and dispersing conductive particles. In order to cause deterioration in storage stability, the thickness is preferably 300 Å or more. When the thickness increases, their effects become saturated. Therefore, it is preferable to set the thickness to 1 μm at the maximum, but there is no limitation. The conductive particles are properly used in a range of 0.1 to 30 parts by volume based on 100 parts by volume of the adhesive resin component. In order to prevent a short circuit or the like in an adjacent circuit due to excessive conductive particles, the content is more preferably 0.1 to 10 parts by volume.

The adhesive composition of the present invention can be used for COG mounting or C
It can also be used as a film adhesive for bonding a flexible tape or a glass substrate to an IC chip in OF mounting. That is, a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged such that the first connection terminal and the second connection terminal are opposed to each other. The adhesive composition (film-like adhesive) of the present invention is interposed between the arranged first connection terminal and the second connection terminal, and heated and pressurized, and the first connection terminal and the second connection terminal arranged opposite to each other are heated and pressed. The connection terminals can be electrically connected.
These circuit members are usually provided with a large number of connection terminals (in some cases, a single terminal may be provided), and at least one set of the circuit members may be provided with at least a part of the connection terminals provided on the circuit members facing each other. Then, the adhesive of the present invention is interposed between the opposed connection terminals, and the connection terminals opposed to each other are electrically connected to each other by heating and pressing to form a circuit board. By heating and pressurizing at least one set of circuit members, the connection terminals arranged opposite to each other can be electrically connected to each other by direct contact or via conductive particles in the adhesive composition.

In the method for connecting circuit terminals of the present invention, the adhesive composition of the present invention is used, and the surface of the connection terminal is selected from gold, silver, tin, platinum group metals, and indium-tin oxide (ITO). After forming at least one type of connection terminal (electrode circuit), the other connection terminal (circuit electrode) can be positioned, heated and pressed, and connected. At this time, light may be emitted from one of the circuit members. In the present invention, the flexible tape is an organic insulating material such as a polyimide resin, the surface of a glass substrate is particularly good for a circuit member coated or adhered with at least one selected from silicon nitride, a silicone compound, a polyimide resin, and a silicone resin. It is possible to provide an electric / electronic adhesive composition capable of obtaining an adhesive strength, a circuit terminal connection method using the same, and a circuit terminal connection structure.

Example 1 A phenoxy resin having a glass transition temperature of 80 ° C. was synthesized from bisphenol A type epoxy resin and bisphenol A. 50 g of this resin was mixed with toluene (boiling point 110.6 ° C.) / Ethyl acetate (boiling point 7
(7.1 ° C.) = 50/50 mixed solvent to obtain a solution having a solid content of 40% by weight. The phenolic resin was mixed in a solid weight ratio of 40 g, and a liquid epoxy containing a microcapsule-type latent curing agent (HX3941HP; trade name of Asahi Kasei Kogyo Co., Ltd., epoxy equivalent: 185) was blended so as to be 60 g. A 0.2 μm thick nickel layer on the surface of
5% by volume of PVA solution is dispersed and dispersed in PVA solution to 5 μm average particle diameter provided with a μm gold layer, and a 80 μm thick PET (polyethylene terephthalate) film having one surface treated. It was applied using a coating apparatus and dried at 70 ° C. for 10 minutes with hot air to obtain a film-shaped adhesive composition having an adhesive layer thickness of 10 μm. Also,
40 g of a phenoxy resin and 60 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent in a solid weight ratio are applied to a PET (polyethylene terephthalate) film having a thickness of 80 μm and a surface treated on one side. Coating using a device, 70 ° C, 10
By drying with hot air for one minute, a film adhesive composition having an adhesive layer thickness of 10 μm was obtained. These adhesive compositions were bonded together using a laminator to obtain a two-layered film adhesive composition.

Example 2 The same procedure as in Example 1 was repeated except that 35 g of a phenoxy resin and 65 g of a liquid epoxy containing a microcapsule-type latent curing agent (epoxy equivalent: 185) were added in a solid weight ratio of 35 g. A layered film adhesive composition was obtained.

Comparative Example 1 A two-layer film was prepared in the same manner as in Example 1 except that the solid weight ratio was changed to 30 g of phenoxy resin and 70 g of liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent. An adhesive composition was obtained.

(Circuit connection) Bump area 50 μm × 50
An IC chip on which gold bumps having a pitch of 100 μm and a height of 20 μm are arranged, and an indium tin oxide (ITO) formed on a 1.1 mm thick glass by vapor deposition.
An O substrate (surface resistance, <20Ω / □) was sandwiched between quartz glass and a pressure head using the above-mentioned adhesive composition.
The connection was made by heating and pressing at 100 ° C. and 100 MPa (bump area conversion) for 10 seconds. At this time, the adhesive surface of the adhesive composition was previously coated on the ITO substrate by 7 minutes.
At 0 ° C, 0.5MPa (converted to bump area), heat and pressure for 5 seconds to adhere, then peel off the PET film and
Connected to C chip. (Measurement of fluidity) Thickness 0.7 mm, 15 mm x 15 mm
A circuit connecting material made of a resin composition for circuit connecting having a thickness of 35 μm and 5 mm × 5 mm was sandwiched between the glasses, and heated and pressed at 200 ° C., 2 MPa, and 10 seconds to obtain an initial area (A ) And the area (B) after heating and pressing, the value of (B) / (A) was determined. (Measurement of Number of Trapped Particles on Bump) After connection of the circuit, the bumps were observed from the glass side with a metallographic microscope (magnification: 200 times), and the number of conductive particles on the bumps was counted to obtain an average value. (Measurement of connection resistance) After the circuit was connected, the electric resistance value of the connection portion was initially kept at 500 cycles in a temperature cycle bath of −40 ° C./30 minutes and 100 ° C./30 minutes, and then a two-terminal measurement method was used. It was measured with a multimeter. Table 1 shows the measurement results.

[0019]

[Table 1]

When the amount of the phenoxy resin used as the film forming material is small and the amount of the epoxy resin is large, the fluidity increases. As the fluidity increases, the number of conductive particles on the bump decreases. When the number of particles decreases, the connection resistance for evaluating the connection reliability after the temperature cycle test greatly increases, and reaches as high as 20Ω or more. When the fluidity of the bonding material of the present invention is in the range of 1.3 to 2.0, both the initial and the connection resistance after the reliability test are low, and good results are shown. On the other hand, when the fluidity of Comparative Example 1 is 2.5, the initial value of the connection resistance is low and good, but the connection resistance after the reliability test is remarkably large and is not suitable as a bonding material for circuit members. Also, as a result of various experiments, the thickness of the adhesive layer containing the conductive particles,
When the diameter was less than three times the particle diameter of the conductive particles, the number of the conductive particles captured on the bumps increased, and the state where the connection resistance was low could be maintained. Further, when the fluidity is less than 1.3, the fluidity is poor and bubbles are involved, so that a good connection cannot be obtained. When the conductive particles are covered with the organic polymer, there is no significant effect on the fluidity, but there is no short circuit between adjacent connection terminals and the insulation failure is eliminated. In addition, the filling amount of the conductive particles was increased, and a reliable connection could be secured.

[0021]

According to the present invention, there is provided an adhesive composition for electric / electronic use which can provide a low-resistance electric connection even in a driving IC having a small bump area in COG mounting or COF mounting. It is possible to provide the connection method of the used circuit terminals and the connection structure of the circuit terminals.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/29 H01R 11/01 501C 23/31 H05K 3/32 B H01R 11/01 501 H01L 23/30 B H05K 3/32 (72) Inventor Yukihisa Hirosawa 1150 Goshomiya, Shimodate-shi, Ibaraki Pref.Hitachi Kasei Kogyo Co., Ltd. Goshomiya Office Co., Ltd. F-term (reference) 4J004 AA10 AA13 BA03 CC02 CE01 DA03 DB02 FA05 4J040 DB021 DB022 DD021 DD022 EB081 EB082 EC041 EC042 EC061 EC062 EC071 EC072 EC081 EC082 EC121 EC122 ED001 ED002 EE061 EF06 EE061 EF06 EE061 HC18 HC23 HD18 JA09 JA12 JB02 JB10 KA14 KA32 KA42 LA09 MA02 MA04 MA10 NA20 4M109 AA02 BA05 BA07 CA2 2 EA02 EA20 EB02 EB18 EC07 5E319 AA03 AC04 AC11 BB11 GG01 GG20 5F044 KK03 KK06 LL07 LL11 RR17 RR18 RR19

Claims (9)

[Claims] 1. A bonding material interposed between opposing circuit electrodes, pressurizing the opposing circuit electrodes, and electrically connecting the electrodes in the pressing direction with at least an insulating adhesive layer and conductive particles. Each bonding layer is composed of (1) an epoxy resin, (2) a latent curing agent,
(3) An adhesive composition containing, as an essential component, at least three of a film-forming material and (4) conductive particles, and the area (A) of a bonding material composed of each adhesive layer before heating and pressing.
And an adhesive composition having a fluidity (B) / (A) value of 1.3 to 2.0 expressed by using an area (B) after heating and pressing. 2. A bonding material comprising: (1) an epoxy resin;
(2) a latent curing agent, (3) an insulating adhesive layer containing a film forming material as an essential component, (1) an epoxy resin, (2) a latent curing agent, (3) a film forming material,
(4) The adhesive composition according to claim 1, comprising an adhesive layer containing conductive particles containing conductive particles as an essential component. 3. The adhesive composition according to claim 1, wherein the surface of the conductive particles is covered with an organic polymer compound. 4. The method according to claim 1, wherein the thickness of the adhesive layer containing the conductive particles is less than three times the particle diameter of the conductive particles.
The adhesive composition according to any one of the above. 5. A first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged with the first connection terminal and the second connection terminal facing each other. The adhesive composition according to any one of claims 1 to 4, wherein the adhesive composition according to any one of claims 1 to 4 is interposed between the first connection terminal and the second connection terminal disposed opposite to each other, and heated and pressurized to form the second connection terminal. A connection method of a circuit terminal for electrically connecting one connection terminal and a second connection terminal. 6. The method according to claim 5, wherein the circuit member having at least one connection terminal is an IC chip. 7. The surface of at least one connection terminal is gold,
Silver, tin, platinum group metals, indium-tin oxide (IT
6. A structure comprising at least one selected from O).
Alternatively, the method for connecting circuit terminals according to claim 6. 8. The method according to claim 5, wherein at least one surface of the circuit member is coated or adhered with at least one selected from silicon nitride, a silicone compound, and a polyimide resin. . 9. A connection structure for circuit terminals obtained by the method for connecting circuit terminals according to claim 5. Description: