JP2003190883A - Cleaning sheet and method of cleaning substrate processing apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning sheet and a cleaning method used for cleaning a substrate processing apparatus which does not like foreign substances, such as a manufacturing apparatus or an inspection apparatus such as a semiconductor, a flat panel display, a printed circuit board, etc. . SOLUTION: In a cleaning sheet in which a cleaning layer is provided on one side of a support and a normal pressure-sensitive adhesive layer is provided on the other side, the holding power of the normal pressure-sensitive adhesive layer is JISZ0.
In 237, the displacement distance after 3600 seconds is 5 mm or less.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning sheet for cleaning various types of substrate processing apparatus and a method for cleaning a substrate processing apparatus using the same, for example, a manufacturing apparatus or inspection for semiconductors, flat panel displays, printed circuit boards and the like. The present invention relates to a cleaning sheet and a cleaning method used for cleaning a substrate processing apparatus such as an apparatus that dislikes foreign matters.

[0002]

2. Description of the Related Art A substrate processing apparatus conveys each conveying system while physically contacting the substrate. At that time, if foreign matter adheres to the substrate or the transport system, subsequent substrates will be contaminated one after another, and it is necessary to periodically stop the apparatus and perform a cleaning process. Therefore, there is a problem that the operating rate is lowered and much labor is required. To solve these problems,
A method of cleaning and removing foreign matter adhering to the inside of the substrate processing apparatus by carrying a substrate to which an adhesive substance is fixed, or a foreign material adhering to the back surface of the substrate by carrying a plate member. A method (Japanese Patent Laid-Open No. 11-87458) has been proposed.

[0003]

The method of cleaning and removing the foreign matter adhering to the inside of the substrate processing apparatus by carrying the substrate to which the sticky substance is fixed is an effective method for overcoming the above-mentioned problems. However, in this method, the adhesive substance and the device contact portion are too strongly adhered to each other and may not be peeled off, so that the substrate may not be reliably transported. In particular, this is a problem when a vacuum suction mechanism is used in the chuck table of the apparatus. Further, the method of removing foreign matter by transporting the plate-shaped member can be carried out without trouble, but has a problem that the essential dust-removing property is poor.

Further, when the cleaning sheet used for these cleanings is, for example, a conveying member with a cleaning function (hereinafter referred to as a cleaning member) provided with an ordinary adhesive layer on the conveying member, the cleaning layer of the cleaning sheet is pulled. When the elastic modulus is large or when the cleaning sheet is attached to the inside smaller than the conveying member (referred to as inner sticking), the cleaning sheet is peeled from the conveying member and the normal pressure-sensitive adhesive layer after the cleaning member is manufactured. There was a problem. Further, when the cleaning sheet is peeled and removed from the conveying member after cleaning the apparatus, there is a problem that a usual adhesive causes an adhesive residue on the conveying member, resulting in contamination of μm order or sub μm order. In view of such a situation, the present invention can reliably convey the inside of the substrate processing apparatus, can easily and surely remove the adhering foreign matter, and further, in manufacturing the cleaning member, the cleaning sheet is peeled off from the conveying member. It is an object of the present invention to provide a cleaning sheet that does not cause adhesive residue on the transport member when the cleaning sheet is peeled and removed.

[0005]

DISCLOSURE OF THE INVENTION The inventors of the present invention have made earnest studies for the above-mentioned object, and as a result, have conveyed a sheet having a cleaning layer adhered thereto or a cleaning member having the sheet adhered to a conveying member such as a substrate. By doing so, in cleaning and removing foreign matter attached in the substrate processing apparatus, in a cleaning sheet having a cleaning layer provided on one surface of the support and an ordinary pressure-sensitive adhesive layer on the other surface, By limiting the holding force of the agent layer to a specific value or less, the cleaning sheet does not peel off from the conveying member, and no adhesive residue is left on the conveying member when the cleaning sheet is peeled and removed. Further, they have found that a cleaning sheet that can be reliably peeled off can be provided, and completed the present invention.

That is, when the cleaning sheet is peeled off from the conveying member or when the cleaning sheet is peeled off from the conveying member, contamination of the order of μm or sub-μm occurs because the cohesive force of the adhesive is insufficient. I thought it was. Here, the cohesive force is a force of molecules in the pressure-sensitive adhesive layer tending to gather together, and is a resistance force against plastic deformation due to external stress. In the present invention, this is JIS Z0237.
It has been found that the above problems can be solved by specifying the holding power.

That is, according to the present invention, in a cleaning sheet having a cleaning layer provided on one side of a support and an ordinary pressure-sensitive adhesive layer on the other side, the holding force of the ordinary pressure-sensitive adhesive layer is 3600 seconds according to JIS Z0237. A cleaning sheet (claim 1), characterized in that the distance of the subsequent displacement is 5 mm or less, and a 180 ° peeling adhesive strength of a normal adhesive layer to a silicon wafer (mirror surface) is 0.01.
The cleaning sheet according to claim 1 (claim 2), wherein the ordinary pressure-sensitive adhesive layer has a weight average molecular weight of 10 ⁵ or less of the polymer contained in the pressure-sensitive adhesive layer. Is 10% by weight or less, the tensile modulus of elasticity of the cleaning layer (Claim 3) according to any one of claims 1 to 2 (according to the test method JISK7127) is 10 MPa or more. The cleaning sheet according to any one of claims 1 to 3 (claim 4), and the transport member, wherein the cleaning sheet according to any one of claims 1 to 4 is provided by an ordinary pressure-sensitive adhesive layer. (Claim 5), the cleaning sheet according to any one of claims 1 to 4 or the transport member according to claim 5 is transported into a substrate processing apparatus. That it is intended according to the cleaning method of a substrate processing apparatus (claim 6).

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below. The cleaning sheet of the present invention is provided with a cleaning layer on one surface of a support and a normal pressure-sensitive adhesive layer on the other surface, and the holding power of the normal pressure-sensitive adhesive layer is measured according to JIS Z0237, and the deviation after 3600 seconds It is necessary that the distance be 5 mm or less, and preferably the distance after 7200 seconds is 5 mm.
Below, more preferably, the distance of deviation after 10800 seconds is 5
mm or less. When the pressure-sensitive adhesive layer exceeds the above specific value,
When the cleaning sheet is attached to the conveying member and the cleaning member is manufactured, the cleaning sheet is easily peeled from the conveying member, and when the cleaning sheet is peeled and removed from the conveying member, μm order or sub μm
May cause contamination of the order. Here, the holding power was measured according to JIS Z0237. That is, a 25 mm × 75 mm measurement sheet was prepared from a cleaning sheet, and the adhesion area was 25 mm × 25 mm on a stainless steel plate (polished with SUS304 # 360 sandpaper) in an environment of 23 ° C. and 50% humidity. To 1
A 9.6N rubber roll is reciprocated once to press the normal pressure-sensitive adhesive layer side. After leaving it for 20 minutes or longer, put it in a constant temperature bath at 40 ° C, fix one end of the stainless steel plate with a clasp, and further 20
After a minute, a load of 9.8 N was applied in the shearing direction, and the distance of deviation after 3600 seconds or the drop time was measured.

The ordinary pressure-sensitive adhesive layer in the present invention is not particularly limited as long as the pressure-sensitive adhesive in the above range is used, but the 180-degree peeling pressure-sensitive adhesive force to the silicon wafer (mirror surface) is 0.01 to 10 N / 10 mm, More preferably 0.
It is desirable that it is from 05 N to 5 N / 10 mm. If the adhesive strength of the cleaning sheet is too high, the base film as a support may tear when the cleaning sheet is peeled off.

The structure of the ordinary pressure-sensitive adhesive layer is not particularly limited, but it is preferable to use a polymer in which the weight average molecular weight of the polymer contained in the pressure-sensitive adhesive layer is 10 ⁵ or less and 10% by weight or less. desirable. The polymer constituting the pressure-sensitive adhesive may be an acrylic polymer obtained by copolymerization in an aqueous dispersion system or a polymerized product obtained by copolymerization in a solution such as toluene. Alternatively, a polymer synthesized in liquid carbon dioxide or carbon dioxide in a supercritical state may be used. An acrylic polymer is particularly preferably used as the polymer. As a monomer mixture that can be a raw material of an acrylic polymer, as the (meth) acrylic acid alkyl ester, various acrylic acid alkyl esters or methacrylic acid alkyl esters, which are alkyl groups having 1 to 18 carbon atoms, can be used. Is methyl acrylate,
Examples thereof include ethyl acrylate, propyl acrylate, butyl acrylate, 21-ethylhexyl acrylate, octyl acrylate, butyl methacryl, 21-ethylhexyl methacrylate and octyl methacrylate. Such (meth) acrylic acid alkyl ester may be used alone, or may be used as a main component in combination with other monomer copolymerizable therewith. A typical example is a carboxyl group-containing ethylenically unsaturated monomer. As examples thereof, (meth) acrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid and the like are used, of which acrylic acid is particularly suitable. This carboxyl group-containing ethylenically unsaturated monomer is an essential component for causing cross-linking in the polymer. As the other monomer, any of various monomers known as a monomer for modifying an acrylic pressure-sensitive adhesive such as vinyl acetate, styrene, acrylonitrile, cyclic (meth) acrylamide, and acyclic methacrylamide can be used. is there. It is preferable from the viewpoint of adhesive properties that the other monomers mentioned as these examples be 50% by weight or less in the total amount with the main monomer.

The polymerization reaction can be carried out with the aid of an initiator which decomposes to form radicals, and it is possible to use all the initiators used for radical polymerization. By way of example, especially at temperatures between 40 and 100 ° C., dibenzoyl peroxide, tert-butyl permaleate, 2,21-azobis- (isobutyronitrile) and azobis-isovaleronitrile are used. 20 ~
A binary initiator (Redox initiator) is used at a temperature of 40 ° C., and examples thereof include a binary system of dibenzoyl peroxide and dimethylaniline. The initiator may be used in the usual amounts for the polymerization of the acrylic monomers. 10
For example, 0.005 to 10 parts by weight, preferably 0.1 to 5 parts by weight of initiator are used per 0 parts by weight of the monomer. When toluene, ethyl acetate or the like is used as the diluent, the copolymerization can be carried out in a reaction vessel equipped with a cooling pipe, a nitrogen introducing pipe, a thermometer and a stirring device. in this case,
For example, the diluent is 5 per 100 parts by weight of the total monomer components
It is possible to polymerize at about 2000 parts by weight, preferably about 20 to 900 parts by weight, and the temperature and time of the polymerization can be set as necessary. When carbon dioxide is used as a diluent, polymerization can be carried out in the same amount as described above with respect to 100 parts by weight of all monomer components, and the pressure and temperature of the polymerization may be set in several stages as necessary. . The method of emulsion polymerization is not particularly limited, and emulsion polymerization can be carried out by any method depending on the purpose and application, such as batch charging of a monomer mixture emulsion-dispersed in water or a dropping method. In this emulsion polymerization,
As the emulsifier, it is desirable to use a nonionic surfactant and / or an anionic surfactant. Depending on the required particle size, the amount used is 0.3 to 30 parts by weight in the case of using the nonionic surfactant or the anionic surfactant alone, based on 100 parts by weight of the total amount of monomers, and when using both in combination. Of the former is 0.2 to 20 parts by weight, and the latter is 0.1 to 10 parts by weight. Examples of the nonionic surfactant include polyoxyethylene alkyl ether, polyoxyethylene alkylphenyl ether, polyoxyethylene-polyoxypropylene block copolymer, sorbitan fatty acid ester, polyoxyethylene fatty acid ester and the like. On the other hand, as the anionic surfactant, alkyl sulfate, alkyl benzene sulfonate, alkyl sulfosuccinate, polyoxyethylene alkyl sulfate, polyoxyethylene alkyl phosphate, etc. are used.

The pressure-sensitive adhesive synthesized by the above method may be used as it is, but usually a crosslinking agent is blended for the purpose of improving the cohesive force of the pressure-sensitive adhesive. The cross-linking structure of the pressure-sensitive adhesive can be obtained by adding a polyfunctional (meth) acrylate as an internal cross-linking agent when obtaining an acrylic polymer or by obtaining an acrylic polymer and then as a poly-functional external cross-linking agent. It can be carried out by adding the epoxy compound or the isocyanate compound. In addition, crosslinking treatment by irradiation with radiation may be performed. Preferably, a polyfunctional epoxy compound or a polyfunctional isocyanate compound is used. The polyfunctionality referred to here is bifunctional or higher. The polyfunctional epoxy compound has two or more epoxy groups in the molecule, and is sorbitol tetraglycidyl ether, trimethylolpropane glycidyl ether, tetraglycidyl-1,3-bisaminomethylcyclohexane. , Tetraglycidyl metaxylene diamine,
Triglycidyl-p-aminophenol and the like. Polyfunctional isocyanate compounds have two or more isocyanate groups in the molecule, and include diphenylmethane diisocyanate, tolylene diisocyanate, and hexamethylene diisocyanate. is there. These crosslinkers are
Depending on the composition and molecular weight of the acrylic copolymer, one or two or more thereof are used at a use ratio such that the gel fraction of the pressure-sensitive adhesive falls within the above range. At that time, in order to accelerate the reaction, dibutyltin laureate, which is usually used as an adhesive, is used.
You may make it add a crosslinking catalyst, such as G. The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is about 5 to 100 μm, preferably about 10 to 50 μm.

The cleaning layer in the cleaning sheet of the present invention is not particularly limited, but its tensile elastic modulus (according to the test method JIS K7127) is preferably 10 Mpa or more, more preferably 10 Mpa to 2000 Mpa. This tensile elastic modulus is 2000 MPa
If it exceeds 10 Mpa, the performance of removing foreign matter adhering to the carrying system is deteriorated, and if it is less than 10 MPa, it may adhere to the portion to be cleaned in the apparatus during carrying, resulting in carrying trouble. The material of the cleaning layer is not particularly limited as long as the tensile elastic modulus is in the above range, but it is cured by active energy such as ultraviolet rays or heat and crosslinked to form a three-dimensional network structure of the cleaning layer to lower the adhesive strength. Alternatively, the disappeared pressure-sensitive adhesive layer is preferable. When a pressure-sensitive adhesive that is polymerized and cured is used for the cleaning layer, the cleaning layer has substantially no tackiness, and there is an effect that it can be reliably transported without being strongly adhered to the apparatus contact portion during transportation. Examples of the active energy source used for curing the pressure-sensitive adhesive layer include ultraviolet rays and heat, and ultraviolet rays are preferable.

The material of the cleaning layer is not particularly limited as long as it has the property of being hardened by an active energy source and having a three-dimensional network structure in its molecular structure. For example, a pressure-sensitive adhesive polymer may have an unsaturated saturation in the molecule. Those containing a polymerizable unsaturated compound having one or more double bonds and a polymerization initiator are preferable. Examples of the pressure-sensitive adhesive polymer include (meth) acrylic acid selected from acrylic acid, acrylic acid ester, methacrylic acid, and methacrylic acid ester, and / or an acrylic polymer having (meth) acrylic acid ester as a main monomer. . In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is used in the acrylic polymer after synthesis. By introducing an unsaturated double bond into the molecule of the acrylic polymer, such as by forming a chemical bond through a reaction between functional groups, so that this polymer itself also participates in the polymerization-curing reaction with active energy. You can also

Here, the compound having one or more unsaturated double bonds in the molecule (hereinafter referred to as a polymerizable unsaturated compound) is a low molecular weight compound which is nonvolatile and has a weight average molecular weight of 10,000 or less. In particular, it preferably has a molecular weight of 5000 or less so that the three-dimensional reticulation of the adhesive layer during curing can be efficiently performed. Here, the polymerizable unsaturated compound is preferably a non-volatile and low molecular weight substance having a weight average molecular weight of 10,000 or less, and particularly, in order to efficiently perform three-dimensional reticulation of the cleaning layer during curing, It preferably has a molecular weight of 5,000 or less. As such a polymerizable compound, for example,
Phenoxy polyethylene glycol (meth) acryl-
, Ε-caprolactone (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, trimethylol
Examples include lupropane tri (meth) acrylate, dipentaerythritol luhexa (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, oligoester (meth) acrylate, and the like. Among these, 1 type (s) or 2 or more types are used. The polymerization initiator added to the pressure-sensitive adhesive layer is not particularly limited, and known ones can be used. For example, when heat is used as active energy, a thermal polymerization initiator such as benzoyl peroxide or azobisisobutyronitrile. When using light, benzoyl, benzoin ethyl ether, cibenzyl, isopropyl benzoin ether, benzophenone, Michler's ketone chlorothioxanthone, dodecyl thioxanthone, cymethyl thioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α
—Photopolymerization initiators such as hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl propane, and 2,2-dimethoxy-2-phenylacetophenone. Further, the thickness of the adhesive layer is not particularly limited,
Usually, it is about 5 to 100 μm.

The support for supporting the cleaning layer is not particularly limited, but examples thereof include polyolefin resins such as polyethylene and polypropylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polyimide, polyamide, polycarbodiimide, nylon film and the like. Examples include plastic films and metal foils. These supports may be one or two
One or more kinds may be used in combination, or one or both surfaces may be subjected to surface treatment such as corona treatment. The thickness of the support film is usually 10 μm to 100 μm
It is a degree.

A separator film may be provided as a protective film on the usual pressure-sensitive adhesive layer and cleaning layer.
In this case, the separator film is not particularly limited, for example, polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, etc. which have been release-treated with a silicone-based, long-chain alkyl-based, fluorine-based, fatty acid amide-based, silica-based release agent or the like. Polyolefin, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane,
Examples thereof include ethylene vinyl acetate copolymers, ionomer resins, ethylene / (meth) acrylic acid copolymers, ethylene / (meth) acrylic acid ester copolymers, polystyrene, and plastic films made of polycarbonate and the like. The thickness of the separator film is usually 1
It is 0 to 100 μm.

According to the present invention, the above-mentioned cleaning layer is provided on one side of the support, and the other side is provided with a regular pressure-sensitive adhesive layer having a specific holding force so that it can be peeled off on a long separator. A label sheet with a cleaning function, which is continuously provided at intervals, is also provided.

The carrying member to which the cleaning sheet is attached is not particularly limited, and examples thereof include semiconductor wafers, flat panel display substrates such as LCDs and PDPs, and substrates such as compact disks and MR heads.

EXAMPLES The present invention will be described below based on examples, but the present invention is not limited thereto. In the following, "parts" means "parts by weight" and "%" means "% by weight". Further, the adhesive holding force, the adhesive force with respect to silicon, and the organic foreign matter contamination with respect to the wafer were evaluated by the following methods. <Adhesive holding power> It was performed based on JIS Z0237. That is, a 25 mm × 75 mm measuring sheet was prepared from the cleaning sheets prepared in Examples and Comparative Examples, and a normal pressure-sensitive adhesive layer was polished at a temperature of 23 ° C. and a humidity of 50% with a stainless steel plate (SUS304 and polished with # 360 sandpaper). 1) so that the adhesive area is 25 mm × 25 mm
A 9.6N rubber roll is reciprocated once and crimped. After leaving it for 20 minutes or more, put it in a constant temperature bath at 40 ° C, fix one end of the stainless plate with a clasp, and after 20 minutes, apply a load of 9.8 N in the shear direction and shift distance after 1 hour or drop time. Was measured.

<Adhesiveness to Silicon> The usual adhesive layers of the cleaning sheets prepared in Examples and Comparative Examples were pressure-bonded to the silicon wafer (mirror surface) by reciprocating a 19.6 N roller once and left for 30 minutes. After that, 180 degree peeling adhesion to the silicon wafer in normal state (N / 10mm width)
Was measured. The peeling speed is 300 mm / mi
n. And

<Organic Contamination Against Wafer> The ordinary pressure-sensitive adhesive layer of the cleaning sheets prepared in Examples and Comparative Examples was attached to a silicon wafer (mirror surface), left at 40 ° C. for 1 day, and then the sheet pieces were peeled off. The organic matter transferred onto the wafer is ES
It measured using CA (model 5400 ULVAC-PHI company make). A wafer without any sheet attached was also analyzed in the same manner, and the transfer amount of the organic substance was evaluated based on the detected increase amount of carbon atoms.

Reference Example 1 73 parts of 2-ethylhexyl acrylate and acrylic acid were placed in a three-necked flask type reactor having a thermometer, a stirrer, a nitrogen introducing tube and a reflux cooling tube and a content of 500 ml. n-butyl 10 parts, N, N-dimethylacrylamide 15 parts and acrylic acid 5 parts, 2,2'-azobisisobutyronitrile as a polymerization initiator 0.
15 parts and 100 parts of ethyl acetate were mixed and added so that the total amount became 200 g, and the mixture was stirred while introducing nitrogen gas for about 1 hour, and the air inside was replaced with nitrogen. After that, the internal temperature was set to 58 ° C., and in this state, polymerization was carried out by holding for about 4 hours to obtain a pressure-sensitive adhesive polymer solution of Reference Example 1. The weight average molecular weight of this polymer measured by gel permeation chromatography was 930,000, and the component having a weight average molecular weight of 100,000 or less was 7.5% by weight.

(Reference Example 2) n-butyl acrylate 100 was placed in a three-necked flask type reactor having a thermometer, a stirrer, a nitrogen introducing tube and a reflux cooling tube and having an internal capacity of 500 ml.
Part, acrylic acid 5 parts, 2,2′-azobisisobutyronitrile 0.1 part, ethyl acetate 200 parts, the total is 200
The mixture was added so that the amount became g, and the mixture was agitated while introducing nitrogen gas for about 1 hour to replace the internal air with nitrogen. After that, the internal temperature was set to 60 ° C., and in this state, the polymerization was carried out by holding for about 6 hours to obtain a pressure-sensitive adhesive polymer solution of Reference Example 2. The weight average molecular weight of this polymer measured by gel permeation chromatography was 1650,000, and the content of the component having a weight average molecular weight of 100,000 or less was 13.1% by weight.

Example 1 Acrylic polymer (weight average molecular weight 700,000) obtained from a monomer mixture liquid consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate, and 5 parts of acrylic acid.
For 100 parts, polyethylene glycol 200 dimethacrylate (manufactured by Shin Nakamura Chemical Co., Ltd .: trade name: Nk ester 4
G) 50 parts, urethane acrylate (manufactured by Shin-Nakamura Chemical: product name: UN-01) 50 parts, polyisocyanate compound (manufactured by Nippon Polyurethane Industry: product name: Coronate L)
3 parts and 3 parts of benzyl dimethyl ketal (manufactured by Ciba Specialty Chemicals: trade name: Irgacure 651) as a photopolymerization initiator were uniformly mixed to prepare an ultraviolet-curable adhesive solution. 3 parts of a polyisocyanate compound was added to 100 parts of the pressure-sensitive adhesive polymer solution prepared in Reference Example 1 and stirred uniformly. Width of the solution 25
A continuous polyester support film having a thickness of 0 mm and a thickness of 25 μm was coated on one surface so as to have a thickness after drying of 15 μm and provided with an ordinary pressure-sensitive adhesive layer, and a 38 μm-thick silicone-treated polyester release film A was provided on the surface Pasted. On the other side of the support film, the above-mentioned UV-curable pressure-sensitive adhesive solution was applied so as to have a thickness after drying of 30 μm to provide a pressure-sensitive adhesive layer as a cleaning layer, and a similar long release film was provided on the surface thereof. Pasted together Next, a cleaning sheet 1 was prepared by irradiating ultraviolet rays having a central wavelength of 365 nm with an integrated light amount of 1000 mJ / cm ² .

The tensile modulus of elasticity (test method JIS K7127) of this UV-curable pressure-sensitive adhesive was measured.
It was 49 Mpa after irradiation with J / cm ² . The normal pressure-sensitive adhesive layer separator film of the cleaning sheet 1 was peeled off, and the pressure-sensitive adhesive layer holding force and the 180 ° peeling pressure-sensitive adhesive force to the silicon wafer (mirror surface), and the amount of organic contaminants on the silicon wafer were measured. Is shown in Table 1.

Next, using this cleaning sheet 1,
The sheet was attached to the wafer to prepare a cleaning member. The cleaning sheet 1 was attached to the mirror surface of an 8-inch silicon wafer with a hand roller, and the sheet was cut into a silicon wafer shape to fabricate a cleaning member 1 for transportation with a cleaning function. This cleaning member 1
Was stored in a thermostatic chamber at 50 ° C for 7 days and observed over time, but there was no problem in appearance and no problem at all.

On the other hand, when a foreign substance of 0.2 μm or more on the mirror surface of four new 8-inch silicon wafers was measured with a laser type foreign substance measuring device, one was 8 and the second was 11
The number of the third sheet was 9, and the number of the fourth sheet was 5. After these wafers were transferred to a substrate processing apparatus having different electrostatic attraction mechanisms with the mirror surface facing down, and foreign particles of 0.2 μm or larger were measured by a laser-type foreign particle measuring apparatus. The first is 28559 in the area, the second is 30115, the third is 27865, and the fourth is 3.
It was 1732. Next, the release film on the cleaning layer side of the cleaning member 1 obtained above was peeled off, and the peeling film was conveyed into the substrate processing apparatus having the wafer stage on which the 28,559 foreign matters had adhered. After that, a new 8-inch silicon wafer was conveyed with the mirror surface facing downward, and a foreign substance of 0.2 μm or more was measured by a laser type foreign substance measuring device. This operation was performed 5 times, and the dust-removing property (%) after that is shown in Table 1.

Example 2 A cleaning sheet 2 was prepared in the same manner as in Example 1 except that a silicone-treated polyester-based release film B was used as the release film on the normal pressure-sensitive adhesive side.
The separator film of the pressure-sensitive adhesive layer of the cleaning sheet 2 was peeled off, the holding force of the pressure-sensitive adhesive layer and the 180 ° peeling pressure-sensitive adhesive force to the silicon wafer (mirror surface), and the amount of organic contamination on the silicon wafer were measured, and the results are shown in Table 1. It was shown to.

Next, using this cleaning sheet 2,
The sheet was attached to the wafer in the same manner as in Example 1 to produce a cleaning member. The cleaning sheet 2 was attached to the mirror surface of an 8-inch silicon wafer with a hand roller, and the sheet was cut into a silicon wafer shape to fabricate a transport cleaning member 2 with a cleaning function. The cleaning member 2 was stored in a thermostatic chamber at 50 ° C. for 7 days and then observed over time, but no defect in appearance was observed and there was no problem.

Next, the release film on the cleaning layer side of the transport cleaning member 2 obtained above was peeled off and transported to the substrate processing apparatus having the wafer stage on which the above-mentioned 30115 foreign matters had adhered, and the transport was carried out without any trouble. did it. After that, the 8-inch silicon wafer is conveyed with the mirror surface facing down, and 0.2μ is measured by the laser-type foreign matter measuring device.
Foreign matter of m or more was measured. This operation was performed 5 times.

Comparative Example 1 Cleaning sheet 3 was prepared in the same manner as in Example 1 except that the pressure-sensitive adhesive polymer of Reference Example 2 was used as the normal pressure-sensitive adhesive layer.
Was produced. The separator film of the adhesive layer of the cleaning sheet 3 is peeled off, and the adhesive force of the adhesive layer and the 180 ° peeling adhesive force to the silicon wafer (mirror surface),
And measure the amount of organic contaminants on the silicon wafer,
The results are shown in Table 1.

Next, using this cleaning sheet 3,
The sheet was attached to the wafer in the same manner as in Example 1 to produce a cleaning member. The cleaning sheet 3 was attached to the mirror surface of an 8-inch silicon wafer with a hand roller, and the sheet was cut into a silicon wafer shape to fabricate a transport cleaning member 3 with a cleaning function. When this cleaning member 3 was stored in a thermostatic chamber at 50 ° C. for 7 days and was observed over time, the edge of the cleaning sheet was peeled off from the wafer by about 5 mm after one day, and a defective appearance occurred. The cleaning member 3 was judged to be unusable as a cleaning member, and cleaning was stopped.

Comparative Example 2 In the same manner as in Example 1 except that the pressure-sensitive adhesive polymer of Reference Example 2 was used as the normal pressure-sensitive adhesive layer, and the silicone-treated polyester release film B was used as the separator film of the normal pressure-sensitive adhesive layer. A cleaning sheet 4 was prepared. The separator film of the pressure-sensitive adhesive layer of the cleaning sheet 4 was peeled off, the holding force of the pressure-sensitive adhesive layer, the 180 ° peeling pressure-sensitive adhesive force to the silicon wafer (mirror surface), and the amount of organic contaminants on the silicon wafer were measured, and the results are shown in Table 1. It was shown to.

Next, using this cleaning sheet 4,
The sheet was attached to the wafer in the same manner as in Example 1 to produce a cleaning member. The cleaning sheet 4 was attached to the mirror surface of an 8-inch silicon wafer with a hand roller, and the sheet was cut into a silicon wafer shape to fabricate a transport cleaning member 4 with a cleaning function. When this cleaning member 4 was stored in a thermostatic chamber at 50 ° C. for 7 days and observed over time, the edge of the cleaning sheet was peeled off from the wafer by about 5 mm after one day, and a defective appearance occurred. The cleaning member 4 was judged to be unusable as a cleaning member, and cleaning was stopped.

[0036]

[0037]

As described above, according to the cleaning sheet of the present invention, it is possible to prevent the cleaning sheet from peeling off from the carrying member, and also to suppress the contamination of the carrying member after peeling and removing, and the substrate processing apparatus. It is possible to provide a cleaning sheet that can be reliably transported inside and can easily and reliably remove foreign matter adhering to the inside of the apparatus.

Claims (6)

[Claims] 1. A cleaning sheet comprising a support having a cleaning layer on one surface and a normal pressure-sensitive adhesive layer on the other surface, wherein the normal pressure-sensitive adhesive layer has a holding power of JIS Z0.
The cleaning sheet according to 237, wherein the deviation distance after 3600 seconds is 5 mm or less. 2. An ordinary adhesive layer has a 180 ° peeling adhesive strength of 0.01 to a silicon wafer (mirror surface).
The cleaning sheet according to claim 1, wherein the cleaning sheet has a size of 10 N / 10 mm. 3. An ordinary pressure-sensitive adhesive layer contains 1 component containing a polymer having a weight average molecular weight of 10 ⁵ or less contained in the pressure-sensitive adhesive layer.
The cleaning sheet according to claim 1, wherein the cleaning sheet is 0% by weight or less. 4. The cleaning sheet according to claim 1, wherein the tensile elastic modulus of the cleaning layer (based on a test method JIS K7127) is 10 MPa or more. 5. A carrying member having a cleaning function, wherein the cleaning sheet according to any one of claims 1 to 4 is provided on the carrying member by an ordinary pressure-sensitive adhesive layer. 6. A method for cleaning a substrate processing apparatus, which comprises transporting the cleaning sheet according to claim 1 or the transport member according to claim 5 into a substrate processing apparatus.