JP2003270496A - Optical transmitting / receiving module, mounting method thereof, and optical transmitting / receiving device - Google Patents

Optical transmitting / receiving module, mounting method thereof, and optical transmitting / receiving device

Info

Publication number
JP2003270496A
JP2003270496A JP2002075419A JP2002075419A JP2003270496A JP 2003270496 A JP2003270496 A JP 2003270496A JP 2002075419 A JP2002075419 A JP 2002075419A JP 2002075419 A JP2002075419 A JP 2002075419A JP 2003270496 A JP2003270496 A JP 2003270496A
Authority
JP
Japan
Prior art keywords
light
optical fiber
emitting element
optical
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002075419A
Other languages
Japanese (ja)
Other versions
JP4006249B2 (en
Inventor
Sachiko Takeuchi
幸子 竹内
Koji Oura
浩二 大浦
Hitomaro Togo
仁麿 東郷
Hiroaki Asano
弘明 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2002075419A priority Critical patent/JP4006249B2/en
Publication of JP2003270496A publication Critical patent/JP2003270496A/en
Application granted granted Critical
Publication of JP4006249B2 publication Critical patent/JP4006249B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Landscapes

  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Communication System (AREA)

Abstract

(57)【要約】 【課題】 発光素子及び受光素子と光ファイバとの光学
結合が、1個の集光レンズを用いた1回の調整(アライ
メント)のみで実現でき、また小型化が容易な光送受信
モジュール及びその実装方法、並びに光送受信装置を提
供する。 【解決手段】 光ファイバ109で双方向に伝送される
光を送受信するに当たり、光の進行経路に沿ってそれぞ
れ基部から突出する第1の突起部101b及び第2の突
起部101cが形成され、第1の突起部は切欠き104
aを有し、第2の突起部は第1の平面102を有し、さ
らに、第1の突起部は切欠きの底部に第2の平面106
を、第2の突起部と対向する側に第1の斜面104を有
する立体回路基板101Aと、第1の平面上に実装され
た送信用の発光素子103と、 第2の平面上に実装さ
れた受信用の受光素子107と、第1の斜面上に装着さ
れた光学膜部材105と、光ファイバと立体回路基板と
の間の光の進行経路に設けられた集光レンズ108とを
備える。
(57) [Problem] To achieve optical coupling between a light emitting element and a light receiving element and an optical fiber by only one adjustment (alignment) using one condensing lens, and it is easy to reduce the size. Provided are an optical transceiver module, a method for mounting the same, and an optical transceiver. SOLUTION: When transmitting and receiving light transmitted bidirectionally through an optical fiber 109, a first protrusion 101b and a second protrusion 101c are formed, respectively, protruding from a base along a light traveling path. 1 is a notch 104
a, the second protrusion has a first flat surface 102, and the first protrusion has a second flat surface 106 at the bottom of the notch.
A three-dimensional circuit board 101A having a first slope 104 on a side facing the second protrusion, a light emitting element 103 for transmission mounted on a first plane, and a light emitting element 103 mounted on a second plane. A light receiving element 107 for reception, an optical film member 105 mounted on the first slope, and a condenser lens 108 provided on a light traveling path between the optical fiber and the three-dimensional circuit board.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は光ファイバ伝送路に
接続して、光信号を送受信する光送受信モジュール(光
加入者線終端装置)及びその実装方法、並びに光送受信
装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical transceiver module (optical subscriber line terminating device) which is connected to an optical fiber transmission line to transmit and receive an optical signal, a mounting method thereof, and an optical transceiver device.

【0002】[0002]

【従来の技術】光伝送システムにおいて、1本の光ファ
イバを用いて双方向伝送を行う場合には、発光素子から
出射される送信光を光ファイバに結合し、また、その光
ファイバから出射される受信光を受光素子へ結合する必
要があるが、その結合方法に関して、様々な方法が提案
されている。
2. Description of the Related Art In an optical transmission system, when bidirectional transmission is performed using a single optical fiber, transmission light emitted from a light emitting element is coupled to the optical fiber and emitted from the optical fiber. It is necessary to couple the received light to the light receiving element, and various methods have been proposed for the coupling method.

【0003】図16は特開2000−180671号公
報に開示された従来の光信号伝送系における光送受信モ
ジュールの概略構成図である。同図において、光ファイ
バ42を内蔵するフェルール41の先端面の光軸上に、
第1の波長λ1の光を光軸方向に通過させ、かつ第2の
波長λ2の光を光軸と垂直方向に反射させるプリズム形
の波長合分波カプラ43を固定するとともに、前記光軸
方向及び光軸と垂直方向にそれぞれ発光素子22、受光
素子31を配置し、これらを単一のケース部材11で固
定支持しており、また、波長合分波カプラ43と発光素
子22、受光素子31との間の各光軸上にそれぞれ単一
のレンズ13、33が配置されている。発光素子22か
らの波長λ1の送信光は波長合分波カプラ43をそのま
ま光軸方向に通過して光ファイバ42に送信される。一
方、光ファイバ42からの波長λ2の受信光は波長合分
波カプラ43で光軸と垂直方向に反射され、受光素子3
1で受信される。
FIG. 16 is a schematic configuration diagram of an optical transmission / reception module in a conventional optical signal transmission system disclosed in Japanese Patent Laid-Open No. 2000-180671. In the figure, on the optical axis of the tip surface of the ferrule 41 containing the optical fiber 42,
A prism type wavelength multiplexing / demultiplexing coupler 43 that allows light of the first wavelength λ1 to pass through in the optical axis direction and reflects light of the second wavelength λ2 in the direction perpendicular to the optical axis is fixed, and at the same time, in the optical axis direction. Further, the light emitting element 22 and the light receiving element 31 are respectively arranged in the direction perpendicular to the optical axis, and these are fixedly supported by the single case member 11, and the wavelength multiplexing / demultiplexing coupler 43, the light emitting element 22, and the light receiving element 31 are also provided. A single lens 13, 33 is arranged on each optical axis between and. The transmission light of wavelength λ1 from the light emitting element 22 passes through the wavelength multiplexing / demultiplexing coupler 43 as it is in the optical axis direction and is transmitted to the optical fiber 42. On the other hand, the received light of wavelength λ2 from the optical fiber 42 is reflected by the wavelength multiplexing / demultiplexing coupler 43 in the direction perpendicular to the optical axis, and the light receiving element 3
Received at 1.

【0004】[0004]

【発明が解決しようとする課題】上述した従来の光送受
信モジュールにおいては、発光素子22と光ファイバ4
2とを高精度で光結合させるため、及び、受光素子31
と光ファイバ42とを高精度で光結合させるために、2
つのレンズ13、33やフェルール41を微調整する必
要があり、調整箇所が多いことに加えて、発光素子22
及び受光素子31をそれぞれ円筒型のパッケージに実装
して、ケース部材11で固定するため、モジュールの小
型化が困難であった。
In the above-mentioned conventional optical transceiver module, the light emitting element 22 and the optical fiber 4 are used.
2 and the light receiving element 31
In order to optically couple the optical fiber 42 and the optical fiber 42 with high accuracy, 2
It is necessary to finely adjust the two lenses 13 and 33 and the ferrule 41, and in addition to the large number of adjustment points, the light emitting element 22
Since the light receiving element 31 and the light receiving element 31 are mounted in a cylindrical package and fixed by the case member 11, it is difficult to reduce the size of the module.

【0005】本発明は、上記従来装置の課題を解決する
ためになされたもので、発光素子及び受光素子と光ファ
イバとの光学結合が、1個の集光レンズを用いた1回の
調整(アライメント)のみで実現でき、また小型化が容
易な光送受信モジュール及びその実装方法、並びに光送
受信装置を提供することを目的とする。
The present invention has been made in order to solve the above-mentioned problems of the conventional apparatus, and the optical coupling between the light emitting element and the light receiving element and the optical fiber is adjusted once by using one condenser lens ( It is an object of the present invention to provide an optical transmission / reception module that can be realized only by alignment) and can be easily miniaturized, a method for mounting the same, and an optical transmission / reception device.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、請求項1に係る発明は、光ファイバで双方向に伝送
される光を、光ファイバの一端部にて送受信するに当た
り、光の進行経路に沿って基部から突出する第1の突起
部及び第2の突起部が形成され、第1の突起部は光の進
行経路となる切欠きを有し、第2の突起部は第1の平面
を有し、さらに、第1の突起部は切欠きの底部に第2の
平面、及び第2の突起部と対向する側に第1の斜面を有
する立体回路基板と、第1の平面上に実装された送信用
の発光素子と、第2の平面上に実装された受信用の受光
素子と、第1の斜面上に装着された光学膜部材と、光フ
ァイバと立体回路基板との間の光の進行経路に設けられ
た集光レンズとを備えたものである。上記構成により、
発光素子、受光素子、光学膜部材を1つの立体回路基板
上に集積化することにより小型化できるとともに、発光
素子、受光素子と光ファイバとの光学的結合が、1つの
集光レンズを用いた1回の調整(アライメント)のみで
実現できる。
In order to achieve the above object, the invention according to claim 1 is characterized in that when transmitting and receiving light transmitted bidirectionally through an optical fiber at one end of the optical fiber, A first protrusion and a second protrusion protruding from the base are formed along the traveling path, the first protrusion has a notch that serves as a light traveling path, and the second protrusion is the first protrusion. And a first projection having a second flat surface on the bottom of the notch and a first sloped surface on the side facing the second projection, and the first flat surface. Of the light emitting element for transmission mounted on the top, the light receiving element for reception mounted on the second plane, the optical film member mounted on the first slope, the optical fiber and the three-dimensional circuit board. And a condensing lens provided in the light traveling path between them. With the above configuration,
The light emitting element, the light receiving element, and the optical film member can be miniaturized by integrating them on one three-dimensional circuit board, and the optical coupling between the light emitting element, the light receiving element and the optical fiber uses one condenser lens. It can be realized with only one adjustment (alignment).

【0007】請求項2に係る発明は、光学膜部材として
ハーフミラーを用い、発光素子から出射した光がハーフ
ミラーを一定の割合で通過し、集光レンズで集光されて
光ファイバに入射し、光ファイバから出射した光が集光
レンズで集光され、ハーフミラーで一定の割合で反射し
て受光素子に入射するようにしたものである。このよう
に構成したことにより、同一波長での時間多重通信用送
受信モジュールに適用することができる。
According to a second aspect of the present invention, a half mirror is used as the optical film member, light emitted from the light emitting element passes through the half mirror at a constant rate, is condensed by a condenser lens and is incident on the optical fiber. The light emitted from the optical fiber is condensed by a condenser lens, reflected by a half mirror at a constant rate, and incident on a light receiving element. With such a configuration, it can be applied to a transceiver module for time-division communication with the same wavelength.

【0008】請求項3に係る発明は、光ファイバが互い
に波長の異なる光を双方向に伝送するとき、光学膜部材
として、光ファイバより出射され、集光レンズで集光さ
れた受信光を全反射して受光素子に入射させ、発光素子
から出射する送信光を全透過して集光レンズで集光して
光ファイバに入射させる波長フィルタを用いたものであ
る。このように構成したことにより、発光素子の出射光
及び受光素子の入射光の損失を低減でき、送信波長と受
信波長が異なるため、同時に送受信できる波長多重通信
用送受信モジュールに適用することができる。
According to the third aspect of the invention, when the optical fibers bidirectionally transmit lights having different wavelengths, all the received light emitted from the optical fiber and condensed by the condenser lens is used as an optical film member. A wavelength filter is used which reflects the reflected light to enter the light receiving element, transmits all the transmitted light emitted from the light emitting element, collects the collected light with a condenser lens, and enters the optical fiber. With such a configuration, it is possible to reduce the loss of the light emitted from the light emitting element and the light incident to the light receiving element, and since the transmission wavelength and the reception wavelength are different, it is possible to apply to a transmitter / receiver module for wavelength multiplexing communication capable of transmitting and receiving at the same time.

【0009】請求項4に係る発明は、受光素子の周囲を
光学的に他から遮断する額縁状の突起を設け、受信光の
みを透過する波長フィルタによって、突起の開放端を覆
ったものである。このように構成したことにより、発光
素子の出射光の受光素子へのもれこみを遮断でき、光ク
ロストークを改善することができる。
According to a fourth aspect of the present invention, a frame-shaped protrusion that optically shields the periphery of the light receiving element from the other is provided, and the open end of the protrusion is covered with a wavelength filter that transmits only received light. . With this configuration, it is possible to block the leakage of the light emitted from the light emitting element into the light receiving element, and improve the optical crosstalk.

【0010】請求項5に係る発明は、受信波長帯域のみ
高い光感度をもつ受光素子を用いたものである。このよ
うに構成したことにより、発光素子の出射光に対する受
光素子の受光感度を抑えることができ、光クロストーク
を改善することができる。
The invention according to claim 5 uses a light-receiving element having a high optical sensitivity only in the reception wavelength band. With this configuration, the light receiving sensitivity of the light receiving element with respect to the emitted light of the light emitting element can be suppressed, and the optical crosstalk can be improved.

【0011】請求項6に係る発明は、送信光を出射する
発光素子の後背部の第1の平面上に、発光素子の後方出
射光の受光を可能に実装された出力モニタ用受光素子を
備えたものである。このように構成したことにより、出
力モニタ機能を備えた光送受信モジュールをより一層小
型化することができる。
According to a sixth aspect of the invention, there is provided an output monitor light receiving element mounted on the first back surface of the light emitting element for emitting the transmission light so as to be capable of receiving the rearward emitted light of the light emitting element. It is a thing. With this configuration, it is possible to further reduce the size of the optical transceiver module having the output monitor function.

【0012】請求項7に係る発明は、立体回路基板が、
第2の突起部よりも光ファイバから遠い側に形成された
第3の突起部を備え、この第3の突起部は発光素子に対
向して第1の平面に対して所定の角度だけ傾斜した斜面
を有し、この斜面上に発光素子の後方出射光の受光を可
能に実装された出力モニタ用受光素子を備えたものであ
る。このように構成したことにより、発光素子の後方出
射光が出力モニタ用受光素子の端面で反射して発光素子
に戻るのを防ぐことができる。
In the invention according to claim 7, the three-dimensional circuit board is
The third protrusion is formed on the side farther from the optical fiber than the second protrusion, and the third protrusion is inclined by a predetermined angle with respect to the light emitting element with respect to the first plane. An output monitor light receiving element is provided which has an inclined surface and is mounted on the inclined surface so as to be able to receive the backward emission light of the light emitting element. With this configuration, it is possible to prevent the backward emission light of the light emitting element from being reflected by the end surface of the output monitoring light receiving element and returning to the light emitting element.

【0013】請求項8に係る発明は、立体回路基板が、
第2の突起部の後背部に第3の突起部を備え、この第3
の突起部は光の進行経路よりも所定の寸法だけ高く形成
され、第1の平面とほぼ平行な第3の平面と、第3の突
起部の発光素子の後方出射光が照射される中央部が切欠
かれ、その切欠きの底部に第1の平面に対して鈍角に傾
斜し、かつ、反射面が形成された第3の斜面とを有し、
第3の平面上に、発光素子の後方出射光が第3の斜面の
反射面で反射された光の受光を可能に実装された出力モ
ニタ用受光素子を備えたものである。このように構成し
たことにより、発光素子、受光素子、出力モニタ用受光
素子の実装方向が同一であるため、実装を簡略化でき
る。
According to the invention of claim 8, the three-dimensional circuit board is
The third protrusion is provided on the back of the second protrusion,
Of the third projection is formed to be higher than the light traveling path by a predetermined dimension, and the third plane substantially parallel to the first plane and the central portion of the third projection on which the backward emission light of the light emitting element is irradiated. Has a notch, and has a third inclined surface that is inclined at an obtuse angle with respect to the first plane and has a reflective surface formed at the bottom of the notch,
The output monitor light-receiving element is mounted on the third plane so as to be able to receive the light emitted from the light-emitting element rearwardly reflected by the third inclined reflecting surface. With this configuration, the light emitting element, the light receiving element, and the output monitoring light receiving element are mounted in the same direction, so that the mounting can be simplified.

【0014】請求項9に係る発明は、立体回路基板が、
第2の突起部よりも光ファイバから遠い側に形成され、
第1の平面とほぼ平行で、かつ、第1の平面よりも所定
の寸法だけ低く形成された第4の平面と、第4の平面よ
りも光ファイバから遠い側に形成され、発光素子に対向
して第1の平面に対して鋭角に傾斜した反射面を有する
壁部とを備え、第4の平面上に、発光素子の後方出射光
が反射面で反射された光の受光を可能に出力モニタ用受
光素子を実装したものである。このように構成したこと
により、発光素子、受光素子、出力モニタ用受光素子の
実装方向が同一で、かつ2つの受光素子の受光面の方向
も同じであることより、実装を共通化、簡略化すること
ができる。
In the invention according to claim 9, the three-dimensional circuit board is
Formed on the side farther from the optical fiber than the second protrusion,
A fourth plane that is substantially parallel to the first plane and is formed lower than the first plane by a predetermined dimension, and a side farther from the optical fiber than the fourth plane, and faces the light emitting element. And a wall portion having a reflecting surface that is inclined at an acute angle with respect to the first plane, and the rear emission light of the light emitting element can be received on the fourth plane to receive the light reflected by the reflecting surface. A light receiving element for monitoring is mounted. With this configuration, the light emitting element, the light receiving element, and the output monitoring light receiving element have the same mounting direction, and the light receiving surfaces of the two light receiving elements have the same mounting direction. Therefore, the mounting is common and simplified. can do.

【0015】請求項10に係る発明は、立体回路基板
が、発光素子よりも光ファイバから遠い側に形成され、
発光素子の後方出射光を通過させる開口を有する壁部を
備え、壁部の後背面に、開口を通過する後方出射光の受
光を可能に出力モニタ用受光素子を実装したものであ
る。このように構成したことにより、発光素子と出力モ
ニタ用受光素子の距離を短くすることができ、モジュー
ル全体を小型化することができる。
According to a tenth aspect of the present invention, the three-dimensional circuit board is formed on the side farther from the optical fiber than the light emitting element,
A light emitting element is provided with a wall portion having an opening that allows rear emission light to pass therethrough, and an output monitor light receiving element is mounted on the rear surface of the wall portion so as to be able to receive rear emission light that passes through the opening. With this configuration, the distance between the light emitting element and the light receiving element for output monitoring can be shortened, and the entire module can be downsized.

【0016】請求項11に係る発明は、光ファイバで双
方向に伝送される光を、前記光ファイバの一端部にて送
受信するに当たり、送受信する光の進行経路に沿ってそ
れぞれ基部から突出し、光ファイバに近い側に第1の突
起部が、光ファイバから遠い側に第2の突起部が形成さ
れ、かつ、脚部及び腕部で構成された逆「L」字形をな
し、腕部を光ファイバ側に向けて第2の突起部の後方端
部に脚部が結合された金属基板を付帯し、金属基板の腕
部は第1及び第2の突起部間に光の進行経路よりも所定
の寸法だけ高く形成された第1の平面を有し、第1の突
起部は光の進行経路となる切欠きを有し、かつ、切欠き
の底部に第1の平面にほぼ平行で、かつ、第1の平面よ
りも低く形成された第2の平面、及び第2の突起部と対
向する側に第2の平面に対して鋭角の角度を持った第1
の斜面を有する立体回路基板と、第1の平面下に、光の
進行経路に実装された送信用の発光素子と、第2の平面
上に実装された受信用の受光素子と、傾斜面上に装着さ
れた光学膜部材と、光ファイバと立体回路基板との間の
光の進行経路に設けられる集光レンズと、第2の突起部
に実装され、発光素子の後方出射光の受光を可能に実装
された出力モニタ用受光素子とを備えたものである。こ
のように構成したことにより、発光素子の放熱を効率よ
く行い、また発光素子、受光素子の配線間の電気的なク
ロストークを低減させることができる。
In the invention according to claim 11, when transmitting and receiving light transmitted bidirectionally in the optical fiber at one end of the optical fiber, the light is projected from the base along the traveling path of the transmitted and received light, A first protrusion is formed on the side closer to the fiber, and a second protrusion is formed on the side farther from the optical fiber, and the arm has an inverted "L" shape composed of a leg and an arm. A metal substrate having legs coupled to the rear end of the second protrusion toward the fiber side is provided, and the arm of the metal substrate has a predetermined distance between the first and second protrusions with respect to the light traveling path. Has a first plane formed to have a height higher than that of the first projection, the first protrusion has a notch serving as a light traveling path, and is substantially parallel to the first plane at the bottom of the notch, and , A second plane formed lower than the first plane, and a second plane on the side facing the second protrusion. The angled in an acute angle to the surface 1
A three-dimensional circuit board having a sloping surface, a light emitting element for transmission mounted on a light traveling path below the first plane, a light receiving element for reception mounted on a second plane, and a sloping surface. Mounted on the optical film member, a condenser lens provided in the light traveling path between the optical fiber and the three-dimensional circuit board, and mounted on the second protrusion to enable reception of backward emission light of the light emitting element. And a light receiving element for output monitoring mounted on. With such a configuration, it is possible to efficiently dissipate heat from the light emitting element and reduce electrical crosstalk between the wirings of the light emitting element and the light receiving element.

【0017】請求項12に係る発明は、集光レンズを立
体回路基板の光ファイバ側の端面に固着したものであ
る。このように構成したことにより、集光レンズの支持
具が不要で、構成を簡略化することができる。
According to a twelfth aspect of the present invention, a condenser lens is fixed to the end face of the three-dimensional circuit board on the optical fiber side. With this structure, a support for the condenser lens is not required, and the structure can be simplified.

【0018】請求項13に係る発明は、発光素子、受光
素子、光学膜部材及び出力モニタ用受光素子のうち、少
なくとも発光素子、受光素子、光学膜部材を実装した立
体回路基板をパッケージで覆い、パッケージの光ファイ
バ側の開口窓に集光レンズを設けたものである。このよ
うに構成したことにより、封止をするパッケージが集光
レンズの固定具の機能を兼ね備えることができる。
According to a thirteenth aspect of the present invention, among the light emitting element, the light receiving element, the optical film member and the output monitoring light receiving element, at least the light emitting element, the light receiving element and the optical film member are mounted on the three-dimensional circuit board with a package, A condenser lens is provided in the opening window on the optical fiber side of the package. With this configuration, the package to be sealed can also have the function of the fixture for the condenser lens.

【0019】請求項14に係る発明は、上述した光送受
信モジュールを実装するに当たり、立体回路基板に、発
光素子、受光素子及び出力モニタ用受光素子のうち、少
なくとも発光素子及び受光素子を実装して電気的接続を
行う第1の工程と、光学膜及び集光レンズを実装する第
2の工程と、発光素子を発光させ、光ファイバへの結合
効率が最もよくなるように光ファイバの位置を微調整し
て固定する第3の工程とを順を追って行うものである。
上記の方法を採用したことにより、発光素子、受光素子
の光ファイバへの結合をレンズ、光ファイバ間の光学的
調整のみで実現できる。
According to a fourteenth aspect of the invention, in mounting the above-mentioned optical transceiver module, at least the light emitting element and the light receiving element among the light emitting element, the light receiving element and the output monitoring light receiving element are mounted on the three-dimensional circuit board. First step of electrical connection, second step of mounting optical film and condenser lens, light emitting element is made to emit light, and the position of the optical fiber is finely adjusted so as to maximize the coupling efficiency to the optical fiber. Then, the third step of fixing is performed in order.
By adopting the above method, the coupling of the light emitting element and the light receiving element to the optical fiber can be realized only by the optical adjustment between the lens and the optical fiber.

【0020】請求項15に係る発明は、上述したいずれ
か一つの光送受信モジュールを1個又は複数個備えた光
送受信装置である。このように構成したことにより、光
送受信装置を小型化でき、また、光送受信モジュールを
集積化した多ポート光送受信装置を実現することができ
る。
According to a fifteenth aspect of the present invention, there is provided an optical transmitter / receiver including one or a plurality of any one of the optical transmitter / receiver modules described above. With such a configuration, the optical transmitter / receiver can be downsized, and a multiport optical transmitter / receiver in which the optical transmitter / receiver module is integrated can be realized.

【0021】[0021]

【発明の実施の形態】以下、本発明を図面に示す好適な
実施の形態に基づいて詳細に説明する。図1は本発明に
係る光送受信モジュールの第1の実施の形態の側面図で
あり、図2はこの実施の形態を構成する光送受信用の半
導体素子が実装された立体回路基板の斜視図であり、図
3はこの立体回路基板に光学膜部材としてのハーフミラ
ーを実装した平面図である。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in detail based on the preferred embodiments shown in the drawings. FIG. 1 is a side view of a first embodiment of an optical transmitter / receiver module according to the present invention, and FIG. 2 is a perspective view of a three-dimensional circuit board on which a semiconductor element for optical transmitter / receiver constituting this embodiment is mounted. FIG. 3 is a plan view in which a half mirror as an optical film member is mounted on this three-dimensional circuit board.

【0022】ここで、立体回路基板101Aは金型成形
した樹脂などの非金属基板で構成され、略平坦な底面を
有する基部101aに対して部分的に突出した第1の突
起部101bと第2の突起部101cとが形成されてい
る。このうち、第2の突起部101cの頂部の平面、す
なわち、第1の平面102上に送信用の発光素子(L
D)103が実装されており、この発光素子103の光
出射側に形成された第1の突起部101bは、発光素子
103の光軸に対して鋭角を持って上向きに傾斜し、か
つ、発光素子103に対向して形成された第1の斜面1
04を有し、この第1の斜面104上に光学膜部材とし
てのハーフミラー(WDM)105が実装されている。
Here, the three-dimensional circuit board 101A is composed of a non-metal substrate such as a resin molded by a mold, and has a first protrusion 101b and a second protrusion 101b which partially protrude from a base 101a having a substantially flat bottom surface. Projections 101c are formed. Of these, a light emitting element (L for transmission) on the top surface of the second protrusion 101 c, that is, on the first plane 102.
D) 103 is mounted, and the first protrusion 101b formed on the light emitting side of the light emitting element 103 is inclined upward with an acute angle with respect to the optical axis of the light emitting element 103, and emits light. First slope 1 formed facing the element 103
04, and a half mirror (WDM) 105 as an optical film member is mounted on the first slope 104.

【0023】また、第1の斜面104が形成された第1
の突起部101bは、幅方向の中央部が切り欠かれてお
り、その切欠部104aの底部に、第1の平面102よ
りも低い位置で、かつ、第1の平面102と、ほぼ平行
な第2の平面106(第1の斜面104とは鋭角をな
す)が形成され、その平面106上に受信用の受光素子
(PD)107が実装されている。したがって、発光素
子103の出射光の一部はハーフミラー105を透過し
て進むことができ、その先方に集光レンズ108と光フ
ァイバ109とが順に配置されている。
Further, the first sloped surface 104 is formed on the first
The protrusion 101b is notched at the center in the width direction, and is formed at the bottom of the notch 104a at a position lower than the first plane 102 and substantially parallel to the first plane 102. A second flat surface 106 (which makes an acute angle with the first inclined surface 104) is formed, and a light receiving element (PD) 107 for reception is mounted on the flat surface 106. Therefore, a part of the light emitted from the light emitting element 103 can pass through the half mirror 105 and travel therethrough, and the condenser lens 108 and the optical fiber 109 are arranged in that order in front of it.

【0024】上記のように構成された光送受信モジュー
ルの実装手順について以下に説明する。立体回路基板1
01に発光素子103及び受光素子107を、それぞれ
の送受信光がハーフミラーを透過し反射して光ファイバ
に結合できるように位置合わせして、それぞれ第1の平
面102及び第2の平面106上に実装し、その後に電
気的接続をして受、給電できる状態にする。次にハーフ
ミラー105を第1の斜面104上に実装し、さらに、
集光レンズ108を立体回路基板101に対して固定さ
れた図示省略の保持具に実装する。最後に光ファイバ1
09を図示省略の微調整が可能な保持具に実装して発光
素子103及び受光素子107との光学的結合が図られ
る。
The mounting procedure of the optical transceiver module configured as described above will be described below. Three-dimensional circuit board 1
The light emitting element 103 and the light receiving element 107 are aligned with 01 so that the transmitted and received light can be transmitted through the half mirror, reflected, and coupled to the optical fiber, and are respectively placed on the first plane 102 and the second plane 106. After mounting, make electrical connection to receive and supply power. Next, the half mirror 105 is mounted on the first slope 104, and further,
The condenser lens 108 is mounted on a holder (not shown) fixed to the three-dimensional circuit board 101. Finally optical fiber 1
09 is mounted on a holder (not shown) capable of fine adjustment, so that the light emitting element 103 and the light receiving element 107 are optically coupled.

【0025】この光学的結合について詳細に説明する
と、まず、発光素子103を発光させ、光ファイバ10
9の出射光をモニタしておき、立体回路基板101に対
する光ファイバの位置を微調整しつつ、光ファイバ10
9の出力が最も大きくなるところで固定する。ここで、
発光素子103及び受光素子107の光軸が交差する位
置を通り、発光素子、受光素子がハーフミラーの面に対
して対称となる様に実装されるため、受光素子107と
光ファイバ109との光学的結合も同時に実現できる。
以上に述べた実装方法は、以下に説明する他の実施の形
態に対しても同様に適用できる。
This optical coupling will be described in detail. First, the light emitting element 103 is caused to emit light, and the optical fiber 10
The emitted light from the optical fiber 10 is monitored and the position of the optical fiber with respect to the three-dimensional circuit board 101 is finely adjusted while the optical fiber 10
Fix at the point where the output of 9 becomes the largest. here,
Since the light emitting element and the light receiving element are mounted so as to pass through the positions where the optical axes of the light emitting element 103 and the light receiving element 107 intersect and are symmetrical with respect to the plane of the half mirror, the optical coupling between the light receiving element 107 and the optical fiber 109 is performed. The physical combination can be realized at the same time.
The mounting method described above can be similarly applied to other embodiments described below.

【0026】次に、この光送受信モジュールの動作につ
いて説明する。まず、発光素子103から出射した光は
ハーフミラー105を、ある一定の割合で透過し、残り
の光が図面の上方へ反射する。ハーフミラー105を透
過した光は集光レンズ108で集光され、光ファイバ1
09に結合して送信される。一方、伝送路を通して伝送
されてきた受信光は集光レンズ108で集光され、ハー
フミラー105で所定の割合で反射して受光素子107
に入射し、残りの光は透過する。なお、送信と受信は時
間的に分割されて、交互に行われる。
Next, the operation of this optical transceiver module will be described. First, the light emitted from the light emitting element 103 is transmitted through the half mirror 105 at a certain ratio, and the remaining light is reflected upward in the drawing. The light transmitted through the half mirror 105 is condensed by the condenser lens 108, and the optical fiber 1
09 and transmitted. On the other hand, the received light transmitted through the transmission path is condensed by the condenser lens 108, reflected by the half mirror 105 at a predetermined ratio, and received by the light receiving element 107.
And the rest of the light is transmitted. Note that transmission and reception are temporally divided and alternately performed.

【0027】以上のように、2つの突起部の一方の頂部
に第1の平面102が形成され、この突起部に並設され
る他の突起部の内側に第1の斜面104が形成され、こ
の第1の斜面104が形成された突起の幅方向の中央部
が切り欠かれるとともに、そのその切り欠き部の底面
が、第1の平面102に対してほぼ平行な第2の平面1
06となった立体回路基板101に、発光素子103、
受光素子107及びハーフミラー105を所定の精度で
位置決めして実装することにより、光送受信モジュール
の集積化及び小型化が可能となり、また、光ファイバ1
09との結合も、発光素子103、集光レンズ108及
び光ファイバ109の光軸調整を一回行うだけで、受光
素子107と光ファイバ109との結合も同時に実現で
き、これによって実装の手順が簡略化される。
As described above, the first flat surface 102 is formed on the top of one of the two protrusions, and the first inclined surface 104 is formed inside the other protrusion arranged in parallel with the protrusion. A central portion in the width direction of the projection on which the first slope 104 is formed is notched, and the bottom surface of the notch is the second plane 1 which is substantially parallel to the first plane 102.
The three-dimensional circuit board 101 which has become 06, the light emitting element 103,
By positioning and mounting the light receiving element 107 and the half mirror 105 with a predetermined accuracy, the optical transceiver module can be integrated and downsized, and the optical fiber 1
09, the light-receiving element 107, the condenser lens 108, and the optical fiber 109 can be coupled at the same time by adjusting the optical axes of the light-emitting element 103, the condenser lens 108, and the optical fiber 109 only once. It is simplified.

【0028】図4は本発明に係る光送受信モジュールの
第2の実施の形態の構成を示す側面図であり、図中、図
1から図3を用いて説明した第1の実施の形態と同一の
要素には同一の符号を付してその説明を省略する。この
第2の実施の形態は、上記第1の実施の形態を構成する
ハーフミラー105の代わりに、光学膜部材として第1
の波長フィルタ110を実装した点が異なり、これ以外
は第1の実施の形態と全く同様に構成されている。この
第2の実施の形態は、発光素子103が出射する光の送
信波長と、受光素子107が受光する受信波長とが異な
るシステムに適用されるもので、波長フィルタ110は
送信波長を全透過させ、受信波長を全反射させる特性を
有している。
FIG. 4 is a side view showing the configuration of the second embodiment of the optical transceiver module according to the present invention, which is the same as the first embodiment described with reference to FIGS. 1 to 3 in the figure. The same elements are denoted by the same reference numerals and the description thereof will be omitted. In the second embodiment, instead of the half mirror 105 constituting the first embodiment, a first optical film member is used.
The configuration is the same as that of the first embodiment except that the wavelength filter 110 is mounted. The second embodiment is applied to a system in which the transmission wavelength of light emitted from the light emitting element 103 and the reception wavelength received by the light receiving element 107 are different, and the wavelength filter 110 transmits all transmission wavelengths. , Has the property of totally reflecting the reception wavelength.

【0029】次に、図4に示した第2の実施の形態の動
作について説明する。まず、発光素子103から出射し
た光は波長フィルタ110を全透過する。透過した光は
集光レンズ108で集光され、光ファイバ109に結合
し、送信される。一方、伝送路を伝送されてきた受信光
は集光レンズ108で集光され、波長フィルタ110で
全反射して受光素子107に入射する。以上のように波
長フィルタを用い、送信波長と受信波長を互いに異なら
せることにより、発光素子103の出射光及び受光素子
107の入射光の損失を低減することができ、全2重で
ある、波長多重通信用送受信モジュールに適用すること
ができる。
Next, the operation of the second embodiment shown in FIG. 4 will be described. First, the light emitted from the light emitting element 103 is completely transmitted through the wavelength filter 110. The transmitted light is condensed by the condenser lens 108, is coupled to the optical fiber 109, and is transmitted. On the other hand, the received light transmitted through the transmission path is condensed by the condenser lens 108, is totally reflected by the wavelength filter 110, and is incident on the light receiving element 107. As described above, by using the wavelength filter and making the transmission wavelength and the reception wavelength different from each other, it is possible to reduce the loss of the emitted light of the light emitting element 103 and the incident light of the light receiving element 107. It can be applied to a transmitting / receiving module for multiplex communication.

【0030】図5は本発明に係る光送受信モジュールの
第3の実施の形態の構成を、部分的に断面を用いて示し
た側面図であり、図中、図4を用いて説明した第2の実
施の形態と同一の要素には同一の符号を付してその説明
を省略する。この第2の実施の形態は、受光素子107
が実装される立体回路基板101Bの第2の平面106
上に、受光素子107の周囲を光学的に他から遮断する
額縁状の突起111を設け、さらに、この突起111の
開放端は受光素子の受光面とほぼ平行でありその開放端
を覆うように第2の波長フィルタ112を実装した点が
図4と構成を異にし、これ以外は図4と同一に構成され
ている。第2の波長フィルタ112は発光素子103か
ら出射される波長の送信光を全反射し、図5では図示を
省略した光ファイバ109から受信する波長の受信光を
全透過させる特性を有している。
FIG. 5 is a side view showing the structure of the third embodiment of the optical transmitter / receiver module according to the present invention by partially using a cross section, and in the drawing, the second embodiment described with reference to FIG. The same elements as those in the embodiment are denoted by the same reference numerals and the description thereof will be omitted. In the second embodiment, the light receiving element 107
The second plane 106 of the three-dimensional circuit board 101B on which the
A frame-shaped protrusion 111 that optically shields the periphery of the light-receiving element 107 from the other is provided on the upper portion, and the open end of this protrusion 111 is substantially parallel to the light-receiving surface of the light-receiving element and covers the open end. The configuration is different from that of FIG. 4 in that the second wavelength filter 112 is mounted, and the other configurations are the same as those of FIG. The second wavelength filter 112 has a characteristic of totally reflecting the transmission light of the wavelength emitted from the light emitting element 103 and totally transmitting the reception light of the wavelength received from the optical fiber 109, which is not shown in FIG. .

【0031】この第3の実施の形態においては、第2の
実施の形態と、ほぼ同じ送受信動作をするが、新たに設
けられた第2の波長フィルタ112は発光素子103か
らの迷光を反射することによって、前記迷光が誤って受
光素子107に入射するのを防ぎ、受光素子107には
受信光のみが入射することとなる。以上のように、受光
素子107の周囲を光学的に他から遮断する額縁状の突
起111を設け、この突起111の光入射面を第2の波
長フィルタ112で覆うことにより、光クロストークを
低減することができる。
The third embodiment performs almost the same transmission / reception operation as the second embodiment, but the newly provided second wavelength filter 112 reflects the stray light from the light emitting element 103. This prevents the stray light from accidentally entering the light receiving element 107, and only the received light enters the light receiving element 107. As described above, the frame-shaped projection 111 that optically shields the periphery of the light receiving element 107 from the other is provided, and the light incident surface of the projection 111 is covered with the second wavelength filter 112, thereby reducing optical crosstalk. can do.

【0032】図6は本発明に係る光送受信モジュールの
第4の実施の形態の構成を示す側面図であり、図中、図
1から図3を用いて説明した第1の実施の形態と同一の
要素には同一の符号を付してその説明を省略する。この
第4の実施の形態に係る立体回路基板101Cは、発光
素子103が実装される第1の平面102上に、発光素
子103が送信光を出射する方向とは反対側、すなわ
ち、後方に出力モニタ用受光素子113を実装した点が
第1の実施の形態と構成を異にし、これ以外は第1の実
施の形態と同一に構成されている。この場合、出力モニ
タ用受光素子113は、発光素子103が送信光出射方
向に限らず、後方にも出射することを利用したもので、
ここでの出力モニタ用受光素子は側面からの受光が可能
なものであり、後方からの出射光を出力モニタ用受光素
子113で受光するものである。
FIG. 6 is a side view showing the configuration of the fourth embodiment of the optical transceiver module according to the present invention, which is the same as the first embodiment described with reference to FIGS. 1 to 3 in the figure. The same elements are denoted by the same reference numerals and the description thereof will be omitted. The three-dimensional circuit board 101C according to the fourth embodiment outputs on the first plane 102 on which the light emitting element 103 is mounted, to the side opposite to the direction in which the light emitting element 103 emits the transmitted light, that is, to the rear side. The configuration is different from that of the first embodiment in that the monitor light-receiving element 113 is mounted, and the other configurations are the same as those of the first embodiment. In this case, the output monitoring light receiving element 113 utilizes that the light emitting element 103 emits light not only in the outgoing direction of the transmitted light but also in the rear direction.
The output monitor light receiving element here is capable of receiving light from the side surface, and the output monitor light receiving element 113 receives light emitted from the rear side.

【0033】図6に示した第4の実施の形態の動作につ
いて、第1の実施の形態と構成の異なる部分について説
明する。発光素子103は送信光出射方向に対して後方
にも出射するが、この後方出射光を受光した出力モニタ
用受光素子113の出力電流をモニタしておき、この出
力電流が一定になるように、発光素子103のバイアス
電流を制御することにより、出力光レベルを一定に制御
することが可能になる。以上のように、立体回路基板1
01C上に、送信用の発光素子103、受光素子10
7、及び、ハーフミラー105又は第1の波長フィルタ
110の他に、出力モニタ用の受光素子113を実装す
ることにより、光送受信モジュールをさらに集積化で
き、実装を簡略化することができる。
With respect to the operation of the fourth embodiment shown in FIG. 6, the part of the configuration different from that of the first embodiment will be described. The light emitting element 103 also emits light to the rear with respect to the outgoing direction of the transmitted light, but the output current of the output monitor light receiving element 113 that has received the backward emitted light is monitored in advance so that this output current becomes constant. By controlling the bias current of the light emitting element 103, the output light level can be controlled to be constant. As described above, the three-dimensional circuit board 1
The light emitting element 103 for transmission and the light receiving element 10 on 01C.
By mounting the light receiving element 113 for the output monitor in addition to 7, and the half mirror 105 or the first wavelength filter 110, the optical transceiver module can be further integrated and the mounting can be simplified.

【0034】図7は本発明に係る光送受信モジュールの
第5の実施の形態の構成を示す側面図であり、図中、図
6を用いて説明した第4の実施の形態と同一の要素には
同一の符号を付してその説明を省略する。この第5の実
施の形態に係る立体回路基板101Dは、発光素子10
3が送信光を放射する方向とは反対の後方にも、発光素
子103に対向して図面の上向きに所定の角度だけ傾斜
した第2の斜面114を有する第3の突起101dを備
え、第2の斜面114に出力モニタ用の受光素子113
を実装したものである。これによって、出力モニタ用受
光素子113の受光面が発光素子103の後方出射光に
対して傾斜することとなり、この点が第4の実施の形態
と構成を異にしている。なお、出力モニタ用受光素子1
13は表面に受光面を有する標準的なものである。
FIG. 7 is a side view showing the configuration of the fifth embodiment of the optical transceiver module according to the present invention. In the figure, the same elements as those of the fourth embodiment described with reference to FIG. 6 are shown. Are assigned the same reference numerals and explanations thereof are omitted. The three-dimensional circuit board 101D according to the fifth embodiment includes the light emitting element 10
A third protrusion 101d having a second inclined surface 114 facing the light emitting element 103 and inclined upward by a predetermined angle in the opposite direction to the direction in which 3 transmits the transmitted light is also provided. The light receiving element 113 for output monitoring on the slope 114 of the
Is implemented. As a result, the light receiving surface of the output monitoring light receiving element 113 is inclined with respect to the backward emission light of the light emitting element 103, which is different from the fourth embodiment. The light receiving element 1 for output monitoring
Reference numeral 13 is a standard one having a light receiving surface on its surface.

【0035】図7に示した第5の実施の形態は、図6に
示した第4の実施の形態と同じ動作をするが、出力モニ
タ用の受光素子113の受光面に対して、発光素子10
3の後方出射光が斜めに入射するため、出力モニタ用受
光素子113の受光面による反射光が発光素子103に
入射することを防ぐことが出来る。以上のように、発光
素子を実装している面の後方に位置する第2の斜面11
4に出力モニタ用受光素子113を実装することによ
り、表面入射可能な標準的な受光素子を使用することが
でき、また出力モニタ用受光素子の受光面での反射光の
発光素子103への影響を低減することができる。
The fifth embodiment shown in FIG. 7 operates in the same manner as the fourth embodiment shown in FIG. 6, except that a light emitting element is provided with respect to the light receiving surface of the light receiving element 113 for output monitoring. 10
Since the rearward outgoing light of No. 3 obliquely enters, it is possible to prevent the reflected light from the light receiving surface of the output monitoring light receiving element 113 from entering the light emitting element 103. As described above, the second slope 11 located behind the surface on which the light emitting element is mounted
By mounting the output monitor light-receiving element 113 in FIG. 4, a standard light-receiving element capable of surface incidence can be used, and the influence of reflected light on the light-receiving surface of the output monitor light-receiving element on the light-emitting element 103. Can be reduced.

【0036】図8は本発明に係る光送受信モジュールの
第6の実施の形態の構成を示す側面図であり、図9はこ
の実施の形態の斜視図である。各図中、図6に示した第
4の実施の形態と同一の要素には同一の符号を付してそ
の説明を省略する。この実施の形態を構成する立体回路
基板101Eは、発光素子103の光信号出射方向に対
してその後方部位に、その頂部が第1の平面102より
も高い突出部101eが形成され、この突出部101e
の頂部に第1の平面102とほぼ平行な第3の平面11
5が形成され、さらに、突出部101eの幅方向中間部
が切欠かれて、その底面に発光素子103に対向し、か
つ、上向きに所定の角度の傾斜(第1の平面102に対
して鈍角の角度)を持った第3の斜面116が形成され
ている。そして、第3の斜面116には反射面が形成さ
れ、第3の平面115上に、出力モニタ用受光素子11
3を実装した点が図6と構成を異にしている。したがっ
て、発光素子103の後方出射光は第3の斜面116に
形成された反射面で反射され、その反射光が出力モニタ
用受光素子113の裏面より入射することとなる。
FIG. 8 is a side view showing the configuration of the sixth embodiment of the optical transceiver module according to the present invention, and FIG. 9 is a perspective view of this embodiment. In each figure, the same elements as those of the fourth embodiment shown in FIG. 6 are designated by the same reference numerals, and the description thereof will be omitted. In the three-dimensional circuit board 101E that constitutes this embodiment, a protrusion 101e whose top is higher than that of the first flat surface 102 is formed at the rear portion of the light emitting element 103 with respect to the optical signal emission direction. 101e
A third plane 11 parallel to the first plane 102 at the top of the
5 is formed, and the widthwise intermediate portion of the protruding portion 101e is cut out so as to face the light emitting element 103 on the bottom surface thereof and tilt upward by a predetermined angle (obtuse angle with respect to the first plane 102). A third slope 116 having an angle is formed. A reflective surface is formed on the third slope 116, and the output monitor light-receiving element 11 is formed on the third plane 115.
3 is different from the configuration shown in FIG. Therefore, the backward emission light of the light emitting element 103 is reflected by the reflection surface formed on the third inclined surface 116, and the reflected light enters from the back surface of the output monitoring light receiving element 113.

【0037】このように構成することによって、発光素
子103の後方出射光が第3の斜面116の反射面によ
って反射されて出力モニタ用受光素子113に入射する
ため、出力モニタ用受光素子113として、表面と裏面
の両方から光入射できる標準的な受光素子を使用するこ
とができ、かつ、出力モニタ用受光素子113の実装方
向が受光素子107と同一方向であるため、実装工程を
簡略化することができる。
With this configuration, the backward emission light of the light emitting element 103 is reflected by the reflecting surface of the third inclined surface 116 and is incident on the output monitoring light receiving element 113. Therefore, as the output monitoring light receiving element 113, Since a standard light receiving element capable of entering light from both the front surface and the back surface can be used, and the mounting direction of the output monitoring light receiving element 113 is the same as the light receiving element 107, the mounting process can be simplified. You can

【0038】図10は本発明に係る光送受信モジュール
の第7の実施の形態の構成を示す側面図であり、図中、
図6に示した第4の実施の形態と同一の要素には同一の
符号を付してその説明を省略する。この実施の形態を構
成する立体回路基板101Fは、発光素子103の光信
号出射方向に対してその後方部位を窪ませてその底部に
第1の平面102とほぼ平行な第4の平面117を形成
し、さらに、窪みの後方に壁部118を図面の上方に延
出させるとともに、発光素子103に対向する上部の壁
面119を下方斜めに傾斜させてこの壁面119に反射
面を形成したものである。そして、第4の平面117上
に出力モニタ用受光素子113を実装し、発光素子10
3の後方出射光が壁面119で反射して出力モニタ用受
光素子113に向かうように、壁面119の傾斜角度が
決定されている。
FIG. 10 is a side view showing the configuration of the seventh embodiment of the optical transceiver module according to the present invention.
The same elements as those in the fourth embodiment shown in FIG. 6 are designated by the same reference numerals and the description thereof will be omitted. In the three-dimensional circuit board 101F that constitutes this embodiment, the rear portion of the light emitting element 103 with respect to the optical signal emission direction is recessed to form a fourth flat surface 117 that is substantially parallel to the first flat surface 102 at the bottom thereof. Further, the wall portion 118 is extended to the upper side of the drawing behind the recess, and the upper wall surface 119 facing the light emitting element 103 is inclined obliquely downward to form a reflection surface on the wall surface 119. . Then, the output monitor light receiving element 113 is mounted on the fourth plane 117, and the light emitting element 10
The inclination angle of the wall surface 119 is determined so that the backward emitted light of No. 3 is reflected by the wall surface 119 and travels toward the output monitor light receiving element 113.

【0039】このように構成することによって、発光素
子103の後方出射光を壁面119の反射膜で反射させ
て出力モニタ用受光素子113で受光することになり、
これによって、出力モニタ用受光素子113として、表
面から光入射できる標準的な受光素子を使用することが
でき、かつ、出力モニタ用受光素子113の実装方向が
発光素子103及び受光素子107と同一方向であるた
め、実装工程を簡略化することができる。
With this structure, the rear emission light of the light emitting element 103 is reflected by the reflection film of the wall surface 119 and is received by the output monitoring light receiving element 113.
As a result, a standard light receiving element that allows light to enter from the surface can be used as the output monitoring light receiving element 113, and the mounting direction of the output monitoring light receiving element 113 is the same direction as the light emitting elements 103 and 107. Therefore, the mounting process can be simplified.

【0040】図11は本発明に係る光送受信モジュール
の第8の実施の形態の構成を示す側面図であり、図中、
図6に示した第4の実施の形態と同一の要素には同一の
符号を付してその説明を省略する。この実施の形態を構
成する立体回路基板101Gは、発光素子103の光信
号出射方向に対してその後方部位に、図面の上方に突出
する壁部118を設けるとともに、発光素子103に対
向する部位に開口120が設けられている。そして、発
光素子103に対向する側とは反対側、すなわち、開口
120の外側に受光面を合わせて出力モニタ用受光素子
113が実装されている。
FIG. 11 is a side view showing the configuration of the eighth embodiment of the optical transceiver module according to the present invention.
The same elements as those in the fourth embodiment shown in FIG. 6 are designated by the same reference numerals and the description thereof will be omitted. The three-dimensional circuit board 101G that constitutes this embodiment is provided with a wall portion 118 projecting upward in the drawing at a rear portion of the light emitting element 103 with respect to the optical signal emitting direction and at a portion facing the light emitting element 103. An opening 120 is provided. The output monitor light receiving element 113 is mounted on the side opposite to the side facing the light emitting element 103, that is, on the outside of the opening 120 with its light receiving surface aligned.

【0041】このように構成することによって、発光素
子103の後方出射光が開口120を通して、出力モニ
タ用受光素子113の受光面に到達し、出力モニタ用受
光素子113がこの後方出射光を受光することとなり、
この結果、出力モニタ用受光素子113の実装スペース
を少なくすることができるため、モジュールを小型化す
ることができる。
With this structure, the rear emission light of the light emitting element 103 reaches the light receiving surface of the output monitoring light receiving element 113 through the opening 120, and the output monitoring light receiving element 113 receives the rear emission light. That means
As a result, the mounting space for the output monitor light-receiving element 113 can be reduced, so that the module can be downsized.

【0042】図12は本発明に係る光送受信モジュール
の第9の実施の形態の構成を示す側面図であり、図中、
図7に示した第5の実施の形態と同一の要素には同一の
符号を付してその説明を省略する。この実施の形態を構
成する立体回路基板101Hは、図7に示した立体回路
基板101中、発光素子103を実装した突起部を除去
し、その代わりに、脚部121a及び腕部121bで構
成された逆「L」字形の金属基板121を付帯し、その
脚部121aを立体回路基板本体の後方端部に結合し、
その腕部121bを前方に向けて固定している。そし
て、金属基板121の腕部121bの先端部の底面にヒ
ートシンク122を装着するとともに、このヒートシン
ク122の下面に発光素子103を実装した点が図7と
構成上異なっている。なお、発光素子103は図7と同
じ位置に実装されている。
FIG. 12 is a side view showing the configuration of the ninth embodiment of the optical transceiver module according to the present invention.
The same elements as those of the fifth embodiment shown in FIG. 7 are designated by the same reference numerals, and the description thereof will be omitted. The three-dimensional circuit board 101H that constitutes this embodiment is configured by removing the protrusions on which the light emitting elements 103 are mounted in the three-dimensional circuit board 101 shown in FIG. 7, and instead using the leg portions 121a and the arm portions 121b. Attaching an inverted "L" -shaped metal substrate 121, and connecting its legs 121a to the rear end of the three-dimensional circuit board body,
The arm portion 121b is fixed toward the front. 7 is different from FIG. 7 in that the heat sink 122 is mounted on the bottom surface of the tip of the arm 121b of the metal substrate 121, and the light emitting element 103 is mounted on the lower surface of the heat sink 122. The light emitting element 103 is mounted at the same position as in FIG.

【0043】上記のように構成された第9の実施の形態
における光信号の送受信及び後方出射光の受光について
は、図7に示した第5の実施の形態と全く同様であるの
で省略するが、この第9の実施の形態は金属基板121
に、ヒートシンク122を介して、発光素子103を実
装するので、発光素子103の放熱効率が高められ、こ
れによって動作の信頼性を高めることができ、また、発
光素子と受光素子の実装基板を別にすることで、発光素
子、受光素子の配線間の電気的クロストークを低減でき
る。
The transmission and reception of the optical signal and the reception of the backward outgoing light in the ninth embodiment configured as described above are the same as those in the fifth embodiment shown in FIG. The ninth embodiment is a metal substrate 121.
In addition, since the light emitting element 103 is mounted via the heat sink 122, the heat radiation efficiency of the light emitting element 103 can be improved, and thus the reliability of operation can be improved, and the mounting substrate for the light emitting element and the light receiving element are separately provided. By doing so, electrical crosstalk between the wirings of the light emitting element and the light receiving element can be reduced.

【0044】ちなみに、この実施の形態の実装手順を説
明すると、以下のとおりである。まず、立体回路基板1
01に受光素子107及び出力モニタ用受光素子113
を位置決めして実装し、その後に電気的接続をする。次
に第1の波長フィルタ110を第1の斜面104に対
し、平坦に実装する。一方、金属基板121に実装した
ヒートシンク122上に発光素子103を位置決めして
実装し、電気的接続をして給電できる状態にする。その
後に立体回路基板本体と金属基板121とを一体的に結
合する。集光レンズ108や光ファイバ109の固定方
法は第1の実施の形態と同じである。
Incidentally, the mounting procedure of this embodiment will be described below. First, the three-dimensional circuit board 1
Reference numeral 01 denotes a light receiving element 107 and an output monitoring light receiving element 113.
Position and mount, then make electrical connection. Next, the first wavelength filter 110 is mounted flat on the first slope 104. On the other hand, the light emitting element 103 is positioned and mounted on the heat sink 122 mounted on the metal substrate 121, and is electrically connected so that power can be supplied. After that, the three-dimensional circuit board body and the metal substrate 121 are integrally coupled. The method of fixing the condenser lens 108 and the optical fiber 109 is the same as that of the first embodiment.

【0045】なお、図12に示した第9の実施の形態
は、図7に示した第5の実施の形態を変形したが、上述
した第4、第6から第8の各実施の形態を変形して、発
光素子103を、ヒートシンク122を介して、金属基
板121に実装する構成とすることにより、上述した場
合と同様に、発光素子103の放熱効率が高められ、こ
れによって動作の信頼性を高めることができ、また、発
光素子と受光素子の実装基板を別にすることで、発光素
子、受光素子の配線間の電気的クロストークを低減でき
るという効果も得られる。
Although the ninth embodiment shown in FIG. 12 is a modification of the fifth embodiment shown in FIG. 7, the fourth, sixth to eighth embodiments described above are not applicable. By deforming and mounting the light emitting element 103 on the metal substrate 121 via the heat sink 122, the heat dissipation efficiency of the light emitting element 103 is enhanced as in the case described above, and thus the reliability of operation is improved. It is also possible to obtain the effect of reducing the electrical crosstalk between the wirings of the light emitting element and the light receiving element by separating the mounting substrate of the light emitting element and the light receiving element.

【0046】図13は本発明に係る光送受信モジュール
の第10の実施の形態の構成を示す側面図であり、図
中、図7に示した第5の実施の形態と同一の要素には同
一の符号を付してその説明を省略する。この実施の形態
を構成する立体回路基板101Iは、発光素子103の
出射光側の先端面123が底面に対して略垂直で、か
つ、出射光の光軸に対しても垂直である。また、出射光
側の突出部101bは、光軸を振り分けにして幅方向の
中央部が切欠かれている。そして、先端面123の切欠
きの中央部に、集光レンズ108の表面形状に合わせて
これを嵌め込む窪みが形成され、この窪みに集光レンズ
108が接着剤にて固着されている。このように、発光
素子103の出射光側の先端面123に集光レンズ10
8を固着することにより、集光レンズ108の保持具を
別個に設ける必要がなくなるため、構成の簡易化が実現
される。
FIG. 13 is a side view showing the configuration of the tenth embodiment of the optical transceiver module according to the present invention. In the figure, the same elements as those of the fifth embodiment shown in FIG. 7 are the same. And the description thereof will be omitted. In the three-dimensional circuit board 101I that constitutes this embodiment, the front end surface 123 of the light emitting element 103 on the outgoing light side is substantially perpendicular to the bottom surface, and is also perpendicular to the optical axis of the outgoing light. Further, the projected portion 101b on the outgoing light side is notched in the central portion in the width direction with the optical axis being divided. Then, in the central portion of the notch of the front end surface 123, a recess is formed to fit the surface shape of the condenser lens 108, and the condenser lens 108 is fixed to the recess with an adhesive. In this way, the condenser lens 10 is provided on the tip surface 123 of the light emitting element 103 on the outgoing light side.
By fixing 8 to each other, it is not necessary to separately provide a holder for the condenser lens 108, so that the structure can be simplified.

【0047】なお、図13に示した第10の実施の形態
は、図7に示した第5の実施の形態を変形したものであ
るが、立体回路基板の出射光側の寸法、又は、集光レン
ズ108の焦点距離を適切に選定することによって、他
の実施の形態に係る立体回路基板の先端面に固着すれば
上述した場合と同様な効果が得られる。また、図13に
示した第10の実施の形態では、接着剤を用いて立体回
路基板101の先端面に集光レンズ108を固着したが
これ以外の方法で集光レンズ108を窪みに固着しても
良い。
The tenth embodiment shown in FIG. 13 is a modification of the fifth embodiment shown in FIG. By appropriately selecting the focal length of the optical lens 108, the same effect as in the above case can be obtained if the optical lens 108 is fixed to the tip surface of the three-dimensional circuit board according to another embodiment. In addition, in the tenth embodiment shown in FIG. 13, the condenser lens 108 is fixed to the front end surface of the three-dimensional circuit board 101 using an adhesive, but the condenser lens 108 is fixed to the recess by another method. May be.

【0048】図14は本発明に係る光送受信モジュール
の第11の実施の形態の構成を、一部を破断して示した
側面図である。これは、第1から第9の実施の形態にお
いて分離して示した集光レンズ108を一体的に組み立
てたものである。ここで、図7に示した立体回路基板1
01を、入出力ピンを備えたパッケージ124内に収納
格納し、耐湿性を高めるためにもこのパッケージ124
により気密封止を行うが、発光素子103の出射方向に
位置する、パッケージ124の開口窓に集光レンズ10
8を設置する。ただし、集光レンズ108の位置は第1
の実施の形態と同様になるように、パッケージの高さを
あらかじめ決めておく必要がある。このように、立体回
路基板を格納するパッケージの、発光素子の出射方向に
位置する開口窓に集光レンズを設置することにより、気
密封止用のパッケージを集光レンズの保持具としても機
能させることができ、構成を簡略化することができる。
なお、パッケージ124内に他の実施の形態に係る立体
回路基板を格納することができ、これによって上述した
場合と同様な効果が得られる。
FIG. 14 is a side view showing the structure of an eleventh embodiment of an optical transceiver module according to the present invention with a part thereof broken away. This is an integrated assembly of the condenser lenses 108 shown separately in the first to ninth embodiments. Here, the three-dimensional circuit board 1 shown in FIG.
01 is housed and stored in a package 124 having input / output pins, and this package 124 is also used to improve moisture resistance.
The light-tight sealing is performed by using the condenser lens 10 in the opening window of the package 124 located in the emission direction of the light emitting element 103.
Install 8. However, the position of the condenser lens 108 is the first
It is necessary to predetermine the height of the package so as to be the same as that in the above embodiment. In this way, by installing the condenser lens in the opening window located in the emitting direction of the light emitting element of the package storing the three-dimensional circuit board, the package for hermetic sealing also functions as a holder for the condenser lens. Therefore, the configuration can be simplified.
It should be noted that the three-dimensional circuit board according to another embodiment can be housed in the package 124, and the same effect as the above case can be obtained.

【0049】図15は本発明に係る光送受信装置の一実
施の形態の構成を示す透視図である。この実施の形態は
第1から第11の実施の形態のいずれの光送受信モジュ
ールをも用いることができるが、特に、図14に示した
第11の実施の形態に係る光送受信モジュール125を
用いた場合を示している。ここで、光送受信モジュール
125は光伝送装置のメイン樹脂基板126の上に1個
又は複数個実装され、光送受信装置筐体127内に収容
されている。筐体127の前面パネルには光入出力ポー
トの機能を持つ光ファイバコネクタプラグ128が取り
付けられている。
FIG. 15 is a perspective view showing the configuration of an embodiment of an optical transmitter / receiver according to the present invention. Although this embodiment can use any of the optical transceiver modules of the first to eleventh embodiments, in particular, the optical transceiver module 125 according to the eleventh embodiment shown in FIG. 14 is used. The case is shown. Here, one or more optical transmitting / receiving modules 125 are mounted on the main resin substrate 126 of the optical transmitting device, and are housed in the optical transmitting / receiving device housing 127. An optical fiber connector plug 128 having a function of an optical input / output port is attached to the front panel of the housing 127.

【0050】以上のように、立体回路基板を有する光送
受信モジュールを光送受信装置筐体に収容することによ
って、光送受信装置を小型化することができ、また複数
個実装することにより、多ポート光送受信装置を実現す
ることができる。
As described above, by accommodating the optical transmitter / receiver module having the three-dimensional circuit board in the optical transmitter / receiver housing, the optical transmitter / receiver can be miniaturized. A transceiver device can be realized.

【0051】[0051]

【発明の効果】以上説明したように、本発明によれば、
立体回路基板に発光素子、受光素子、光学膜部材、出力
モニタ用受光素子及び集光レンズのうち、少なくとも、
発光素子、受光素子及び光学膜部材を一体的に収納した
ので、発光素子及び受光素子と光ファイバとの光学結合
が、1個の集光レンズを用いた1回の調整のみで実現で
き、また小型化が容易になるという効果が得られる。
As described above, according to the present invention,
At least one of a light emitting element, a light receiving element, an optical film member, a light receiving element for output monitoring, and a condenser lens on the three-dimensional circuit board,
Since the light emitting element, the light receiving element and the optical film member are integrally housed, the optical coupling between the light emitting element, the light receiving element and the optical fiber can be realized by only one adjustment using one condenser lens. The effect of facilitating miniaturization is obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る光送受信モジュールの第1の実施
の形態の側面図
FIG. 1 is a side view of a first embodiment of an optical transceiver module according to the present invention.

【図2】図1に示した第1の実施の形態を構成する光送
受信用の半導体素子が実装された立体回路基板の斜視図
FIG. 2 is a perspective view of a three-dimensional circuit board on which a semiconductor element for optical transmission / reception, which constitutes the first embodiment shown in FIG. 1, is mounted.

【図3】図1に示した第1の実施の形態の立体回路基板
に光学膜部材としてのハーフミラーを実装した平面図
FIG. 3 is a plan view in which a half mirror as an optical film member is mounted on the three-dimensional circuit board of the first embodiment shown in FIG.

【図4】本発明に係る光送受信モジュールの第2の実施
の形態の構成を示す側面図
FIG. 4 is a side view showing the configuration of the second embodiment of the optical transceiver module according to the present invention.

【図5】本発明に係る光送受信モジュールの第3の実施
の形態の構成を、部分的に断面を用いて示した側面図
FIG. 5 is a side view showing a configuration of a third embodiment of the optical transceiver module according to the present invention partially with a cross section.

【図6】本発明に係る光送受信モジュールの第4の実施
の形態の構成を示す側面図
FIG. 6 is a side view showing a configuration of a fourth embodiment of an optical transceiver module according to the present invention.

【図7】本発明に係る光送受信モジュールの第5の実施
の形態の構成を示す側面図
FIG. 7 is a side view showing the configuration of the fifth embodiment of the optical transceiver module according to the present invention.

【図8】本発明に係る光送受信モジュールの第6の実施
の形態の構成を示す側面図
FIG. 8 is a side view showing the configuration of the sixth embodiment of the optical transceiver module according to the present invention.

【図9】図8に示した第6の実施の形態の斜視図9 is a perspective view of the sixth embodiment shown in FIG.

【図10】本発明に係る光送受信モジュールの第7の実
施の形態の構成を示す側面図
FIG. 10 is a side view showing the configuration of the seventh embodiment of the optical transceiver module according to the present invention.

【図11】本発明に係る光送受信モジュールの第8の実
施の形態の構成を示す側面図
FIG. 11 is a side view showing the configuration of the eighth embodiment of the optical transceiver module according to the present invention.

【図12】本発明に係る光送受信モジュールの第9の実
施の形態の構成を示す側面図
FIG. 12 is a side view showing the configuration of the ninth embodiment of the optical transceiver module according to the present invention.

【図13】本発明に係る光送受信モジュールの第10の
実施の形態の構成を示す側面図
FIG. 13 is a side view showing the configuration of the tenth embodiment of the optical transceiver module according to the present invention.

【図14】本発明に係る光送受信モジュールの第11の
実施の形態の構成を、一部を破断して示した側面図
FIG. 14 is a side view showing the configuration of an eleventh embodiment of an optical transceiver module according to the present invention with a part thereof cut away.

【図15】本発明に係る光送受信装置の一実施の形態の
構成を示す透視図
FIG. 15 is a perspective view showing a configuration of an embodiment of an optical transceiver according to the present invention.

【図16】従来の光信号伝送系における光送受信モジュ
ールの概略構成図
FIG. 16 is a schematic configuration diagram of an optical transceiver module in a conventional optical signal transmission system.

【符号の説明】[Explanation of symbols]

101A〜101I 立体回路基板 102 第1の平面 103 送信用発光素子 104 第1の斜面 105 ハーフミラー(光学膜部材) 106 第2の平面 107 受光素子 108 集光レンズ 109 光ファイバ 110 第1の波長フィルタ 111 突起 112 第2の波長フィルタ 113 出力モニタ用受光素子 114 第2の斜面 115 第3の平面 116 第3の斜面 117 第4の平面 118 壁部 119 壁面 120 開口 121 金属基板 122 ヒートシンク 123 立体回路基板の先端面 124 気密封止パッケージ 125 光送受信モジュール 126 メイン樹脂基板 127 光送受信装置筐体ラグ 128 光ファイバコネクタプ 101A-101I Three-dimensional circuit board 102 First plane 103 Light emitting element for transmission 104 First slope 105 Half mirror (optical film member) 106 Second plane 107 light receiving element 108 Condensing lens 109 optical fiber 110 First wavelength filter 111 protrusion 112 Second wavelength filter 113 Light receiving element for output monitor 114 Second slope 115 Third plane 116 Third slope 117 Fourth plane 118 wall 119 wall surface 120 openings 121 Metal substrate 122 heat sink 123 Front end surface of three-dimensional circuit board 124 Hermetically sealed package 125 Optical transceiver module 126 Main resin substrate 127 Optical transmitter / receiver housing lug 128 optical fiber connector

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H04B 10/13 10/135 10/14 (72)発明者 東郷 仁麿 神奈川県横浜市港北区綱島東四丁目3番1 号 松下通信工業株式会社内 (72)発明者 浅野 弘明 神奈川県横浜市港北区綱島東四丁目3番1 号 松下通信工業株式会社内 Fターム(参考) 2H037 BA03 BA12 CA10 CA37 DA02 DA06 DA18 5F073 AB27 AB28 AB29 BA02 EA26 EA27 FA02 FA11 FA23 5F088 AA01 BA15 BA16 BA18 BB01 EA09 EA11 JA03 JA12 JA13 JA14 5F089 AA01 AC01 AC10 CA15 CA20 5K102 AA15 AA31 AL12 MA01 MA02 MC01 RB02 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI Theme Coat (reference) H04B 10/13 10/135 10/14 (72) Inventor Nitoro Togo Tsunashima Tohoku, Kohoku Ward, Yokohama City, Kanagawa Prefecture 3-3-1 Matsushita Communication Industrial Co., Ltd. (72) Inventor Hiroaki Asano 4-3-1, Tsunashima-higashi, Kohoku-ku, Yokohama-shi, Kanagawa Matsushita Communication Industrial Co., Ltd. F-term (reference) 2H037 BA03 BA12 CA10 CA37 DA02 DA06 DA18 5F073 AB27 AB28 AB29 BA02 EA26 EA27 FA02 FA11 FA23 5F088 AA01 BA15 BA16 BA18 BB01 EA09 EA11 JA03 JA12 JA13 JA14 5F089 AA01 AC01 AC10 CA15 CA20 5K102 AA15 AA31 AL12 MA01 MA02 MC01 RB02

Claims (15)

【特許請求の範囲】[Claims] 【請求項1】 光ファイバで双方向に伝送される光を、
前記光ファイバの一端部にて送受信する光送受信モジュ
ールにおいて、 送受信する光の進行経路に沿ってそれぞれ基部から突出
し、前記光ファイバに近い側に第1の突起部が、前記光
ファイバから遠い側に第2の突起部が形成され、前記第
1の突起部は光の進行経路となる切欠きを有し、前記第
2の突起部は光の進行経路よりも所定の寸法だけ低く形
成された第1の平面を有し、さらに、前記第1の突起部
は前記切欠きの底部に前記第1の平面にほぼ平行で、か
つ、前記第1の平面よりも低く形成された第2の平面、
及び前記第2の突起部と対向する側に前記第2の平面に
対して鋭角の角度を持った第1の斜面を有する立体回路
基板と、 前記第1の平面上に実装された送信用の発光素子と、 前記第2の平面上に実装された受信用の受光素子と、 前記第1の斜面上に装着された光学膜部材と、 前記光ファイバと前記立体回路基板との間の光の進行経
路に設けられた集光レンズとを、 備えたことを特徴とする光送受信モジュール。
1. Light transmitted bidirectionally through an optical fiber,
In an optical transceiver module that transmits and receives at one end of the optical fiber, each protrudes from a base along a traveling path of light to be transmitted and received, and a first protrusion is provided on a side closer to the optical fiber, and a first protrusion is provided on a side far from the optical fiber. A second protrusion is formed, the first protrusion has a notch serving as a light traveling path, and the second protrusion is formed lower than the light traveling path by a predetermined dimension. A second flat surface having a first flat surface, the first protruding portion being substantially parallel to the first flat surface at the bottom of the notch, and being lower than the first flat surface.
And a three-dimensional circuit board having a first inclined surface having an acute angle with the second plane on the side facing the second protrusion, and a three-dimensional circuit board mounted on the first plane for transmission. A light emitting element, a receiving light receiving element mounted on the second plane, an optical film member mounted on the first slope, and a light beam between the optical fiber and the three-dimensional circuit board. An optical transceiver module, comprising: a condenser lens provided on a traveling path.
【請求項2】 前記光学膜部材がハーフミラーで構成さ
れ、前記発光素子から出射した光が前記ハーフミラーを
一定の割合で通過し、前記集光レンズで集光されて前記
光ファイバに入射し、前記光ファイバから出射した光が
前記集光レンズで集光され、前記ハーフミラーで一定の
割合で反射して前記受光素子に入射することを特徴とす
る請求項1に記載の光送受信モジュール。
2. The optical film member is composed of a half mirror, and light emitted from the light emitting element passes through the half mirror at a constant rate, is condensed by the condenser lens, and enters the optical fiber. The light transmitting / receiving module according to claim 1, wherein the light emitted from the optical fiber is condensed by the condenser lens, reflected by the half mirror at a constant rate, and incident on the light receiving element.
【請求項3】 前記光ファイバが互いに波長の異なる光
を双方向に伝送するとき、前記光学膜部材は、前記光フ
ァイバより出射され、前記集光レンズで集光された受信
光を全反射して前記受光素子に入射させ、前記発光素子
から出射する送信光を全透過して前記集光レンズで集光
して前記光ファイバに入射させる波長フィルタであるこ
とを特徴とする請求項1に記載の光送受信モジュール。
3. When the optical fiber bidirectionally transmits lights having different wavelengths, the optical film member totally reflects the received light emitted from the optical fiber and condensed by the condenser lens. 2. A wavelength filter that causes the transmission light emitted from the light emitting element to be incident on the light receiving element and totally transmitted, is condensed by the condenser lens, and is incident on the optical fiber. Optical transceiver module.
【請求項4】 前記受光素子の周囲を光学的に他から遮
断する額縁状の突起を設け、受信光のみを透過する波長
フィルタによって、前記突起の開放端を覆ったことを特
徴とする請求項3に記載の光送受信モジュール。
4. A frame-shaped protrusion that optically shields the periphery of the light receiving element from the other is provided, and the open end of the protrusion is covered with a wavelength filter that transmits only received light. 3. The optical transceiver module according to item 3.
【請求項5】 前記受光素子は受光感度に波長依存性を
もったものであり、前記受信光に対して高い受光感度を
もち、その他の波長に対してはより低い受光感度をも
ち、少なくとも送信光の波長に対しては著しく低い受光
感度をもっていることを特徴とする請求項3に記載の光
送受信モジュール。
5. The light receiving element has a light receiving sensitivity having wavelength dependency, has a high light receiving sensitivity for the received light, and has a lower light receiving sensitivity for other wavelengths, and at least a transmitting light. The optical transceiver module according to claim 3, which has a remarkably low light receiving sensitivity with respect to the wavelength of light.
【請求項6】 送信光を出射する前記発光素子の後背部
の前記第1の平面上に、前記発光素子の後方出射光の受
光を可能に実装された出力モニタ用受光素子を備えたこ
とを特徴とする請求項1から5のいずれか1つに記載の
光送受信モジュール。
6. A light-receiving element for output monitoring, which is mounted so as to be able to receive rear-emitted light of the light-emitting element, on the first plane behind the light-emitting element that emits transmitted light. The optical transceiver module according to any one of claims 1 to 5, which is characterized in that.
【請求項7】 前記立体回路基板が、前記第2の突起部
よりも前記光ファイバから遠い側に形成された第3の突
起部を備え、前記第3の突起部は前記発光素子に対向し
て前記第1の平面に対して所定の角度だけ傾斜した斜面
を有し、前記斜面上に前記発光素子の後方出射光の受光
を可能に実装された出力モニタ用受光素子を備えたこと
を特徴とする請求項1から5のいずれか1つに記載の光
送受信モジュール。
7. The three-dimensional circuit board includes a third protrusion portion formed on a side farther from the optical fiber than the second protrusion portion, the third protrusion portion facing the light emitting element. And an output monitor light receiving element mounted on the slope so as to be able to receive the backward emission light of the light emitting element. The optical transceiver module according to any one of claims 1 to 5.
【請求項8】 前記立体回路基板が、前記第2の突起部
よりも前記光ファイバから遠い側に形成された第3の突
起部を備え、前記第3の突起部は光の進行経路よりも所
定の寸法だけ高く形成され、前記第1の平面とほぼ平行
な第3の平面と、前記第3の突起部の前記発光素子の後
方出射光が照射される中央部が切欠かれ、その切欠きの
底部に前記第1の平面に対して鈍角に傾斜し、かつ、反
射面が形成された第3の斜面とを有し、前記第3の平面
上に、前記発光素子の後方出射光が前記第3の斜面の反
射面で反射された光の受光を可能に実装された出力モニ
タ用受光素子を備えたことを特徴とする請求項1から5
のいずれか1つに記載の光送受信モジュール。
8. The three-dimensional circuit board includes a third protrusion formed on a side farther from the optical fiber than the second protrusion, and the third protrusion is more than a light traveling path. A third plane, which is formed to be high by a predetermined dimension and is substantially parallel to the first plane, and a central portion of the third protrusion, which is irradiated with the backward emission light of the light emitting element, are notched, and the notch is formed. Has a third slope inclined at an obtuse angle with respect to the first plane and having a reflection surface formed on the bottom thereof, and the rear emission light of the light emitting element is on the third plane. 6. A light receiving element for output monitoring, which is mounted so as to be able to receive the light reflected by the third reflecting surface of the inclined surface.
The optical transceiver module according to any one of 1.
【請求項9】 前記立体回路基板が、前記第2の突起部
よりも前記光ファイバから遠い側に形成され、前記第1
の平面とほぼ平行で、かつ、前記第1の平面よりも所定
の寸法だけ低く形成された第4の平面と、前記第4の平
面よりも前記光ファイバから遠い側に形成され、前記発
光素子に対向して前記第1の平面に対して鋭角に傾斜し
た反射面を有する壁部とを備え、前記第4の平面上に、
前記発光素子の後方出射光が前記反射面で反射された光
の受光を可能に出力モニタ用受光素子を実装したことを
特徴とする請求項1から5のいずれか1つに記載の光送
受信モジュール。
9. The three-dimensional circuit board is formed on a side farther from the optical fiber than the second protrusion is, and
And a fourth plane that is substantially parallel to the first plane and is formed lower than the first plane by a predetermined dimension, and is formed on a side farther from the optical fiber than the fourth plane, And a wall portion having a reflecting surface facing the first plane and inclined at an acute angle with respect to the first plane, and on the fourth plane,
The light transmitting / receiving module according to claim 1, wherein an output monitor light receiving element is mounted so as to be able to receive the light emitted from the light emitting element from the rear surface and reflected by the reflecting surface. .
【請求項10】 前記立体回路基板が、前記発光素子よ
りも前記光ファイバから遠い側に形成され、前記発光素
子の後方出射光を通過させる開口を有する壁部を備え、
前記壁部の後背面に、前記開口を通過する後方出射光の
受光を可能に出力モニタ用受光素子を実装したことを特
徴とする請求項1に記載の光送受信モジュール。
10. The three-dimensional circuit board includes a wall portion that is formed on a side farther from the optical fiber than the light emitting element, and has an opening that allows rearward emission light of the light emitting element to pass therethrough,
The light transmitting / receiving module according to claim 1, wherein a light receiving element for output monitoring is mounted on the rear surface of the wall portion so as to be able to receive the rearward emission light passing through the opening.
【請求項11】 光ファイバで双方向に伝送される光
を、前記光ファイバの一端部にて送受信する光送受信モ
ジュールにおいて、 送受信する光の進行経路に沿ってそれぞれ基部から突出
し、前記光ファイバに近い側に第1の突起部が、前記光
ファイバから遠い側に第2の突起部が形成され、かつ、
脚部及び腕部で構成された逆「L」字形をなし、前記腕
部を前記光ファイバ側に向けて前記第2の突起部の後方
端部に前記脚部が結合された金属基板を付帯し、前記金
属基板の腕部は前記第1及び第2の突起部間に光の進行
経路よりも所定の寸法だけ高く形成された第1の平面を
有し、前記第1の突起部は光の進行経路となる切欠きを
有し、かつ、前記切欠きの底部に前記第1の平面にほぼ
平行で、かつ、前記第1の平面よりも低く形成された第
2の平面、及び前記第2の突起部と対向する側に前記第
2の平面に対して鋭角の角度を持った第1の斜面を有す
る立体回路基板と、 前記第1の平面下に、光の進行経路に実装された送信用
の発光素子と、 前記第2の平面上に実装された受信用の受光素子と、 前記傾斜面上に装着された光学膜部材と、 前記光ファイバと前記立体回路基板との間の光の進行経
路に設けられる集光レンズと、 前記第2の突起部に実装され、前記発光素子の後方出射
光の受光を可能に実装された出力モニタ用受光素子と
を、 備えたことを特徴とする光送受信モジュール。
11. In an optical transceiver module for transmitting and receiving light transmitted bidirectionally through an optical fiber at one end of the optical fiber, the optical transmitting and receiving module projects from the base along a traveling path of the light to be transmitted and received to the optical fiber. A first protrusion is formed on the near side, and a second protrusion is formed on the side far from the optical fiber, and
An inverted “L” -shaped body composed of a leg portion and an arm portion is formed, and a metal substrate to which the leg portion is coupled is attached to the rear end portion of the second protrusion with the arm portion facing the optical fiber side. However, the arm portion of the metal substrate has a first flat surface formed between the first and second protrusions by a predetermined dimension higher than a light traveling path, and the first protrusion is a light source. A second plane that has a notch that serves as a traveling path of the second plane, that is substantially parallel to the first plane at the bottom of the notch, and that is formed lower than the first plane; And a three-dimensional circuit board having a first inclined surface having an acute angle with respect to the second plane on the side facing the second protrusion, and mounted on the light traveling path under the first plane. A light emitting element for transmission, a light receiving element for reception mounted on the second plane, and an optical film member mounted on the inclined surface. A condenser lens provided in a light advancing path between the optical fiber and the three-dimensional circuit board; and a second projection, which is mounted so as to be able to receive rear emission light of the light emitting element. An optical transmitter-receiver module comprising a light-receiving element for output monitoring.
【請求項12】 前記集光レンズを前記立体回路基板の
光ファイバ側の端面に固着したことを特徴とする請求項
1から11のいずれか1つに記載の光送受信モジュー
ル。
12. The optical transceiver module according to claim 1, wherein the condenser lens is fixed to an end face of the three-dimensional circuit board on the optical fiber side.
【請求項13】 前記発光素子、受光素子、光学膜部材
及び出力モニタ用受光素子のうち、少なくとも前記発光
素子、受光素子、光学膜部材を実装した前記立体回路基
板をパッケージで覆い、前記パッケージの光ファイバ側
の開口窓に前記集光レンズを設けた請求項1から12の
いずれか1つに記載の光送受信モジュール。
13. Among the light emitting device, the light receiving device, the optical film member, and the light receiving device for output monitoring, at least the three-dimensional circuit board on which the light emitting device, the light receiving device, and the optical film member are mounted is covered with a package, The optical transceiver module according to claim 1, wherein the condenser lens is provided in an opening window on the optical fiber side.
【請求項14】 請求項1から12に記載の光送受信モ
ジュールの実装方法において、 前記立体回路基板に、前記発光素子、受光素子及び出力
モニタ用受光素子のうち、少なくとも前記発光素子及び
受光素子を実装して電気的接続を行う第1の工程と、 前記光学膜及び前記集光レンズを実装する第2の工程
と、 前記発光素子を発光させ、前記光ファイバへの結合効率
が最もよくなるように前記光ファイバの位置を微調整し
て固定する第3の工程とを、 順を追って行うことを特徴とする光送受信モジュールの
実装方法。
14. The method for mounting an optical transceiver module according to claim 1, wherein at least the light emitting element and the light receiving element among the light emitting element, the light receiving element, and the output monitoring light receiving element are provided on the three-dimensional circuit board. A first step of mounting and electrical connection; a second step of mounting the optical film and the condenser lens; causing the light emitting element to emit light so that the coupling efficiency with the optical fiber is maximized. And a third step of finely adjusting and fixing the position of the optical fiber, the steps being performed in order.
【請求項15】 請求項1から請求項13のいずれか1
つに記載の光送受信モジュールを1個又は複数個備えた
ことを特徴とする光送受信装置。
15. The method according to any one of claims 1 to 13.
An optical transmitter / receiver device comprising one or a plurality of the optical transmitter / receiver modules described in 1.
JP2002075419A 2002-03-19 2002-03-19 Optical transmission / reception module, mounting method therefor, and optical transmission / reception apparatus Expired - Fee Related JP4006249B2 (en)

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JP2009075465A (en) * 2007-09-21 2009-04-09 Sumitomo Electric Ind Ltd Optical transceiver module
JP2009223029A (en) * 2008-03-17 2009-10-01 Mitsubishi Electric Corp Optical communication subscriber's line terminating apparatus
JP4578569B1 (en) * 2009-06-01 2010-11-10 三菱電機株式会社 Optical transceiver module
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JP2014010172A (en) * 2012-06-27 2014-01-20 Nippon Telegr & Teleph Corp <Ntt> Optical triplexer module
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JP2009075465A (en) * 2007-09-21 2009-04-09 Sumitomo Electric Ind Ltd Optical transceiver module
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JP2014010172A (en) * 2012-06-27 2014-01-20 Nippon Telegr & Teleph Corp <Ntt> Optical triplexer module
JP2015079092A (en) * 2013-10-16 2015-04-23 住友電気工業株式会社 Full-duplex optical transceiver
US20160142131A1 (en) * 2014-11-18 2016-05-19 Fujitsu Optical Components Limited Optical transmitter module
JP2019507374A (en) * 2016-04-19 2019-03-14 オプティシス カンパニー リミテッド Optical connector
CN113725720A (en) * 2020-05-26 2021-11-30 日亚化学工业株式会社 Light emitting device

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