JP2004010901A - 一液性エポキシ組成物中の酸無水物硬化剤のための促進剤としての2−フェニルイミダゾール燐酸二水素塩 - Google Patents
一液性エポキシ組成物中の酸無水物硬化剤のための促進剤としての2−フェニルイミダゾール燐酸二水素塩 Download PDFInfo
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- JP2004010901A JP2004010901A JP2003331271A JP2003331271A JP2004010901A JP 2004010901 A JP2004010901 A JP 2004010901A JP 2003331271 A JP2003331271 A JP 2003331271A JP 2003331271 A JP2003331271 A JP 2003331271A JP 2004010901 A JP2004010901 A JP 2004010901A
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- phenylimidazole
- accelerator
- epoxy
- phosphate
- curing agent
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- 239000000203 mixture Substances 0.000 title abstract description 36
- 239000004593 Epoxy Substances 0.000 title abstract description 33
- 150000008065 acid anhydrides Chemical class 0.000 title abstract description 17
- 239000003795 chemical substances by application Substances 0.000 title abstract description 15
- FVVMKNVTVIKSBM-UHFFFAOYSA-N 2-phenyl-1h-imidazole;phosphoric acid Chemical compound OP(O)(O)=O.C1=CNC(C=2C=CC=CC=2)=N1 FVVMKNVTVIKSBM-UHFFFAOYSA-N 0.000 title abstract description 13
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-M dihydrogenphosphate Chemical compound OP(O)([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-M 0.000 claims abstract description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract description 28
- 229920000647 polyepoxide Polymers 0.000 abstract description 25
- 239000003822 epoxy resin Substances 0.000 abstract description 20
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 3
- 239000007795 chemical reaction product Substances 0.000 abstract description 2
- 229920006334 epoxy coating Polymers 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 19
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 17
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 235000011007 phosphoric acid Nutrition 0.000 description 13
- 150000008064 anhydrides Chemical class 0.000 description 11
- 238000000113 differential scanning calorimetry Methods 0.000 description 11
- LPXDNEQTGPFOPF-UHFFFAOYSA-N hydron;1h-imidazol-1-ium;phosphate Chemical class C1=CNC=N1.OP(O)(O)=O LPXDNEQTGPFOPF-UHFFFAOYSA-N 0.000 description 11
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 9
- 150000003839 salts Chemical class 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 150000002460 imidazoles Chemical class 0.000 description 6
- 229910019142 PO4 Inorganic materials 0.000 description 5
- 235000021317 phosphate Nutrition 0.000 description 5
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 3
- 239000008199 coating composition Substances 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000013035 low temperature curing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 2
- SGYZMKMUHMFVTN-UHFFFAOYSA-N 2-ethyl-1h-imidazole;phosphoric acid Chemical compound OP(O)(O)=O.CCC1=NC=CN1 SGYZMKMUHMFVTN-UHFFFAOYSA-N 0.000 description 2
- HHPCPPMMHCXVAA-UHFFFAOYSA-N 2-ethyl-5-methyl-1h-imidazole;phosphoric acid Chemical compound OP(O)(O)=O.CCC1=NC=C(C)N1 HHPCPPMMHCXVAA-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- CLNLPMJHCMQMPN-UHFFFAOYSA-N 2-methyl-1h-imidazole;phosphoric acid Chemical compound OP(O)(O)=O.CC1=NC=CN1 CLNLPMJHCMQMPN-UHFFFAOYSA-N 0.000 description 2
- IIWSTWCYKKQQCZ-UHFFFAOYSA-N 5-methyl-1h-imidazole;phosphoric acid Chemical compound OP(O)(O)=O.CC1=CN=CN1 IIWSTWCYKKQQCZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- GQLRFPJNVQIFPK-UHFFFAOYSA-N dihydrogen phosphate;3-methyl-1h-imidazol-3-ium Chemical compound OP(O)(O)=O.CN1C=CN=C1 GQLRFPJNVQIFPK-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- NCVGSSQICKMAIA-UHFFFAOYSA-N 2-heptadecyl-4,5-dihydro-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NCCN1 NCVGSSQICKMAIA-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- KPSKFRBAZLLZTP-UHFFFAOYSA-N 6-methyl-4-oxatricyclo[5.2.1.02,6]dec-1-ene-3,5-dione Chemical class C1C2CCC1=C1C2(C)C(=O)OC1=O KPSKFRBAZLLZTP-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical class OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- -1 alkyl carboxylic acids Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
- C07D233/64—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5093—Complexes of amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Pyrrole Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
【解決手段】 促進剤として2−フェニルイミダゾールの燐酸二水素塩を用いることからなる。
【選択図】 なし
Description
すなわち、熱硬化されるエポキシ組成物中での酸無水物潜伏性硬化剤のための促進剤、および低温硬化と長期の保存安定性との良好なバランスをもたらす、2−フェニルイミダゾール燐酸二水素塩、酸無水物およびエポキシ樹脂を含む一液性の固形物100%のエポキシ組成物。
び均染助剤、消泡剤などを含めてコーティング処方物の技術で当業者に周知の広範な種類の成分とともに処方されることができる。約1〜90重量%の有機溶媒を含むまたは固形物100%からなるエポキシ組成物を使用することができる。
これらの実施例は2−フェニルイミダゾール(2−PI)、1−メチルイミダゾール(1−MI)、2−メチルイミダゾール(2−MI)、イミダゾール(MI)、4−メチルイミダゾール(4−MI)、2−エチルイミダゾール(2−EI)および2−エチル−4−メチルイミダゾール(24−EMI)の85%燐酸とのモル比1:1の反応によってつくられるイミダゾール燐酸塩の調製を示す。これらのイミダゾール燐酸塩を調製するのに使用される方法は以下のとおりであった。
磁気撹拌機、熱電気対、冷却器および滴下漏斗を備えた250mlの丸底の三つ口フラスコにメタノール100mlと所望の置換イミダゾールの適量、例えば2−フェニルイミダゾール(2−PI)36.0g(0.25モル)とを添加した。イミダゾールを溶解が完了した後、15分にわたって85%燐酸を滴加した。添加が完了した後、得られるスラリーを15分間混合した。固形の生成物をブフナー漏斗内で濾過によって単離し、新しいメタノール50mlで洗浄しそして自然乾燥した。回収したイミダゾール燐酸塩の量は理論収率の99%であった。
反応物の量、イミダゾール燐酸塩の収率、示差走査熱分析(DSC)によって測定されるイミダゾール燐酸塩の融点および各々の調合物の5%溶液のpHを表1に示す。
固形物100%のエポキシ系のこれらの実施例は、酸無水物で硬化されるエポキシ樹脂
組成物のための促進剤としてのイミダゾール燐酸塩を例示する。以下の成分を完全に混合することにより組成物を調製した。
Epon 828 100.0g
メチルヘキサヒドロフタル酸無水物 90.0g
イミダゾール燐酸塩 0.5g
2−フェニルイミダゾール燐酸塩(2−PIP)
1−メチルイミダゾール燐酸塩(1−MIP)
2−メチルイミダゾール燐酸塩(2−MIP)
イミダゾール燐酸塩(IMP)
4−メチルイミダゾール燐酸塩(4−MIP)
2−エチルイミダゾール燐酸塩(2−EIP)
2−エチル−4−メチルイミダゾール燐酸塩(24−EMIP)
Claims (1)
- 2−フェニルイミダゾールの燐酸二水素塩。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/703,443 US6462164B1 (en) | 2000-11-01 | 2000-11-01 | 2-phenylimidazole-phosphoric acid salt as an accelerator for acid anhydride curatives in one-component epoxy compositions |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001333609A Division JP3509800B2 (ja) | 2000-11-01 | 2001-10-31 | 一液性エポキシ組成物中の酸無水物硬化剤のための促進剤としての2−フェニルイミダゾール−燐酸塩 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2004010901A true JP2004010901A (ja) | 2004-01-15 |
Family
ID=24825411
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001333609A Expired - Fee Related JP3509800B2 (ja) | 2000-11-01 | 2001-10-31 | 一液性エポキシ組成物中の酸無水物硬化剤のための促進剤としての2−フェニルイミダゾール−燐酸塩 |
| JP2003331271A Pending JP2004010901A (ja) | 2000-11-01 | 2003-09-24 | 一液性エポキシ組成物中の酸無水物硬化剤のための促進剤としての2−フェニルイミダゾール燐酸二水素塩 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001333609A Expired - Fee Related JP3509800B2 (ja) | 2000-11-01 | 2001-10-31 | 一液性エポキシ組成物中の酸無水物硬化剤のための促進剤としての2−フェニルイミダゾール−燐酸塩 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6462164B1 (ja) |
| EP (1) | EP1203781B1 (ja) |
| JP (2) | JP3509800B2 (ja) |
| CN (1) | CN1191293C (ja) |
| AT (1) | ATE294202T1 (ja) |
| DE (1) | DE60110343T2 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060194064A1 (en) * | 2002-03-01 | 2006-08-31 | Xiao Allison Y | Underfill encapsulant for wafer packaging and method for its application |
| CN101218276B (zh) * | 2005-07-11 | 2013-04-24 | 索尼化学&信息部件株式会社 | 热固性环氧树脂组合物 |
| CN103936676A (zh) * | 2009-03-17 | 2014-07-23 | 日本曹达株式会社 | 包合配合物、固化剂、固化促进剂、环氧树脂组合物及半导体封装用环氧树脂组合物 |
| US9546243B2 (en) * | 2013-07-17 | 2017-01-17 | Air Products And Chemicals, Inc. | Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions |
| WO2018111884A1 (en) * | 2016-12-12 | 2018-06-21 | Evonik Degussa Gmbh | Novel low temperature anhydride epoxy cured systems |
| US11299423B1 (en) * | 2020-02-05 | 2022-04-12 | Glow Path Pavers, Llc | Photoluminescent sand |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3356645A (en) | 1964-04-20 | 1967-12-05 | Shell Oil Co | Process for curing epoxy resins with a salt of an imidazole and compositions thereof |
| US3329652A (en) | 1965-02-15 | 1967-07-04 | Shell Oil Co | Process for curing polyepoxides with anhydrides and activators therefor |
| US3632427A (en) | 1970-05-15 | 1972-01-04 | Air Prod & Chem | Epoxy resin and imidazole alkyl acid phosphate fiber treatment |
| US3631150A (en) | 1970-05-20 | 1971-12-28 | Dexter Corp | Synergistic composition for curing polyepoxides comprising an imidazole compound and dicyandiamide |
| DE3624177A1 (de) | 1986-07-17 | 1988-01-21 | Huels Chemische Werke Ag | Pulverlacke, deren herstellung und verwendung |
| JPH0253777A (ja) * | 1988-08-18 | 1990-02-22 | Shikoku Chem Corp | 1−ベンジルイミダゾール化合物の合成方法 |
| CA2151834A1 (en) | 1992-12-21 | 1994-07-07 | Alliedsignal Inc. | Solvent free epoxy resin compositions |
| US5508328A (en) | 1994-11-17 | 1996-04-16 | Alliedsignal Inc. | Curing epoxy resins using dicy, imidazole and acid |
-
2000
- 2000-11-01 US US09/703,443 patent/US6462164B1/en not_active Expired - Lifetime
-
2001
- 2001-10-30 EP EP01125885A patent/EP1203781B1/en not_active Expired - Lifetime
- 2001-10-30 AT AT01125885T patent/ATE294202T1/de not_active IP Right Cessation
- 2001-10-30 DE DE60110343T patent/DE60110343T2/de not_active Expired - Fee Related
- 2001-10-31 JP JP2001333609A patent/JP3509800B2/ja not_active Expired - Fee Related
- 2001-11-01 CN CNB011372567A patent/CN1191293C/zh not_active Expired - Fee Related
-
2003
- 2003-09-24 JP JP2003331271A patent/JP2004010901A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP3509800B2 (ja) | 2004-03-22 |
| EP1203781A1 (en) | 2002-05-08 |
| CN1351091A (zh) | 2002-05-29 |
| EP1203781B1 (en) | 2005-04-27 |
| US6462164B1 (en) | 2002-10-08 |
| ATE294202T1 (de) | 2005-05-15 |
| DE60110343T2 (de) | 2006-03-09 |
| CN1191293C (zh) | 2005-03-02 |
| JP2002145991A (ja) | 2002-05-22 |
| DE60110343D1 (de) | 2005-06-02 |
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