JP2008510302A5 - - Google Patents
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- Publication number
- JP2008510302A5 JP2008510302A5 JP2007525630A JP2007525630A JP2008510302A5 JP 2008510302 A5 JP2008510302 A5 JP 2008510302A5 JP 2007525630 A JP2007525630 A JP 2007525630A JP 2007525630 A JP2007525630 A JP 2007525630A JP 2008510302 A5 JP2008510302 A5 JP 2008510302A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- liquid
- semiconductor
- substrate
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 66
- 239000000758 substrate Substances 0.000 claims 63
- 239000007788 liquid Substances 0.000 claims 23
- 238000000034 method Methods 0.000 claims 9
- 238000007654 immersion Methods 0.000 claims 6
- 230000002209 hydrophobic effect Effects 0.000 claims 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 3
- 239000012530 fluid Substances 0.000 claims 3
- 229920002120 photoresistant polymer Polymers 0.000 claims 3
- 238000009987 spinning Methods 0.000 claims 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 2
- 238000004380 ashing Methods 0.000 claims 2
- 239000008367 deionised water Substances 0.000 claims 2
- 229910021641 deionized water Inorganic materials 0.000 claims 2
- 230000007723 transport mechanism Effects 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/918,757 US20060035475A1 (en) | 2004-08-12 | 2004-08-12 | Semiconductor substrate processing apparatus |
| PCT/US2005/025823 WO2006020333A1 (en) | 2004-08-12 | 2005-07-22 | A semiconductor substrate processing apparatus and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008510302A JP2008510302A (ja) | 2008-04-03 |
| JP2008510302A5 true JP2008510302A5 (2) | 2008-09-04 |
Family
ID=34980381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007525630A Pending JP2008510302A (ja) | 2004-08-12 | 2005-07-22 | 半導体基板処理装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20060035475A1 (2) |
| EP (1) | EP1787315A1 (2) |
| JP (1) | JP2008510302A (2) |
| KR (1) | KR100890486B1 (2) |
| CN (1) | CN100552872C (2) |
| TW (1) | TW200610011A (2) |
| WO (1) | WO2006020333A1 (2) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7718012B2 (en) * | 2004-12-30 | 2010-05-18 | Infineon Technologies Ag | Method of degasification in semiconductor cleaning |
| US20080268617A1 (en) * | 2006-08-09 | 2008-10-30 | Applied Materials, Inc. | Methods for substrate surface cleaning suitable for fabricating silicon-on-insulator structures |
| US7694688B2 (en) | 2007-01-05 | 2010-04-13 | Applied Materials, Inc. | Wet clean system design |
| CN106944381A (zh) * | 2016-01-06 | 2017-07-14 | 中芯国际集成电路制造(上海)有限公司 | 晶圆清洗装置及其清洗方法 |
| US11139183B2 (en) | 2018-05-24 | 2021-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for dry wafer transport |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4764477A (en) * | 1987-04-06 | 1988-08-16 | Motorola, Inc. | CMOS process flow with small gate geometry LDO N-channel transistors |
| JPH02116130A (ja) * | 1988-10-26 | 1990-04-27 | Matsushita Electron Corp | 基板の洗浄方法 |
| JPH03129732A (ja) * | 1989-07-19 | 1991-06-03 | Matsushita Electric Ind Co Ltd | 半導体の処理方法 |
| JP2963947B2 (ja) * | 1990-03-30 | 1999-10-18 | 東京エレクトロン株式会社 | ウエット洗浄装置 |
| US5227001A (en) * | 1990-10-19 | 1993-07-13 | Integrated Process Equipment Corporation | Integrated dry-wet semiconductor layer removal apparatus and method |
| US5996594A (en) * | 1994-11-30 | 1999-12-07 | Texas Instruments Incorporated | Post-chemical mechanical planarization clean-up process using post-polish scrubbing |
| US5605861A (en) * | 1995-05-05 | 1997-02-25 | Texas Instruments Incorporated | Thin polysilicon doping by diffusion from a doped silicon dioxide film |
| JPH0945610A (ja) * | 1995-07-28 | 1997-02-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| US20030051972A1 (en) * | 1997-05-05 | 2003-03-20 | Semitool, Inc. | Automated immersion processing system |
| JP4299966B2 (ja) * | 1997-09-23 | 2009-07-22 | エスイーゼツト・アクチエンゲゼルシヤフト | 改善された化学的乾燥及び清浄化システム |
| US6494217B2 (en) * | 1998-03-12 | 2002-12-17 | Motorola, Inc. | Laser cleaning process for semiconductor material and the like |
| US6328814B1 (en) * | 1999-03-26 | 2001-12-11 | Applied Materials, Inc. | Apparatus for cleaning and drying substrates |
| US6410436B2 (en) * | 1999-03-26 | 2002-06-25 | Canon Kabushiki Kaisha | Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate |
| US6727185B1 (en) * | 1999-11-29 | 2004-04-27 | Texas Instruments Incorporated | Dry process for post oxide etch residue removal |
| CN1381868A (zh) * | 2001-04-17 | 2002-11-27 | 华邦电子股份有限公司 | 具有加热组件的半导体制造装置 |
| EP1263022B1 (en) * | 2001-05-31 | 2007-04-25 | S.E.S. Company Limited | Substrate cleaning system |
| US6579810B2 (en) * | 2001-06-21 | 2003-06-17 | Macronix International Co. Ltd. | Method of removing a photoresist layer on a semiconductor wafer |
| JP2003100688A (ja) * | 2001-09-25 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2003179025A (ja) * | 2001-09-27 | 2003-06-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP4005388B2 (ja) * | 2002-03-08 | 2007-11-07 | 大日本スクリーン製造株式会社 | 基板処理システム |
| US6875289B2 (en) * | 2002-09-13 | 2005-04-05 | Fsi International, Inc. | Semiconductor wafer cleaning systems and methods |
-
2004
- 2004-08-12 US US10/918,757 patent/US20060035475A1/en not_active Abandoned
-
2005
- 2005-07-22 CN CNB200580027378XA patent/CN100552872C/zh not_active Expired - Fee Related
- 2005-07-22 EP EP05773630A patent/EP1787315A1/en not_active Withdrawn
- 2005-07-22 KR KR1020077004040A patent/KR100890486B1/ko not_active Expired - Fee Related
- 2005-07-22 WO PCT/US2005/025823 patent/WO2006020333A1/en not_active Ceased
- 2005-07-22 JP JP2007525630A patent/JP2008510302A/ja active Pending
- 2005-08-01 TW TW094126095A patent/TW200610011A/zh unknown
-
2007
- 2007-10-19 US US11/975,578 patent/US20080045029A1/en not_active Abandoned
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