JP2009155449A - 携帯端末部品 - Google Patents
携帯端末部品 Download PDFInfo
- Publication number
- JP2009155449A JP2009155449A JP2007334706A JP2007334706A JP2009155449A JP 2009155449 A JP2009155449 A JP 2009155449A JP 2007334706 A JP2007334706 A JP 2007334706A JP 2007334706 A JP2007334706 A JP 2007334706A JP 2009155449 A JP2009155449 A JP 2009155449A
- Authority
- JP
- Japan
- Prior art keywords
- polybutylene terephthalate
- portable terminal
- terminal component
- acid
- terephthalate resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001707 polybutylene terephthalate Polymers 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 239000003365 glass fiber Substances 0.000 claims abstract description 25
- 239000011342 resin composition Substances 0.000 claims abstract description 16
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 13
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 13
- -1 polybutylene terephthalate Polymers 0.000 claims description 75
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 34
- 238000002156 mixing Methods 0.000 claims description 13
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 9
- 239000012463 white pigment Substances 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000000704 physical effect Effects 0.000 abstract description 6
- 238000013329 compounding Methods 0.000 abstract 1
- 238000007665 sagging Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 16
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000000835 fiber Substances 0.000 description 9
- 238000001746 injection moulding Methods 0.000 description 9
- 239000000178 monomer Substances 0.000 description 8
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 7
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 150000001991 dicarboxylic acids Chemical class 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000006060 molten glass Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- DCTMXCOHGKSXIZ-UHFFFAOYSA-N (R)-1,3-Octanediol Chemical compound CCCCCC(O)CCO DCTMXCOHGKSXIZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920001634 Copolyester Polymers 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 238000000071 blow moulding Methods 0.000 description 2
- YYRMJZQKEFZXMX-UHFFFAOYSA-L calcium bis(dihydrogenphosphate) Chemical compound [Ca+2].OP(O)([O-])=O.OP(O)([O-])=O YYRMJZQKEFZXMX-UHFFFAOYSA-L 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910001463 metal phosphate Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000412 polyarylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- RGASRBUYZODJTG-UHFFFAOYSA-N 1,1-bis(2,4-ditert-butylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C RGASRBUYZODJTG-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GXURZKWLMYOCDX-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.OCC(CO)(CO)CO GXURZKWLMYOCDX-UHFFFAOYSA-N 0.000 description 1
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- HCUZVMHXDRSBKX-UHFFFAOYSA-N 2-decylpropanedioic acid Chemical compound CCCCCCCCCCC(C(O)=O)C(O)=O HCUZVMHXDRSBKX-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- SDAMTPCXBPNEQC-UHFFFAOYSA-N 3,4-dimethylphthalic acid Chemical compound CC1=CC=C(C(O)=O)C(C(O)=O)=C1C SDAMTPCXBPNEQC-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- HAYIPGIFANTODX-UHFFFAOYSA-N 4,6-dimethylbenzene-1,3-dicarboxylic acid Chemical compound CC1=CC(C)=C(C(O)=O)C=C1C(O)=O HAYIPGIFANTODX-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 241001120493 Arene Species 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052601 baryte Inorganic materials 0.000 description 1
- 239000010428 baryte Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- YGANSGVIUGARFR-UHFFFAOYSA-N dipotassium dioxosilane oxo(oxoalumanyloxy)alumane oxygen(2-) Chemical compound [O--].[K+].[K+].O=[Si]=O.O=[Al]O[Al]=O YGANSGVIUGARFR-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
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- 239000012948 isocyanate Substances 0.000 description 1
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- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
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- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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Abstract
【解決手段】(A)変性ポリブチレンテレフタレート樹脂100重量部に対して、(B)扁平な断面形状を有するガラス繊維40〜140重量部を配合してなるポリブチレンテレフタレート樹脂組成物からなる携帯端末部品。
【選択図】図1
Description
即ち、本発明は
(A)変性ポリブチレンテレフタレート樹脂100重量部に対して、
(B)扁平な断面形状を有するガラス繊維40〜140重量部
を配合してなるポリブチレンテレフタレート樹脂組成物からなる携帯端末部品である。
実施例1〜8、比較例1〜7
各樹脂組成物を表1に示す混合比率でドライブレンドし、30mmφのスクリューを有する2軸押出機((株)日本製鋼製)を用いて、シリンダー設定温度250℃で溶融混練したのちペレット化し、試験片を作成し、各評価を行った。結果を表1に示す。
(1)使用成分
(A)成分
(A-1)イソフタル酸変性ポリブチレンテレフタレート(固有粘度IV=0.65dL/g)
テレフタル酸と1,4 −ブタンジオールとの反応において、テレフタル酸の一部(12.5モル%)に代えて、共重合成分としてのジメチルイソフタル酸12.5モル%を用いた変性ポリブチレンテレフタレート
(A-2)ポリブチレンテレフタレート(固有粘度IV=0.69dL/g、ウィンテックポリマー(株)製)
(A-3)イソフタル酸変性ポリエチレンテレフタレート(イソフタル酸12.0モル%変性、固有粘度IV=0.80dL/g、(株)ベルポリエステルプロダクツ製)
(B)ガラス繊維
(B-1) ;扁平な断面形状を有するガラス繊維(長径・短径比:4、平均断面積196μm2、日東紡(株)製)
(B'-1) ;一般的な円形断面形状を有するガラス繊維(長径・短径比:1、平均断面積133μm2、日本電気ガラス(株)製)
(C)白色顔料
(C-1)硫化亜鉛 モース硬度4
(C'-1)ルチル型酸化チタン モース硬度7
尚、実施例6、7、8および比較例5については、表中の組成に更に第一リン酸カルシウムを0.15重量部添加している。
(2)物性評価
<引張強さ>
得られたペレットを140℃で3時間乾燥後、成形機シリンダー温度260℃、金型温度80℃で、射出成形により引張試験片を作製し、ISO−527(試験片厚み4mm)に準じて測定した。
<シャルピー衝撃強さ>
得られたペレットを140℃で3時間乾燥後、成形機シリンダー温度260℃、金型温度80℃で、射出成形によりシャルピー衝撃試験片を作製し、ISO−179(試験片厚み4mm)に準じて測定した。
(3)そり変形の評価
下記基準で平板の平面度を測定した。
評価成形品;50mm×50mm×厚さ1mmの平板
成形機;FANUC ROBOSHOTα-100Ia
シリンダー温度;260-260-240-220℃
金型温度;80℃
射出圧力;69MPa
平面度測定機;CNC画像測定機クイックビジョンQVH404(ミツトヨ社製)
平面度測定法は平板上の9点(縦横3×3点)にて測定した。
(4)携帯電話ハウジングでの評価
図1に示す携帯電話ハウジングを成形し、(4-1)〜(4-3)の評価を行った。
成形機;住友重機工業SE100D
シリンダー温度;270-270-260-230℃
金型温度;100℃
(4-1)携帯電話ハウジングのヒンジ部の曲げ強度
図1のヒンジ部を押し曲げて、破壊強度を測定した。
測定速度;1000mm/分
(4-2)携帯電話ハウジングのボス部のひけ
図1のボス部の表面のひけ状況を目視観察した。
判断
○…ひけ少ない
×…ひけ多い
(4-3)携帯電話ハウジングのやけ(ガスによる圧縮発熱)
図1のヒンジ部流動末端のやけ状況を目視観察した。
判断
○…やけ少ない
×…やけ多い
Claims (7)
- (A)変性ポリブチレンテレフタレート樹脂100重量部に対して、
(B)扁平な断面形状を有するガラス繊維40〜140重量部
を配合してなるポリブチレンテレフタレート樹脂組成物からなる携帯端末部品。 - (A)変性ポリブチレンテレフタレート樹脂が、全ジカルボン酸成分に対して5〜30モル%のイソフタル酸を含むイソフタル酸変性ポリブチレンテレフタレートである請求項1記載のポリブチレンテレフタレート携帯端末部品。
- (A)変性ポリブチレンテレフタレート樹脂が、ポリブチレンテレフタレートとイソフタル酸変性ポリエチレンテレフタレートの混合物である請求項1記載の携帯端末部品。
- (B)扁平な断面形状を有するガラス繊維が、長さ方向に直角の断面の長径(断面の最長の直線距離)と短径(長径と直角方向の最長の直線距離)の比が1.3〜10の間にあるものである請求項1〜3の何れか1項記載の携帯端末部品。
- (B)扁平な断面形状を有するガラス繊維が、平均断面積100〜300平方マイクロメートルのものである請求項1〜4の何れか1項記載の携帯端末部品。
- 更に(C)モース硬度4.5以下の無機白色顔料を用いて着色された請求項1〜5の何れか1項記載の携帯端末部品。
- 携帯端末部品の筐体(ハウジング)、補強板(シャーシ)、フレーム、ヒンジ又はこれらの周辺関連部品である請求項1〜6の何れか1項記載の携帯端末部品。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007334706A JP5329804B2 (ja) | 2007-12-26 | 2007-12-26 | 携帯端末部品 |
| CN200880122938.3A CN101910305B (zh) | 2007-12-26 | 2008-12-24 | 便携终端部件 |
| KR1020107014025A KR101503100B1 (ko) | 2007-12-26 | 2008-12-24 | 휴대 단말 부품 |
| PCT/JP2008/003909 WO2009081574A1 (ja) | 2007-12-26 | 2008-12-24 | 携帯端末部品 |
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| JP2007334706A JP5329804B2 (ja) | 2007-12-26 | 2007-12-26 | 携帯端末部品 |
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| JP5329804B2 JP5329804B2 (ja) | 2013-10-30 |
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| JP (1) | JP5329804B2 (ja) |
| KR (1) | KR101503100B1 (ja) |
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| WO (1) | WO2009081574A1 (ja) |
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| JP2010111816A (ja) * | 2008-11-07 | 2010-05-20 | Mitsubishi Engineering Plastics Corp | ウエルド部を有するポリブチレンテレフタレート樹脂成形品 |
| WO2011155367A1 (ja) * | 2010-06-10 | 2011-12-15 | ウィンテックポリマー株式会社 | 接着力改善用樹脂組成物、樹脂成形体、接合体及び接着力改善剤 |
| WO2013165007A1 (ja) * | 2012-05-01 | 2013-11-07 | ウィンテックポリマー株式会社 | 電子機器用筐体 |
| JP2014040556A (ja) * | 2012-08-24 | 2014-03-06 | Mitsubishi Engineering Plastics Corp | ポリカーボネート樹脂組成物及び成形体 |
| JP2014040555A (ja) * | 2012-08-24 | 2014-03-06 | Mitsubishi Engineering Plastics Corp | ポリカーボネート樹脂組成物及び成形体 |
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| JP2024507435A (ja) * | 2022-01-27 | 2024-02-20 | エルジー・ケム・リミテッド | ポリエステル樹脂組成物、その製造方法及びそれから製造された成形品 |
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| KR101823736B1 (ko) | 2015-09-24 | 2018-01-30 | 롯데첨단소재(주) | 폴리에스테르 수지 조성물 및 이를 이용한 성형품 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0395257A (ja) * | 1989-05-29 | 1991-04-19 | Polyplastics Co | 難燃性ポリエステル樹脂組成物 |
| JPH09216245A (ja) * | 1996-02-13 | 1997-08-19 | Toray Ind Inc | 携帯機器用筐体 |
| JPH09286036A (ja) * | 1996-04-22 | 1997-11-04 | Toray Ind Inc | 樹脂成形品 |
| JP2001339235A (ja) * | 2000-05-26 | 2001-12-07 | Sony Corp | 電子機器 |
| WO2005083991A1 (ja) * | 2004-02-27 | 2005-09-09 | Nec Corporation | カード型携帯電話機 |
| JP2006176691A (ja) * | 2004-12-24 | 2006-07-06 | Wintech Polymer Ltd | 振動溶着用ポリブチレンテレフタレート樹脂組成物 |
| JP2007091865A (ja) * | 2005-09-28 | 2007-04-12 | Wintech Polymer Ltd | 難燃性ポリブチレンテレフタレート樹脂組成物 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5938264B2 (ja) * | 1976-12-09 | 1984-09-14 | 東レ株式会社 | 熱可塑性ポリエステル樹脂組成物 |
| JPS612746A (ja) * | 1984-06-15 | 1986-01-08 | Mitsubishi Chem Ind Ltd | ポリエステル樹脂組成物 |
| JPS62268612A (ja) * | 1986-05-19 | 1987-11-21 | Nitto Boseki Co Ltd | ガラス繊維強化樹脂成型体 |
| JP2610671B2 (ja) * | 1988-12-26 | 1997-05-14 | ポリプラスチックス 株式会社 | 繊維強化熱可塑性樹脂組成物 |
| JPH04353556A (ja) * | 1991-05-31 | 1992-12-08 | Teijin Ltd | ポリエステル樹脂組成物 |
| JP4364339B2 (ja) * | 1999-03-17 | 2009-11-18 | ポリプラスチックス株式会社 | インサート成形品 |
| JP5058565B2 (ja) * | 2006-11-13 | 2012-10-24 | ウィンテックポリマー株式会社 | ポリブチレンテレフタレート樹脂組成物及び成形品 |
| JP5396690B2 (ja) * | 2007-03-07 | 2014-01-22 | 東洋紡株式会社 | 無機強化ポリエステル系樹脂組成物及びそれを用いた成形品の表面外観改良方法。 |
-
2007
- 2007-12-26 JP JP2007334706A patent/JP5329804B2/ja not_active Expired - Fee Related
-
2008
- 2008-12-24 KR KR1020107014025A patent/KR101503100B1/ko not_active Expired - Fee Related
- 2008-12-24 WO PCT/JP2008/003909 patent/WO2009081574A1/ja not_active Ceased
- 2008-12-24 CN CN200880122938.3A patent/CN101910305B/zh not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0395257A (ja) * | 1989-05-29 | 1991-04-19 | Polyplastics Co | 難燃性ポリエステル樹脂組成物 |
| JPH09216245A (ja) * | 1996-02-13 | 1997-08-19 | Toray Ind Inc | 携帯機器用筐体 |
| JPH09286036A (ja) * | 1996-04-22 | 1997-11-04 | Toray Ind Inc | 樹脂成形品 |
| JP2001339235A (ja) * | 2000-05-26 | 2001-12-07 | Sony Corp | 電子機器 |
| WO2005083991A1 (ja) * | 2004-02-27 | 2005-09-09 | Nec Corporation | カード型携帯電話機 |
| JP2006176691A (ja) * | 2004-12-24 | 2006-07-06 | Wintech Polymer Ltd | 振動溶着用ポリブチレンテレフタレート樹脂組成物 |
| JP2007091865A (ja) * | 2005-09-28 | 2007-04-12 | Wintech Polymer Ltd | 難燃性ポリブチレンテレフタレート樹脂組成物 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010111816A (ja) * | 2008-11-07 | 2010-05-20 | Mitsubishi Engineering Plastics Corp | ウエルド部を有するポリブチレンテレフタレート樹脂成形品 |
| WO2011155367A1 (ja) * | 2010-06-10 | 2011-12-15 | ウィンテックポリマー株式会社 | 接着力改善用樹脂組成物、樹脂成形体、接合体及び接着力改善剤 |
| US11124602B2 (en) * | 2010-06-10 | 2021-09-21 | Polyplastics Co., Ltd. | Method for adhering resin molded articles |
| WO2013165007A1 (ja) * | 2012-05-01 | 2013-11-07 | ウィンテックポリマー株式会社 | 電子機器用筐体 |
| JPWO2013165007A1 (ja) * | 2012-05-01 | 2015-12-24 | ウィンテックポリマー株式会社 | 電子機器用筐体 |
| JP2014040556A (ja) * | 2012-08-24 | 2014-03-06 | Mitsubishi Engineering Plastics Corp | ポリカーボネート樹脂組成物及び成形体 |
| JP2014040555A (ja) * | 2012-08-24 | 2014-03-06 | Mitsubishi Engineering Plastics Corp | ポリカーボネート樹脂組成物及び成形体 |
| WO2019070025A1 (ja) * | 2017-10-06 | 2019-04-11 | 東洋紡株式会社 | 無機強化熱可塑性ポリエステル樹脂組成物 |
| JPWO2019070025A1 (ja) * | 2017-10-06 | 2020-09-10 | 東洋紡株式会社 | 無機強化熱可塑性ポリエステル樹脂組成物 |
| JP7120212B2 (ja) | 2017-10-06 | 2022-08-17 | 東洋紡株式会社 | 無機強化熱可塑性ポリエステル樹脂組成物 |
| JP2024507435A (ja) * | 2022-01-27 | 2024-02-20 | エルジー・ケム・リミテッド | ポリエステル樹脂組成物、その製造方法及びそれから製造された成形品 |
| JP7624518B2 (ja) | 2022-01-27 | 2025-01-30 | エルジー・ケム・リミテッド | ポリエステル樹脂組成物、その製造方法及びそれから製造された成形品 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100105840A (ko) | 2010-09-30 |
| JP5329804B2 (ja) | 2013-10-30 |
| WO2009081574A1 (ja) | 2009-07-02 |
| CN101910305B (zh) | 2013-02-13 |
| KR101503100B1 (ko) | 2015-03-16 |
| CN101910305A (zh) | 2010-12-08 |
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