JP2010077303A - Epoxy resin composition and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small warp after molding or solder processing when used in a semiconductor device requiring low warpage and smoothness, particularly an area mounting type semiconductor device in which a resin layer is formed on one side of a substrate. To provide an epoxy resin composition having excellent solderability and excellent productivity.
SOLUTION: A crystalline epoxy resin (A) having a melting point of 30 ° C. or higher and 150 ° C. or lower, a polyfunctional epoxy resin (B), a polyfunctional phenol resin (C), a spherical inorganic filler (D), a flaky inorganic An epoxy resin composition containing a filler (E) and a curing accelerator (F), wherein the resin composition has a spurious flow at 175 ° C. of 50 cm or more, and measurement of the resin composition at 175 ° C. is started. An epoxy resin composition characterized by having a curast torque value of 10 N · m or more after 30 seconds.
[Selection figure] None

Description

  The present invention relates to an epoxy resin composition and a semiconductor device. For example, it is suitably used for a semiconductor device that requires low warpage and smoothness, such as an area mounting type semiconductor device, MEMS (Micro Electro Mechanical Systems), and an image sensor.

In recent years, electronic devices have become smaller, lighter, and more functional, and as the integration of semiconductors has progressed year by year and the surface mounting of semiconductor devices has been promoted, new area-mounted semiconductor devices have been developed. It has been developed and is beginning to shift from conventional semiconductor devices. Typical area-mounted semiconductor devices are BGA (Ball Grid Array) or CSP (Chip Size Package) in pursuit of further miniaturization.
These are the conventional QFP (Quad Flat Package), SOP
Surface mount semiconductor devices typified by (Small Out-line Package) have been developed to meet the demand for high pin count and high speed approaching the limit. As a structure, a semiconductor element is mounted on one side of a circuit board typified by a bismaleimide triazine (hereinafter also referred to as “BT”) resin / copper foil circuit board, and the semiconductor element mounting surface, that is, one side of the board. Only a resin layer such as an epoxy resin composition is formed. Since a resin layer of about several hundred μm to several mm is formed on the semiconductor element mounting surface, it is substantially a single-sided resin layer.
Such a single-sided resin layer is formed by directly sealing a semiconductor element, mounting a flip chip, protecting the circuit surface of the element with a liquid underfill as a first resin, and surrounding it. There exists what forms a resin layer etc. as 2nd resin.

  Since the resin layer is substantially formed on one side, mismatch of thermal expansion / shrinkage between the organic substrate or metal substrate and the cured epoxy resin composition, or molding / curing of the epoxy resin composition Due to the influence of curing shrinkage at the time, these semiconductor devices are likely to warp immediately after molding. The semiconductor device is exposed to a temperature of 230 to 260 ° C. during solder connection, and may be exposed to a temperature of −65 ° C. in a temperature cycle test or the like. In this case, if the amount of warpage increases, the wiring may be cut, or a crack may enter the resin portion and the crack may progress to cut the wiring. Various studies have been made to reduce such warpage. For example, using a triphenylmethane type epoxy resin or a naphthalene type polyfunctional epoxy resin, the glass transition temperature of the cured product of the epoxy resin composition is set to a molding temperature or higher. Thus, the warpage when cooled to room temperature after molding can be reduced (see, for example, Patent Document 1), but the warpage increases when the semiconductor device is exposed to an atmosphere of 230 to 260 ° C. for solder connection thereafter. There is. The main factor is considered to be that the difference between the linear expansion coefficient of the substrate at a high temperature and the linear expansion coefficient of the cured product of the epoxy resin composition is increased. Therefore, as a result of intensive studies, it is possible to reduce the coefficient of linear expansion particularly at high temperatures and reduce the warpage of the semiconductor device by using an epoxy resin composition to which a flaky inorganic filler with a high aspect ratio is added. I found. Although the effect of reducing the linear expansion coefficient is influenced by the shape and molding method of the cured product, the scaly inorganic filler having a high aspect ratio in the cured product of the epoxy resin composition is parallel to the longitudinal direction of the substrate. It is inferred that it is expressed by more orientation in the direction. However, when a scaly inorganic filler with a high aspect ratio is added, the epoxy resin composition has a significant decrease in curability and fluidity, so that the productivity of the industrial semiconductor device is low. It was not necessarily suitable for production. As a result of intensive studies to solve such problems, the present invention has been completed.

JP 2002-037863 A

  When the present invention is used for a semiconductor device that requires low warpage and smoothness, particularly an area mounting type semiconductor device in which a resin layer is formed on one side of a substrate, the warpage after molding or during soldering is small. An object of the present invention is to provide an epoxy resin composition excellent in solder resistance and productivity and a semiconductor device excellent in reliability.

  The epoxy resin composition of the present invention has a crystalline epoxy resin (A), polyfunctional epoxy resin (B), polyfunctional phenol resin (C), spherical inorganic filler (D) having a melting point of 30 ° C. or higher and 150 ° C. or lower. ), A scale-like inorganic filler (E), and an epoxy resin composition containing a curing accelerator (F), wherein the epoxy resin composition has a spurious flow at 175 ° C. of 50 cm or more, and the epoxy resin composition The curast torque value at 30 seconds after the start of measurement at 175 ° C. of the product is 10 N · m or more.

  In the epoxy resin composition of the present invention, the scale-like inorganic filler (E) may have an aspect ratio of 2 or more and 10 or less.

  In the epoxy resin composition of the present invention, the scale-like inorganic filler (E) may be surface-treated with a coupling agent.

  In the epoxy resin composition of the present invention, the crystalline epoxy resin (A) is represented by the compound represented by the following general formula (1), the compound represented by the following general formula (2), and the following general formula (3). It is possible to be at least one selected from the compounds described above.

（ただし、上記一般式（１）において、Ｒ１は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ａは０〜４の整数である。）

(However, in the said General formula (1), R1 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. A is 0-4. Is an integer.)

（ただし、上記一般式（２）において、Ｒ２は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｂは０〜４の整数で
ある。−Ｘ−は−Ｃ（Ｒ３）_２−、−Ｏ−、−Ｓ−の中から選択される基である。Ｒ３は水素原子、又は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。）

(However, in the said General formula (2), R2 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. B is 0-4. -X- is a group selected from -C (R3) _2- , -O-, and -S-, where R3 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. And they may be the same or different from each other.)

（ただし、上記一般式（３）において、Ｒ４は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｃは０〜４の整数である。）

(However, in the said General formula (3), R4 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. C is 0-4. Is an integer.)

  In the epoxy resin composition of the present invention, the polyfunctional epoxy resin (B) is represented by the compound represented by the following general formula (4), the compound represented by the following general formula (5), and the following general formula (6). It is possible to be at least one selected from the compounds described above.

（ただし、上記一般式（４）において、Ｒ５は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｄは０〜４の整数である。ｎ４の平均値は０又は１０以下の正数である。）

(However, in the said General formula (4), R5 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. D is 0-4. (The average value of n4 is a positive number of 0 or 10 or less.)

（ただし、上記一般式（５）において、ｅは１、ｆは１又は０、Ｒ６は水素原子、炭素数１〜４のアルキル基の中から選択される基、又はフェニル基であり、Ｇはグリシジル基を示す。

(In the general formula (5), e is 1, f is 1 or 0, R6 is a hydrogen atom, a group selected from alkyl groups having 1 to 4 carbon atoms, or a phenyl group, and G is A glycidyl group is shown.

（ただし、上記一般式（６）において、Ｒ７は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｇは０〜４の整数である。）

(However, in the said General formula (6), R7 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. G is 0-4. Is an integer.)

  The epoxy resin composition of the present invention is a blending ratio (B) / {(A) + (B) of the polyfunctional epoxy resin (B) with respect to the total amount of the crystalline epoxy resin (A) and the polyfunctional epoxy resin (B). )} Can be 0.6 or more and 0.9 or less in mass ratio.

  The epoxy resin composition of the present invention is obtained by premixing the crystalline epoxy resin (A) and the polyfunctional epoxy resin (B), and then mixing and / or melt-kneading with other components. Can do.

  The epoxy resin composition of the present invention is at least one selected from the compound represented by the following general formula (7) and the compound represented by the following general formula (8), wherein the polyfunctional phenol resin (C) is: There can be.

（ただし、上記一般式（７）において、Ｒ８は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｈは０〜４の整数で
ある。ｎ７の平均値は０又は１０以下の正数である。）

(However, in the said General formula (7), R8 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. H is 0-4. (The average value of n7 is a positive number of 0 or 10 or less.)

（ただし、上記一般式（８）において、Ｒ９は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｉは０〜４の整数である。）

(However, in the said General formula (8), R9 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. I is 0-4. Is an integer.)

  The epoxy resin composition of the present invention can be an addition product of a phosphine compound and a phenol compound in which the curing accelerator (F) is represented by the following general formula (9).

（ただし、上記一般式（９）において、Ｘは炭素数１〜３のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。Ｙはヒドロキシル基であり、それらは互いに同一であっても異なっていてもよい。ｊ、ｋは１〜３の整数である。）

(However, in the said General formula (9), X is group selected from a C1-C3 alkyl group, and they may mutually be same or different. Y is a hydroxyl group. And they may be the same or different from each other, j and k are integers of 1 to 3.)

  In the epoxy resin composition of the present invention, the curing accelerator (F) is at least one selected from a compound represented by the following formula (10) and a compound represented by the following formula (11). can do.

  The epoxy resin composition of the present invention may further contain a compound (G) in which a hydroxyl group is bonded to each of two or more adjacent carbon atoms constituting an aromatic ring.

  In the epoxy resin composition of the present invention, the scaly inorganic filler (E) may be glass flakes.

  In the epoxy resin composition of the present invention, the composition of the glass flakes may be borosilicate glass.

  In the epoxy resin composition of the present invention, the blending ratio of the scale-like inorganic filler (E) to the total epoxy resin composition may be 10% by mass or more and 70% by mass or less.

  The epoxy resin composition of the present invention is a blending ratio (E) / {(D of the scale-like inorganic filler (E) with respect to the total amount of the spherical inorganic filler (D) and the scale-like inorganic filler (E). ) + (E)} can be 0.1 or more and 0.8 or less.

  A semiconductor device according to the present invention has a cured product of the above-described epoxy resin composition.

  When the present invention is used for a semiconductor device that requires low warpage and smoothness, particularly an area mounting type semiconductor device in which a resin layer is formed on one side of a substrate, the warpage after molding or during soldering is small. An epoxy resin composition excellent in solder resistance and productivity, and a semiconductor device excellent in reliability can be obtained.

Hereinafter, the epoxy resin composition and semiconductor device of the present invention will be described in detail.
The epoxy resin composition of the present invention has a crystalline epoxy resin (A), polyfunctional epoxy resin (B), polyfunctional phenol resin (C), spherical inorganic filler (D) having a melting point of 30 ° C. or higher and 150 ° C. or lower. ), A scale-like inorganic filler (E), and an epoxy resin composition containing a curing accelerator (F), wherein the epoxy resin composition has a spurious flow at 175 ° C. of 50 cm or more, and the epoxy resin composition The curast torque value at 30 seconds after the start of measurement at 175 ° C. of the product is 10 N · m or more.
Moreover, the semiconductor device of this invention has the hardened | cured material of the above-mentioned epoxy resin composition, It is characterized by the above-mentioned.

First, the epoxy resin composition of the present invention will be described.
The epoxy resin composition of the present invention contains a crystalline epoxy resin (A). The crystalline epoxy resin (A) used in the present invention is used to develop fluidity during molding. A known crystalline epoxy resin can be used, but those having a melting point in the range of 30 ° C. or higher and 150 ° C. or lower are preferable in consideration of moldability and productivity. If it is more than the said lower limit, the production | generation of an epoxy resin composition will not cause the malfunction of adhesion to a conveying apparatus etc., adhesion | attachment of tablets, and stable production will be attained. Moreover, if it is below the said upper limit, melt | dissolution of resin will not become non-uniform | heterogenous at the time of a melting | fusing of an epoxy resin composition, and a homogeneous resin composition can be obtained.

  The crystalline epoxy resin (A) used in the present invention is not particularly limited. For example, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, sulfur atom-containing type epoxy resin, A stilbene type epoxy resin, a hydroquinone type epoxy resin, a naphthalene type epoxy resin, etc. are mentioned, These may be used individually by 1 type, or may use 2 or more types together. Among these, the compound represented by the following general formula (1), the compound represented by the following general formula (2) and the compound represented by the following general formula (3) are industrially available and suitable for the present invention. Used for. Among them, particularly preferable resins include compounds represented by the following general formula (1) or compounds represented by the following general formula (2). Thereby, fluidity | liquidity can be improved especially.

（ただし、上記一般式（１）において、Ｒ１は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ａは０〜４の整数である。）

(However, in the said General formula (1), R1 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. A is 0-4. Is an integer.)

（ただし、上記一般式（２）において、Ｒ２は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｂは０〜４の整数で
ある。−Ｘ−は−Ｃ（Ｒ３）_２−、−Ｏ−、−Ｓ−の中から選択される基である。Ｒ３は水素原子、又は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。）

(However, in the said General formula (2), R2 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. B is 0-4. -X- is a group selected from -C (R3) _2- , -O-, and -S-, where R3 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. And they may be the same or different from each other.)

（ただし、上記一般式（３）において、Ｒ４は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｃは０〜４の整数である。）

(However, in the said General formula (3), R4 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. C is 0-4. Is an integer.)

  The blending ratio of the crystalline epoxy resin (A) used in the present invention is not particularly limited, but is preferably 1% by mass or more and 5% by mass or less in the total epoxy resin composition, and 1.2% by mass. % Or more and 3% by mass or less is more preferable. The effect which improves fluidity | liquidity can be acquired as the compounding ratio of a crystalline epoxy resin (A) is in the said range.

  The epoxy resin composition of the present invention contains a polyfunctional epoxy resin (B). The polyfunctional epoxy resin (B) used in the present invention may be either one not containing a repeating unit structure or one containing a repeating unit structure, and in the case of one containing no repeating unit structure, three or more per molecule. And having a repeating unit structure, it has 3 or more epoxy groups per molecule even when the repeating unit n is assumed to be 0. That is, it does not include an ortho-cresol novolac type epoxy resin. By using the polyfunctional epoxy resin (B), it is possible to increase the glass transition temperature of the cured resin, which is effective as a means for improving warpage.

  Although it does not specifically limit as polyfunctional epoxy resin (B) used by this invention, For example, a triphenol methane type epoxy resin, a naphthalene dimer type epoxy resin, an alkyl modified triphenol methane type epoxy resin etc. are mentioned. These may be used alone or in combination of two or more. Among these, as preferred examples, compounds represented by the following general formula (4), compounds represented by the following general formula (5), and compounds represented by the following general formula (6) are industrially available. And is suitable for the present invention.

（ただし、上記一般式（４）において、Ｒ５は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｄは０〜４の整数である。ｎ４の平均値は０又は１０以下の正数である。）

(However, in the said General formula (4), R5 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. D is 0-4. (The average value of n4 is a positive number of 0 or 10 or less.)

（ただし、上記一般式（５）において、ｅは１、ｆは１又は０、Ｒ６は水素原子、炭素数１〜４のアルキル基の中から選択される基、又はフェニル基であり、Ｇはグリシジル基を示す。

(In the general formula (5), e is 1, f is 1 or 0, R6 is a hydrogen atom, a group selected from alkyl groups having 1 to 4 carbon atoms, or a phenyl group, and G is A glycidyl group is shown.

（ただし、上記一般式（６）において、Ｒ７は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｇは０〜４の整数である。）

(However, in the said General formula (6), R7 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. G is 0-4. Is an integer.)

  Although it does not specifically limit as a compounding ratio of the polyfunctional epoxy resin (B) used by this invention, It is preferable that it is 3 mass% or more and 15 mass% or less in all the epoxy resin compositions, and 4 mass% or more. More preferably, it is 12% by mass or less. The effect which improves low curvature property can be acquired as the compounding ratio of a polyfunctional epoxy resin (B) is in the said range.

  The preferred blending ratio of the crystalline epoxy resin (A) and the polyfunctional epoxy resin (B) used in the present invention is a polyfunctional epoxy resin relative to the total amount of the crystalline epoxy resin (A) and the polyfunctional epoxy resin (B). The blending ratio (B) / {(A) + (B)} of (B) is preferably 0.6 or more and 0.9 or less in terms of mass ratio, and is 0.7 or more and 0.8 or less. Is more preferable. When it is not more than the above upper limit, the viscosity at the time of molding becomes an appropriate range, and good moldability is obtained. Further, when it is at least the above lower limit value, the glass transition temperature becomes an appropriate range, and a sufficient low warpage effect is obtained.

  Moreover, it is also possible to add a well-known epoxy resin in the range which does not impair the effect of this invention obtained by using together a crystalline epoxy resin (A) and a polyfunctional epoxy resin (B). Examples include phenol novolac epoxy resins, cresol novolac epoxy resins, phenol aralkyl epoxy resins, naphthol novolac epoxy resins, naphthol aralkyl epoxy resins, anthracene epoxy resins, triazine nucleus-containing epoxy resins, dicyclopentadiene modified A phenol type epoxy resin etc. are mentioned, These may be used individually by 1 type, or may use 2 or more types together.

  The epoxy resin composition of the present invention contains a polyfunctional phenol resin (C). The polyfunctional phenol resin (C) used in the present invention may be either one not containing a repeating unit structure or one containing a repeating unit structure, and in the case of one containing no repeating unit structure, three or more per molecule. And having a repeating unit structure, it has three or more phenolic hydroxyl groups per molecule even when the repeating unit n is assumed to be 0. That is, it does not include a phenol novolac resin. By using the polyfunctional phenol resin (C), the glass transition temperature can be increased as in the case of the polyfunctional epoxy resin (B), thereby obtaining an effect of improving warpage.

  Although it does not specifically limit as polyfunctional phenol resin (C) used by this invention, For example, a triphenol methane type phenol resin, an alkyl modified triphenol methane type phenol resin, etc. are mentioned, These are one type. It may be used alone or in combination of two or more. Among these, preferred examples include a compound represented by the following general formula (7) and a compound represented by the following general formula (8). These are industrially available and are suitable for achieving the purpose.

（ただし、上記一般式（７）において、Ｒ８は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｈは０〜４の整数である。ｎ７の平均値は０又は１０以下の正数である。）

(However, in the said General formula (7), R8 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. H is 0-4. (The average value of n7 is a positive number of 0 or 10 or less.)

（ただし、上記一般式（８）において、Ｒ９は炭素数１〜６のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。ｉは０〜４の整数である。）

(However, in the said General formula (8), R9 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. I is 0-4. Is an integer.)

  Although it does not specifically limit as a compounding ratio of the polyfunctional phenol resin (C) used by this invention, It is preferable that it is 2 mass% or more and 10 mass% or less in all the epoxy resin compositions, and 3 mass% or more. More preferably, it is 8 mass% or less. The effect which improves low curvature property can be acquired as the compounding ratio of polyfunctional phenol resin (C) is in the said range.

  Moreover, it is also possible to add a well-known phenol resin in the range which does not impair the effect of this invention obtained by using polyfunctional phenol resin (C). Examples thereof include phenol novolak resin, cresol novolak resin, dicyclopentadiene modified phenol resin, terpene modified phenol resin, phenol aralkyl resin (having phenylene skeleton, biphenylene skeleton, etc.), naphthol novolak resin, naphthol aralkyl resin (phenylene skeleton, Having a biphenylene skeleton), a sulfur atom-containing phenol resin, and the like. These may be used alone or in combination of two or more.

In the epoxy resin composition of the present invention, the blending ratio of all epoxy resins and all phenol resins is equivalent ratio of the number of epoxy groups (EP) of the whole epoxy resin and the number of phenolic hydroxyl groups (OH) of the whole phenol resin ( EP) / (OH) is preferably 0.8 or more and 1.3 or less. When the equivalent ratio is within this range, sufficient curability can be obtained during molding of the epoxy resin composition. Further, when the equivalent ratio is within this range, the glass transition temperature becomes an appropriate range, and good physical properties in the cured resin can be obtained.

  The epoxy resin composition of the present invention contains a spherical inorganic filler (D). By adding the spherical inorganic filler (D), the linear expansion coefficient can be reduced, the mechanical strength can be improved, the moisture resistance, and the fluidity can be improved. For example, known insulating inorganic spherical fillers can be used, and more preferable examples include spherical fused silica and spherical alumina. These spherical inorganic fillers (D) may be used alone or in combination of two or more.

  Although it does not specifically limit as a mixture ratio of the spherical inorganic filler (D) used by this invention, It is preferable that it is 10 mass% or more and 85 mass% or less in all the epoxy resin compositions, and 15 mass% or more. 80% by mass or less is more preferable. When the blending ratio of the spherical inorganic filler (D) is within the above range, the effect of improving the mechanical strength and moisture resistance can be obtained while maintaining sufficient fluidity.

  The epoxy resin composition of the present invention contains a scaly inorganic filler (E). The scale-like inorganic filler (E) used in the present invention preferably has a lower aspect ratio of 2 or more, more preferably 2.5 or more in the particle shape. Further, the upper limit of the aspect ratio is preferably 10 or less, and more preferably 5 or less. In addition, an aspect ratio is the value calculated | required by average particle diameter / average thickness from average thickness and average particle diameter. The average thickness can be calculated using, for example, the area occupied by the surface of flakes measured by the water surface single particle membrane method (see paragraphs 0023 to 0024 of JP-A-9-48613). Moreover, about an average particle diameter, the mode diameter measured with the commercially available laser type particle size distribution analyzer (For example, Shimadzu Corporation make, SALD-7000 etc.) can be used, for example. The effect which improves low curvature property can be acquired by reducing the linear expansion coefficient of resin hardened | cured material as it is more than the said lower limit. Moreover, when the aspect ratio is not more than the above upper limit, the viscosity at the time of molding of the resin composition does not increase excessively, and there is little possibility of causing molding defects.

  The scale-like inorganic filler (E) used in the present invention is not particularly limited, and examples thereof include glass flakes, glass fibers, or clay minerals such as mica and clay. Used to calculate the aspect ratio when pulverized. More preferred are glass flakes, in which borosilicate glass is particularly effective for reducing the coefficient of linear expansion and improving strength. As such a scale-like inorganic filler (E), a commercially available product can be used as it is or after pulverization if necessary. Regarding the aspect ratio in the case where a commercially available product is used as it is, data of a commercial product manufacturer can be used. Moreover, about the aspect ratio in the case of grind | pulverizing and using a commercial item, the data of a commercial item manufacturer are used as an average thickness, and a commercially available laser type particle size distribution meter (for example, SALD-manufactured by Shimadzu Corporation) is used as the average particle size. 7000 etc.) and can be calculated by using the mode diameter measured.

  Even when the scale-like inorganic filler (E) is in the above-described aspect ratio range, the contact resistance with the resin is large due to its shape, so that when the epoxy resin composition is melted The fluidity tends to decrease. Moreover, when using glass flakes made of borosilicate glass, the curability of the epoxy resin composition tends to decrease. In the present invention, it is possible to significantly improve the above-described problems in fluidity and curability by surface-treating the surface of the scaly inorganic filler (E) with a coupling agent.

A well-known thing can be used as a coupling agent used for the surface treatment of a scale-like inorganic filler (E). Examples thereof are γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane. N-phenyl γ-aminopropyltriethoxysilane, N-phenyl γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltriethoxysilane, N-6- (aminohexyl) 3-aminopropyl Trimethoxysilane, N- (3- (trimethoxysilylpropyl) -1,3-benzenedimethanane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxy Propylmethyldimethoxysilane, β- (3,4 epoxy cyclohexyl Sil) ethyltrimethoxysilane, methyltrimethoxysilane, γ-ureidopropyltriethoxysilane, vinyltriethoxysilane, etc. Among them, treatment with an aminosilane coupling agent improves fluidity and curability. More preferred.

  The scaly inorganic filler (E) treated with such a coupling agent can also be obtained industrially, and examples thereof include REF-015A (aminosilane treatment) manufactured by Nippon Sheet Glass Co., Ltd. Moreover, the scale-like inorganic filler (E) treated with the coupling agent is an untreated scale-like inorganic filler (E) that can be obtained industrially, for example, REF-015 manufactured by Nippon Sheet Glass Co., Ltd. It can also be obtained by surface-treating with the coupling agent by a method such as spraying, gas-phase treatment, or mixing treatment.

  Although it does not specifically limit as a compounding ratio of the scale-like inorganic filler (E) used by this invention, It is preferable that it is 10 mass% or more and 70 mass% or less in all the epoxy resin compositions, and 15 mass%. As mentioned above, it is more preferable that it is 60 mass% or less. When the blending ratio of the scale-like inorganic filler (E) is within the above range, it is possible to obtain an effect of reducing the linear expansion coefficient and improving the low warpage while maintaining sufficient fluidity.

  The content ratio (E) / {(D) + (E)} of the flaky inorganic filler (E) relative to the total amount of the spherical inorganic filler (D) and the flaky inorganic filler (E) used in the present invention is as follows. It is preferably 0.1 or more and 0.8 or less, and more preferably 0.2 or more and 0.7 or less. The melt viscosity of an epoxy resin composition can be made into an appropriate range as it is below the said upper limit. Moreover, the effect which reduces a linear expansion coefficient and improves low curvature property as it is more than the said lower limit can fully be acquired.

  The epoxy resin composition of the present invention contains a curing accelerator (F). The hardening accelerator (F) used by this invention can use a well-known thing, if the acceleration | stimulation of the crosslinking reaction of an epoxy resin and a phenol resin is promoted. For example, diazabicycloalkenes such as 1,8-diazabicyclo (5,4,0) undecene-7 and derivatives thereof; organic phosphines such as triphenylphosphine and methyldiphenylphosphine; imidazole compounds such as 2-methylimidazole; tetra Examples thereof include tetra-substituted phosphonium and tetra-substituted borates such as phenylphosphonium and tetraphenylborate, and these may be used alone or in combination of two or more. Considering the balance between fluidity and curability, an adduct of an organic phosphine compound represented by the following general formula (9) and a phenol is preferable, a compound represented by the following formula (10), and the following formula (11) The compound represented by these is more preferable.

（ただし、上記一般式（９）において、Ｘは炭素数１〜３のアルキル基の中から選択される基であり、それらは互いに同一であっても異なっていてもよい。Ｙはヒドロキシル基であり、それらは互いに同一であっても異なっていてもよい。ｊ、ｋは１〜３の整数である。）

(However, in the said General formula (9), X is group selected from a C1-C3 alkyl group, and they may mutually be same or different. Y is a hydroxyl group. And they may be the same or different from each other, j and k are integers of 1 to 3.)

  In addition, the epoxy resin composition of the present invention can be prepared, as necessary, from a compound (G) in which a hydroxyl group is bonded to two or more adjacent carbon atoms constituting an aromatic ring (hereinafter, simply referred to as “compound (G)”). Can also be used. The compound (G) that can be used in the present invention has the effect of lowering the viscosity of the epoxy resin composition and improving fluidity. The compound (G) that can be used in the present invention is not particularly limited, and may have a substituent other than a hydroxyl group. For example, the compound represented by the following general formula (12), The compound etc. which are represented by Formula (13) are mentioned.

（上記一般式（１２）において、Ｒ１０、Ｒ１４はどちらか一方が水酸基であり、片方が水酸基のとき他方は水素、水酸基又は水酸基以外の置換基である。Ｒ１１、Ｒ１２、Ｒ１３は水素、水酸基又は水酸基以外の置換基である。）

(In the general formula (12), one of R10 and R14 is a hydroxyl group, and when one is a hydroxyl group, the other is hydrogen, a hydroxyl group or a substituent other than a hydroxyl group. R11, R12, R13 are hydrogen, hydroxyl group or It is a substituent other than a hydroxyl group.)

（上記一般式（１３）において、Ｒ１５、Ｒ２１はどちらか一方が水酸基であり、片方が水酸基のとき他方は水素、水酸基又は水酸基以外の置換基である。Ｒ１６、Ｒ１７、Ｒ１８、Ｒ１９、Ｒ２０は水素、水酸基又は水酸基以外の置換基である。）

(In the general formula (13), one of R15 and R21 is a hydroxyl group, and when one is a hydroxyl group, the other is hydrogen, a hydroxyl group or a substituent other than a hydroxyl group. R16, R17, R18, R19, R20 are It is hydrogen, a hydroxyl group or a substituent other than a hydroxyl group.)

  Specific examples of the compound represented by the general formula (12) include catechol, pyrogallol, gallic acid, gallic acid ester, and derivatives thereof. Specific examples of the compound represented by the general formula (13) include 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and derivatives thereof. Among these, a compound in which a hydroxyl group is bonded to each of two adjacent carbon atoms constituting an aromatic ring is preferable because of easy control of fluidity and curability. In consideration of volatilization in the kneading process, it is more preferable that the mother nucleus is a compound having a low volatility and a naphthalene ring having high weighing stability. When considering both ease of fluidity and curability control and volatilization in the kneading step, for example, a naphthalene ring such as 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene and its derivatives A compound in which a hydroxyl group is bonded to each of two adjacent carbon atoms constituting the structure can be obtained. These compounds (G) may be used alone or in combination of two or more.

  Moreover, the epoxy resin composition of this invention can use separately the coupling agent similar to the coupling agent used for the surface treatment of the scale-like inorganic filler (E) as needed. The coupling agent has an effect of improving the interfacial strength between the resin matrix and the inorganic filler. These coupling agents can be added when the raw material components of the epoxy resin composition of the present invention are uniformly mixed using a mixer or the like. At that time, water, acid or alkali is added in advance. You may hydrolyze and use. Moreover, you may surface-treat these to a spherical inorganic filler (D) beforehand.

The epoxy resin composition of the present invention is represented by carbon black, if necessary, in addition to the coupling agent used for the surface treatment of the components (A) to (G) and (E), and other coupling agents. Coloring agents to be used; mold release agents such as natural wax and synthetic wax; low stress agents for developing low stress; flame retardants and the like can be appropriately blended.

  In the epoxy resin composition of the present invention, the spurious flow at 175 ° C. is preferably 50 cm or more, and more preferably 60 cm or more. The spiral flow is an index indicating the fluidity at the time of molding, and can be measured according to EMMI-1-66. If the spurious flow value at 175 ° C. is within the above range, there is little possibility that unfilling will occur during molding, or problems such as wire flow will occur. In order to make the spiral flow value at 175 ° C. within the above range, a crystalline epoxy resin (A) having a melting point of 30 ° C. or higher and 150 ° C. or lower, a polyfunctional epoxy resin (B), a polyfunctional phenol resin (C), This is achieved by adjusting the types and blending ratios of the spherical inorganic filler (D), the scale-like inorganic filler (E), and the curing accelerator (F). In particular, the blending ratio of the crystalline epoxy resin (A) and the polyfunctional epoxy resin (B), the blending ratio of the spherical inorganic filler (D) and the scaly inorganic filler (E), the shape of the scaly inorganic filler (E) Etc. is important. It is also important whether or not the surface of the scaly inorganic filler (E) is surface-treated with a coupling agent. Further, a curing accelerator (F) capable of affecting the fluidity during molding of the epoxy resin composition, a compound (G) in which a hydroxyl group is bonded to each of two or more adjacent carbon atoms constituting the aromatic ring, and the like are appropriately used. These properties can be adjusted by selecting and blending.

  The epoxy resin composition of the present invention preferably has a curast torque value of 30 N · m or more, more preferably 15 N · m or more, at 30 seconds after the start of measurement at 175 ° C. The curast torque is an index indicating the curability at the time of molding, and can be measured using, for example, JSR Curast Meter IVPS type manufactured by Orientec Co., Ltd. If the curast torque value at 30 seconds after the start of measurement at 175 ° C. is within the above range, there is little possibility that a release failure will occur at the time of demolding or the molded product will be deformed. In order to set the curast torque value at 175 ° C. for 30 seconds after the start of measurement to the above range, a crystalline epoxy resin (A), a polyfunctional epoxy resin (B) having a melting point of 30 ° C. or higher and 150 ° C. or lower, multifunctional This is achieved by adjusting the types and blending ratios of the phenol resin (C), the spherical inorganic filler (D), the scaly inorganic filler (E), and the curing accelerator (F). In particular, selection of the blending ratio of the spherical inorganic filler (D) and the scale-like inorganic filler (E), the shape of the scale-like inorganic filler (E), and the like are important. It is also important whether or not the surface of the scaly inorganic filler (E) is surface-treated with a coupling agent. Further, a curing accelerator (F) capable of affecting the curability at the time of molding of the epoxy resin composition, a compound (G) in which a hydroxyl group is bonded to each of two or more adjacent carbon atoms constituting the aromatic ring, and the like are appropriately used. These properties can be adjusted by selecting and blending.

  Moreover, the epoxy resin composition of the present invention is obtained by mixing each raw material component sufficiently uniformly using a mixer or the like, and then further heat-kneading with a kneader such as a heating kneader, a heat roll, or an extruder, Those that have been appropriately adjusted in dispersity, fluidity, and the like can be used as needed.

Next, the semiconductor device of the present invention will be described.
In order to manufacture a semiconductor device using the epoxy resin composition of the present invention, it may be cured by a conventional molding method such as transfer molding, compression molding, injection molding or the like.

The form of the semiconductor device of the present invention is not particularly limited. For example, the dual in-line package (DIP), the plastic lead chip carrier (PLCC), the quad flat package (QFP), the small outline, and the like. Package (SOP), Small Outline J Lead Package (SOJ), Thin Small
Outline Package (TSOP), Thin Quad Flat Package (TQFP), Tape Carrier Package (TCP), Ball Grid Array (BGA), Chip Size Package (CSP), Flip Chip BGA, Quad Flat non-lead package (QFN) and the like can be mentioned. Among these, examples of semiconductor devices that require low warpage and smoothness include area mounted semiconductor devices such as BGA, CSP, and flip chip BGA.
A semiconductor device sealed by a molding method such as the above transfer mold is completely cured at a temperature of about 80 ° C. to 200 ° C. for about 10 minutes to 10 hours, and then mounted on an electronic device or the like. Is done.

  Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto. The blending ratio is part by mass.

It shows below about the component used by the Example and the comparative example.
(Epoxy resin)
Epoxy resin 1: YL-6777 manufactured by Japan Epoxy Resin Co., Ltd. In the compound represented by the general formula (1), epoxy resin (melting point: 110 ° C.) 25% by mass whose main component is a compound in which a = 0, and in the compound represented by the general formula (4), d = 0. A mixture of 75% by mass of an epoxy resin mainly composed of a compound. Melting point 50 ° C., epoxy equivalent 163. )

Epoxy resin 2: DIC Corporation, HP-4770. In the compound represented by the general formula (5), 50% by mass of e = 0, f = 0 and R6 is a hydrogen atom (melting point 140 ° C.), e = 1, f = 0 and R6 is a hydrogen atom A mixture of 40% by mass of a compound and 10% by mass of a compound in which e = 1, f = 1 and R6 is a hydrogen atom. Softening point 72 ° C., epoxy equivalent 205.

Epoxy resin 3: manufactured by Japan Epoxy Resin Co., Ltd., YL-6121H. In the compound represented by the general formula (1), a mixture of 50% by mass of a compound in which a = 1 and R1- is CH ₃ —, and 50% by mass of a compound in which a = 0. Melting point 110 ° C., epoxy equivalent 171.

Epoxy resin 4: YL-6810, manufactured by Japan Epoxy Resin Co., Ltd. An epoxy resin containing, as a main component, a compound represented by the general formula (2), wherein b = 0 and -X- is -C (CH ₃ ) _2- . Melting point 47 ° C., epoxy equivalent 172.

Epoxy resin 5: YDC1312, manufactured by Tohto Kasei Co., Ltd. The epoxy resin which has as a main component the compound represented by General formula (14). Melting point 140 ° C., epoxy equivalent 178.

Epoxy resin 6: E-1032H60 manufactured by Japan Epoxy Resin Co., Ltd. The epoxy resin which has as a main component the compound which is d = 0 in the compound represented by General formula (4). Softening point 58 ° C., epoxy equivalent 171.

(Phenolic resin)
Phenol resin 1: MEH7500 manufactured by Meiwa Kasei Co., Ltd. The phenol resin which has as a main component the compound which is h = 0 in the compound represented by General formula (7). Softening point 110 ° C., hydroxyl equivalent 97.

  Phenol resin 2: manufactured by Sumitomo Bakelite Co., Ltd., PR-HF-3. Phenol novolac resin. Softening point 80 ° C., hydroxyl equivalent 105.

(Inorganic filler)
Spherical inorganic filler 1: Spherical fused silica (manufactured by Micron Corp., S30-71, average particle size 25 μm)
Scale-like inorganic filler 1: glass flake 1 (manufactured by Nippon Sheet Glass Co., Ltd., REF-015A. Composition: borosilicate glass, average particle size 15 μm, average thickness 5 μm, aspect ratio 3. Aminosilane-treated product)
Scale-like inorganic filler 2: Glass flake 2 (manufactured by Nippon Sheet Glass Co., Ltd., REFG-301. Composition: borosilicate glass. Average particle size 5 μm, average thickness 0.5 μm, aspect ratio 10. Epoxy silane-treated product.)
Scale-like inorganic filler 3: Glass flake 3 (manufactured by Nippon Sheet Glass Co., Ltd., REFG-302. Composition: borosilicate glass, average particle size 5 μm, average thickness 0.6 μm, aspect ratio 8.3, ureidosilane treated product. )
Scale-like inorganic filler 4: Glass flake 4 (manufactured by Nippon Sheet Glass Co., Ltd., REF-015. Composition: borosilicate glass. Average particle size 15 μm, average thickness 5 μm, aspect ratio 3. Product without silane treatment.)
Scale-like inorganic filler 5: Mica (manufactured by Coop Chemical Co., Ltd., ME-100. Average particle diameter 6 μm, average thickness 0.3 μm, aspect ratio 20; product without silane treatment.)

(Curing accelerator)
Curing accelerator 1: Compound represented by formula (10) Curing accelerator 2: Compound represented by formula (11) Curing accelerator 3: Triphenylphosphine

(Other additives)
Compound G1: 2,3-Dihydroxynaphthalene Coupling agent 1: 3-mercaptopropyltrimethoxysilane Colorant 1: Carbon black Release agent 1: Carnauba wax

Example 1
Epoxy resin 1 9.25 parts by weight Phenolic resin 1 5.50 parts by weight Spherical inorganic filler 1 64 parts by weight Scale-like inorganic filler 1 20 parts by weight Curing accelerator 2 0.45 parts by weight Coupling agent 1 0.3 parts by weight Part Colorant 1 0.3 part by weight Release agent 1 0.2 part by weight

  The above components were mixed at room temperature with a mixer, kneaded with a heating roll at 70 to 120 ° C., cooled and ground to obtain an epoxy resin composition. The obtained epoxy resin composition was evaluated by the following methods. The evaluation results are shown in Table 1.

Evaluation method Spiral flow: Using a low-pressure transfer molding machine (KTS-15, manufactured by Kotaki Seiki Co., Ltd.), a mold for spiral flow measurement according to EMMI-1-66, mold temperature 175 ° C., injection pressure The epoxy resin composition was injected under the conditions of 6.9 MPa and holding time of 120 seconds, and the flow length was measured. The spiral flow is a fluidity parameter, and the larger the value, the better the fluidity. The unit is cm.

  Curast meter torque: Using a curast meter (manufactured by Orientec Co., Ltd., JSR curast meter IVPS type), the torque at a mold temperature of 175 ° C. and 30 seconds after the start of heating was determined. The torque in the curast meter is a curability parameter, and a larger value is better from the viewpoint of fast curability. The unit is N · m.

Glass transition temperature Tg, linear expansion coefficient α1 (linear expansion coefficient in a temperature range lower than Tg), α2 (linear expansion coefficient in a temperature range higher than Tg): low-pressure transfer molding machine (manufactured by Fujiwa Seiki Co., Ltd., TEP-50- 30), a resin composition was injected and molded under the conditions of a mold temperature of 175 ° C., an injection pressure of 7.4 MPa, and a curing time of 120 seconds, and a test piece having a width of 4 mm, a thickness of 3 mm, and a length of 15 mm was obtained. Produced. The obtained test piece was subjected to heat treatment at 175 ° C. for 4 hours and 200 ° C. for 4 hours as post-curing. After cooling to room temperature, using a thermomechanical analyzer (manufactured by Seiko Electronics Co., Ltd., TMA-120), in the length direction of the test piece, a compression load of 5 g, a heating rate of 5 ° C./min, a temperature range of −65 Measured at 300 ° C. Tg was defined as the intersection of the tangent line at 30 ° C. and the tangent line at 280 ° C. in the graph of temperature and sample size obtained by measurement. In addition, α1 and α2 have average values in portions where the slopes are almost constant in each temperature range in the graph of temperature and sample size obtained by measurement. The unit of Tg is ° C., and the unit of α1 and α2 is ppm.

  Package warpage amount: A silicon chip (size: 15 × 15 mm, thickness: 0.73 mm) is mounted on a circuit board (ELC-4785GS core double-sided board manufactured by Sumitomo Bakelite Co., Ltd., substrate size: 43 × 43 mm), and underfill ( Sumitomo Bakelite Co., Ltd. CRP-4152) was filled. Then, using a low pressure transfer molding machine (TOWA, Y series), a circuit board on which a silicon chip is mounted with an epoxy resin composition under conditions of a mold temperature of 180 ° C., an injection pressure of 7.4 MPa, and a curing time of 120 seconds. Sealing molding was performed to produce a package (package size: 43 × 43 mm). Further, heat treatment was performed at 175 ° C. for 4 hours and 200 ° C. for 4 hours as post-curing. After cooling to room temperature, the amount of warpage of the package was measured using a shadow moire type warpage measuring device (manufactured by Acrometrix, PS-200), and the displacement in the height direction was measured, and the value with the largest displacement difference was taken as the amount of warpage. Measurement temperature was performed at four points of −55 ° C., 25 ° C., 150 ° C., and 260 ° C. In all temperature ranges, the warp value is 200 μm or less, ◎, larger than 200 μm, 400 μm or less, ○, larger than 400 μm, 600 μm or smaller, Δ, larger than 600 μm, 800 μm or smaller. The thing was made into x.

  Solder resistance: The package molded in the evaluation of the amount of warpage of the package was heat-treated at 175 ° C. for 4 hours as post-curing, and then humidified for 168 hours at 65 ° C. and 60% relative humidity according to JEDEC level 3 treatment. Thereafter, IR reflow treatment was performed at a peak temperature of 235 ° C. under JEDEC conditions. For eight packages after IR reflow treatment, the presence or absence of internal peeling and cracks was observed with an ultrasonic flaw detector (manufactured by Hitachi Construction Machinery Finetech Co., Ltd., mi-scope hyper II), and the number of defective packages was counted. . When the number of defective packages is n out of 8 packages, it is indicated as n / 8.

Temperature cycle resistance: After the package molded in the evaluation of the amount of warpage of the package was subjected to heat treatment at 175 ° C. for 4 hours as post-curing, it was dried at 125 ° C. for 24 hours, and 65 ° C. according to JEDEC level 3 treatment. It was placed in a constant temperature and humidity chamber with a relative humidity of 60% and humidified for 40 hours. Thereafter, it passed 3 times IR reflow (N ₂ in the flow) at a peak temperature 235 ° C. of JEDEC conditions, -55 ° C. and 125 ° C. the bath is replaced instantly apparatus (ESPEC Ltd., THERMAL SHOCK CHAMBER TSA-101S) the package Ten packages were loaded and 125 ° C for 30 minutes and -55 ° C for 30 minutes as one cycle, and after 1000 cycles of temperature cycle processing, internal peeling and cracks were detected using an ultrasonic flaw detector (Hitachi Construction Machinery Finetech). This was confirmed by mi-scope hyper II, manufactured by Co., Ltd., and the number of defective packages was counted. Of the 10 packages, n / 10 when the number of defective packages was n.

Examples 2 to 15 and Comparative Examples 1 to 6
According to the composition of Table 1, Table 2, and Table 3, an epoxy resin composition was obtained in the same manner as in Example 1 and evaluated in the same manner as in Example 1.

Examples 1-15 are crystalline epoxy resin (A) whose melting | fusing point is 30 degreeC or more and 150 degrees C or less, a polyfunctional epoxy resin (B), a polyfunctional phenol resin (C), spherical inorganic filler (D), The scale-like inorganic filler (E) and the curing accelerator (F) are included, and the resin composition has a spiral flow at 175 ° C. of 50 cm or more, and the resin composition has a curast torque value of 30 seconds after starting measurement at 175 ° C. Is in the range of 10 N · m or more, and the types and blending ratios of the crystalline epoxy resin (A) and the polyfunctional epoxy resin (B) are changed, and the scale-like inorganic filler (E) is blended and blended. In all cases, the glass transition temperature is sufficiently high, the linear expansion coefficient is sufficiently low, and the balance thereof is within an appropriate range. , Resistant Good results in packaging characteristics in degrees cycle, etc. were obtained. Also, no defects on the molding surface such as unfilled occurred.
On the other hand, in Comparative Example 2 in which the crystalline epoxy resin (A) was not used, the spiral flow was less than 50 cm, so that unfilling occurred at the molding stage of the package, and a sample worthy of evaluation of the package characteristics could be obtained. could not. In Comparative Examples 1 and 4 in which the polyfunctional epoxy resin (B) or polyfunctional phenol resin (C) was not used, the glass transition temperature was lower than the molding temperature, and the amount of package warpage, temperature cycle resistance, etc. The package characteristics were inferior. Moreover, in the comparative example 5 which did not use a scale-like inorganic filler (E), it resulted in inferior package characteristics, such as package curvature amount and temperature cycling resistance. Moreover, in the comparative example 6 which used the scaly inorganic filler (E) excessively, when the spiral flow was less than 50 cm, unfilling occurred at the package forming stage, and a sample worthy of evaluation of the package characteristics was obtained. I couldn't. Further, as shown in Comparative Example 3, depending on the selection of the type and amount of the curing accelerator, the spiral flow is less than 50 cm, and unfilling occurs at the molding stage of the package. You can't get it.

  The epoxy resin composition of the present invention has low warpage after molding or during solder processing, excellent solder resistance, and excellent productivity, and therefore requires a low warpage and smoothness. Particularly, it is useful for an area mounting type semiconductor device in which a resin layer is formed on one side of a substrate.

Claims (16)

A crystalline epoxy resin (A) having a melting point of 30 ° C. or higher and 150 ° C. or lower,
Polyfunctional epoxy resin (B),
Polyfunctional phenolic resin (C),
Spherical inorganic filler (D),
Scaly inorganic filler (E),
Curing accelerator (F)
An epoxy resin composition containing
The spurious flow at 175 ° C. of the epoxy resin composition is 50 cm or more,
An epoxy resin composition, wherein the epoxy resin composition has a curast torque value of 10 N · m or more 30 seconds after the start of measurement at 175 ° C.   The epoxy resin composition according to claim 1, wherein the scale-like inorganic filler (E) has an aspect ratio of 2 or more and 10 or less.   The epoxy resin composition according to claim 1 or 2, wherein the scaly inorganic filler (E) is surface-treated with a coupling agent. The crystalline epoxy resin (A) is selected from a compound represented by the following general formula (1), a compound represented by the following general formula (2), and a compound represented by the following general formula (3). The epoxy resin composition according to any one of claims 1 to 3, wherein the epoxy resin composition is at least one kind.

(However, in the said General formula (1), R1 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. A is 0-4. Is an integer.)

(However, in the said General formula (2), R2 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. B is 0-4. -X- is a group selected from -C (R3) _2- , -O-, and -S-, where R3 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. And they may be the same or different from each other.)

(However, in the said General formula (3), R4 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. C is 0-4. Is an integer.) The polyfunctional epoxy resin (B) is selected from a compound represented by the following general formula (4), a compound represented by the following general formula (5), and a compound represented by the following general formula (6). The epoxy resin composition according to any one of claims 1 to 4, wherein the epoxy resin composition is at least one kind.

(However, in the said General formula (4), R5 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. D is 0-4. (The average value of n4 is a positive number of 0 or 10 or less.)

(In the general formula (5), e is 1, f is 1 or 0, R6 is a hydrogen atom, a group selected from alkyl groups having 1 to 4 carbon atoms, or a phenyl group, and G is A glycidyl group is shown.

(However, in the said General formula (6), R7 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. G is 0-4. Is an integer.)   The blending ratio (B) / {(A) + (B)} of the polyfunctional epoxy resin (B) to the total amount of the crystalline epoxy resin (A) and the polyfunctional epoxy resin (B) is 0.6. The epoxy resin composition according to any one of claims 1 to 5, wherein the epoxy resin composition is 0.9 or less.   The crystalline epoxy resin (A) and the polyfunctional epoxy resin (B) are premixed and then mixed and / or melt-kneaded with other components. Item 7. The epoxy resin composition according to any one of Items 6. The polyfunctional phenol resin (C) is at least one selected from a compound represented by the following general formula (7) and a compound represented by the following general formula (8). The epoxy resin composition according to claim 7.

(However, in the said General formula (7), R8 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. H is 0-4. (The average value of n7 is a positive number of 0 or 10 or less.)

(However, in the said General formula (8), R9 is group selected from a C1-C6 alkyl group, and they may mutually be same or different. I is 0-4. Is an integer.) The epoxy resin composition according to any one of claims 1 to 8, wherein the curing accelerator (F) includes an adduct of a phosphine compound and a phenol compound represented by the following general formula (9). object.

(However, in the said General formula (9), X is group selected from a C1-C3 alkyl group, and they may mutually be same or different. Y is a hydroxyl group. And they may be the same or different from each other, j and k are integers of 1 to 3.) The said hardening accelerator (F) contains at least 1 type chosen from the compound represented by following formula (10), and the compound represented by following formula (11), The 1 thru | or Claim characterized by the above-mentioned. 10. The epoxy resin composition according to any one of 9 above.

  The epoxy resin composition according to any one of claims 1 to 10, further comprising a compound (G) in which a hydroxyl group is bonded to each of two or more adjacent carbon atoms constituting an aromatic ring.   The epoxy resin composition according to any one of claims 1 to 11, wherein the scaly inorganic filler (E) is glass flakes.   The epoxy resin composition according to claim 12, wherein the composition of the glass flakes is borosilicate glass.   The epoxy resin according to any one of claims 1 to 13, wherein a blending ratio of the scale-like inorganic filler (E) to the total epoxy resin composition is 10% by mass or more and 70% by mass or less. Composition.   The blending ratio (E) / {(D) + (E)} of the scale-like inorganic filler (E) to the total amount of the spherical inorganic filler (D) and the scale-like inorganic filler (E) is 0. It is 1 or more and 0.8 or less, The epoxy resin composition in any one of Claim 1 thru | or 14 characterized by the above-mentioned.   A semiconductor device comprising a cured product of the epoxy resin composition according to claim 1.