JP2011199103A - Wiring board and method of manufacturing the same - Google Patents

Abstract

Provided is a wiring board in which corrosion of a conductive layer that electrically connects a terminal portion and wiring and corrosion of the wiring itself are suppressed.
A wiring board includes an insulating substrate, a wiring formed on a first main surface of the insulating substrate, and an overlapping of the wiring in a plan view. A non-penetrating via hole 40 penetrating the terminal portion 30, the wiring 20 and the insulating substrate 10 formed on the second main surface 10b and having the back surface 30b of the terminal portion 30 as a bottom; And a conductive layer 50 electrically connecting the wiring 20 and the terminal portion 30 and an insulating layer 60 formed on the conductive layer 50 so as to close the via hole 40. To do.
[Selection] Figure 2

Description

  The present invention relates to a wiring board having a terminal portion and a manufacturing method thereof.

  There is known a printed circuit board in which a wiring pattern and a terminal portion are electrically connected through a through hole, and the wiring pattern is covered with a cover insulating layer (for example, see Patent Document 1).

JP 2008-294351 A

  In the above printed circuit board, the opening of the through hole is not blocked, so that the electrolytic solution for plating remains in the through hole, and the wiring pattern and the protective plating layer of the through hole may be corroded. was there.

  The problem to be solved by the present invention is to provide a wiring board and a method for manufacturing the same, in which corrosion of a conductive layer that electrically connects the wiring and the terminal portion and corrosion of the wiring itself are suppressed.

  The wiring substrate according to the present invention includes an insulating substrate, a wiring formed on the first main surface of the insulating substrate, and a second main of the insulating substrate so as to overlap the wiring in a plan view. A terminal portion formed on a surface, the wiring and the insulating substrate, and a non-penetrating via hole having a bottom surface on the back surface of the terminal portion; and an inner surface of the via hole; A conductive layer electrically connecting the terminal portion and an insulating layer formed on the conductive layer so as to close the via hole are provided.

  In the above invention, the conductive layer may be made of metal plating.

  In the above invention, the conductive layer may be made of a cured conductive paste.

  In the above invention, the via hole may be formed by laser processing the insulating substrate.

  The method for manufacturing a wiring board according to the present invention includes an insulating substrate, a wiring formed on a first main surface of the insulating substrate, a second main surface of the insulating substrate, and the wiring. And a first through hole forming step of forming a first through hole in a conductor layer on which the wiring is formed; and A second through hole forming step of forming a second through hole communicating with the through hole and reaching the back surface of the terminal portion in the insulating substrate by laser processing; the first through hole and the second through hole; A metal layer is formed on the inner surface of the through hole to form a conductive layer that electrically connects the conductor layer and the terminal portion, and the first through hole and the second through hole are blocked. And an insulating layer forming step of forming an insulating layer on the conductive layer.

  The method for manufacturing a wiring board according to the present invention includes an insulating substrate, a wiring formed on a first main surface of the insulating substrate, a second main surface of the insulating substrate, and the wiring. A wiring board having a terminal portion electrically connected, the first through-hole forming step of forming a first through-hole in the wiring, and the first through-hole communicating with the first through-hole forming step. A second through hole forming step of forming a second through hole reaching the back surface of the terminal portion in the insulating substrate by laser processing, and an inner surface of the first through hole and the second through hole. A conductive layer forming step for forming a conductive layer that electrically connects the wiring and the terminal portion, and the first through hole and the second through hole are blocked by printing and curing a conductive paste. And an insulating layer forming step of forming an insulating layer on the conductive layer. To.

  The method for manufacturing a wiring board according to the present invention includes an insulating substrate, a wiring formed on a first main surface of the insulating substrate, a second main surface of the insulating substrate, and the wiring. A wiring board having a terminal portion electrically connected to the insulating board, wherein a through-hole extending from the first main surface of the insulating substrate to the back surface of the terminal portion is formed in the insulating substrate by laser. A through hole forming step formed by processing, a wiring forming step of forming the wiring by printing and curing a conductive paste on the first main surface of the insulating substrate, and an inner surface of the through hole A conductive layer forming step of forming a conductive layer that electrically connects the wiring and the terminal portion by printing and curing the conductive paste; and on the conductive layer so as to close the through hole And an insulating layer forming step for forming an insulating layer. A wiring forming step, said conductive layer forming step, and carrying out at the same time.

  According to the present invention, the conductive layer includes the non-penetrating via hole penetrating the wiring and the insulating substrate and having the bottom surface of the terminal portion as a bottom, and the insulating layer closing the via hole. And corrosion of the wiring itself is suppressed.

FIG. 1 is a plan view of a wiring board according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a cross-sectional view showing a first modification of the wiring board according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view showing a second modification of the wiring board in the first embodiment of the present invention. FIG. 5 is a flowchart showing a method of manufacturing a wiring board in the first embodiment of the present invention. FIG. 6A is a cross-sectional view illustrating the terminal portion forming step and the first through hole forming step of FIG. 5. FIG. 6B is a plan view of the wiring board shown in FIG. 6A as viewed from the back side. 6C is a cross-sectional view showing the second through-hole forming step of FIG. FIG. 6D is a cross-sectional view showing the conductive layer forming step of FIG. FIG. 6E is a cross-sectional view showing the wiring formation step of FIG. 6F is a cross-sectional view showing the insulating layer forming step of FIG. FIG. 7 is a flowchart showing a method of manufacturing a wiring board in the second embodiment of the present invention. FIG. 8A is a cross-sectional view showing the terminal part forming step and the first through hole / wiring forming step of FIG. 7. FIG. 8B is a cross-sectional view showing the conductive layer forming step of FIG. FIG. 9 is a cross-sectional view of a wiring board according to the third embodiment of the present invention. FIG. 10 is a flowchart showing a method of manufacturing a wiring board according to the third embodiment of the present invention. 11 is a cross-sectional view showing the wiring / conductive layer forming step of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< first embodiment >>
1 is a plan view of a wiring board according to the present embodiment, FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1, and FIGS. 3 and 4 are cross-sectional views illustrating modifications of the wiring board according to the present embodiment. .

  The wiring board 1 in the present embodiment is, for example, a state in which it is fitted with a connector or the like, a transparent electrode of a liquid crystal panel made of ITO (Indium Tin Oxide) through an anisotropic conductive film (ACF), etc. In a state of being crimped, it is incorporated in an electronic device such as a mobile phone. Examples of the wiring board 1 include a flexible printed circuit (FPC) and a rigid printed wiring board.

  As shown in FIGS. 1 and 2, the wiring board 1 includes an insulating substrate 10, wiring 20, terminal portions 30, via holes 40, a conductive layer 50, and an insulating layer 60.

  The insulating substrate 10 is made of, for example, an electrically insulating material such as polyimide. When the wiring board 1 is a rigid printed wiring board, the insulating substrate 10 is made of glass epoxy resin or the like. A wiring 20 is formed on the first main surface 10 a of the insulating substrate 10. On the other hand, the terminal part 30 is formed in the 2nd main surface 10b located in the insulating substrate 10 on the opposite side to the 1st main surface 10a.

  The wiring 20 is made of, for example, copper. In addition, the material of the wiring 20 is not specifically limited, You may comprise this wiring 20 with gold | metal | money, silver, etc. In the present embodiment, as shown in FIG. 1, the three wirings 20 are formed on the insulating substrate 10, but the number of wirings 20 is not particularly limited.

  The terminal portion 30 is a portion that becomes an electrical contact with another electronic component (for example, the above-described connector or liquid crystal panel) in the wiring board 10, and is made of, for example, copper. In addition, the material of the terminal part 30 is not specifically limited, You may comprise with metal materials, such as gold | metal | money and silver.

  The terminal portion 30 is disposed on the first main surface 10a of the insulating substrate 10 so as to partially overlap the wiring 20 in a plan view shown in FIG. In addition, in this embodiment, although the terminal part 30 is rectangular shape, it is not specifically limited. Moreover, in this embodiment, as shown in the figure, although the three terminal parts 30 are formed in the insulating board | substrate 10, the number of the terminal parts 30 is not specifically limited, either. The number of terminal portions 30 can be appropriately set according to the number of terminals of other electronic components and the number of wirings 20.

  As shown in FIG. 2, the surface 30a of the terminal portion 30 is covered with a terminal protective layer 31 having conductivity. The terminal protective layer 31 is composed of a first terminal protective layer made of nickel (Ni) plating and a second terminal protective layer made of gold (Au) plating. Although not particularly illustrated, the first terminal protective layer covers the terminal portion 30 directly, and the second terminal protective layer covers the terminal portion 30 via the first terminal protective layer. Yes.

  In the present embodiment, the terminal protective layer 31 is composed of two layers, a first terminal protective layer and a second terminal protective layer, but is not particularly limited, and the terminal protective layer 31 is composed of one layer. Also good. For example, the terminal protective layer 31 may be composed of only the first terminal protective layer. Further, the terminal protective layer 31 may be constituted by metal plating such as solder plating, silver (Ag) plating, tin (Sn) plating, instead of nickel plating or gold plating. Alternatively, the terminal protective layer 31 may be formed by printing and curing a carbon paste or a silver paste.

  The back surface 30b of the terminal portion 30 is in contact with the second main surface 10b of the insulating substrate 10 as shown in FIG. In the via hole 40, the back surface 30 b is exposed from the insulating substrate 10 and is in contact with the conductive layer 50.

  The via hole 40 is a non-penetrating via hole that penetrates the insulating substrate 10 but does not penetrate to the terminal portion 30 in order to electrically connect the wiring 20 and the terminal portion 30. The via hole 40 is arranged at a position where the wiring 20 and the terminal portion 30 overlap in the wiring substrate 1 as seen in a plan view shown in FIG.

  As shown in FIG. 2, the via hole 40 includes a first through hole 41, a second through hole 42, and a bottom surface 43.

  The first through hole 41 is formed in the wiring 20 and communicates with the second through hole 42. The first through hole 41 is formed by etching.

  The second through hole 42 is formed in the insulating substrate 10 and reaches the back surface 30 b of the terminal portion 30. The second through hole 42 is formed by, for example, laser processing. Note that the second through hole 42 may be formed by wet etching.

  The bottom surface 43 is configured by the back surface 30 b of the terminal portion 30, and closes the second through hole 42 on the second main surface 10 b side of the insulating substrate 10.

  Thus, the via hole 40 in this embodiment is a non-penetrating hole (bottomed hole) that penetrates the insulating substrate 10 and the wiring 20 and has the back surface 30b of the terminal portion 30 as a bottom.

  As shown in FIG. 2, the conductive layer 50 is laminated from the wiring 20 to the entire inner surface (including the bottom surface 43) of the via hole 40, and electrically connects the wiring 20 and the terminal portion 30. Yes. The conductive layer 50 is made of, for example, copper plating. The material of the conductive layer 50 is not particularly limited. For example, the conductive layer 50 may be composed of metal plating such as solder plating, silver plating, or tin plating, but is preferably substantially the same material as the material of the wiring 20.

  As shown in FIG. 2, the insulating layer 60 is laminated on the conductive layer 50 so as to close the via hole 40. An example of the insulating layer 60 is a coverlay film.

  The insulating layer 60 has an insulating film 61 and an adhesive layer 62.

  The insulating film 61 protects the wiring 20 and the conductive layer 50. The insulating film 61 is made of polyimide, for example.

  The adhesive layer 62 adheres the insulating film 61 and the conductive layer 50. Further, the adhesive layer 62 enters the via hole 40 and closes the via hole 40. Such an adhesive layer 62 is made of an adhesive made of an epoxy resin, for example.

  Here, the wiring board 1 in the present embodiment has a configuration in which the wiring 20 and the terminal portion 30 are formed on one insulating substrate 10, but is not particularly limited. For example, as shown in FIG. 3, the wiring board 1 </ b> B may be configured by a multilayer printed board having terminal portions 30 arranged on the surface. In this case, the insulating layer 60 may be formed only by the adhesive layer 62 without providing the insulating film of the insulating layer 60, and another insulating substrate 12 may be bonded to the adhesive layer 62.

  As described above, the wiring board 1 according to the present embodiment penetrates the wiring 20 and the insulating substrate 10, and the non-penetrating via hole 40 with the back surface 30 b of the terminal portion 30 as the bottom, and the insulating layer that blocks the via hole 40. 60. For this reason, it is difficult for the electrolyte used for plating or sweat when handling electronic equipment to enter the via hole 40, and the corrosion of the wiring 20 and the conductive layer 50 is suppressed. Thereby, the reliability of the electrical connection between the wiring 20 and the terminal part 30 can be improved.

  In the present embodiment, since both the wiring 20 and the conductive layer 50 are made of the same material (copper in this example), the wiring 20 and the conductive layer 50 can be etched simultaneously.

  Moreover, in this embodiment, since the surface 30a of the terminal part 30 is coat | covered with the terminal protective layer 31, corrosion of the terminal part 30 is suppressed.

  In this embodiment, the non-penetrating via hole 40 is formed by laser processing the insulating substrate 10. For this reason, the via hole 40 can be formed with a comparatively small diameter, and the terminal portion 30 can be reduced in size and pitch.

  In the wiring substrate 1C, as shown in FIG. 4, the wiring 20 on the first main surface 10a is formed on the second main surface 10b via a via hole 80 different from the non-penetrating via hole 40. The wiring 90 may be electrically connected. The via hole 80 only needs to be able to conduct the wirings 20 and 90, and may be penetrated or non-penetrated. Alternatively, instead of the via hole 80, the wirings 20 and 90 may be conducted through through holes.

  In the wiring substrate 1C, the insulating layer 60a is laminated only on the wiring 90 on the second main surface 10b of the insulating substrate 10, and the terminal portion 30 is exposed. For this reason, since all the surfaces 30a of the terminal part 30 can be coat | covered with the terminal protective layer 31, the migration in the terminal part 30 can be suppressed.

  Next, the manufacturing method of the wiring board 1 in this embodiment is demonstrated.

  FIG. 5 is a flowchart showing a method of manufacturing a wiring board in the present embodiment, FIG. 6A is a cross-sectional view showing the terminal portion forming step and the first through-hole forming step of FIG. 5, and FIG. 6B is the back side of the wiring board shown in FIG. FIG. 6C is a sectional view showing the second through hole forming step of FIG. 5, FIG. 6D is a sectional view showing the conductive layer forming step of FIG. 5, and FIG. 6E shows the wiring forming step of FIG. FIG. 6F is a cross-sectional view showing the insulating layer forming step of FIG. 5.

  As shown in FIG. 5, the manufacturing method of the wiring board 1 in the present embodiment includes a terminal portion forming step S10, a first through hole forming step S11, a second through hole forming step S12, and a conductive layer forming step. S13, wiring formation process S14, insulating layer formation process S15, and terminal protective layer formation process S16 are provided. When manufacturing the wiring substrate 1, first, a double-sided copper-clad laminate in which a conductor layer (copper foil) is laminated on both sides of the insulating substrate 10 is prepared.

  In the terminal part forming step S10, as shown in FIG. 6A, the terminal part 30 is formed by etching the conductor layer laminated on the second main surface 10b of the insulating substrate 10. The conductor layer is made of copper, for example.

  The details of this etching will be described. First, an ultraviolet curable resist is laminated on the conductor layer laminated on the second main surface 10 b of the insulating substrate 10. Next, the resist is exposed through a mask in which the pattern (opening) of the terminal portion 30 is formed. Next, development is performed to remove the resist layered on the portion other than the portion to be the terminal portion 30. Next, the portion of the conductor layer other than the portion that becomes the terminal portion 30 is etched with a chemical having metal corrosiveness to form the terminal portion 30. Finally, the resist remaining on the terminal portion 30 is removed.

  In 1st through-hole formation process S11, as shown to FIG. 6A, the conductor layer 11 (copper foil) laminated | stacked on the 1st main surface 10a of the insulating substrate 10 in the same way as the terminal part formation process S10. The first through-hole 41 is formed by etching. In the first through-hole forming step S11, the first through-hole 41 is formed in the conductor layer 11 so that the first through-hole 41 overlaps the terminal portion 30 in the plan view shown in FIG. 6B. .

  In the second through-hole forming step S12, as shown in FIG. 6C, the second through-hole reaching the back surface 30b of the terminal portion 30 through the insulating substrate 10 by the laser irradiation device 70 and communicating with the first through-hole 41. Hole 42 is formed. Thereby, a non-penetrating via hole 40 is formed in the wiring board 1.

  The details of this laser processing will be described. As shown in the figure, the laser irradiation device 70 irradiates the insulating substrate 10 exposed by the first through hole 41 with laser light. Note that the output of the laser light at this time is such that the material of the insulating substrate 10 (for example, polyimide) can be processed, but the material of the wiring 20 and the terminal portion 30 (for example, copper) cannot be processed. Thereby, the conductor layer 11 functions as a mask, and only the part exposed by the first through hole 41 in the insulating substrate 10 is processed. Further, when the second through hole 42 is formed and the laser light reaches the back surface 30b of the terminal portion 30, the terminal portion 30 functions as a stopper, and further processing is suppressed.

As described above, in the second through-hole forming step S12, the insulating substrate 10 is laser processed, so that the second through-hole 42 can be formed without processing the wiring 20 and the terminal portion 30. A via hole 40 having a small diameter can be formed. Examples of lasers that can be used for such laser processing include a CO ₂ laser, a YAG laser (YAG: Yttrium Aluminum Garnet), and an excimer laser.

  In the conductive layer forming step S13, as shown in FIG. 6D, a conductive layer 50 made of copper is laminated from the conductor layer 11 to the back surface 30b of the terminal portion 30 in the second through hole 42 (via hole 40). . Thereby, the terminal part 30 and the conductor layer 11 are electrically connected. In the present embodiment, the conductive layer 50 is formed on the inner surface of the via hole 40 by a plating method.

  In the wiring formation step S14, as shown in FIG. 6E, the conductor layer 11 on which the conductive layer 50 is laminated is etched to form the wiring 20 in the same manner as in the terminal portion formation step S10. Note that the conductive layer 50 is made of substantially the same material (copper in this example) as the material constituting the wiring 20, so that the conductor layer 50 and the conductive layer 11 are simultaneously etched in this wiring formation step S14. Can improve productivity.

  In the insulating layer forming step S15, as shown in FIG. 6F, the insulating layer 60 is formed by laminating a cover lay film composed of the insulating film 61 and the adhesive layer 62 on the conductive layer 50 so as to close the via hole 40. . As a result, the wiring 20 and the conductive layer 50 are protected, and the via hole 40 is completely blocked by the terminal portion 30 and the insulating layer 60. Note that, as shown in FIG. 3 described above, when the wiring substrate 1 </ b> B is multilayered, only the adhesive layer 62 is laminated on the conductive layer 50 to form the insulating layer 60.

  In the terminal protective layer forming step S <b> 16, the terminal protective layer 31 is formed on the surface 30 a of the terminal portion 30. Specifically, the surface 30a of the terminal portion 30 is covered with a first terminal protective layer made of nickel plating, and further the first terminal protective layer is covered with a second terminal protective layer made of gold plating. Thus, the terminal protective layer 31 is formed. In this embodiment, since the entire surface 30a of the terminal part 30 is covered with the terminal protective layer 31, corrosion and migration in the terminal part 30 are suppressed.

  The terminal protective layer forming step S16 may be performed before the insulating layer forming step S15, but the terminal protective layer forming step S16 is performed after the via hole 40 is completely blocked in the insulating layer forming step S15. It is preferable that the electrolytic solution or the like used in the plating process does not easily enter the via hole 40 and corrosion of the wiring 20 and the conductive layer 50 is suppressed.

Next, a second embodiment will be described.

<< Second Embodiment >>
In the wiring board 1D according to the present embodiment, the configuration of the conductive layer 50a is different from that of the first embodiment, but other configurations are the same as those of the first embodiment. Only the differences from the first embodiment will be described below, and portions having the same configuration as in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.

  The conductive layer 50a (see FIG. 8B) of the wiring board 1D in the present embodiment is composed of a cured conductive paste. Examples of the conductive paste include copper paste, silver paste, and carbon paste. Although not particularly illustrated, the conductive layer 50a may be formed by filling the via hole 40 with a conductive paste.

  Next, a method for manufacturing the wiring board 1D in the present embodiment will be described.

  7 is a flowchart showing a method of manufacturing a wiring board according to the present embodiment, FIG. 8A is a cross-sectional view showing the terminal portion forming step and the first through hole / wiring forming step of FIG. 7, and FIG. 8B is a conductive layer forming step of FIG. It is sectional drawing which shows a process.

  The manufacturing method of the wiring board 1D in the present embodiment includes a terminal portion forming step S20, a first through hole / wiring forming step S21, a second through hole forming step S22, a conductive layer forming step S23, and an insulating layer. A forming step S24 and a terminal protective layer forming step S25 are provided. When manufacturing the wiring substrate 1D, first, a double-sided copper-clad laminate in which a conductor layer (copper foil) is laminated on both sides of the insulating substrate 10 is prepared.

  In the terminal portion forming step S20, as shown in FIG. 8A, the conductor layer formed on the second main surface 10b of the insulating substrate 10 is etched in the same manner as the terminal portion forming step S10 of the first embodiment. Thus, the terminal portion 30 is formed.

  In the first through hole / wiring forming step S21, as shown in FIG. 8A, the first main surface 10a of the insulating substrate 10 is formed in the same manner as in the first through hole forming step S11 of the first embodiment. The formed conductor layer is etched to form the first through hole 41. Further, in the first through hole / wiring forming step S21, the conductor layer formed on the first main surface 10a of the insulating substrate 10 is etched in the same manner as the wiring forming step S14 of the first embodiment. Thus, the wiring 20 is formed simultaneously with the first through hole 41.

  In the second through-hole forming step S22, the insulating substrate 10 is laser processed to form the second through-hole 42 in the same manner as the second through-hole forming step S12 of the first embodiment.

  In the conductive layer forming step S23, as shown in FIG. 8B, a conductive paste is printed from the wiring 20 to the back surface 30b of the terminal portion 30 in the second through hole 42 (via hole 40) by screen printing. Next, the conductive layer 50a is formed by curing the printed conductive paste.

  In the insulating layer forming step S24, an insulating layer is formed on the conductive layer 50a in the same manner as the insulating layer forming step S15 of the first embodiment.

  In the terminal protective layer forming step S25, the terminal 30 is plated to form the terminal protective layer 31 in the same manner as the terminal protective layer forming step S16 of the first embodiment.

  In the conductive layer forming step S23 in the present embodiment, since the conductive paste is screen-printed, the conductive layer 50a can be formed only on the inner surfaces of the wiring 20 and the via hole 40. For this reason, it is not necessary to etch the conductive layer 50a after the conductive layer forming step S23, and productivity can be improved.

  In the present embodiment, since the first through hole 41 and the wiring 20 can be formed at the same time in the first through hole forming step S21, the productivity can be improved.

  Next, a third embodiment will be described.

<< Third Embodiment >>
FIG. 9 is a cross-sectional view showing a wiring board in the present embodiment.

  In the wiring board 1E in the present embodiment, the configurations of the wiring 20a and the conductive layer 50b are different from those in the first embodiment, but other configurations are the same as those in the first embodiment. Only the differences from the first embodiment will be described below, and portions having the same configuration as in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.

  The wiring 20a and the conductive layer 50b in the present embodiment are made of a hardened conductive paste, and the wiring 20a and the conductive layer 50b are integrally formed. Examples of such conductive paste include copper paste, silver paste, and carbon paste.

  Next, a method for manufacturing the wiring board 1E in the present embodiment will be described.

  FIG. 10 is a flowchart showing a method of manufacturing a wiring board in the present embodiment, and FIG. 11 is a cross-sectional view showing the wiring / conductive layer forming step of FIG.

  The manufacturing method of the wiring board 1E in the present embodiment includes a terminal part forming step S30, a through hole forming step S31, a wiring / conductive layer forming step S32, an insulating layer forming step S33, a terminal protective layer forming step S34, It has. When manufacturing the wiring substrate 1E, first, a single-sided copper-clad laminate in which a conductor layer (copper foil) is laminated only on the second main surface 10b of the insulating substrate 10 is prepared.

  In the terminal portion forming step S30, as shown in FIG. 11, the conductor layer formed on the second main surface 10b of the insulating substrate 10 is etched in the same manner as the terminal portion forming step S10 of the first embodiment. Thus, the terminal portion 30 is formed.

  In the through hole forming step S31, the insulating substrate 10 is laser processed to form the second through hole 42 in the same manner as in the second through hole forming step S12 of the first embodiment.

  In the wiring / conductive layer forming step S32, as shown in FIG. 11, the conductive paste is printed by screen printing so as to form the wiring 20a on the first main surface 10a of the insulating substrate 10. Further, in this wiring / conductive layer forming step S32, a conductive paste is printed on the inner surface of the second through hole 42 by screen printing. Next, the wiring 20a and the conductive layer 50b are formed simultaneously by curing the conductive paste printed in this way.

  In the insulating layer forming step S33, an insulating layer is formed on the conductive layer 50b in the same manner as the insulating layer forming step S15 of the first embodiment.

  In the terminal protective layer forming step S34, the terminal protective layer is formed by plating the terminals 30 in the same manner as the terminal protective layer forming step S16 of the first embodiment.

  As described above, in the method for manufacturing the wiring board 1E according to the present embodiment, the process of forming the wiring 20a and the process of forming the conductive layer 50b are performed at the same time, so that productivity can be improved.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Wiring board 10 ... Insulating board 20 ... Wiring 30 ... Terminal part 30b ... Back surface 40 ... Via hole 50 ... Conductive layer 60 ... Insulating layer

Claims (7)

An insulating substrate;
Wiring formed on the first main surface of the insulating substrate;
A terminal portion formed on the second main surface of the insulating substrate so as to overlap the wiring in a plan view;
A non-penetrating via hole penetrating the wiring and the insulating substrate and having the bottom surface of the terminal portion as a bottom;
A conductive layer formed on the inner surface of the via hole and electrically connecting the wiring and the terminal portion;
And an insulating layer formed on the conductive layer so as to close the via hole. The wiring board according to claim 1,
The wiring board, wherein the conductive layer is made of metal plating. The wiring board according to claim 1,
The wiring board, wherein the conductive layer is made of a hardened conductive paste. The wiring board according to any one of claims 1 to 3,
The via hole is formed by laser processing the insulating substrate. An insulating substrate; wiring formed on the first main surface of the insulating substrate; and a terminal portion formed on the second main surface of the insulating substrate and electrically connected to the wiring. A method of manufacturing a wiring board having
A first through hole forming step of forming a first through hole in a conductor layer in which the wiring is formed;
A second through hole forming step of forming a second through hole communicating with the first through hole and reaching the back surface of the terminal portion in the insulating substrate by laser processing;
A conductive layer forming step of metal-plating inner surfaces of the first through hole and the second through hole to form a conductive layer that electrically connects the conductor layer and the terminal portion;
An insulating layer forming step of forming an insulating layer on the conductive layer so as to close the first through hole and the second through hole. An insulating substrate; wiring formed on the first main surface of the insulating substrate; and a terminal portion formed on the second main surface of the insulating substrate and electrically connected to the wiring. A method of manufacturing a wiring board having
A first through hole forming step of forming a first through hole in the wiring;
A second through hole forming step of forming a second through hole communicating with the first through hole and reaching the back surface of the terminal portion in the insulating substrate by laser processing;
A conductive layer forming step of forming a conductive layer that electrically connects the wiring and the terminal portion by printing and curing a conductive paste on the inner surfaces of the first through hole and the second through hole. When,
An insulating layer forming step of forming an insulating layer on the conductive layer so as to close the first through hole and the second through hole. An insulating substrate; wiring formed on the first main surface of the insulating substrate; and a terminal portion formed on the second main surface of the insulating substrate and electrically connected to the wiring. A method of manufacturing a wiring board having
A through hole forming step of forming a through hole from the first main surface of the insulating substrate to the back surface of the terminal portion in the insulating substrate by laser processing;
A wiring forming step of forming the wiring by printing and curing a conductive paste on the first main surface of the insulating substrate;
A conductive layer forming step of forming a conductive layer that electrically connects the wiring and the terminal portion by printing and curing the conductive paste on the inner surface of the through hole;
An insulating layer forming step of forming an insulating layer on the conductive layer so as to close the through hole, and
A method of manufacturing a wiring board, wherein the wiring forming step and the conductive layer forming step are performed simultaneously.

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