JP2014123761A - チャンバ壁に一体化されたモータを伴う基板処理装置 - Google Patents
チャンバ壁に一体化されたモータを伴う基板処理装置 Download PDFInfo
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Program-controlled manipulators characterised by positioning means for manipulator elements with articulated links
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
- H02K2201/18—Machines moving with multiple degrees of freedom
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- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
ことにより、小型化された装置を提供する。
【解決手段】基板搬送装置20、22には、隔離された雰囲気を保持できる基板搬送チャンバ14T1、2を定義する内面を有する周壁と、内面および周壁の隣接する外面の間に、周壁内に位置する少なくとも1つのステータモジュールを有する少なくとも1つの実質的にリング形状のモータと、リング形状のモータにより包囲される周壁の表面が、所定の装置、および少なくとも1つのロータに接続され少なくとも1枚の基板を保持するよう構成された少なくとも1つのエンドエフェクタを有する少なくとも1本の基板搬送アームの取り付けのために構成されるよう、搬送チャンバ内に実質的な接触のない状態で懸垂された少なくとも1つのロータと、が含まれる。
【選択図】図1
Description
Claims (11)
- 基板処理装置であって、
所定の雰囲気を保持できる少なくとも1つの隔離可能なチャンバを有するフレームと、少なくとも1枚の基板を搬送するよう構成されている、前記少なくとも1つの隔離可能なチャンバ内に少なくとも部分的に位置する基板搬送装置と、
を含み、前記基板搬送装置は、
前記少なくとも1つの隔離可能なチャンバの周壁内に取り外し可能に埋め込まれた少なくとも2つのネスト化されたステータモジュールセットと、前記少なくとも1つの隔離可能なチャンバ内に位置する少なくとも2つのリング形状のロータと、前記少なくとも2つのリング形状のロータに結合され、基板を保持するための少なくとも1つのエンドエフェクタを有する少なくとも1本の搬送アームと、を含み、
前記少なくとも2つのネスト化されたステータモジュールセットのうちの少なくとも1つのセットは、前記少なくとも2つのネスト化されたステータモジュールセットのうちの他のセット内にネスト化された2つ以上のステータモジュールを含み、
前記少なくとも2つのリング形状のロータの各々は、前記少なくとも2つのネスト化されたステータモジュールセットによって少なくとも2つのネスト化されたモータに接触することなく支持されており、前記少なくとも2つのネスト化されたモータの1つは、前記少なくとも2つのネスト化されたモータの他の1つにより包囲されており、
前記少なくとも2つのネスト化されたモータは、前記少なくとも1本の搬送アームに少なくとも2自由度の動きをもたらすことを特徴とする基板処理装置。 - 前記少なくとも1つの隔離可能なチャンバの妨げのない底面を介して、前記少なくとも1つの隔離可能なチャンバに結合された、真空/通気システムをさらに備えることを特徴とする請求項1に記載の基板処理装置。
- 前記少なくとも2つのネスト化されたステータモジュールセットは、前記リング形状のロータの各々にトルク及び自己支持力を印可し、前記少なくとも1本の搬送アームの動きを生じさせるように構成されていることを特徴とする請求項1に記載の基板処理装置。
- 前記少なくとも1つの隔離可能なチャンバは、前記少なくとも1つのステータモジュールを前記周壁内に挿入するために、前記少なくとも1つの隔離可能なチャンバの少なくとも1つの側面上に少なくとも1つの開口部を備えることを特徴とする請求項1に記載の基板処理装置。
- 前記少なくとも1つの隔離可能なチャンバは、直列構成で配置された少なくとも2つの隔離可能なチャンバを備えることを特徴とする請求項1に記載の基板処理装置。
- 前記少なくとも2つの隔離可能なチャンバの1つは、対称的な基板搬送装置を含み、前記少なくとも2つの隔離可能なチャンバの他の1つは、左右相称の基板搬送装置を含むことを特徴とする請求項1に記載の基板処理装置。
- 基板搬送装置であって、
基板搬送チャンバを形成するフレームと、
前記基板搬送チャンバの周壁上に互いに離間して周方向に分配された2つ以上のステータモジュールからなるステータモジュールセットを含み、少なくとも1つの共通リングロータを含む少なくとも1つのモータと、
前記少なくとも1つの共通リングロータに接続され、各々が基板を支持するように構成された少なくとも1つのエンドエフェクタと、を含み、
前記ステータモジュールの各々は前記周壁に独立して取り付けられることが可能であり、前記少なくとも1つの共通リングロータは、接触することなく前記共通のリングロータを支持する前記ステータモジュールの各々と共に動作し、
前記ステータモジュールセットおよび前記少なくとも1つの共通リングロータは、前記少なくとも1つのエンドエフェクタのモータに少なくとも1自由度の動きをもたらすよう構成されていることを特徴とする基板搬送装置。 - 前記少なくとも1つの共通リングロータは、前記ステータモジュールの各々のステータの巻線と共に動作することを特徴とする請求項7に記載の基板搬送装置。
- 前記少なくとも1つのロータは、前記少なくとも1つのステータモジュールのステータの巻線によって支持されていることを特徴とする請求項7に記載の基板搬送装置。
- 前記ロータの各々は、前記ステータモジュールセットの各1つのステータの巻線によって支持されていることを特徴とする特徴とする請求項7に記載の基板搬送装置。
- 前記少なくとも2つのロータの各々は、前記少なくとも2つのネスト化されたステータモジュールの各1つのステータの巻線によって支持されていることを特徴とする特徴とする請求項7に記載の基板処理装置。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US95033107P | 2007-07-17 | 2007-07-17 | |
| US60/950,331 | 2007-07-17 | ||
| US12/175,278 US8008884B2 (en) | 2007-07-17 | 2008-07-17 | Substrate processing apparatus with motors integral to chamber walls |
| US12/175,278 | 2008-07-17 |
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| JP2010517162A Division JP2011514652A (ja) | 2007-07-17 | 2008-07-17 | チャンバ壁に一体化されたモータを伴う基板処理装置 |
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| JP2016216382A Division JP6466386B2 (ja) | 2007-07-17 | 2016-11-04 | チャンバ壁に一体化されたモータを伴う基板処理装置 |
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| JP2014123761A true JP2014123761A (ja) | 2014-07-03 |
| JP6040182B2 JP6040182B2 (ja) | 2016-12-07 |
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| JP2014027707A Active JP6040182B2 (ja) | 2007-07-17 | 2014-02-17 | チャンバ壁に一体化されたモータを伴う基板処理装置 |
| JP2016216382A Active JP6466386B2 (ja) | 2007-07-17 | 2016-11-04 | チャンバ壁に一体化されたモータを伴う基板処理装置 |
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| US (3) | US8008884B2 (ja) |
| JP (3) | JP2011514652A (ja) |
| KR (6) | KR101825595B1 (ja) |
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| US20090022571A1 (en) | 2009-01-22 |
| KR20190077134A (ko) | 2019-07-02 |
| JP6466386B2 (ja) | 2019-02-06 |
| KR102617936B1 (ko) | 2023-12-27 |
| US8680803B2 (en) | 2014-03-25 |
| KR101825595B1 (ko) | 2018-02-05 |
| KR20100056468A (ko) | 2010-05-27 |
| CN101801817B (zh) | 2015-07-22 |
| KR20150140401A (ko) | 2015-12-15 |
| KR20210119580A (ko) | 2021-10-05 |
| WO2009012396A2 (en) | 2009-01-22 |
| KR20180014247A (ko) | 2018-02-07 |
| KR20230079518A (ko) | 2023-06-07 |
| US20120301261A1 (en) | 2012-11-29 |
| JP6040182B2 (ja) | 2016-12-07 |
| JP2011514652A (ja) | 2011-05-06 |
| US8237391B2 (en) | 2012-08-07 |
| US20110316370A1 (en) | 2011-12-29 |
| WO2009012396A3 (en) | 2009-03-05 |
| CN101801817A (zh) | 2010-08-11 |
| JP2017022426A (ja) | 2017-01-26 |
| US8008884B2 (en) | 2011-08-30 |
| WO2009012396A9 (en) | 2009-04-23 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |