JP2014162012A - Microstructure molding method and microstructure molding die - Google Patents

Abstract

The present invention provides a method and a mold capable of molding a flat microstructure having not only burrs at the edge but also having a microstructure transferred and formed on a flat surface and one edge.
A method for forming a microstructure according to the present invention comprises pressing a coating film formed by applying a molten resin to a lower mold with an upper mold, and a flat portion and one edge portion of the coating film. The fine structure is transferred and molded, and this is cooled and solidified, and the flat structure having the fine structure at one edge and the flat edge and having no burr at the one edge is formed. A method of forming a flat coating film on the lower mold, and after contacting the tip of the lower end with the lower mold in a state where the upper mold is inclined from a horizontal plane Then, the upper mold is rotated and pressed around the contact portion until it becomes horizontal, and the fine structure is transferred and formed on the flat portion and one edge portion of the coating film.
[Selection] Figure 1

Description

  The present invention relates to a method and a mold for pressing a molten thermoplastic resin onto a mold having a fine structure, and forming a flat fine structure having the fine structure transferred and formed on a flat portion and one edge portion. About.

  A micro-lens array or light guide plate with a thin plate having a fine structure presses a thermoplastic resin melt onto a mold or roll having a fine structure by a press molding method, an injection molding method or an extrusion molding method. Is formed by cooling and solidifying. These methods have an advantage that various thermoplastic resins can be molded, and their application and use range is expanded.

  For example, in Patent Document 1, while moving a coating apparatus supplied with a thermoplastic resin onto a mold having fine uneven portions, the thermoplastic resin is filled in the fine uneven portions, and the applied thermoplastic resin A method for producing a molded body is disclosed in which the material is pressed by a mold and then cooled and solidified. According to this method of manufacturing a molded body, it is said that a flat microstructure having a thickness of 50 μm to 5 mm and having a microstructure having irregularities of 10 nm to 1 mm can be molded.

  Patent Document 2 discloses a light guide plate formed by injection-molding a cyclic olefin-based resin composition, and the light guide plate has a thickness (T) of 0.1 mm to 1 mm, and light enters the light guide plate. The ratio (L / T) of the width (L) to the thickness (T) in the direction is 70 or more, and the ratio between the maximum brightness and the minimum brightness in the light exit plane (maximum brightness / minimum brightness) A light guide plate having a thickness of 1.05 or less is disclosed. The light guide plate includes an injection speed control unit that controls a maximum injection speed that is a maximum value of the injection speed, and an injection acceleration control unit that controls an injection acceleration from the start of injection until the maximum injection speed is reached. It can be manufactured using a molding machine.

  Molding methods using a mold such as the press molding method and the injection molding method are such that a cavity for filling a molten resin is formed by an upper die and a lower die or a movable die and a fixed die. In addition, there is a problem that burrs are likely to occur on the mating surface (parting line) of the mold. As a method for preventing the occurrence of this burr, for example, a method disclosed in Patent Document 3 has been proposed. That is, in a mold in which a cavity filled with a molten resin is formed by a fixed stamper of an injection mold, a movable stamper, and an outer ring that advances and retreats the outer periphery of the movable stamper, the outer peripheral surface and the outer ring of the movable stamper An information recording disk substrate molding die is disclosed in which a clearance from the inner peripheral surface of the substrate is secured to 1 μm to 30 μm by a bearing.

  On the other hand, a molding method that does not use a mold has also been proposed, and Patent Document 4 discloses an extrusion molding method in which a molten resin supplied to a sandwiched portion between a rotary drive roll and a molding roll is pressurized to form a fine structure. Discloses a method of forming an optical sheet. That is, an optical sheet that is used in an edge light type surface light source device that can be molded by an extrusion molding method, and in which a plurality of unit optical shapes are arranged on at least one surface, An optical element having a thickness that continuously changes in the direction, and a portion in which the thickness gradually decreases from at least one end of the optical sheet toward the other end in the one direction. A sheet is disclosed.

  Patent Document 5 discloses that a three-layer light guide plate is formed by a coextrusion molding method with a layer in which fine particles such as silica or bubbles are dispersed. That is, a light guide plate used in a display device having an edge light type light source, and a light emission surface that irradiates light to the image display panel side, a counter light emission surface that is a surface facing the light emission surface, and A light guide plate having a thickness of 0.5 to 4 mm made of a thermoplastic resin having at least one light incident surface substantially perpendicular to the two surfaces has been proposed. This light guide plate has high front luminance and uniform luminance distribution, and can be mass-produced.

JP 2006-56107 A JP 2012-256429 A JP 2000-218657 A JP 2012-69355 A JP 2011-233285 A

  The fine structure having a fine structure is required to be thinner and thinner, and the fine structure is required to be provided on the front surface and / or the back surface of the flat fine structure. Further, the light guide plate needs to have a mirror surface at the edge of the fine structure, but a light guide plate having a fine structure up to the edge is required. In order to form such a fine structure provided on a desired surface of a flat plate-like fine structure, the extrusion method described in Patent Document 4 or 5 is perpendicular to the extrusion direction. Transfer molding in the direction (to the side of the thin flat microstructure) is difficult and undesirable. On the other hand, a press molding method or an injection molding method as described in Patent Document 1 or 2 in which a cavity is formed by a mold is preferable.

  However, when a mold is used, there is a problem of burrs as described above. In the case of the injection molding method described in Patent Document 2, it is difficult to make the gap on the mating surface of the molds zero as described in Patent Document 3, and there is a risk of burrs. In the injection molding method, the temperature of the resin decreases and the viscosity increases or solidifies during the process of flowing the molten resin from the gate filling the molten resin into the mold cavity to every corner of the thin flat cavity. Since it is difficult to fill every corner of the cavity and it is further difficult to transfer the microstructure processed at the edge of the cavity to the molten resin, a flat microstructure having a microstructure at the edge There is a problem that it is not easy to mold.

  On the other hand, the press molding method described in Patent Document 1 has an advantage that a very thin plate-like microstructure can be molded, but the temperature of the mold for transferring the microstructure to the molten resin is high. Further, since the molten resin enters even in a gap of 1 μm or less, there is a problem that burrs are easily generated, and it is not easy to form an edge portion without burrs.

  In view of such conventional problems and technical demands, the present invention uses a press molding method suitable for the molding method of a thinner flat plate-like microstructure, and not only has no burrs at the edges. It is an object of the present invention to provide a fine structure forming method and a fine structure forming mold capable of forming a flat fine structure having a fine structure transferred to a flat portion and one edge portion.

  In the microstructure forming method according to the present invention, a coating film formed by applying a molten resin to a lower mold is pressed by an upper mold, and a microstructure is formed on a flat portion and one edge of the coating film. This is a method of forming a flat microstructure having a fine structure at the edge portion of the flat portion and having no burrs at the edge portion of the one side, which is formed by transfer molding and cooled and solidified. A step of forming a flat coating film on the lower mold, and abutting the tip of the lower end with the lower mold in a state where the upper mold is inclined from the horizontal, and then contacting the lower mold This is carried out by rotating and pressing the upper mold until the upper mold becomes horizontal, centering on the portion, and performing transfer molding of the fine structure on the flat portion and one edge portion of the coating film. The term “horizontal” is based on the normal form in which the upper mold and the lower mold are installed horizontally (the mold installation plane or the press molding surface is horizontal) in the press molding method. Is inclined, the inclined installation plane is the reference.

  In the above invention, the contact surface pressure between the lower end of the upper mold and the lower mold is such that the molten resin enters the mold mating surface of the upper mold and the lower mold during the pressing of the coating film. It is preferable that the size is larger than that which can be prevented.

Further, the coating film is preferably formed so that one edge portion thereof is located at a position exceeding 0 mm and not more than 5 mm from the front surface of the upper mold on which the fine structure is transferred. The coating may be of one edge side is thicker shaped plates projecting strip is formed, the thickness t _e of the convex portion of the coating 0.05 to 5 mm, the flat portion the thickness t is 0.05 to 5 _{mm, t} e -t can be 0 to 1 mm.

  The upper mold may have an upper surface mold part that performs transfer molding of the top surface of the flat part of the coating film and an end surface mold part that performs transfer molding of one edge part. May have a lower surface mold part for performing transfer molding of the ground surface of the flat part of the coating film.

  The flat surface portion of the coating film on which the fine structure transfer molding is performed can be the top surface and / or the bottom surface.

  The fine structure molding die according to the present invention is such that a coating film formed by applying a molten resin to a lower mold is pressed by an upper mold having a fine structure, and a flat portion of the coating film and one edge. A microstructure forming mold for forming a flat microstructure having the microstructure on one edge of the flat portion by transferring and molding the microstructure to a part and cooling and solidifying the planar structure; An upper mold having an upper mold part that performs transfer molding of the flat surface part, and an end mold part that performs transfer molding of the one edge part, and an upper mold part held by an elastic member via an elastic member; The lower mold is opposed to the upper mold, and the upper mold is inclined from the horizontal by the elastic member.

  In the above microstructured mold, the elastic member may be thicker on one end face mold part side than on the other side.

  In addition, the inclination angle θ of the upper mold part of the upper mold is preferably θ = 0.001 to 1 °, and an interference member is provided at a part where the end face mold part of the upper mold part contacts the lower mold. It is good.

  ADVANTAGE OF THE INVENTION According to this invention, the fine structure which has a fine structure in desired site | parts, such as the flat thin surface and / or back surface, or one edge part, can be shape | molded. And according to this invention, there is no burr | flash in one edge part of the shape | molded microstructure, and work, such as cutting removal of the edge part, or a deburring, is not required. Moreover, the fine structure molding die according to the present invention does not require a special structure and does not require any special operation.

It is a schematic diagram which shows the structure of the microstructure molding metal mold | die which concerns on this invention. It is explanatory drawing explaining the mode at the time of carrying out transfer molding of the fine structure to a coating film. It is a schematic diagram which shows the shape of a coating film. It is explanatory drawing which shows another Example. FIG. 2 is a drawing showing a surface pressure distribution of a contact surface when pressing a mirror plate provided on an upper mold and a lower mold in a microstructure forming mold according to the present invention, and FIG. (B) is a case where there is no elastic member (a state where the member is not inclined). It is a photograph which shows the cross-sectional part of one edge part of the microstructure of the Example (a) and comparative example (b) by a shaping | molding test.

  Hereinafter, modes for carrying out the present invention will be described. The microstructure forming method according to the present invention can be preferably carried out by the microstructure forming mold shown in FIG. In FIG. 1, an upper mold 10 has an upper mold part 12 held by an upper mother mold 11 via elastic members 18 (18A, 18B). The upper mold part 12 has a temperature control means 125, and is held via the upper mother mold 11 and the heat insulating member 15 (15A, 15B). The upper mold part 12 includes an upper surface mold part 121 having a fine structure on the surface of 121a and an end face mold part 122 having a fine structure on the surface of 122a. An escape portion d is provided.

  The lower mold 20 has a lower mold part 22 held by a lower mother mold 21. The lower mold part 22 has temperature control means 225 and is held by the lower mother mold 21 via a heat insulating member 25. A coating film 30 can be formed on the upper surface of the lower mold portion 22 by applying a molten thermoplastic resin. In this microstructured mold, the elastic member 18 is different in thickness between the elastic member 18A and the elastic member 18B, and the upper mold part 12 is inclined from the horizontal as shown in FIG.

  This microstructure forming method is a method that is preferably performed using such a microstructure forming mold, and a coating film 30 formed by applying a molten resin to the lower mold 20 is applied to the upper mold. Pressed by the mold 10, the fine structure is transferred to the flat part and one edge part of the coating film 30 and cooled and solidified, and the fine part has the fine structure on the flat part and one edge part, and This is a method of forming a flat microstructure having no burr at one edge.

  That is, in this microstructure forming method, first, the flat coating film 30 is formed on the lower mold portion 22 of the lower mold 20. The coating film 30 is preferably applied by a T die so that a thermoplastic molten resin is applied to its upper surface with a dynamic pressure of 0.1 to 5 MPa by gauge pressure. Thereby, the thickness of the coating film 30 can be controlled with high accuracy, and the thickness of the fine structure as the final product can be controlled with high accuracy. Further, in the application by this T-die, the in-plane thickness distribution (difference between the thickest part and the thinnest part) can be suppressed to around 10 μm. That is, move the T die with the resin discharge part from the T die close to the coated surface of the lower mold part 22 to the same distance as the thickness of the coating film, the resin discharge width from the T die and the movement of the T die The molten resin having a flow rate substantially equal to the volume flow rate calculated by multiplying the speed and the distance between the resin discharge portion of the T die and the horizontal surface of the lower mold portion is applied while being discharged from the discharge portion. Thereby, the width of the coating film can be made substantially equal to the width of the resin discharge portion from the T die, and the length of the coating film can be made substantially equal to the moving distance of the T die. And by these, the width | variety, length, and thickness of a coating film can be accurately apply | coated to the shape and thickness substantially equal to the final fine structure obtained after a press.

In the present invention, as shown in FIG. 1 or 2, the coating film 30 is formed by being applied to the lower mold part 22 so as to have a gap δ from the front surface of the end face mold part 122 of the upper mold part 12. For the gap δ, an appropriate value is selected so that the molten resin does not enter the gap between the tip part p and the lower mold part 22 before the tip part p contacts the lower mold part 22. For example, if the thickness t _te of the ridge portion of the coating film is relatively thick with respect to the h dimension of the end face mold portion, the gap δ needs to be increased, and conversely, the thickness of the ridge portion with respect to the h dimension. If t _{e is} slightly thick, the gap δ needs to be reduced. However, the gap δ is generally over 0 mm and not more than 5 mm.

The coating film 30 is generally formed by applying a flat plate to the lower mold part 22, but as shown in FIG. 3, a plate-like body in which one edge part 30c is thickened as a ridge. Can be formed. Such coatings 30, for example, the thickness of the convex portion t _{e =} 0.05 to 5 mm, the flat portion thickness t = 0.05 to 5 mm, can be a (t e _-t) = 0~1mm. The coating film 30 having a shape in which the one edge portion 30c is thick depends on the size of the gap δ, but is convenient when a fine structure is transferred and molded to the one edge portion 30c with high accuracy. It is.

  When the coating film 30 is formed as described above, the upper mold 10 is then lowered. As shown in FIG. 2, the upper mold 10 is such that the upper mold part 12 is inclined from the horizontal, so that the tip part p at the lower end first contacts the lower mold part 22 of the lower mold 20. Then, the elastic member 18A and the elastic member 18B provided on the upper mold 10 are compressed by the reaction force from the tip part p, and the coating film 30 is compressed by the upper surface mold part 121. This pressing of the coating film 30 by the upper surface mold part 121 causes a minute flow in the coating film, and the top surface of the coating film 30 in the cavity formed by the upper surface mold part 121, the end surface mold part 122 and the lower mold part 22 30a and one edge portion 30c are subjected to transfer molding with a fine structure. The pressing force is 1 to 10 MPa. When the lower mold part 22 has a fine structure, the fine structure can be transferred and molded also to the bottom surface of the coating film 30b.

  In the transfer molding of the coating film 30, the surface pressure applied to the tip portion p is set such that the molten resin does not enter the tip portion p while the coating film 30 is pressed. As a result, a fine structure free of burrs can be formed on one edge 30c of the coating film 30.

  In the transfer molding of the coating film 30, the upper mold portion 12 behaves as rotated (clockwise in FIG. 2) around the tip portion p. That is, in the present invention, after the upper die is inclined from the horizontal, the lower end of the tip is brought into contact with the lower die, and then the upper die is leveled around the contact portion. Any method that can be rotated and pressed may be used.

  This fine structure forming method can form a flat fine structure having a fine structure on a flat portion (top surface or / and bottom surface) and one edge, and one edge in transfer molding. It is characterized by no burrs. Therefore, as described above, the upper mold part 12 is provided with the upper surface mold part 121 and the end face mold part 122 having a fine structure. It is preferable that the upper surface mold portion 121 and the end surface mold portion 122 are integrated and do not have a mold matching surface. This is because, if there is a die mating surface, there is a risk that burrs will occur in this part, and it will be necessary to provide a structure like the tip part p of the upper mold part 12 described above in this part. However, the upper surface mold portion 121 and the end surface mold portion 122 are preferably configured to be disassembled. This is because the fine structure of the planar portion and the edge portion of the fine structure often have completely different forms, and in particular, it is preferable that the fine structure of the edge portion can be of various forms. .

  Various thermoplastic resins can be used as the thermoplastic resin used in the present microstructure forming method. For example, polycarbonate (PC), polymethyl methacrylate (PMMA), cycloolefin polymer (COP), cyclic olefin copolymer (COC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polystyrene (PS), methyl methacrylate butadiene Resin materials such as styrene (MBS) can be suitably used.

  In the microstructure forming mold used in this microstructure forming method, as described above, the upper mold portion 12 of the upper mold 10 is held by the upper matrix 11 via the elastic members 18A and 18B having different thicknesses. The upper mold portion 12 is inclined from the horizontal. The inclination angle θ of the upper mold part 12 can be set to θ = 0.001 to 1 °. Various elastic members for generating the inclination angle θ can be used. For example, silicon rubber, fluorine rubber, urethane rubber, butyl rubber, nitrile rubber, natural rubber and the like can be mentioned. The Young's modulus is preferably several MPa to several tens of MPa, and the thickness is preferably several hundred μm to several mm. The elastic member can realize a contact pressure that can prevent the molten resin from entering the mold mating surface of the upper mold and the lower mold at the initial pressing stage, and abuts by the pressing force in the pressing process. What is necessary is just to select suitably the thing which has the deformation allowance which can be rotated until the said upper metal mold | die becomes horizontal (a mold fitting surface is horizontal) centering on the part p. If this condition is satisfied, the elastic member may be a coil spring or a leaf spring.

  The contact part p of the upper mold part 12 is preferably provided with a relief part d so that this part is in contact with the lower mold part 22 reliably. Further, it is preferable that an interference member is provided so that the contact portion p does not cause galling with the lower mold portion 22. As the interference member, a polymer film having a thickness of several tens of μm or a polymer coating having a thickness of several μm can be used. A heat resistant polyimide is preferred. The interference member can also exhibit a sealing function that prevents the molten resin from entering the die mating surface.

  The microstructure forming method and the microstructure forming mold according to the present invention have been described above. However, the present invention is not limited to the above embodiment. For example, the microstructure forming method according to the present invention can also be implemented by a microstructure forming mold shown in FIG. In FIG. 4A, the coating film 30 is formed in a recess formed by the b surface and the c surface having the fine structure of the lower mold part 22. The upper mold part 12 is configured to contact the lower mold part 22 at an inclination angle θ.

  1 is provided with a wedge-shaped recess as shown in FIG. 4B at the joint between the surface 121a of the upper surface mold 121 and the surface 122a of the end surface mold 122. When the upper mold part 12 is used, the area of the end face of one edge part can be increased, the cross-sectional area gradually decreases from the end face, and the microstructure has a form following the flat part having a uniform cross-sectional area. The body can be shaped. This wedge-shaped recess may be provided at the bottom of the microstructure forming mold shown in FIG.

  A molding test was performed to mold a flat microstructure made of polycarbonate having a thickness of 230 μm using the microstructure molding mold shown in FIG. The molding test was conducted as follows. The end mold part of the upper mold part was h = 230 μm. As the elastic member 18A, silicon rubber having a thickness of 0.7 mm and a hardness of 50 ° (elastic modulus 14.2 MPa) was used. As the elastic member 18B, silicon rubber having a thickness of 0.5 mm and a hardness of 50 ° (elastic modulus 14.2 MPa) was used. The coating film was formed by applying polycarbonate 285 ° C. molten resin to the lower mold part using a T die having a discharge width of 104 mm. The coating film had a thickness of 240 μm and the gap δ with the end face mold portion was 1.8 mm. The set temperature of the upper mold and the lower mold was 195 ° C., and the temperature was raised to 195 ° C., and then a polycarbonate molten resin was applied to the lower mold portion with a T die. In addition, the upper mold part and the lower mold part were in a mirror surface state without unevenness. When good transfer molding is performed, the obtained fine structure has an extremely smooth top surface and bottom surface and a glossy surface.

In the above state, first, the upper mold was lowered and the coating film was pressed with a pressure of 3 MPa (= pressing thrust (N) ÷ projected area (m ² ) of the flat microstructure). Next, cooling of the mold was started while pressing at a pressure of 3 MPa, and the pressure was gradually reduced to 0 MPa. When the temperature of the upper mold was lowered to 135 ° C. and the temperature of the lower mold was lowered to 150 ° C., the mold was opened and the transferred microstructure was taken out.

  In addition, as a comparative example for the above molding test, a molding test was conducted in which the elastic members 18A and 18B both used silicon rubber having a thickness of 0.5 mm and a hardness of 50 ° (elastic modulus 14.2 MPa). Furthermore, in order to investigate the pressing state of the coating film in the present invention, a pressurization test was conducted to examine the pressure distribution when pressing the mirror plates together using a flat mirror plate in the upper mold part and the lower mold part in Example 1. I did it. The pressure distribution was measured using a prescale low pressure product (measurable pressure of 2.5 to 10 MPa) manufactured by Fuji Film.

  FIG. 5 shows the pressure test results. In FIG. 5 (a), the elastic member 18A is made of silicon rubber having a thickness of 0.6 mm and a hardness of 50 ° (elastic modulus 14.2 MPa), and the elastic member 18B is made of silicon rubber having a thickness of 0.5 mm and a hardness of 50 ° (elastic modulus 14.2 MPa). The pressure test result in the case where the upper mold part is inclined from the horizontal (inclined with respect to the lower mold part) is shown. In FIG. 5B, both elastic members 18A and 18B use silicon rubber having a thickness of 0.5 mm and a hardness of 50 ° (elastic modulus 14.2 MPa), and the upper mold part is not inclined with respect to the lower mold part (in horizontal direction) The result is shown. Comparing FIG. 5 (a) with FIG. 5 (b), in the case of FIG. 5 (a), since only one edge end side comes into contact in the initial pressing, the peripheral pressing force is high. Finally, it turns out that the upper mold part rotates around the contact part and the opposite side (right side of the drawing) of the one edge is also pressed, so that it is uniformly pressed as a whole.

  FIG. 6 shows the molding test results of the invention example and the comparative example. It can be seen that the inventive example has no burrs at one edge. In addition, in the case of the invention example, not only the flat portion (top and bottom surfaces) but also one edge portion has a very smooth and glossy mirror surface. According to the present invention, the flat portion and one edge It can be seen that highly accurate transfer molding with a fine structure is also possible at the end.

10 Upper mold
11 Upper matrix
12 Upper mold part
121 Top mold part
122 End mold part
125 Temperature control means
15, 15A, 15B Thermal insulation member
18, 18A, 18B Elastic member
20 Lower mold
21 Lower matrix
22 Lower mold part
225 Temperature control means
25 Thermal insulation
30 coatings

Claims (11)

The coating film formed by applying the molten resin to the lower mold is pressed by the upper mold, and the fine structure is transferred to the flat portion and one edge portion of the coating film, and this is cooled and solidified. A method of forming a flat microstructure without a burr at the one edge, while having the microstructure at one edge and a plane part,
Forming a flat coating film on the lower mold; and
With the upper die tilted from the horizontal, the lower end of the tip is brought into contact with the lower die, and then the upper die is rotated and pressed around the contact portion until the upper die becomes horizontal. A fine structure molding method for performing transfer molding of the fine structure on a flat surface portion and one edge portion of the coating film.   The contact surface pressure between the tip of the lower end of the upper mold and the lower mold can prevent the molten resin from entering the mold mating surface of the upper mold and the lower mold during the pressing of the coating film. The microstructure forming method according to claim 1, wherein the microstructure has the above size.   3. The coating film according to claim 1 or 2, wherein one edge portion of the coating film is formed at a position more than 0 mm and less than 5 mm away from the front surface of the upper mold on which fine structure transfer molding is performed. The microstructure forming method described.   The method for forming a fine structure according to any one of claims 1 to 3, wherein the coating film has a flat plate shape in which one edge end side is thick and a protrusion is formed. The thickness t _e of the convex portion of the coating 0.05 to 5 mm, the thickness t of the flat portion is 0.05 to 5 mm, t e _-t microstructure of claim 4, characterized in that the 0~1mm Body molding method.   The upper mold has an upper surface mold portion that performs transfer molding of the top surface of the flat portion of the coating film and an end surface mold portion that performs transfer molding of one edge portion. The microstructure forming method according to claim 5.   The method for forming a fine structure according to any one of claims 1 to 6, wherein the flat portion of the coating film on which the fine structure is transferred is the top surface or / and the bottom surface. The coating film formed by applying the molten resin to the lower mold is pressed by an upper mold having a fine structure, and the fine structure is transferred and molded on the flat portion and one edge portion of the coating film. A microstructure-molding mold for cooling and solidifying, and molding a planar microstructure having the microstructure on one edge with the plane portion,
An upper mold having an upper mold part that performs transfer molding of the flat surface part, and an end mold part that performs transfer molding of the one edge part, and an upper mold part held by an elastic member via an elastic member; ,
Having a lower mold facing the upper mold;
The upper mold is a microstructure forming mold configured to be inclined from the horizontal by the elastic member.   The microstructure forming mold according to claim 8, wherein the elastic member is thicker on one end face mold part side than on the other side.   The microstructure forming mold according to claim 8 or 9, wherein an inclination angle θ of an upper mold portion of the upper mold is θ = 0.001 to 1 °.   The microstructure forming mold according to any one of claims 8 to 10, wherein an interference member is provided at a portion where the end face mold part of the upper mold part contacts the lower mold.

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