JP2017200720A5 - - Google Patents

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Publication number
JP2017200720A5
JP2017200720A5 JP2017084668A JP2017084668A JP2017200720A5 JP 2017200720 A5 JP2017200720 A5 JP 2017200720A5 JP 2017084668 A JP2017084668 A JP 2017084668A JP 2017084668 A JP2017084668 A JP 2017084668A JP 2017200720 A5 JP2017200720 A5 JP 2017200720A5
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JP
Japan
Prior art keywords
grinding
truing
workpiece
grinding wheel
sensor
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JP2017084668A
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Japanese (ja)
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JP6926626B2 (en
JP2017200720A (en
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Publication of JP2017200720A5 publication Critical patent/JP2017200720A5/ja
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Claims (8)

工作物を回転可能に支持する主軸台と、
前記工作物を研削する砥石車と、
前記砥石車をツルーイングするツルアと、
前記工作物、及び、前記砥石車により研削した前記工作物以外の対象物の何れかである研削対象物の表面粗さを検出するセンサと、
前記砥石車に対するツルーイングに関する制御を行う制御装置と、を備え、
前記制御装置は、
前記砥石車に対するツルーイングを行ってから、次にツルーイングを行うまでに研削する前記工作物の数が研削実施数として設定される研削実施数設定部と、
前記ツルアによるツルーイング後に、前記砥石車が研削した前記工作物の数をカウントする研削数カウンタと、
前記研削数カウンタによりカウントした前記工作物の数が、前記研削実施数に到達したか否かを判定するツルーイング時期判定部と、
前記センサの検出結果に基づき、現在設定されている前記研削実施数が適切であるか否かを判定し、且つ、当該判定結果に基づき、次回以降に用いる前記研削実施数を再設定する研削数判定部と、を備える、研削盤システム。
A headstock that rotatably supports the workpiece,
A grinding wheel for grinding the workpiece,
Truer for truing the grinding wheel,
A sensor for detecting the surface roughness of a grinding object which is any one of the objects other than the workpiece, which is ground by the grinding wheel.
A control device for controlling the truing of the grinding wheel,
The control device is
After performing truing for the grinding wheel, the number of grinding execution number setting unit in which the number of the workpieces to be ground before performing the next truing is set as the number of grinding executions,
After truing by the truer, a grinding number counter for counting the number of the workpieces ground by the grinding wheel,
A truing timing determination unit that determines whether or not the number of workpieces counted by the grinding number counter has reached the number of grinding operations;
Based on the detection result of the sensor, it is determined whether or not the currently set number of grinding operations is appropriate, and based on the determination result, the number of grinding operations for resetting the number of grinding operations to be used next time or later. A grinding machine system including a determination unit.
前記研削対象物は、前記砥石車による研削が終了した前記工作物であり、
前記センサは、前記工作物の表面粗さを、加工領域とは異なる位置で検出し、
前記センサによる前記研削対象物としての前記工作物の表面粗さの検出は、前記砥石車による前記工作物の研削と並行して行われる、請求項1に記載の研削盤システム。
The object to be ground is the workpiece finished grinding by the grinding wheel,
The sensor detects the surface roughness of the workpiece at a position different from the processing area,
The grinder system according to claim 1, wherein detection of the surface roughness of the workpiece as the object to be ground by the sensor is performed in parallel with the grinding of the workpiece by the grinding wheel.
前記センサは、
ツルーイングを行う直前に研削した一の前記工作物のみに対し、表面粗さの検出を行う、請求項2に記載の研削盤システム。
The sensor is
The grinding machine system according to claim 2, wherein the surface roughness is detected only for one of the workpieces ground immediately before performing truing.
前記センサは、
ツルーイングを行う直前に研削した複数の前記工作物に対し、表面粗さの検出を行う、請求項2に記載の研削盤システム。
The sensor is
The grinding machine system according to claim 2, wherein the surface roughness is detected for the plurality of workpieces ground immediately before the truing.
前記研削盤システムは、
前記砥石車との接触により前記砥石車の外径を測定する接触検知ピンを備え、
前記研削対象物は、前記接触検知ピンであり、
前記センサは、ツルーイングを行う直前に前記砥石車に接触した前記接触検知ピンの表面粗さを検出する、請求項1に記載の研削盤システム。
The grinder system is
A contact detection pin for measuring the outer diameter of the grinding wheel by contact with the grinding wheel,
The object to be ground is the contact detection pin,
The grinder system according to claim 1, wherein the sensor detects a surface roughness of the contact detection pin that comes into contact with the grinding wheel immediately before performing truing.
前記センサによる前記接触検知ピンの表面粗さの検出は、前記ツルアによる前記砥石車のツルーイングと並行して行われる、請求項5に記載の研削盤システム。 The grinding machine system according to claim 5, wherein the detection of the surface roughness of the contact detection pin by the sensor is performed in parallel with the truing of the grinding wheel by the truer. 前記センサは、
基板と、
前記基板上に装着され、前記工作物に向けて発光する発光素子と、
前記基板上において前記発光素子の近傍に装着され、前記工作物からの反射光を受光可能な受光素子と、
前記受光素子の受光量に基づいて表面粗さを演算部と、
を備える、請求項1−6の何れか一項に記載の研削盤システム。
The sensor is
Board,
A light emitting element mounted on the substrate and emitting light toward the workpiece;
A light-receiving element mounted on the substrate in the vicinity of the light-emitting element and capable of receiving reflected light from the workpiece,
A surface roughness calculating unit based on the amount of light received by the light receiving element,
The grinding machine system according to any one of claims 1 to 6, further comprising:
前記研削盤システムは、 The grinder system is
前記主軸台、前記砥石車、前記ツルアを少なくとも備える複数の研削盤と、前記複数の研削盤が接続されるネットワーク上に設けられる解析部と、を備え、 The headstock, the grinding wheel, a plurality of grinding machines including at least the truer, and an analysis unit provided on a network to which the plurality of grinding machines are connected,
前記研削数判定部は、前記解析部に設けられ、前記複数の研削盤から送信されたデータに基づいて前記判定且つ前記再設定を行う、請求項1−7の何れか一項に記載の研削盤システム。 The grinding number determination unit is provided in the analysis unit, and performs the determination and the resetting based on data transmitted from the plurality of grinding machines, The grinding according to any one of claims 1 to 7. Board system.
JP2017084668A 2016-04-28 2017-04-21 Grinding machine system Active JP6926626B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016091856 2016-04-28
JP2016091856 2016-04-28

Publications (3)

Publication Number Publication Date
JP2017200720A JP2017200720A (en) 2017-11-09
JP2017200720A5 true JP2017200720A5 (en) 2020-07-09
JP6926626B2 JP6926626B2 (en) 2021-08-25

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ID=60264576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017084668A Active JP6926626B2 (en) 2016-04-28 2017-04-21 Grinding machine system

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JP (1) JP6926626B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7172636B2 (en) * 2019-01-18 2022-11-16 株式会社ジェイテクト Machine tool maintenance support device and machine tool system
JP7724133B2 (en) * 2021-10-29 2025-08-15 株式会社ジェイテクト Grinding System
JPWO2023105633A1 (en) * 2021-12-07 2023-06-15

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627776A (en) * 1979-08-16 1981-03-18 Sumitomo Metal Ind Ltd Tool monitoring device
JPH069786B2 (en) * 1985-04-29 1994-02-09 マツダ株式会社 Grinding control device
JPS62259772A (en) * 1986-05-02 1987-11-12 Disco Abrasive Syst Ltd Grinding device with roughness measuring means
JP2565032Y2 (en) * 1992-05-29 1998-03-11 エヌティエヌ株式会社 Dress interval control device for grinder
JP2010226007A (en) * 2009-03-25 2010-10-07 Renesas Electronics Corp Polishing process control method and semiconductor wafer polishing system
WO2015163164A1 (en) * 2014-04-22 2015-10-29 株式会社 荏原製作所 Polishing method and polishing apparatus

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