JP2018024077A5 - - Google Patents

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Publication number
JP2018024077A5
JP2018024077A5 JP2017086850A JP2017086850A JP2018024077A5 JP 2018024077 A5 JP2018024077 A5 JP 2018024077A5 JP 2017086850 A JP2017086850 A JP 2017086850A JP 2017086850 A JP2017086850 A JP 2017086850A JP 2018024077 A5 JP2018024077 A5 JP 2018024077A5
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Japan
Prior art keywords
grinding
workpiece
surface roughness
sensor
condition
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JP2017086850A
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Japanese (ja)
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JP2018024077A (en
JP6888396B2 (en
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Claims (12)

工作物を研削する砥石車と、
前記砥石車により研削された前記工作物の表面粗さを検出するセンサと、
前記センサにより検出される表面粗さに基づいて検出後に行う研削の条件を決定し、その決定された条件で研削を行う制御装置と、
を備える研削盤システム。
A grinding wheel that grinds a workpiece,
A sensor for detecting the surface roughness of the workpiece ground by the grinding wheel,
A control device that determines the condition of grinding performed after detection based on the surface roughness detected by the sensor, and performs grinding under the determined condition,
Grinding machine system.
前記制御装置は、検出された前記表面粗さが所定閾値よりも大きい場合に、検出後に行う研削の条件として、前記表面粗さが前記閾値以下となる条件を決定し、その決定された条件で研削を行う、請求項1に記載の研削盤システム。 When the detected surface roughness is larger than a predetermined threshold value, the control device determines a condition that the surface roughness is equal to or less than the threshold value as a condition for grinding performed after the detection, and determines the condition. The grinding machine system according to claim 1, which performs grinding. 前記制御装置は、
複数の研削工程を順次実行し、
前記センサにより検出される前記表面粗さに基づき、前記複数の研削工程の切替を行うタイミングを決定する、請求項2に記載の研削盤システム。
The control device is
Perform multiple grinding steps in sequence,
The grinding machine system according to claim 2, wherein the timing for switching the plurality of grinding steps is determined based on the surface roughness detected by the sensor.
前記研削盤システムは、プランジ研削により前記工作物を研削する、請求項1−3の何れか一項に記載の研削盤システム。 The grinder system according to any one of claims 1-3, wherein the grinder system grinds the workpiece by plunge grinding. 前記研削盤システムは、トラバース研削により前記工作物を研削する、請求項1−3の何れか一項に記載の研削盤システム。 The grinder system according to any one of claims 1-3, wherein the grinder system grinds the workpiece by traverse grinding. 前記制御装置は、前記センサにより検出される前記表面粗さに基づき、検出後のトラバース研削の条件として残りトラバース回数を決定し、その決定された前記残りトラバース回数のトラバース研削を行う、請求項5に記載の研削盤システム。 The control device determines a remaining number of traverses as a condition for the traverse grinding after detection based on the surface roughness detected by the sensor, and performs the traverse grinding of the determined remaining traverse number. Grinder system described in. 前記センサは、前記砥石車による所定回数のトラバース研削が終了した後であって次回のトラバース研削を開始する前に、前記表面粗さを検出する、請求項5又は6に記載の研削盤システム。 7. The grinding machine system according to claim 5, wherein the sensor detects the surface roughness after the traverse grinding by the grinding wheel is completed a predetermined number of times and before the next traverse grinding is started. 前記センサは、前記砥石車によるトラバース研削を行いながら、前記表面粗さを検出する請求項5又は6に記載の研削盤システム。 The grinding machine system according to claim 5, wherein the sensor detects the surface roughness while performing traverse grinding by the grinding wheel. 前記センサは、前記工作物が回転している状態であって、前記センサに対して前記工作物が相対的にトラバース送りされる状態で、前記工作物の研削された部位を検出する、請求項5−8のいずれか一項に記載の研削盤システム。 The sensor detects a ground portion of the workpiece in a state in which the workpiece is rotating and the workpiece is traversed relative to the sensor. The grinding machine system according to any one of 5-8. 前記センサは、前記工作物の研削された部位のうち、前記工作物の所定の軸方向位置の1周分の範囲の前記表面粗さを検出する、請求項1−8の何れか一項に記載の研削盤システム。 9. The sensor according to claim 1, wherein the sensor detects the surface roughness within a range of one circumference of a predetermined axial position of the workpiece in the ground portion of the workpiece. Grinding machine system described. 前記センサは、
基板と、
前記基板上に装着され、前記工作物に向けて発光する発光素子と、
前記基板上において前記発光素子の近傍に装着され、前記工作物からの反射光を受光可能な受光素子と
を備える、請求項1−10の何れか一項に記載の研削盤システム。
The sensor is
Board,
A light emitting element mounted on the substrate and emitting light toward the workpiece;
The light-receiving element mounted on the substrate in the vicinity of the light-emitting element and capable of receiving reflected light from the workpiece.
前記研削盤システムは、 The grinder system is
前記砥石車及び前記センサを備える複数の研削盤と、前記複数の研削盤が接続されるネットワーク上に設けられる解析装置と、を備え、 A plurality of grinding machines provided with the grinding wheel and the sensor, and an analysis device provided on a network to which the plurality of grinding machines are connected,
前記制御装置は、前記センサにより検出される前記表面粗さに基づいて前記研削の条件を決定する研削条件決定部を備え、 The control device includes a grinding condition determination unit that determines the grinding condition based on the surface roughness detected by the sensor,
前記研削条件決定部は、前記解析装置に設けられ、前記複数の研削盤における前記センサにより検出された前記表面粗さの解析結果に基づいて研削条件を決定する、請求項1−11の何れか一項に記載の研削盤システム。 The grinding condition determination unit is provided in the analysis device, and determines a grinding condition based on an analysis result of the surface roughness detected by the sensors in the plurality of grinding machines, 12. The grinding machine system according to one item.
JP2017086850A 2016-08-09 2017-04-26 Grinding machine system Active JP6888396B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016156934 2016-08-09
JP2016156934 2016-08-09

Publications (3)

Publication Number Publication Date
JP2018024077A JP2018024077A (en) 2018-02-15
JP2018024077A5 true JP2018024077A5 (en) 2020-07-09
JP6888396B2 JP6888396B2 (en) 2021-06-16

Family

ID=61193462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017086850A Active JP6888396B2 (en) 2016-08-09 2017-04-26 Grinding machine system

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JP (1) JP6888396B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113118880A (en) * 2021-04-23 2021-07-16 苏州健雄职业技术学院 High-precision machining method for grinding machine
CN118357797B (en) * 2024-06-18 2024-09-20 德新钢管(中国)有限公司 Intelligent control system and method for grinding seamless steel pipes
CN120382430B (en) * 2025-06-27 2025-08-22 保定乐凯包装材料有限公司 Control method and system for paper tube outer layer polishing device
CN120516525B (en) * 2025-07-23 2025-11-18 成都合信恒泰工程技术有限公司 Measuring device and measuring method for determining ground stress direction

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295543A (en) * 1988-09-30 1990-04-06 Omron Tateisi Electron Co Control device for grinder
JPH031758U (en) * 1989-05-29 1991-01-09
JP2005059141A (en) * 2003-08-12 2005-03-10 Kazuhito Ohashi Grinding method and controller of grinder

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