JP2018505263A - セラミック化シリコーン樹脂組成物、及びそれを用いたプリプレグと積層板 - Google Patents
セラミック化シリコーン樹脂組成物、及びそれを用いたプリプレグと積層板 Download PDFInfo
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Abstract
Description
縮合型シリコーン樹脂50〜100重量部と、
触媒0.0001〜2重量部と、
セラミック形成フィラー5〜80重量部と、
フラックス剤0.01〜50重量部とを含む、セラミック化シリコーン樹脂組成物。
間で橋渡し作用を果たし、発火温度で硬化させ、冷却すると、一定の強度を有し、且つ所定の衝撃力に耐えられる凝集した自己支持型セラミック化生成物を形成し、火災中でも電力や通信の遮断を防止できる。
縮合型シリコーン樹脂50〜100重量部と、
触媒0.0001〜2重量部と、
セラミック形成フィラー5〜80重量部と、
フラックス剤0.01〜50重量部と、
非セラミック形成フィラー5〜80重量部と、
助剤0.01〜10重量部とを含む。
接着液の固形分を50〜70%にすればよい。
前記セラミック化シリコーン樹脂組成物100重量部に対し、トルエン又はキシレン等の有機溶剤を加え、固形分50〜70%(重量比率)の樹脂接着液を製造し、強化材、例えばガラス繊維布に該樹脂接着液を浸漬させた後、120〜190℃で2〜15分間ベークして調製することである。
(1)本発明で得たセラミック化シリコーン樹脂積層板は、連続して燃焼する際に堅い構造を有し、一定の強度を有するとともに、所定の衝撃力に耐えられ、連続して裸火で焼いても積層板の完全性を維持できる。
(2)本発明で得たセラミック化シリコーン樹脂積層板は、極めて優れた耐熱性を有し、1%分解温度が548.7℃以上と高く、高出力モータ用の耐高温・電気絶縁性材料として使用できるだけではなく、航空宇宙用航空機の耐高温構造材料としても使用でき、応用の将来性が期待できる。
(3)本発明のセラミック化シリコーン樹脂組成物は、ノンハロゲン、低排煙性、低毒性、自己消火性、及び環境保全等の利点を有し、積層板及び銅張積層板の難燃・耐火化に新しいアイデアと新方法を提供する。
(4)本発明の調製過程に用いる全てのプロセス、及び装置は、一般的なFR−4汎用型であり、従来の生産装置を用いて本発明を実施でき、製品の産業化に役立つ。
キシ)プロピルトリメトキシシラン(米国のダウコーニング社製)8.9部を加え、撹拌し均一に混合して接着液を得た。平坦且つ滑らかで、厚さ0.1mmのE−ガラス繊維布に、上記接着液を均一に塗布し、オーブンにおいて170℃で5minベークしてプリプレグを得た。8枚の上記プリプレグを積層し、上下に35μmの銅箔を被覆し、真空ホットプレスに入れ、圧力3MPaと温度220℃の条件下で3hプレスして積層板を得た。
を、200mmx200mmの寸法に切断してエッチング処理を行い、シリコーン樹脂積層板を得て、積層板を裸火(800〜1100℃)で0.5h焼いた後のセラミック形成効果は明白で、積層板は堅く、顕著な孔もなかった。
公司製)を加え、均一に撹拌し接着液を得た。
トキシシラン(米国のダウコーニング社製)8.9部を加え、撹拌し均一に混合して接着液を得た。
グ社製)8.9部を加え、撹拌し均一に混合して接着液を得た。
Claims (15)
- セラミック化シリコーン樹脂組成物であって、
縮合型シリコーン樹脂50〜100重量部と、
触媒0.0001〜2重量部と、
セラミック形成フィラー5〜80重量部と、
フラックス剤0.01〜50重量部とを含む、ことを特徴とするセラミック化シリコーン樹脂組成物。 - 前記縮合型シリコーン樹脂は、メチルシリコーン樹脂、メチルフェニルシリコーン樹脂又はフェニルシリコーン樹脂のうちの任意の1種、又は少なくとも2種の混合物である、ことを特徴とする請求項1に記載のセラミック化シリコーン樹脂組成物。
- 前記縮合型シリコーン樹脂は、R/Si=1.0〜1.7(モル比)、Ph/(Me+Ph)=0〜1.0(モル比)のメチルシリコーン樹脂、メチルフェニルシリコーン樹脂又はフェニルシリコーン樹脂であり、ただし、Phはフェニル基、Meはメチル基、Rは有機官能基−CH3、−Ph、−OCH3、−OCH2CH3、−H又は−OHを示す、ことを特徴とする請求項1又は2に記載のセラミック化シリコーン樹脂組成物。
- 前記縮合型シリコーン樹脂は、R/Si=1.2〜1.7(モル比)、Ph/(Me+Ph)=0.2〜0.6(モル比)のメチルフェニルシリコーン樹脂である、ことを特徴とする請求項1又は2に記載のセラミック化シリコーン樹脂組成物。
- 前記触媒は、ナフテン酸亜鉛、ナフテン酸錫、ナフテン酸コバルト、ナフテン酸鉄、ナフテン酸セリウム、カルボン酸亜鉛、カルボン酸錫、カルボン酸コバルト、カルボン酸鉄、カルボン酸セリウム、パーフルオロスルホン酸、塩化ホスホニトリル、アミン類、第四級アンモニウム塩基、オクタン酸亜鉛、イソオクタン酸亜鉛、チタネート又はグアニジン化合物のうちの任意の1種、又は少なくとも2種の組み合わせであることを特徴とする請求項1又は2に記載のセラミック化シリコーン樹脂組成物。
- 前記セラミック形成フィラーは、雲母粉、珪灰石、又はカオリンのうちの任意の1種又は少なくとも2種の組み合わせであり、
前記フラックス剤は、ガラス添加剤、含ホウ素化合物、又は酸化亜鉛のうちの任意の1種、又は少なくとも2種の混合物、好ましくは、ガラス粉末、酸化亜鉛、酸化鉄又はホウ酸亜鉛のうちの任意の1種又は少なくとも2種の混合物である、ことを特徴とする請求項1又は2に記載のシリコーン樹脂組成物。 - 前記セラミック化シリコーン樹脂組成物は、非セラミック形成フィラー、又は/及び助剤をさらに含む、ことを特徴とする請求項1〜3のいずれか1項に記載のセラミック化シリコーン樹脂組成物。
- 前記非セラミック形成フィラーは、シリカ、アルミナ、水酸化アルミニウム、窒化ホウ素、窒化アルミニウム、窒化ケイ素又は炭化ケイ素のうちの任意の1種、又は少なくとも2種の混合物であり、
前記非セラミック形成フィラーの含有量は5〜80重量部である、ことを特徴とする請求項7に記載のセラミック化シリコーン樹脂組成物。 - 前記助剤は、シランカップリング剤、チタネートカップリング剤及び分散剤のうちの1種又は少なくとも2種の混合物であり、
前記助剤の含有量は0.01〜10重量部である、ことを特徴とする請求項7に記載の
セラミック化シリコーン樹脂組成物。 - 縮合型シリコーン樹脂50〜100重量部と、
触媒0.0001〜2重量部と、
セラミック形成フィラー5〜80重量部と、
フラックス剤0.01〜50重量部と、
非セラミック形成フィラー5〜80重量部と、
助剤0.01〜10重量部とを含み、
前記セラミック形成フィラー、フラックス剤、及び非セラミック形成フィラーの平均粒子径は、独立して10μm以下、好ましくは5μm以下であることを特徴とする、請求項1〜4のいずれか1項に記載のセラミック化シリコーン樹脂組成物。 - 請求項1〜10のいずれか1項に記載のセラミック化シリコーン樹脂組成物を溶剤に溶解、又は分散させて得る、ことを特徴とする樹脂接着液。
- 強化材及び含浸乾燥後に強化材に付着させた請求項1〜10のいずれか1項に記載のセラミック化シリコーン樹脂組成物を含むプリプレグ。
- 請求項12に記載のプリプレグを少なくとも一枚含む積層板。
- 少なくとも一枚の積層した請求項12に記載のプリプレグ及び積層したプリプレグの片側又は両側にラミネートした銅箔を含む銅張積層板。
- 請求項13に記載の積層板を少なくとも一枚含むプリント回路基板。
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| TW201623449A (zh) | 2016-07-01 |
| US10030143B2 (en) | 2018-07-24 |
| TWI597325B (zh) | 2017-09-01 |
| EP3239243A1 (en) | 2017-11-01 |
| WO2016101534A1 (zh) | 2016-06-30 |
| US20170355851A1 (en) | 2017-12-14 |
| CN105778504A (zh) | 2016-07-20 |
| KR101915920B1 (ko) | 2018-11-06 |
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