JP2531461Z - - Google Patents

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Publication number

JP2531461Z

JP2531461Z JP2531461Z JP 2531461 Z JP2531461 Z JP 2531461Z JP 2531461 Z JP2531461 Z JP 2531461Z

Authority

JP

Japan

Prior art keywords

wiring pattern

conductive member

insulating substrate

thermal head

substrate

Prior art date

1999-01-20

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

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• 239000000758 substrate Substances 0.000 claims description 50
• 238000010438 heat treatment Methods 0.000 claims description 10
• 239000011810 insulating material Substances 0.000 claims description 5
• 229910000679 solder Inorganic materials 0.000 claims description 5
• 239000000919 ceramic Substances 0.000 description 15
• 230000003014 reinforcing effect Effects 0.000 description 10
• 229910052782 aluminium Inorganic materials 0.000 description 4
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
• 230000001681 protective effect Effects 0.000 description 3
• 229920002379 silicone rubber Polymers 0.000 description 3
• 230000002093 peripheral effect Effects 0.000 description 2
• 230000002787 reinforcement Effects 0.000 description 2
• 239000004945 silicone rubber Substances 0.000 description 2
• 230000008602 contraction Effects 0.000 description 1
• 230000000994 depressogenic effect Effects 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 238000007747 plating Methods 0.000 description 1