JP2600033C - - Google Patents

Info

Publication number

JP2600033C

JP2600033C JP2600033C JP 2600033 C JP2600033 C JP 2600033C JP 2600033 C JP2600033 C JP 2600033C

Authority

JP

Japan

Prior art keywords

epoxy resin

resin composition

copper

laser

oxalate

Prior art date

1999-02-10

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

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• 239000003822 epoxy resin Substances 0.000 claims description 31
• 229920000647 polyepoxide Polymers 0.000 claims description 31
• QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 claims description 24
• 239000000203 mixture Substances 0.000 claims description 20
• 239000011164 primary particle Substances 0.000 claims description 11
• 239000000463 material Substances 0.000 claims description 9
• 238000004040 coloring Methods 0.000 claims description 6
• 239000003795 chemical substances by application Substances 0.000 claims description 2
• 239000000945 filler Substances 0.000 claims 1
• 239000000843 powder Substances 0.000 description 18
• 238000000576 coating method Methods 0.000 description 16
• 239000011248 coating agent Substances 0.000 description 15
• 239000002245 particle Substances 0.000 description 14
• 238000000034 method Methods 0.000 description 12
• 238000007639 printing Methods 0.000 description 8
• 239000011342 resin composition Substances 0.000 description 6
• LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
• 238000007648 laser printing Methods 0.000 description 5
• 229920005989 resin Polymers 0.000 description 5
• 239000011347 resin Substances 0.000 description 5
• VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
• CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
• IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
• 239000010419 fine particle Substances 0.000 description 4
• 229920003986 novolac Polymers 0.000 description 4
• QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
• 230000000052 comparative effect Effects 0.000 description 3
• 238000002845 discoloration Methods 0.000 description 3
• 239000000976 ink Substances 0.000 description 3
• CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
• PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
• 229910000019 calcium carbonate Inorganic materials 0.000 description 2
• 239000001569 carbon dioxide Substances 0.000 description 2
• 229910002092 carbon dioxide Inorganic materials 0.000 description 2
• 238000005266 casting Methods 0.000 description 2
• 230000002542 deteriorative effect Effects 0.000 description 2
• 229960004887 ferric hydroxide Drugs 0.000 description 2
• 239000012530 fluid Substances 0.000 description 2
• 238000007654 immersion Methods 0.000 description 2
• 239000011256 inorganic filler Substances 0.000 description 2
• 229910003475 inorganic filler Inorganic materials 0.000 description 2
• 239000011810 insulating material Substances 0.000 description 2
• IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 2
• 239000012778 molding material Substances 0.000 description 2
• LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
• QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
• 239000004593 Epoxy Substances 0.000 description 1
• ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
• 229910000004 White lead Inorganic materials 0.000 description 1
• HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
• 150000008065 acid anhydrides Chemical class 0.000 description 1
• 125000001931 aliphatic group Chemical group 0.000 description 1
• 230000015572 biosynthetic process Effects 0.000 description 1
• 239000000378 calcium silicate Substances 0.000 description 1
• 229910052918 calcium silicate Inorganic materials 0.000 description 1
• OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
• 238000006243 chemical reaction Methods 0.000 description 1
• 229940116318 copper carbonate Drugs 0.000 description 1
• GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
• 229930003836 cresol Natural products 0.000 description 1
• 229910002026 crystalline silica Inorganic materials 0.000 description 1
• GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
• FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
• 239000006185 dispersion Substances 0.000 description 1
• 238000010292 electrical insulation Methods 0.000 description 1
• 238000007590 electrostatic spraying Methods 0.000 description 1
• 239000005350 fused silica glass Substances 0.000 description 1
• -1 glycidyl ester Chemical class 0.000 description 1
• 150000002460 imidazoles Chemical class 0.000 description 1
• 238000009413 insulation Methods 0.000 description 1
• 230000001678 irradiating effect Effects 0.000 description 1
• 238000004898 kneading Methods 0.000 description 1
• RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 description 1
• 239000007788 liquid Substances 0.000 description 1
• 239000000395 magnesium oxide Substances 0.000 description 1
• AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
• 229920001568 phenolic resin Polymers 0.000 description 1
• 239000005011 phenolic resin Substances 0.000 description 1
• 239000000049 pigment Substances 0.000 description 1
• 229920000768 polyamine Polymers 0.000 description 1
• 238000010298 pulverizing process Methods 0.000 description 1
• 239000002994 raw material Substances 0.000 description 1
• 238000005096 rolling process Methods 0.000 description 1
• 235000012239 silicon dioxide Nutrition 0.000 description 1
• 238000005507 spraying Methods 0.000 description 1
• 150000003512 tertiary amines Chemical class 0.000 description 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1
• CQDTUBLRLRFEJX-UHFFFAOYSA-N tricopper;diborate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]B([O-])[O-].[O-]B([O-])[O-] CQDTUBLRLRFEJX-UHFFFAOYSA-N 0.000 description 1
• 229910052845 zircon Inorganic materials 0.000 description 1
• GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1